JPH05243715A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH05243715A JPH05243715A JP4510892A JP4510892A JPH05243715A JP H05243715 A JPH05243715 A JP H05243715A JP 4510892 A JP4510892 A JP 4510892A JP 4510892 A JP4510892 A JP 4510892A JP H05243715 A JPH05243715 A JP H05243715A
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- release agent
- resist film
- photosensitive
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は印刷配線板の製造方法に
関し、特にソルダレジスト工程を有する印刷配線板の製
造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for manufacturing a printed wiring board having a solder resist process.
【０００２】[0002]
【従来の技術】印刷配線板のはんだブリッジ防止の目的
に用いるソルダレジストの形成には、高密度印刷配線板
においては、従来のスクリーン印刷法に替わって感光性
液状ソルダレジストを用いた写真法が一般的に用いられ
ている。2. Description of the Related Art In order to form a solder resist used for the purpose of preventing solder bridging of a printed wiring board, in a high density printed wiring board, a photographic method using a photosensitive liquid solder resist is used instead of the conventional screen printing method. It is commonly used.
【０００３】この写真法によるソルダレジスト工程の製
造方法について図２を用いて説明する。A method of manufacturing the solder resist process by this photographic method will be described with reference to FIG.
【０００４】まず、図２（ａ）に示すように、絶縁基板
に回路１ａを形成する。次に、図２（ｂ）に示すよう
に、回路形成された絶縁基板１に感光性液状ソルダレジ
ストを塗布し、熱風循環炉で乾燥して感光性ソルダレジ
スト膜２を得る。次に、図２（ｃ）に示すように、所定
のパターンを有するマスクフィルム４を回路形成された
絶縁基板１に重ね合わせ位置決め後、露光して感光した
ソルダレジスト膜５を形成する。次に、図２（ｄ）に示
すように、未露光部のソルダレジスト膜６を現像除去
し、回路１ａ間に感光したソルダレジスト膜５を有する
印刷配線板を得る。First, as shown in FIG. 2A, a circuit 1a is formed on an insulating substrate. Next, as shown in FIG. 2B, a photosensitive liquid solder resist is applied to the circuit-formed insulating substrate 1 and dried in a hot air circulation oven to obtain a photosensitive solder resist film 2. Next, as shown in FIG. 2C, a mask film 4 having a predetermined pattern is superimposed on the circuit-formed insulating substrate 1, positioned, and then exposed to form a solder resist film 5 which is exposed to light. Next, as shown in FIG. 2D, the solder resist film 6 in the unexposed portion is developed and removed to obtain a printed wiring board having the solder resist film 5 exposed between the circuits 1a.
【０００５】[0005]
【発明が解決しようとする課題】この従来の製造方法で
は、以下に述べる問題点があった。This conventional manufacturing method has the following problems.
【０００６】一般に、感光性液状ソルダレジストは、感
光性を付与する目的でその成分中に重合開始剤ならびに
増感剤等の低分子の成分を含んでいる。このため、乾燥
された感光性液状ソルダレジスト膜は、常温時でも粘着
性を有している。また、３０℃を越えると粘着性は著し
く高くなる傾向にある。Generally, the photosensitive liquid solder resist contains a low molecular weight component such as a polymerization initiator and a sensitizer for the purpose of imparting photosensitivity. Therefore, the dried photosensitive liquid solder resist film has adhesiveness even at room temperature. Further, when the temperature exceeds 30 ° C., the tackiness tends to be remarkably increased.
【０００７】したがって、乾燥後の感光性ソルダレジス
ト膜は常温でも塗膜同士を接したり重ねたりすることが
できないので、取り扱い方法としては一枚毎に間隔を空
けて立てて保持する必要があるとともに、厚み０．４ｍ
ｍ以下の印刷配線板については立てて保持するというこ
とが困難であるために製造ができなかった。Therefore, since the photosensitive solder resist film after drying cannot contact or overlap the coating films even at room temperature, as a handling method, it is necessary to stand and hold each film at an interval. , Thickness 0.4m
A printed wiring board of m or less could not be manufactured because it is difficult to hold it upright.
【０００８】また、露光時に温度が３０℃を越えると、
粘着性が著しくなって露光ガラス面と感光性ソルダレジ
スト膜が密着してしまうために搬送不良を生じたり、感
光性ソルダレジスト膜に品質欠点を生じたり、生産効率
を悪化させていた。If the temperature exceeds 30 ° C. during exposure,
Adhesiveness became remarkable and the exposed glass surface and the photosensitive solder resist film were in close contact with each other, resulting in conveyance failure, quality defects in the photosensitive solder resist film, and deterioration in production efficiency.
