JP2769553B2 - Pachinko ball detection device and pachinko game machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pachinko ball detection device and a pachinko game machine, and more particularly to a device for detecting a pachinko ball, a winning accessory device, and the like on a board of the pachinko game machine.

[0002]

2. Description of the Related Art Accurately grasping, for each pachinko game machine, a player's playing, pachinko ball hitting, out-hole entering an out-hole, and ball entering a safe-hole, etc., is required for profit management of amusement arcades. Very important in customer management.

[0003] For this reason, Japanese Patent Laid-Open Publication No.
-279186.

That is, in the publication, a matrix sensor is formed by arranging a plurality of transmission coil row groups and reception coil row groups on a glass base substrate in a cross direction, and the matrix sensor is provided along the surface of the pachinko game machine. In addition, there is disclosed a technique of detecting a pachinko ball based on an impedance change in a superimposed portion of a transmission unit and a reception unit.

In this matrix sensor, a pattern of a transmission coil row group and a reception coil row group is formed of a transparent conductive film, and external connection terminals are provided at ends of the transmission coil row group and the reception coil row group, respectively. Is provided. Each external connection terminal is connected to a transmission circuit and a reception circuit, respectively.

[0006]

However, in the above-mentioned prior art, since the entirety of the transmission coil row group and the reception coil column group is made of the transparent conductive film, there is a limit in making the transmission coil row group and the reception coil column group inconspicuous and thin. In addition, there is a problem that if the coil is made uniform and the detection accuracy is improved, the manufacturing cost becomes expensive.

The present invention has been made in view of such conventional problems, and it is possible to make the matrix sensor thin so as not to be noticeable, to improve the detection accuracy, and to manufacture the sensor at low cost. It is an object of the present invention to provide a pachinko ball detection device capable of performing the same and a pachinko game machine equipped with such a pachinko ball detection device.

[0008]

SUMMARY OF THE INVENTION In order to achieve the above object, the gist of the present invention is as follows. (1) In a pachinko ball detection device provided along the surface of a pachinko game machine, a plurality of parallel folded transmissions are provided. The wire is attached to one side of a substantially square glass base substrate, and a plurality of parallel folded reception lines whose electromagnetic characteristics change due to the approach of a pachinko ball are electromagnetically coupled in a direction crossing the transmission line to form the glass. A planar matrix sensor having a detection unit in an enclosing portion of each transmission line and each reception line is arranged on the opposite surface of the base substrate, and the transmission base folded substrate and the transmission side drawing substrate are formed on the glass base substrate. A turning substrate, a receiving-side turning substrate, and a receiving-side turning substrate are provided, and the transmitting-side turning substrate and the transmitting-side turning substrate are provided to face each other at one end of the glass base substrate. Is, the receiving-side fold substrate and the receiving side circumventive substrate disposed opposite at said opposite face of the end portion of the glass base substrate of the transmitting-side fold substrate and the sender circumventive substrate and the cross direction,
The transmission line and the reception line are configured by a folded portion, a transmission terminal, a routing portion, and a wire, and the folded portion of the transmission line is formed by a conductor pattern on the transmission-side folded substrate. The transmission terminal is formed on the transmission-side routing board, and the routing portion of the transmission line is formed of a conductor pattern on the transmission-side routing board and one end of the transmission terminal corresponds to the transmission terminal. And the turn-back portion of the receiving line is
The reception terminal is formed on the reception-side folded substrate by a conductor pattern, the reception terminal is formed on the reception-side routing substrate, and the routing portion of the reception line is disposed on the reception-side routing substrate. One end is formed by a conductor pattern and connected to the corresponding reception terminal, and the transmission line and the reception line each have a conductive pad at an end of the folded portion and the other end of the routing portion, A pachinko ball detection device, wherein a wire is connected to a corresponding conductive pad of the folded portion and a conductive pad of the routing portion.

