JPH0523416A - Metal detector and pinball game machine - Google Patents

Abstract

PURPOSE:To equalize the sensitivity and to eliminate the detection miss of a pinball by providing a transparent protective sheet on one face of a glass base substrate by holding a transmitting line therebetween with a matrix sensor, providing a transparent conductive film on its upper face, and providing annularly a conductive band on the conductive film along the edge of the substrate and grounding it. CONSTITUTION:When the matrix sensor 20 transmits the signal of a prescribed frequency to the transmitting line 22 and a magnetic field is generated, electromotive force is generated in a receiving line 26, and when a metallic pinball approaches the sensor 20, an eddy current is generated on the surface of the pinball, the transmitting line 22 varies a current, and in accordance therewith, the receiving line 26 varies the electromotive force. The transmitting line 22 and the receiving line 26 whose characteristics are varied are detected, and from its intersecting position, the position of a metal can be recognized. A transparent protective sheet 17 protects the transmitting line 22, and a transparent conductive film 17e shields an electric influence from the surface, and prevents an illegal action. A conductive band 17f equalizes the resistance value of the transparent conductive film 17e, equalizes the sensitivity characteristic of the matrix sensor 20, and can enhance an external noise characteristic, and the detection accuracy of the pinball.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal detection device and a pachinko game machine, and more particularly to a device for detecting a pachinko ball, a prize winning device, or the like on the board surface of the pachinko game machine.

[0002]

2. Description of the Related Art Accurately grasping a player's playing, pachinko ball hitting, out ball in an out hole, ball in a safe hole, etc. for each pachinko game machine is to manage profits at a game hall. Very important for customer management.

Therefore, as a conventional technique for detecting the passage of a pachinko ball in the passage path of a pachinko game machine, Japanese Patent Application Laid-Open No. HEI 2
There is one disclosed in Japanese Patent Publication No. 279186.

That is, in the publication, a matrix sensor is constructed by arranging a group of transmitting coils and a group of receiving coils in a cross direction on a glass base substrate, and the matrix sensor is attached along a board surface of a pachinko game machine. A technique for detecting a pachinko ball by changing the impedance of a portion where a transmission unit and a reception unit overlap is disclosed.

An outer glass body is provided on the transmitter coil row group of the glass base substrate, and a transparent conductive film for shielding is attached to the surface of the outer glass body.

[0006]

However, in the above conventional technique, the transparent conductive film is provided for the shield, but the resistance value of the transparent conductive film is not uniform depending on the position on the glass base substrate. Therefore, there is a problem in that the sensitivity characteristics of the matrix sensor become non-uniform depending on the detection position, the shield of external noise becomes incomplete, and a pachinko ball detection error may occur.

The present invention has been made by paying attention to such a conventional problem, and the sensitivity characteristic of the matrix sensor is uniform over the entire area to eliminate the influence of external noise.
An object of the present invention is to provide a metal detection device that has no detection error and has high detection accuracy for metals such as pachinko balls, and a pachinko game machine to which such a metal detection device is attached.

[0008]

The gist of the present invention for attaining the above-mentioned object is to: 1 attach a plurality of parallel folded-back transmission lines to one surface of a glass base substrate, and bring electromagnetic characteristics by approaching a metal. A plurality of parallel folded-back receiving lines that vary, are placed by electromagnetically coupling with the transmitting lines in the crossing direction, and a plane having a detection unit in the surrounding portion of each transmitting line and each receiving line. A matrix sensor is provided, a transparent protective sheet is provided on the one surface of the glass base substrate with the transmission line interposed therebetween, a transparent conductive film is provided on an upper surface of the transparent protective sheet, and a conductive band is provided on the transparent conductive sheet. A metal detecting device characterized in that the film is provided in a ring shape along the edge of the glass base substrate and is grounded.

2. The metal detecting device according to claim 1, wherein the conductive band is made of a conductive paint.

3. The metal detecting device according to item 1 or 2, wherein a protective film is provided on the upper surface of the transparent protective sheet with the conductive band interposed therebetween.