【０００９】本発明の目的は、乾燥後の感光性ソルダレ
ジストの重ね取り扱いが可能で、露光時に粘着性を生じ
ない印刷配線板の製造方法を提供することにある。It is an object of the present invention to provide a method for producing a printed wiring board which allows the photosensitive solder resist after drying to be handled in a stack and does not cause tackiness during exposure.
【００１０】[0010]
【課題を解決するための手段】本発明の印刷配線板の製
造方法は、回路形成された絶縁基板に感光性液状ソルダ
を塗布，乾燥し、感光性ソルダレジスト膜を得る工程
と、該感光性ソルダレジスト膜上に離型剤を重ねて塗
布，乾燥し離型剤塗膜を形成する工程と、更に、所定の
パターンを有するマスクフィルムを重ね合わせて露光し
未露光部の前記感光性ソルダレジスト膜と前記離型剤塗
膜とを同時に現像除去する工程とを有する。A method for manufacturing a printed wiring board according to the present invention comprises a step of applying a photosensitive liquid solder to an insulating substrate having a circuit formed thereon and drying the same to obtain a photosensitive solder resist film; A step of forming a release agent coating film by coating a release agent on the solder resist film and then drying it, and further, exposing a mask film having a predetermined pattern by overlapping and exposing the photosensitive solder resist. And a step of simultaneously developing and removing the film and the release agent coating film.
【００１１】[0011]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１２】図１（ａ）〜（ｅ）は本発明の一実施例を
説明する工程順に示した断面図である。1 (a) to 1 (e) are cross-sectional views showing a process sequence for explaining an embodiment of the present invention.
【００１３】まず、図１（ａ）に示すように、絶縁基板
上に回路１ａを形成する。First, as shown in FIG. 1A, a circuit 1a is formed on an insulating substrate.
【００１４】次に、図１（ｂ）に示すように、回路形成
された絶縁基板１に感光性液状ソルダレジストをスプレ
ーコータ法で２０〜５０μｍの厚さに塗布し、８０〜１
００℃の熱風循環炉で１０〜３０分乾燥して感光性ソル
ダレジスト膜２を得る。Next, as shown in FIG. 1B, a photosensitive liquid solder resist is applied to the insulating substrate 1 on which a circuit is formed by a spray coater method to a thickness of 20 to 50 μm, and 80 to 1 is applied.
The photosensitive solder resist film 2 is obtained by drying in a hot air circulating oven at 00 ° C. for 10 to 30 minutes.
【００１５】次に、図１（ｃ）に示すように、感光性ソ
ルダレジスト膜２上に離型剤を０．５〜３μｍの厚さに
塗布し、２０〜１００℃の熱風循環炉で５〜１０分乾燥
して離型剤塗膜３を得る。Next, as shown in FIG. 1 (c), a release agent is applied to the photosensitive solder resist film 2 to a thickness of 0.5 to 3 μm, and the release agent is applied in a hot air circulating oven at 20 to 100 ° C. The release agent coating film 3 is obtained by drying for 10 minutes.
【００１６】次に、図１（ｄ）に示すように、所定のパ
ターンを有するマスクフィルム４を回路形成した絶縁基
板１に重ね合わせ位置決めし、４００〜１０００ｍＪ／
ｃｍ2 の紫外線エネルギーを照射し露光することによ
り、感光したソルダレジスト膜５を得る。Next, as shown in FIG. 1 (d), a mask film 4 having a predetermined pattern is superposed and positioned on the circuit-formed insulating substrate 1, and 400 to 1000 mJ /
The exposed solder resist film 5 is obtained by irradiating and exposing with ultraviolet energy of cm 2 .
【００１７】次に、図１（ｅ）に示すように、未露光部
のソルダレジスト膜６と離型剤塗膜３を同時に０．５〜
３．０％の炭酸ナトリウム水溶液で現像除去し、回路１
ａの間に感光したソルダレジスト膜５のパターンを形成
し、印刷配線板が得られる。Next, as shown in FIG. 1 (e), the solder resist film 6 and the release agent coating film 3 in the unexposed area are coated with 0.5 to 0.5 at the same time.
Develop and remove with 3.0% sodium carbonate aqueous solution, Circuit 1
A pattern of the exposed solder resist film 5 is formed between a and a printed wiring board is obtained.
【００１８】尚、離型剤としては、シリコーン樹脂を結
合剤と混合し有機溶剤に溶かしたものを用いる。フッ素
樹脂を結合剤と混合し有機溶剤に溶かしたものを用いる
こともできる。また、感光性ソルダレジスト膜上への離
型剤の塗布方法は、スプレーコータ法，ローラーコータ
法，刷毛塗り等の方法で実施することもできる。As the release agent, a silicone resin mixed with a binder and dissolved in an organic solvent is used. A fluororesin mixed with a binder and dissolved in an organic solvent may be used. The release agent may be applied onto the photosensitive solder resist film by a spray coater method, a roller coater method, a brush coating method, or the like.