[0009] The transmission line and the reception line may be configured such that at least one of the conductive pads at the end of the folded portion and the other end of the routing portion extends in the length direction of the wire. The pachinko ball detection device according to claim 1, characterized in that:

[0010] The wire is connected to the conductive pad by soldering, and the transmission-side folded board, the transmission-side folded board, the reception-side folded board, and the reception-side folded board are each formed of a conductive material. A transmission layer having an insulating layer on the folded portion and the routing portion other than the pad, having a shield layer on each insulating layer, and covering the one surface of the glass base substrate and extending over each shield layer. A side protection glass is provided on the one side, a reception side protection glass covering the opposite side of the glass base substrate and over each shield layer is provided on the opposite side, and the transmission side folded substrate and the transmission side routing substrate are provided. The soldering portion of the wire is placed in the interval from the receiving-side protective glass to the transmitting-side protective glass and the interval from the receiving-side folded substrate and the receiving-side routing substrate to the receiving-side protective glass. Item 3. The pachinko ball detection device according to item 1 or 2.

[0011] A pachinko game machine characterized in that the pachinko ball detecting device according to item 1, 2 or 3 is mounted on a mounting frame of an inner glass body along the board surface.

[0012]

In the pachinko ball detection device, when a signal of a predetermined frequency is sequentially transmitted from a transmission circuit to a plurality of folded transmission lines to generate a magnetic field, mutual induction is applied to a reception line electromagnetically coupled to the transmission line. An electromotive force is generated by the action. At this time, when a metal such as a pachinko ball approaches the matrix sensor, an eddy current is generated on the surface of the metal in a direction to cancel the magnetic flux by the matrix sensor.

The impedance of the transmission line changes due to the influence of the eddy current, and the current changes. The reception line changes the magnitude of the electromotive force in response to the change. The transmission line and the reception line having changed electromagnetic characteristics are detected, and the position of the metal on the matrix sensor can be grasped as coordinates from the intersection position.

The transmission line and the reception line are composed of a folded portion, a transmission terminal, a routing portion, and a wire, and the matrix sensor can be thinned by the wire so as not to be noticeable.
Also, since the wire can be easily made uniform in thickness,
The detection accuracy can be improved, and the manufacturing cost can be reduced as compared with the case of manufacturing using a conductor pattern.

Further, since the transmission line and the reception line have conductive pads at the end of the folded portion and the other end of the routing portion, when the wires are connected, the conductive pads absorb an error in the connection position and are manufactured. Becomes easier.

When the conductive pad extends in the length direction of the wire, when the wire is connected, the conductive pad absorbs an error in the connection position in the length direction of the wire, which further facilitates manufacturing. .

In the case where the soldering portion of the wire is provided on the transmission side and the receiving side at a distance from the folded substrate and the routing substrate to the protective glass, the soldering portion does not hinder the provision of the protective glass. The fixing of the protective glass is ensured.

In the pachinko game machine, the movement of the pachinko ball on the board can be tracked as a change in coordinates by the pachinko ball detecting device, and the progress of the game can be monitored, and the hit ball, the out ball, and the prize winning device can be safely monitored. It is possible to know the condition of the ball, to check for an error due to hitting management and fraud, and to use the data as nail adjustment data.

[0019]

An embodiment of the present invention will be described below with reference to the drawings. 1 to 20 show an embodiment of the present invention. As shown in FIG. 2, the pachinko game machine 10
Pachinko balls are driven into the board 11 along the guide rails 11a.
The inside of is the game area. In this game area, a large number of nails 11b, 11b... For playing pachinko balls are driven, safe holes 14a, 14a... Are opened in various places, and a prize winning device 14b is provided in the center of the board between the upstream and the downstream. An out hole 15 is provided at the lower end of the game area.

The prize winning device 14b is a device which changes a large number of pachinko balls into safe balls by changing due to a prize. On the front of the pachinko game machine 10, a launching handle 12 for performing a pachinko ball launching operation, and a tray 1 for receiving a payout.
3 are provided.

As shown in FIG. 3, the pachinko game machine 10
A mounting frame 21 is provided on the front surface of the device so as to be freely opened and closed.
The inner glass body 17 is attached to the mounting frame 21, and the board surface 11 is a surface glass body 1 that covers the outside.
6 and an inner glass body 17 on the inner side, which is on the board surface side.

The matrix sensor 20 is shown in FIGS.
As shown in FIG. 6, the inner glass body 17 is formed in a planar shape using the glass substrate, and is attached to the mounting frame 21 along the board surface 11, and as shown in FIG. It is provided between them. Inner glass body 17
Has a shape in which both corners 18 at the lower end are cut out, as shown in FIG.