(4) A pachinko game machine characterized in that the metal detection device according to item (1), (2) or (3) is attached to a mounting frame of an inner glass body along the board surface.

[0012]

In the metal detection device, when a signal of a predetermined frequency is sequentially transmitted from the transmission circuit to a plurality of folded transmission lines to generate a magnetic field, mutual induction action occurs on the reception line electromagnetically coupled to the transmission line. Causes electromotive force. At this time, if a metal such as a pachinko ball approaches the matrix sensor,
Eddy current is generated on the surface of the metal in the direction in which the magnetic flux from the matrix sensor is canceled.

The impedance of the transmission line changes due to the effect of the eddy current, and the current changes, and accordingly, the reception line changes the magnitude of the electromotive force. It is possible to detect the transmission line and the reception line whose electromagnetic characteristics have changed, and grasp the position of the metal in the matrix sensor as coordinates from the intersecting position.

The transparent protective sheet protects the transmission line, and the transparent conductive film shields the electrical influence due to the proximity of the metal or derivative from the surface to eliminate detection mistakes and protect from fraudulent acts.

The conductive band makes the resistance value of the transparent conductive film uniform. As a result, the sensitivity characteristic of the matrix sensor becomes uniform over the entire area, and the external noise characteristic and the detection accuracy of a metal such as a pachinko ball become high.

If the conductive strip consists of a conductive paint,
It becomes easy to provide a conductive band on the transparent conductive film.

When the transparent protective sheet has a protective film on the upper surface of the conductive strip so as to sandwich the conductive strip, the durability of the conductive strip can be improved.

In the pachinko game machine, the movement of the pachinko ball on the board can be tracked as a change in coordinates by the metal detection device, and the progress of the game can be monitored and the ball hit, the out ball,
It is possible to know the status of the safe balls of the prize winning device device, check stoppages, check for abnormalities due to fraud, and use it as data for nail adjustment and the like.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 to 14 show an embodiment of the present invention. As shown in FIG. 2, the pachinko game machine 10
Pachinko balls are driven into the board surface 11 along the guide rails 12, and the inside of the guide rails 12 on the board surface 11 forms the game area. In this game area, a large number of nails 13, 13 ... Which strike a pachinko ball are driven, safe holes 14a, 14a ... Are opened in various places, and a prize winning device device 14b is provided in the central portion of the board surface between upstream and downstream. An out hole 15 is provided at the lower end of the game area.

The prize winning device device 14b is a device which changes a number of pachinko balls to be safe balls depending on a prize. On the front of the pachinko game machine 10, a launching handle 33 for launching a pachinko ball, and a bowl 3 for receiving the ball.
And 4 are provided.

As shown in FIG. 3, a pachinko game machine 10
A mounting frame 80 is provided on the front surface of the so as to be openable and closable.
The inner glass body 17 is attached to the mounting frame 80, and the board surface 11 covers the outside.
6 and an inner glass body 17, which is the inner side and is the board surface side, are covered with two pieces of glass. Matrix sensor 2
As shown in FIG. 4, 0 has a planar shape with the inner glass body 17 as a glass substrate, and is attached to the mounting frame 80 along the board surface 11 so that the surface glass body 16 and the board surface 11
It is provided between and.

As shown in FIG. 5, the matrix sensor 20
Then, one transmission line 22 is made into a parallel folded shape (or loop shape) which is U-turned at the folding part 61,
A plurality of transmission lines 22 are formed, and these are arranged in parallel in one direction on one surface of the inner glass body 17 and attached.

Similarly, the plurality of receiving lines 26 are also configured such that one receiving line 26 makes a U-turn so as to form a parallel folded shape (or a loop shape). These are arranged in parallel in one direction and arranged and attached to the opposite surface of the inner glass body 17. The transmission terminal 23 and the reception terminal 27 are arranged centrally at the lower end of the inner glass body 17 in a vertical relationship when attached to a pachinko game machine.

Each reception line 26 is electromagnetically coupled to each transmission line 22 and is arranged in a plane-parallel position with respect to each transmission line 22 at a right angle crossing direction so that the electromagnetic characteristics are changed by the approach of a pachinko ball. Each transmission line 22 using the body 17 as a substrate
A planar matrix sensor 20 is configured by the receiving lines 26 and the receiving lines 26.