【００１９】また、回路形成された絶縁基板への感光性
液状ソルダレジストの塗布方法は、スクリーン印刷法，
カーテンコータ法，ローラーコータ法等の方法で実施す
ることもできる。Further, the method of applying the photosensitive liquid solder resist to the circuit-formed insulating substrate includes a screen printing method,
It can also be carried out by a curtain coater method, a roller coater method or the like.
【００２０】[0020]
【発明の効果】以上説明したように本発明は、感光性ソ
ルダレジスト膜上に離型剤塗布膜を形成することによ
り、以下の効果を有する。As described above, the present invention has the following effects by forming the release agent coating film on the photosensitive solder resist film.
【００２１】乾燥後の回路形成された絶縁基板を、積み
重ねることが可能となるため取り扱いが容易になるとと
もに、厚み０．４ｍｍ以下の印刷配線板の製造が可能と
なる。The dried circuit-formed insulating substrates can be stacked so that they can be easily handled and a printed wiring board having a thickness of 0.4 mm or less can be manufactured.
【００２２】また、露光時に温度が３０℃を越えた場合
でも粘着性が現われないので、露光時の搬送性が安定
し、生産効率が向上する。Further, since the adhesiveness does not appear even when the temperature exceeds 30 ° C. during exposure, the transportability during exposure is stabilized and the production efficiency is improved.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明の一実施例を説明する工程順に示した断
面図である。1A to 1D are cross-sectional views showing a process sequence for explaining an embodiment of the present invention.
【図２】従来の印刷配線板の製造方法を説明する工程順
に示した断面図である。2A to 2D are cross-sectional views showing a method of manufacturing a conventional printed wiring board in the order of steps.
１ 回路形成された絶縁基板 １ａ 回路 ２ 感光性ソルダレジスト膜 ３ 離型剤塗膜 ４ 所定のパターンを有するマスクフィルム ５ 感光したソルダレジスト膜 ６ 未露光部のソルダレジスト膜 DESCRIPTION OF SYMBOLS 1 Circuit-formed insulating substrate 1a Circuit 2 Photosensitive solder resist film 3 Release agent coating film 4 Mask film having a predetermined pattern 5 Photosensitive solder resist film 6 Solder resist film in unexposed area
Claims (1)
ルダを塗布，乾燥し、感光性ソルダレジスト膜を得る工
程と、該感光性ソルダレジスト膜上に離型剤を重ねて塗
布，乾燥し離型剤塗膜を形成する工程と、更に、所定の
パターンを有するマスクフィルムを重ね合わせて露光し
未露光部の前記感光性ソルダレジスト膜と前記離型剤塗
膜とを同時に現像除去する工程とを有するこを特徴とす
る印刷配線板の製造方法。1. A step of applying a photosensitive liquid solder to an insulating substrate on which a circuit is formed and drying the same to obtain a photosensitive solder resist film, and applying a mold release agent on the photosensitive solder resist film and applying and drying the release agent. A step of forming a release agent coating film, and a step of developing and removing the photosensitive solder resist film and the release agent coating film of an unexposed portion by superposing and exposing a mask film having a predetermined pattern. A method of manufacturing a printed wiring board, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4510892A JP2710512B2 (en) | 1992-03-03 | 1992-03-03 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4510892A JP2710512B2 (en) | 1992-03-03 | 1992-03-03 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05243715A true JPH05243715A (en) | 1993-09-21 |
| JP2710512B2 JP2710512B2 (en) | 1998-02-10 |
Family
ID=12710079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4510892A Expired - Fee Related JP2710512B2 (en) | 1992-03-03 | 1992-03-03 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2710512B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1513381A3 (en) * | 2003-09-08 | 2007-05-16 | Nitto Denko Corporation | Process for producing wiring circuit board |
| US9177886B2 (en) * | 2012-04-17 | 2015-11-03 | Samsung Electronics Co., Ltd. | Semiconductor package including chip support and method of fabricating the same |
-
1992
- 1992-03-03 JP JP4510892A patent/JP2710512B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1513381A3 (en) * | 2003-09-08 | 2007-05-16 | Nitto Denko Corporation | Process for producing wiring circuit board |
| US7354697B2 (en) | 2003-09-08 | 2008-04-08 | Nitto Denko Corporation | Process for producing wiring circuit board |
| US7572351B2 (en) | 2003-09-08 | 2009-08-11 | Nitto Denko Corporation | Process for producing wiring circuit board |
| US9177886B2 (en) * | 2012-04-17 | 2015-11-03 | Samsung Electronics Co., Ltd. | Semiconductor package including chip support and method of fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2710512B2 (en) | 1998-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970924 |
|
| LAPS | Cancellation because of no payment of annual fees |