As shown in FIG. 1, the matrix sensor 20
A plurality of transmission lines 22 are configured such that one transmission line 22 has a parallel folded shape (or a loop shape) that is U-turned at a folded portion 22a. It is arranged and mounted on one side of the body 17.

Similarly, the plurality of receiving lines 26 are configured such that one receiving line 26 turns in a U-turn to form a parallel folded (or loop) shape. These are arranged and mounted on the opposite surface of the inner glass body 17 in parallel in one direction. The transmission terminal 23 and the reception terminal 27 are arranged intensively at the lower end of the inner glass body 17 when mounted on the pachinko game machine.

Each of the receiving lines 26 is electromagnetically coupled to each of the transmitting lines 22 and is disposed in a direction perpendicular to the plane parallel to each of the transmitting lines 22 so that the electromagnetic characteristics change when the pachinko balls approach. Each transmission line 22 having the body 17 as a substrate
And the receiving lines 26 constitute a planar matrix sensor 20.

As shown in FIG. 16, each transmission line 2
Each of the square-shaped surrounding portions surrounded by 2 and each receiving line 26 forms detection units 20a, 20a,... For sensing a pachinko ball by an impedance change which is an electromagnetic characteristic value.

As shown in FIG. 6, the inner glass body 17 is
The inner protective glass plate 17a, which is a receiving-side transparent protective sheet for the receiving line 26 (shown in FIG. 9), the receiving-side glass base substrate 17b, the transmitting-side glass base substrate 17c, and the transmitting line 2
2 (shown in FIG. 8) as a transmission-side transparent protective sheet. The inner glass body 17 typically has a vertical length a of 367 mm ± 1.
A glass substrate having a substantially square shape having a size of 0 mm and a horizontal length b of 405 mm ± 10 mm, and 3.0 to 3.5 mm
Has a thickness of

As shown in FIG. 8, in order to attach the transmission line 22, the transmission-side glass base substrate 17c includes a transmission-side folded substrate 19a formed of an elongated flexible printed circuit (FPC) along one vertical side 24a on one side. Adhesive, opposite side 24b on the opposite side of transmission side folded substrate 19a in the vertical direction
And a side 2 at the lower end, which is a side adjacent to the transmission-side folded substrate 19a.
Along the part of 4c, a transmission-side routing board 19b also made of a flexible board is bonded.

Therefore, the transmission-side folded substrate 19a and the transmission-side routing substrate 19b are provided to face each other at the end of the transmission-side glass base substrate 17c. The transmission-side folded substrate 19a and the transmission-side routing substrate 19b are connected to both corners 1
The lower part 18 a has a bent shape along 8.

The transmission-side folded substrate 19a and the transmission-side routing substrate 19b are provided on the inner shield layer 81 bonded to the transmission-side glass base substrate 17c, the inner insulating layer 82, and the routing portion 2
5, the outer insulating layer 83, and the outer shield layer 84 are sequentially stacked.

The transmission line 22 includes a folded portion 22a, a transmission terminal 23, a routing portion 25, and a wire 28. As shown in FIG. 1 and FIG.
A plurality of, specifically, 32 conductive patterns are formed in a row on the inner insulating layer 82 of the transmitting-side folded substrate 19a by a conductor pattern made of copper foil. The folded portion 22a has conductive pads 31 on both ends. The conductive pad 31 extends in the length direction of the wire 28 and has an elongated shape, that is, a dimension in which the length in the horizontal and vertical directions is about 1 mm and the length in the vertical direction is about 2 mm.

As shown in FIG. 10, the transmission terminal 23 is located on the transmission-side routing board 19b at a position closest to the opposite side 24b on the opposite side of the transmission-side folded board 19a in the vertical direction, and at the lower end side 24c. Are formed along. The transmitting-side routing board 19b on the opposite side has a lower end partly protruding outside the transmitting-side glass base board 17c. As shown in FIG. 8, the transmitting terminal 23 is formed on the edge of the protruding portion 23a. Have been.

The routing portion 25 is formed by a conductor pattern on the inner insulating layer 82 of the transmission-side routing substrate 19b.
One end is connected to the corresponding transmission terminal 23. The other end of the routing unit 25 has a circular conductive pad 33. As shown in FIG. 7, the wire 28 is connected to the conductive pad 31 at the end of the corresponding folded part 22a and the conductive pad 33 at the end of the routing part 25 by soldering using solder 34. doing.