In the front view of FIG. 5, each square-shaped surrounding portion surrounded by each intersecting transmission line 22 and each reception line 26 is
The detection units 20a, 20a, ... Detect a pachinko ball by changing impedance, which is an electromagnetic characteristic value.

FIG. 6A shows an enlarged cross-sectional view of the inner glass body 17, and FIG. 6B shows an enlarged view of a portion surrounded by a broken line in FIG. The inner glass body 17 is provided with a reception line 26 (see FIG.
Inner protective glass plate 17a, which is a transparent protective sheet for (see FIG. 5), a receiving side glass base substrate 17b, a transmitting side glass base substrate 17c, and an outer glass which is a transparent protective sheet for the transmission line 22 (shown in FIG. 5). The plate 17d has a four-layered structure. The outer glass plate 17d is the transmission line 22.
Protects the world from the outside world.

Inner protective glass plate 17a and outer glass plate 1
7d has a shorter vertical length than the reception side glass base substrate 17b and the transmission side glass base substrate 17c, and the lower end 17p of the inner glass body 17 is exposed.

Between the inner protective glass plate 17a and the receiving side glass base substrate 17b, a plurality of parallel folded-back receiving lines 26 are mounted, and the transmitting side glass base substrate 17 is provided.
A plurality of parallel folded-back transmission lines 22 are mounted between the c and the outer glass plate 17d.

Therefore, in the inner glass body 17, the transmission line 22 is placed on one surface of the transmission side glass base substrate 17c by the transparent adhesive layer 18a, and the outer glass plate 17d is covered so as to cover the transmission line 22. The transparent adhesive layer 18b is used for bonding, the reception line 26 is bonded and arranged on the other surface of the receiving-side glass base substrate 17b with the transparent adhesive layer 18c, and the inner protective glass plate 17a is provided so as to cover it.
Is bonded by a transparent adhesive layer 18d, and the other surface of the transmitting side glass base substrate 17c and the other surface of the receiving side glass base substrate 17b are bonded by a transparent adhesive layer 18e.

A transparent conductive film 17e for shielding is additionally provided on the entire surface of the outer glass plate 17d, which is the front side of the plurality of transmission lines 22. The transparent conductive film 17e is formed by depositing a film of indium oxide (ITO) or a film of tin oxide on the outer glass plate 17d. The transparent conductive film 17e shields an electric influence due to the proximity of a metal or a derivative from the surface, eliminates a detection error, and protects from a fraudulent act.

On the upper surface of the transparent conductive film 17e, an annular conductive band 17f is formed along the edge of the transmitting side glass base substrate 17c.
Are provided (FIG. 1). The conductive band 17f is made of a conductive paint made by melting silver powder with a phenol resin, and is formed by applying it to the upper surface of the transparent conductive film 17e. Since the conductive band 17f is made of a conductive paint, it is easy to provide it on the transparent conductive film 17e. The material of the conductive band 17f is a transparent conductive film 17e.
The one with smaller resistance is selected.

A lead wire 35 to a circuit ground (not shown) is attached to the conductive band 17f by soldering,
It is grounded. The lead wire 35 may be attached by a conductive adhesive instead of soldering.

As shown in FIG. 5, the transmission side glass base substrate 17c having a quadrangular shape is adhered to the transmission side turn-back substrate 19a made of a slender flexible printed circuit board (FPC) along one side of the transmission side glass base substrate 17c to extend in the vertical direction. An L-shaped transmission-side routing board 19b made of a flexible board is also bonded along the opposite side and a part of the lower side.

As shown in FIG. 7, the transmitting side turn-back board 19a has a plurality of, specifically 32 arc-shaped turn-back portions 61 formed in a line by a conductor pattern made of copper foil, and as shown in FIG. Further, one end 62 a of the wire 62 is connected to one end 61 a of each folded-back portion 61 by soldering using a solder 63 or welding.

