JPH0524552Y2 - - Google Patents
Info
- Publication number
- JPH0524552Y2 JPH0524552Y2 JP1985124363U JP12436385U JPH0524552Y2 JP H0524552 Y2 JPH0524552 Y2 JP H0524552Y2 JP 1985124363 U JP1985124363 U JP 1985124363U JP 12436385 U JP12436385 U JP 12436385U JP H0524552 Y2 JPH0524552 Y2 JP H0524552Y2
- Authority
- JP
- Japan
- Prior art keywords
- card
- metal frame
- lsi chip
- film
- resin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985124363U JPH0524552Y2 (US20030204162A1-20031030-M00001.png) | 1985-08-12 | 1985-08-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985124363U JPH0524552Y2 (US20030204162A1-20031030-M00001.png) | 1985-08-12 | 1985-08-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6233477U JPS6233477U (US20030204162A1-20031030-M00001.png) | 1987-02-27 |
| JPH0524552Y2 true JPH0524552Y2 (US20030204162A1-20031030-M00001.png) | 1993-06-22 |
Family
ID=31016305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985124363U Expired - Lifetime JPH0524552Y2 (US20030204162A1-20031030-M00001.png) | 1985-08-12 | 1985-08-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0524552Y2 (US20030204162A1-20031030-M00001.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2558842B2 (ja) * | 1988-09-27 | 1996-11-27 | 松下電子工業株式会社 | Ｉｃカード |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS607760A (ja) * | 1983-06-28 | 1985-01-16 | Toshiba Corp | Ｉｃカ−ドの製造方法 |
| JPS60142488A (ja) * | 1983-12-28 | 1985-07-27 | Dainippon Printing Co Ltd | Ｉｃカ−ド |
-
1985
- 1985-08-12 JP JP1985124363U patent/JPH0524552Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS607760A (ja) * | 1983-06-28 | 1985-01-16 | Toshiba Corp | Ｉｃカ−ドの製造方法 |
| JPS60142488A (ja) * | 1983-12-28 | 1985-07-27 | Dainippon Printing Co Ltd | Ｉｃカ−ド |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6233477U (US20030204162A1-20031030-M00001.png) | 1987-02-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5444301A (en) | Semiconductor package and method for manufacturing the same | |
| US4800419A (en) | Support assembly for integrated circuits | |
| US5999413A (en) | Resin sealing type semiconductor device | |
| KR100705521B1 (ko) | 반도체 장치 | |
| KR20010098590A (ko) | 반도체 장치 및 그 제조 방법 | |
| KR20010020324A (ko) | 반도체 소자 탑재용 기판 및 그 제조 방법 및 반도체 장치 | |
| US20030209815A1 (en) | Semiconductor device and its manufacturing method | |
| JPH0524552Y2 (US20030204162A1-20031030-M00001.png) | ||
| JP2000148949A (ja) | 非接触ｉｃカードおよびその製造方法 | |
| KR20010070081A (ko) | 반도체 장치 및 그 제조 방법 | |
| JP2840166B2 (ja) | 半導体装置 | |
| JP3764213B2 (ja) | Ｉｃカード及びその製造方法 | |
| JP3126782B2 (ja) | 薄型半導体装置の製造方法 | |
| JP2568915B2 (ja) | Ｉｃカード | |
| JP2904785B2 (ja) | カード内蔵用ｉｃモジユール | |
| JP4961636B2 (ja) | 非接触型ｉｃカード及びその製造方法 | |
| JPH081109Y2 (ja) | 複数チップ内蔵のｉｃモジュール | |
| JPH01210394A (ja) | 集積回路装置 | |
| JP3485736B2 (ja) | 半導体装置とその製造方法 | |
| KR0147156B1 (ko) | 필름 온 칩 패키지와 그 제조방법 | |
| JP2513044Y2 (ja) | 半導体装置 | |
| JPH0450145Y2 (US20030204162A1-20031030-M00001.png) | ||
| JPH0815829B2 (ja) | Ｉｃカード用モジュールの製造方法 | |
| JP2687775B2 (ja) | Ｔａｂテープ | |
| JPH11260972A (ja) | 薄型半導体装置 |