As shown in FIG. 7, the transmission-side folded substrate 19a
In addition, the outer insulating layer 83 of the transmission-side routing board 19b is provided with the folded portion 22 on the end side other than the conductive pads 31 and 33, respectively.
a and the outer shield layer 8
4 is provided on each insulating layer 83.

As shown in FIG. 9, the receiving-side glass base substrate 1 is used to attach the receiving line 26, similarly to the transmitting line 22.
7b, the receiving-side folded substrate 29a is adhered along one side 24d in the horizontal direction which is opposite to the lower side 24c of the transmitting-side folded substrate 19a, and the lateral lower-side edge of the transmitting-side folded substrate 19a is provided. An elongated receiving-side routing board 29b is adhered along a part of 24c. Therefore, the receiving side folded substrate 2
9a and the receiving-side routing board 29b are the transmission-side folded board 1
9a and the transmission-side routing board 19b are provided so as to face the end of the reception-side glass base substrate 17b in the direction intersecting with the transmission-side board 19b.

The receiving-side folded substrate 29a and the receiving-side routing substrate 29b are, similarly to the transmitting side, formed on the inner shield layer 81 bonded to the receiving-side glass base substrate 17b, the inner insulating layer 82, and the routing portion 25. , The outer insulating layer 83 and the outer shield layer 84 are sequentially stacked.

The receiving line 26 includes a folded portion 26a, a receiving terminal 27, a routing portion 25, and a wire 28. As shown in FIG. 13, the folding part 26 a
Similarly to the above, 32 conductor patterns are formed in a row on the inner insulating layer 82 of the receiving-side folded substrate 29a. The folded portion 26a has conductive pads at both ends, similarly to the folded portion 22a of the transmission line 22. The conductive pad extends in the length direction of the wire 28 and has an elongated shape.

As shown in FIG. 12, the receiving terminal 27 is formed on the receiving side routing board 29b along the lower side 24c. The receiving-side routing board 29b on the opposite side has a part of the lower end projecting outside the receiving-side glass base board 17b, and as shown in FIG.
7a is formed on the edge.

The receiving terminal 27 faces in the same direction as the transmitting terminal 23, and the end of the routing portion 25 of the receiving line 26 is provided on the surface of the receiving side routing board 29b opposite to the receiving terminal 27. I have. The receiving terminal 27 and the transmitting terminal 23 are provided as far away from each other as possible to prevent transmission / reception interference. As shown in FIG. 12, the receiving-side routing board 29b includes
, And each routing portion 25 is connected to each reception terminal 27 through the through hole 85.

The routing portion 25 is formed by a conductor pattern on the inner insulating layer 82 of the receiving-side routing substrate 29b.
One end is connected to the corresponding receiving terminal 27. The other end of the routing unit 25 has a circular conductive pad similarly to the routing unit 25 of the transmission line 22. Like the transmission line 22, the wire 28 is connected to the conductive pad at the end of the corresponding folded portion 26a and the conductive pad at the end of the routing portion 25 by soldering using solder. .

Similarly to the transmitting side, the outer insulating layer 83 of the receiving-side folded substrate 29a and the receiving-side routing substrate 29b is formed by the folded portion 22a on the end side other than the conductive pads 31 and 33, respectively.
And the outer shield layer 84
Are provided on each insulating layer 83.

The matrix sensor 20 has a transmission-side folded substrate 19a, a transmission-side routing substrate 19b, and a transmission line 22 attached to one surface of a transmission-side glass base substrate 17c with a transparent adhesive, and covers the upper side. The outer glass plate 17d is bonded with a transparent adhesive as described above.

The outer glass plate 17d covers each outer shield layer 84 so as to cover one surface of the transmission-side glass base substrate 17c. Therefore, the soldered portion of the wire 28 with the solder 34 is accommodated in the space between the transmission-side folded substrate 19a and the transmission-side routing substrate 19b and the outer glass plate 17d.

On one side of the receiving-side glass base substrate 17b, a receiving-side folded substrate 29a, a receiving-side routing substrate 29b, and a receiving line 26 are bonded and arranged with a transparent adhesive.
An internal protective glass plate 17a is attached with a transparent adhesive so as to cover the upper surface.