A part of the lower end of the transmitting-side routing board 19b on the opposite side is projected, and the projecting part has copper foil on its edge and along part of the side, as shown in FIG. A plurality of, specifically, 64 transmission terminals 23 for external connection extending in the vertical direction are formed by the conductor pattern made of.

The terminal side of each transmission line 22 has a transmission terminal 23 of each transmission line 22 and a routing section 64 to each transmission terminal 23. The routing portion 64 to each transmission terminal 23 is formed on the transmission-side routing board 19b by a conductor pattern, and extends from each transmission terminal 23 along the transmission-side routing board 19b.

The other end 62b of the wire 62 extending from one end 61a of each folded-back portion 61 is provided with tension on the wire 62, and soldering using solder 63 is applied to the starting point 64a of the corresponding terminal-side routing portion 64. Connected by welding, and the routing part 64
It is connected to the transmission terminal 23 via. The routing section 64 connects two straight line portions with a circular arc section 64R in order to remove high frequency interference.

Similarly, the reception side glass base substrate 17a having a rectangular shape has the reception side folded substrate 29a adhered along one side of the upper end in the horizontal direction, and the elongated reception side substrate 29a extends along a part of the lower side in the horizontal direction. The side routing board 29b is adhered. Similar to the transmission side return substrate 19a, the reception side return substrate 29a includes a plurality of conductor patterns made of copper foil, specifically 32.
The arc-shaped folding part 61 of the book is formed, and one end 61a of each folding part is formed.
One end 62a of the wire 62 is connected to the wire 62 by soldering or welding using the solder 63.

As shown in FIG. 6, a part of the lower end of the receiving side routing board 29b on the opposite side is projected, and the projecting portion has
When a reception side glass base substrate 17b is attached to a transmission side glass base substrate 17c along a part of a side of the edge, a plurality of conductor patterns made of copper foil are provided at non-opposing positions that do not overlap each other. Specifically, 64 receiving terminals 27 for external connection extending in the vertical direction are formed.
The terminal side of each reception line 26 has a reception terminal 27 of each reception line 26.
And a routing portion 64 to each receiving terminal 27. The routing portion 64 to each receiving terminal 27 is formed on the receiving-side routing board 29b by a conductor pattern, and extends from each receiving terminal 27 along the receiving-side routing board 29b.

The other end 62b of the wire 62 extending from the one end 61a of each folded-back portion 61 is made to have tension on the wire 62, and soldering using a solder 63 is performed at the starting point 64a of the corresponding lead portion 64 on the terminal side. Connected by welding, and the routing part 64
It is connected to the receiving terminal 27 via.

As described above, the transmission line 22 and the reception line 26 are formed by the folding portions 6 formed on the folding boards 19a and 29a.
1, each routing portion 64 formed on each routing substrate 19b, 29b, each wire 62, the transmission terminal 23 that forms the end of the transmission line 22, and the reception terminal 27 that forms the end of the reception line 26. It is composed by. The conductive band 17f is formed on the transparent conductive film 17e so as to fit within the width of each folded substrate 19a, 29a and each routing substrate 19b, 29b.

The pattern of the matrix sensor 20 suitable for the ordinary pachinko game machine 10 is 32 lines of the transmission line 22,
The reception line 26 has 32 columns, and the total number of the detection units 20a is 1
There are 024 patterns. In addition, in FIG. 5, the pattern other than the outer side is omitted.

The thickness of the wires forming the transmission line 22 and the reception line 26 is preferably set to a value of 25 μm to 30 μm. In the case of this embodiment, as shown in FIG.
And the overall widths c and d of the receiving terminal 27 are 12 respectively.
As shown in FIG. 7, the width e of the longitudinally extending portion of the transmitting side folded board 19a is 10 mm or less, and the width f of the longitudinally extending portion of the transmitting side routing board 19b is 22 mm.
It is formed to less than mm Further, as shown in FIG. 9, the width g of each one of the transmission terminal 23 and the reception terminal 27 is
It is 1.5 mm.

As shown in FIG. 1, the matrix sensor 20
The inner glass body 17 has a transmission / reception board 171 attached to the lower end 17p. The transmission / reception board 171 is arranged between the surface glass body 16 and the matrix sensor 20.

A signal processing system constituting a metal detecting device for detecting a pachinko ball is as shown in FIGS. As shown in FIG. 10, the matrix sensor 20 is under the control of the CPU memory control board 172 via the matrix I / O transmission / reception board 171. The CPU memory control board 172 constitutes a data processing device and can communicate with the communication line 179. In addition, the CPU memory control board 172
Has an interface unit 176 for the CPU unit 172 to read the monitoring points from the RAM card 173.

The card 173 is a memory card of a monitoring memory that stores the monitoring points of pachinko balls in a readable manner and can be attached to and detached from the interface section 176. Card 1
Reference numeral 73 designates safe holes 14a, 14a ... Provided on the board surface of the pachinko game machine 10, a hitting ball detection position and an out hole 1.
The data of the position 5 and the detection algorithm of the pachinko balls entering the safe holes 14a, 14a ... And the out holes 15 are recorded as monitoring data. A RAM card, a mask ROM, an EPROM, a one-time ROM, or the like can be used as the card.

The option 174 connected to the CPU memory control board 172 is a device for recording the trajectory of a pachinko ball moving around between the board surface 11 of the pachinko game machine 10 and the inner glass body 617.

The option 174 may have a system of storing it in a semiconductor memory or the like, but during the time when the number of players increases, the operation rate of the pachinko game machine 10 becomes high, which requires an enormous storage capacity, which is enormous. Since a semiconductor memory that requires a storage capacity is generally expensive or requires a larger space, a hard disk is used to record the movement of a pachinko ball. As hard disks, optical disks, optical / magnetic disks, analog or digital tape recorders,
It may be either a video tape or a system in which a personal computer is directly connected.

The recorded data is applied to a computer incorporating software for analyzing the trajectory of a pachinko ball and arithmetically processed, and a pachinko game hall (hall).
You can get the data you need.

The transmission circuit 40 is a circuit that sequentially transmits signals of a predetermined frequency to each transmission line 22, and the reception circuit 50 is a circuit that sequentially receives signals from each reception line 26 in synchronization with the transmission circuit 40. As a voltage waveform to the transmission line 22 by the transmission circuit 40, a continuous sine wave centered at 0 V having a frequency of 1 to 1.3 MHz is suitable.

As shown in FIG. 11, the transmission circuit 40 includes a transmission connector 41, an amplifier 42 and a channel switching logic 43 connected to the transmission connector 41, and an amplifier 42.
And an analog multiplexer 44 connected to the channel switching logic 43, and a plurality of analog multiplexers 44 connected to the analog multiplexer 44 via the transmission connector 67a.
Specifically, 32 PNP + NPN totem pole drivers 45 connected to the transmission line 22 side of 32 circuits respectively.
It is composed of and.

As shown in FIG. 12, the receiving circuit 50 includes a plurality of CT transformers (current transformers) 51 connected to a plurality of receiving circuits 67b, specifically 32 receiving circuits 26 on the receiving line 26 side. , An analog multiplexer 52 connected to the CT transformer 51, and an analog multiplexer 52
Amplifier 53 and channel switching logic 5 connected to
4 and a receiving connector 55 connected to the amplifier 53 and the channel switching logic 54. Therefore, the receiving circuit 50 is adapted to receive a signal from each receiving line 26 via each CT transformer 51.

The CT transformer 51 insulates each receiving line 26 from the analog multiplexer 52 and amplifies the signal from each receiving line 26 ten times. The analog multiplexer 52 sequentially receives the signals from the CT transformers 51, and the amplifier 53 amplifies the signal from the analog multiplexer 52. The channel switching logic 54 is a member similar to the channel switching logic 43 of the transmission circuit 40.

As shown in FIG. 13, the CPU memory control board 172 has the CPU unit 3 on the transmitting side.
CPU connector 46 connected to 0 and CPU connector 4
6, a sequence control circuit 47 that sends a transmission clock in response to a start signal from the CPU unit 30, a bandpass filter 48 that receives the transmission clock and sends the transmission signal, and an amplifier that amplifies the transmission signal and sends it to the transmission connector. And 49.