The inner protective glass plate 17a covers one surface of the receiving-side glass base substrate 17b and covers each outer shield layer 84.
On top of. For this reason, the receiving-side folded board 29a
And the internal protective glass plate 17 from the receiving side routing board 29b.
The soldered portion of the wire 28 by the solder 34 is accommodated in the interval up to a.

The inner glass body 17 is connected to the other surface of the transmission-side glass base substrate 17c and the reception-side glass base substrate 17c.
b is bonded to the other surface with a transparent adhesive. Thus, the transmission line 22 is sandwiched between the transmission-side glass base substrate 17c and the outer glass plate 17d, and the reception line 26 is sandwiched between the inner protection glass plate 17a and the reception-side glass base substrate 17b. I have. Also, the transmission line 22
And the receiving line 26 are arranged on the opposite surfaces of the inner glass body 17.

A transparent conductive film for shielding is additionally provided on the entire surface of the outer glass plate 17d on the front side of the plurality of transmission lines 22. The transparent conductive film is formed by depositing a film of indium oxide (ITO) or a film of tin oxide on the outer glass plate 17d.

The pattern of the matrix sensor 20 suitable for the ordinary pachinko game machine 10 is as follows.
The reception line 26 has 32 columns, and the number of the detection units 20a is 1 in total.
There are 024 patterns. The thickness of the wires constituting the transmission line 22 and the reception line 26 is preferably set to a value of 25 μm to 30 μm.

As shown in FIGS. 14 and 15, the matrix sensor 20 is provided with a connector mounting plate 32 at the lower ends of the receiving glass base substrate 17b and the transmitting glass base substrate 17c. Connector mounting plate 32
Are integrally fixed to the inner glass body 17 with the lower end of the inner glass body 17 sandwiched from both sides by the pressing portions 32a.

As shown in FIGS. 4 and 5, the transmission / reception board 61 is attached to the lower end of the inner glass body 17 of the matrix sensor 20. The transmission / reception board 61 is arranged between the surface glass body 16 and the matrix sensor 20. The transmission / reception board 61 includes a mounting board 61a formed of a printed board mounted on both sides.

As shown in FIG. 14 and FIG.
Matrix I / O case 3 to cover the receiving board 61
5 are provided. The transmission / reception board 61 and the matrix I / O case 35 are mounted on the connector mounting plate 32 with screws 36 and nuts 38.

The transmitting circuit 40, the receiving circuit 50, and the connecting connector 37a of the transmitting connector and the receiving connector 37 are mounted on the mounting board 61a of the transmitting / receiving board 61. Connection connector 37a of transmission connector 37
Are mounted on the transmitting side routing board 19b by surface mounting by soldering.
Are mounted on the receiving-side routing board 29b by surface mounting by soldering.

The transmission connector 37 is connected to the transmission terminal 23 of each transmission line 22, and connects each transmission terminal 23 to the transmission circuit 40. The reception connector 37 is connected to the reception terminal 27 of each reception line 23, and connects each reception terminal 27 to the reception circuit 50.

The transmission circuit 40 is a circuit for sequentially transmitting a signal of a predetermined frequency to the plurality of transmission lines 22 of the matrix sensor 20, and the reception circuit 50 sequentially transmits signals from the plurality of reception lines 26 in synchronization with the transmission circuit 40. It is a circuit for receiving. As a voltage waveform to the transmission line 22 by the transmission circuit 40, a continuous sine wave centered on 0 V at a frequency of 1 to 1.3 MHz is preferable.

FIGS. 16 to 19 show a signal processing system constituting a pachinko ball detecting device for detecting pachinko balls.
As shown in FIG. As shown in FIG. 16, the matrix sensor 20 is under the control of a CPU memory control board 62 via a matrix I / O transmission / reception board 61. The CPU memory control board 62 constitutes a data processing device and can communicate with a communication line 69. In addition, the CPU memory control board 62
The PU unit 30 has an interface section 66 for reading monitoring points from the RAM card 63.

The card 63 is a memory card of a monitoring memory which stores a monitoring point of a pachinko ball in a readable manner and is detachable from the interface unit 66. Card 63
Are data of the safe holes 14a, 14a... And hit ball detection positions and the positions of the out holes 15 provided on the board surface of the pachinko game machine 10, and a detection algorithm for pachinko balls entering the safe holes 14a, 14a. Are recorded as monitoring data.

The option 64 connected to the CPU memory control board 62 corresponds to the pachinko game machine 10
This is a device for recording the trajectory of a pachinko ball moving around between the board surface 11 and the inner glass body 17. The recorded data is applied to a computer incorporating software for analyzing the trajectory of a pachinko ball, and is subjected to arithmetic processing, whereby necessary data can be obtained in a pachinko game hall (hall).

As shown in FIG. 17, the transmission circuit 40 includes a transmission connector 41, an amplifier 42 and a channel switching logic 43 connected to the transmission connector 41, and an amplifier 42.
And an analog multiplexer 44 connected to the channel switching logic 43 and a plurality of, specifically 32 connected to the transmission line 22 side of the 32 circuits via the transmission connector 37 while being connected to the analog multiplexer 44.
It is composed of two PNP + NPN totem pole drivers 45.

As shown in FIG. 18, the receiving circuit 50 includes a plurality of, specifically, 32 CT transformers (current transformers) 51 connected to the receiving line 26 of the 32 circuits via the receiving connector 37. , An analog multiplexer 52 connected to a CT transformer 51, and an analog multiplexer 52
53 and channel switching logic 5 connected to
4 and a receiving connector 55 connected to the amplifier 53 and the channel switching logic 54. Therefore, the receiving circuit 50 receives a signal from each receiving line 26 via each CT transformer 51.

The CT transformer 51 insulates each reception line 26 from the analog multiplexer 52 and amplifies the signal from each reception line 26 by 10 times. The analog multiplexer 52 sequentially receives signals from the respective CT transformers 51, and the amplifier 53 amplifies signals from the analog multiplexer 52. The channel switching logic 54 is a member similar to the channel switching logic 43 of the transmission circuit 40.

As shown in FIG. 19, the CPU memory control board 62 includes a CPU unit 30 on the transmitting side.
A CPU connector 46 connected to the
A sequence control circuit 47 for transmitting a transmission clock in accordance with a start signal from the CPU unit 30 via the CPU, and a band-pass filter 4 for receiving the transmission clock and transmitting the transmission signal.
8 and an amplifier 4 for amplifying the transmission signal and sending it to the transmission connector
9.

The CPU memory control board 6
On the receiving side, an amplifier 71 for amplifying the reception signal from the reception connector 55, a band-pass filter 72 for receiving the amplified signal, a full-wave rectifier / amplifier 73 for receiving the reception signal from the band-pass filter 72, Wave rectifier / amplifier 7
Two-stage low-pass filter 74 that receives the received signal from
a, 74b, an A / D converter 75 that receives a received signal from the low-pass filter 74b and sends digital data to the bidirectional RAM 76 under the control of the sequence control circuit 47, and receives the digital data and controls it by the sequence control circuit 47. Then, the received data is written, and the received data is written into the CPU in accordance with a read signal from the CPU connector 46.
And a bi-directional RAM 76 for sending to the CPU unit 30 via the connector 46.

The bi-directional RAM 76 is a memory for storing the position of the pachinko ball as detection data of the detection unit 20a by each transmission line 22 and each reception line 26 based on a signal from the reception circuit 50, and has an internal memory. It has a counter, and all the processing of the matrix data of pachinko balls is performed by the counter. Further, the CPU memory control board 62 has a power supply unit 77.

The CPU unit 30 reads the monitoring area data of the card 63, reads the detection data of the bidirectional RAM 76, and monitors the pachinko balls by associating the detection data with the monitoring area data of the pachinko balls. .

Next, the operation will be described. The transmission line 22 and the reception line 26 are connected to the folded portion 22a, the transmission terminal 23, and the routing portion 25.
And the wire 28, and the matrix sensor 20
Can be made inconspicuous by the wire 28. In addition, since the wire 28 can be easily formed to have a uniform thickness, the detection accuracy can be improved, and the manufacturing cost can be reduced as compared with the case where the wire 28 is manufactured using a conductor pattern.

Since the transmission line 22 and the reception line 26 have the conductive pads 31 and 33 at the end of the folded portion 22a and the other end of the routing portion 25, when the wire 28 is connected,
The conductive pads 31 and 33 absorb the error of the connection position, and the manufacture becomes easy. In particular, since the conductive pad 31 at the end of the folded portion 22a extends in the length direction of the wire 28,
When the wire 28 is connected to the conductive pad 31, the conductive pad 31 absorbs an error in the connection position in the length direction of the wire 28, and the manufacturing becomes easier.