The CPU memory control board 1
On the receiving side, 72 is an amplifier 71 that amplifies the reception signal from the reception connector 55, a bandpass filter 72 that receives the amplified signal, a full-wave rectification / amplifier 73 that receives the reception signal from the bandpass filter 72, Two-stage low-pass filter 7 for receiving the received signal from the wave rectifier / amplifier 73
4a, 74b and the A / D converter 75 which receives the received signals from the low-pass filter 74b and is controlled by the sequence control circuit 47 to send digital data to the bidirectional RAM 76, and the digital data which is received and controlled by the sequence control circuit 47. Write the received data to the CPU
CP the received data according to the read signal from the connector 46
It has a bidirectional RAM 76 for sending to the CPU unit 30 via the U connector 46.

The bidirectional RAM 76 is a memory for storing the position of the pachinko ball as the detection data of the detection unit 20a by the transmission lines 22 and the reception lines 26, based on the signal from the reception circuit 50, and internally. It has a counter, and all processing of matrix data of pachinko balls is performed by that counter. Further, the CPU memory control board 172 has a power supply unit 77.

The CPU unit 30 reads the monitoring area data of the card 173, reads the detection data of the bidirectional RAM 76, and correlates the detection data with the monitoring area data of the pachinko balls to monitor the pachinko balls. .

Next, the operation will be described. CPU unit 30
Address and control signals from the CPU
It is transmitted to the matrix sensor 20 via the connector 46.

In the matrix sensor 20, on the transmitting side, the sequence control circuit 47 receives the start signal and receives 16 MH.
The original oscillation clock of z is divided as necessary to output a transmission clock. The transmission clock from the sequence control circuit 47 is waveform-shaped from the digital signal to the analog signal by the bandpass filter 48, amplified by the amplifier 49, and sent to the transmission connector 41.

Further, the transmission signal is amplified by the amplifier 42 in the transmission circuit 40. Analog multiplexer 44
Is a channel switched by the channel switching logic 43 and sequentially operates the totem pole driver 45, whereby the totem pole driver 45 sequentially outputs the signal amplified by the amplifier 42 to the transmission line 22 at a predetermined cycle. (See step 91 in FIG. 14).

In the matrix sensor 20, the transmission circuit 40
When a signal having a predetermined frequency is sequentially transmitted from a plurality of folded transmission lines 22 to generate a magnetic field, an electromotive force is generated in the reception line 26 electromagnetically coupled to the transmission lines 22 by a mutual induction effect. . At this time, when a pachinko ball made of metal approaches the detection unit 20a of the matrix sensor 20,
On the surface of the pachinko ball, an eddy current is generated in the direction in which the magnetic flux from the matrix sensor 20 is canceled. The impedance of the transmission line 22 changes due to the effect of the eddy current and changes the current, and accordingly, the reception line 26 changes the magnitude of the electromotive force.

The conductive band 17f makes the resistance value of the transparent conductive film 17e uniform. As a result, the sensitivity characteristics of the matrix sensor 20 are made uniform over the entire area, and the influence of external noise or the like is eliminated, and the pachinko balls and the winning prize device device 14b.
The detection accuracy of such as.

On the receiving side, the receiving circuit 50 receives a signal from each receiving line 26 via each CT transformer 51 in synchronization with the transmitting circuit 40 by the sequence control circuit 47. As shown in FIG. 12, a current that is an electromagnetic characteristic value that appears in the plurality of reception lines 26 is amplified by the CT transformer 51 ten times. Since amplification is performed by the CT transformer 51,
Therefore, it is not necessary to increase the amplification degree of the amplifier on the receiving side. The CT transformer 51 insulates each of the reception lines 26 of the matrix sensor 20 forming a metal sensor from the analog multiplexer 52 of the reception circuit 50, prevents noise from entering from the pachinko game machine 10 to the reception circuit 50, and receives the noise. Amplify the signal.