The distance from the transmission-side folded board 19a and the transmission-side board 19b to the outer glass plate 17d, the reception-side folded board 29a and the reception-side board 29b
And the wire 28
Since the soldered portion by the solder 34 is contained, the soldered portion does not become an obstacle in providing the outer glass plate 17d and the inner protective glass plate 17a, and the glass plate 17a,
The fixing of 17d is ensured.

Next, detection of pachinko balls by the matrix sensor 20 will be described.

The address signal and the control signal from the CPU unit 30 pass through the CPU connector 46,
It is transmitted to the matrix sensor 20.

In the matrix sensor 20, on the transmitting side, the sequence control circuit 47 receives a start signal and outputs a 16 MHz signal.
The transmission clock is output by dividing the original clock of z as necessary. The transmission clock from the sequence control circuit 47 is subjected to waveform shaping from a digital signal to an analog signal by a band-pass filter 48, amplified by an amplifier 49, and sent to a transmission connector 41.

Further, the transmission signal is amplified by the amplifier 42 in the transmission circuit 40. Analog multiplexer 44
Is a channel that is switched by the channel switching logic 43, and sequentially operates the totem pole driver 45, whereby the totem pole driver 45 sequentially outputs the signal amplified by the amplifier 42 to the transmission line 22 at a predetermined cycle. (See step 91 in FIG. 20).

In the matrix sensor 20, the transmitting circuit 40
When a signal of a predetermined frequency is sequentially transmitted to a plurality of folded transmission lines 22 to generate a magnetic field, an electromotive force is generated in a reception line 26 electromagnetically coupled to the transmission line 22 by a mutual induction action. . At this time, when the pachinko ball, which is a metal, approaches the detection unit 20a of the matrix sensor 20,
An eddy current is generated on the surface of the pachinko ball in a direction to cancel the magnetic flux generated by the matrix sensor 20. The impedance of the transmission line 22 changes due to the influence of the eddy current, thereby changing the current. In response, the reception line 26 changes the magnitude of the electromotive force.

On the receiving side, the receiving circuit 50 receives a signal from each receiving line 26 via each CT transformer 51 in synchronization with the transmitting circuit 40 by the sequence control circuit 47. As shown in FIG. 18, currents that are electromagnetic characteristic values appearing on the plurality of reception lines 26 are amplified ten times by the CT transformer 51.

The analog multiplexer 52 switches signals from the respective receiving lines 26 through the CT transformer 51 by the channel switching logic 54 and sequentially outputs the signals at a predetermined cycle. The signal from the analog multiplexer 52 is amplified 100 times by the amplifier 53 (FIG. 20).
See step 92).

The received signal is transmitted to the receiving connector 55 and the amplifier 7
1. Amplification and detection are performed via the band-pass filter 72. The received signal from the bandpass filter 72 is an analog signal, and this analog signal is
Waveform shaping is performed by the full-wave rectifier / amplifier 73. The signal from the full-wave rectifier / amplifier 73 is supplied to a low-pass filter 7.
At 4a and 74b, averaging is performed by integration processing.

Next, the received signal is supplied to the A / D converter 75
Sent to The A / D converter 75 converts a signal from the matrix sensor 20 into a digital signal in a predetermined bit unit such as 12 bits, and controls the sequence control circuit 63 to record the detection data in the bidirectional RAM 76 (step in FIG. 20). 93).

The processing speed is as high as 25,000 times per second. The bidirectional RAM 76 records the detection data irrespective of the operation of the CPU unit 30 by the write signal from the sequence control circuit 63, and then increases the address by +1 by inputting one clock (see step 94 in FIG. 20). . The capacity of the bidirectional RAM 76 is, for example, 2048 bytes.

Next, the analog multiplexer 52 of the receiving circuit 50 switches the signal from each receiving line 26 (FIG. 20).
(Refer to step 95), 32 according to the 32 reception lines 26
The above steps are repeated once (see step 96 in FIG. 20). After 32 repetitions, the analog multiplexer 44 of the transmission circuit 40 switches the transmission line 22 (see step 97 in FIG. 20), and repeats the signal processing again.