The analog multiplexer 52 switches the signal from each receiving line 26 passing through the CT transformer 51 by the channel switching logic 54 and sequentially outputs it at a predetermined cycle. The signal from the analog multiplexer 52 is amplified 100 times by the amplifier 53 (FIG. 14).
See step 92).

The received signal is received by the receiving connector 55 and the amplifier 7.
1. Amplification and detection are performed through the bandpass filter 72. The received signal from the bandpass filter 72 is an analog signal, and this analog signal is
The full-wave rectification / amplifier 73 performs waveform shaping. The signal from the full-wave rectifier / amplifier 73 is supplied to the low-pass filter 7
Averaging is performed by integration processing at 4a and 74b.

Next, the received signal is the A / D converter 75.
Sent to. The A / D converter 75 converts the signal from the matrix sensor 20 into a digital signal in a predetermined bit unit such as 12 bits, and controls the sequence control circuit 63 to record the detection data in the bidirectional RAM 76 (step in FIG. 14). 93). This processing speed is as high as 25,000 times per second. Bidirectional RAM 7
6 is C by the write signal from the sequence control circuit 63.
Regardless of the operation of the PU unit 30, after recording the detection data, input 1 clock to input +
It is incremented by 1 (see step 94 in FIG. 14). Bidirectional RA
The capacity of M76 is, for example, 2048 bytes.

Next, the analog multiplexer 52 of the receiving circuit 50 switches the signal from each receiving line 26 (see FIG. 14).
32 according to 32 reception lines 26 (see step 95)
The above steps are repeated once (see step 96 in FIG. 14). After repeating 32 times, the analog multiplexer 44 of the transmission circuit 40 switches the transmission line 22 (see step 97 in FIG. 14) and repeats the signal processing again.

Thus, the reception line 26 in which the reception signal has changed
, And the transmission lines 22, 22 ... Transmitted at that time can be detected by scanning, and the position of the pachinko ball on the matrix sensor 20 can be grasped as coordinates from the intersecting position. The number of the detection units 20a is 32 for the transmission line 22.
Since there are 1024 rows and 32 receiving lines in total,
It can be detected even if the pachinko ball passes through any of the safe holes 14a and the out holes 15 on the board surface 11.

The bidirectional RAM 76 determines the position of the pachinko ball in the matrix sensor 20 from the intersection position of the reception line 26 in which the reception signal has changed and the transmission line 22 transmitted at that time, based on the signal from the reception circuit 50. It is stored as detection data of the detection unit 20a by each transmission line 22 and each reception line 26.

The CPU unit 30 reads the detection data relating to the position of the pachinko ball recorded in the bidirectional RAM 76 by a read start signal as necessary, performs arithmetic processing, and the detection data is stored in the card 173. The pachinko balls are monitored in association with the monitoring data.

The CPU unit 30 repeats this process. The matrix sensor 20 can follow the movement of a pachinko ball on the board surface 11 of the pachinko game machine 10 as a change in coordinates, such as the state of the ball entering a pachinko ball. Pachinko game machine 10
Then, by monitoring the progress of the game by the matrix sensor 20 and knowing the status of hit balls, out balls, safe balls of the winning prize device device 14b, etc., stop management and check for abnormalities due to fraud, nail adjustment, etc. Can be used as data.

A protective film may be provided on the upper surface of the transparent protective sheet with the conductive band in between. In this case, the durability of the conductive band can be improved.

The conductive band may be provided on the upper surface of the transparent conductive film, or may be provided between the transparent conductive film and the outer glass plate which is the transparent protective sheet.

Further, the inner glass body 17 is formed by quadruple lamination of an inner protective glass plate 17a, a receiving side glass base substrate 17b, a transmitting side glass base substrate 17c and an outer side glass plate 17d, and a receiving side glass base substrate. 17b
Alternatively, the transmission-side glass base substrate 17c may be formed of one sheet to form a triple-layered structure.

[0075]

According to the metal detecting device and the pachinko game machine of the present invention, since the conductive band makes the resistance value of the transparent conductive film uniform, the sensitivity characteristic of the matrix sensor is uniform over the entire area, The influence of noise is eliminated, there is no detection error, and the detection accuracy of metals such as pachinko balls can be improved.

When the conductive strip is made of conductive paint,
Since it can be provided by applying a conductive paint, it becomes easy to provide a conductive band on the transparent conductive film.

When the transparent protective sheet has a protective film on the upper surface with the conductive band sandwiched, the conductive band is protected.
The durability of the conductive band can be improved.

In the pachinko game machine, the movement of the pachinko ball on the board can be tracked as a change in coordinates by the metal detection device.

[Brief description of drawings]

FIG. 1 is a schematic front view of a metal detection device showing an embodiment of the present invention.

FIG. 2 is a perspective view conceptually disassembled of a pachinko game machine and a metal detection device according to an embodiment of the present invention.

FIG. 3 is a front view of the pachinko game machine according to the embodiment of the present invention with the mounting frame open.

FIG. 4 is a partial vertical cross-sectional view of a pachinko game machine according to an embodiment of the present invention.

FIG. 5 is a front view of a metal detection device according to an embodiment of the present invention.

FIG. 6 is an enlarged cross-sectional view of a metal detection device according to an embodiment of the present invention.

FIG. 7 is a detailed front view of a transmission line according to an embodiment of the present invention.

FIG. 8 is an enlarged sectional view showing a wire connection state of a transmission line according to an embodiment of the present invention.

FIG. 9 is an enlarged front view of the transmission terminal according to the embodiment of the present invention.

FIG. 10 is a schematic configuration diagram of a metal detection device according to an embodiment of the present invention.

FIG. 11 is a block diagram of a transmission circuit of a matrix I / O transmission / reception board according to an embodiment of the present invention.

FIG. 12 is a block diagram of a receiver circuit of a matrix I / O transmitter / receiver board according to an embodiment of the present invention.

FIG. 13 is a block diagram of a reception and transmission circuit of a CPU memory control board according to an embodiment of the present invention.

FIG. 14 is a flowchart of scanning of the metal detecting device according to the embodiment of the present invention.

[Explanation of symbols]

B ... Pachinko ball, 10 ... Pachinko game machine, 11 ... Board surface, 14a ... Safe hole, 15 ... Out hole, 17 ... Inner glass body, 17a ... Internal protective glass plate, 17b ... Receiving side glass base substrate, 17c ... Transmitting side Glass base substrate, 1
7d ... Outer glass plate, 17e ... Transparent conductive film, 17f ... Conductive band, 19a, 29a ... Folded substrate, 19b, 29b ...
Routing board, 20 ... Matrix sensor, 20a ... Detection unit, 22 ... Transmission line, 23 ... Transmission terminal, 26 ... Reception line, 2
7 ... Reception terminal, 30 ... CPU unit, 35 ... Lead wire, 40 ... Transmission circuit, 50 ... Reception circuit, 61 ... Folding part,
62 ... Wire, 64 ... Leading part, 80 ... Mounting frame, 171 ...
Matrix I / O transmission / reception board, 172 ... CPU memory control board.

Claims (4)

[Claims] 1. A plurality of parallel folded-back transmission lines are attached to one surface of a glass base substrate, and a plurality of parallel folded-back reception lines whose electromagnetic characteristics are changed by the approach of a metal are provided.
Arranged electromagnetically in the cross direction with the transmission line,
A planar matrix sensor having a detection unit in the surrounding portion of each transmission line and each reception line is configured, and a transparent protective sheet is provided on the one surface of the glass base substrate with the transmission line interposed therebetween, and transparent conductive A metal detector, wherein a film is provided on an upper surface of the transparent protective sheet, a conductive band is provided on the transparent conductive film in an annular shape along an edge of the glass base substrate, and the film is grounded. 2. The metal detecting device according to claim 1, wherein the conductive band is made of a conductive paint. 3. The metal detection device according to claim 1, wherein a protective film is provided on the upper surface of the transparent protective sheet with the conductive band interposed therebetween. 4. A pachinko game machine in which the metal detection device according to claim 1, 2 or 3 is attached to a mounting frame of an inner glass body along a board surface.