In this way, the reception line 26 in which the reception signal has changed
., Transmitted at that time are detected by scanning, and the position of the pachinko ball in the matrix sensor 20 can be grasped as coordinates from the intersection. The number of the detection units 20a is 32 for the transmission line 22.
Since the total number of rows and reception lines 26 is 1024 in 32 columns,
Even if the pachinko ball passes through any of the safe holes 14a and the out holes 15 of the board 11, it can be detected.

The bidirectional RAM 76 determines the position of the pachinko ball in the matrix sensor 20 from the intersection of the reception line 26 where the reception signal has changed and the transmission line 22 transmitted at that time based on the signal from the reception circuit 50. It is stored as detection data of the detection unit 20a by each transmission line 22 and each reception line 26.

The CPU unit 30 reads the detection data relating to the position of the pachinko ball recorded in the bidirectional RAM 76 by a read start signal as necessary, performs an arithmetic process, and converts the detection data into the pachinko ball stored in the card 63. The pachinko balls are monitored in correspondence with the monitoring data.

CPU unit 30 repeats this process. The matrix sensor 20 can follow the movement of the pachinko ball on the board 11 of the pachinko game machine 10 as a change in coordinates. Pachinko game machine 10
Then, the progress of the game is monitored by the matrix sensor 20, and the status of the hit ball, the out ball, and the safe ball of the winning prize device 14b is known. It can be used as data.

The elongated conductive pad extending in the length direction of the wire may be either the end of the folded portion or the end of the routing portion, or may be both.

The inner glass body 17 is formed of a four-layer structure of an inner protective glass plate 17a, a receiving glass base substrate 17b, a transmitting glass base substrate 17c, and an outer glass plate 17d. 17b
In addition, the transmission-side glass base substrate 17c may be configured as a single sheet to form a three-layer structure.

[0085]

According to the pachinko ball detection device and the pachinko game machine of the present invention, the transmission line and the reception line
Since it is composed of the folded portion, the transmitting terminal, the routing portion and the wire, the matrix sensor can be made thin so as not to be noticeable by the wire. Further, since the wire can be easily made to have a uniform thickness, the detection accuracy can be improved, and the manufacturing cost can be reduced as compared with the case where the wire is formed by a conductor pattern.

Further, the transmission line and the reception line have conductive pads at the end of the folded portion and the other end of the routing portion, and when the wires are connected, the conductive pads can absorb errors in connection positions. Therefore, the manufacture of the matrix sensor becomes easy.

When the conductive pad extends in the length direction of the wire, when connecting the wire, the conductive pad can absorb an error in the connection position in the length direction of the wire. Becomes easier.

In the case where the soldered portion of the wire is placed in the interval from the transmitting side folded substrate, the transmitting side folded substrate, the receiving side folded substrate, and the receiving side folded substrate to the protective glass, the solder is provided for providing the protective glass. Since the attachment portion does not become an obstacle, the fixing of the protective glass becomes more reliable.

In the pachinko game machine, the movement of the pachinko ball on the board can be tracked as a change in coordinates by the pachinko ball detection device.

[Brief description of the drawings]

FIG. 1 is a detailed front view of a transmission line of a pachinko ball detection device according to an embodiment of the present invention.

FIG. 2 is a conceptual exploded perspective view of the pachinko game machine and the pachinko ball detection device according to one embodiment of the present invention.

FIG. 3 is a front view of the pachinko game machine according to the embodiment of the present invention in a state where an attachment frame is opened.

FIG. 4 is a schematic front view of a pachinko ball detection device according to one embodiment of the present invention.

FIG. 5 is a schematic side view of a pachinko ball detection device according to one embodiment of the present invention.

FIG. 6 is a partial vertical sectional view of the pachinko game machine of one embodiment of the present invention.

FIG. 7 is an enlarged cross-sectional view taken along the line VII-VII of FIG. 1, showing a connection state of wires of a transmission line of the pachinko ball detection device according to one embodiment of the present invention.

FIG. 8 is a front view showing a transmission-side glass base substrate of the pachinko ball detection device according to one embodiment of the present invention.

FIG. 9 is a front view showing a receiving-side glass base substrate of the pachinko ball detection device according to one embodiment of the present invention.

FIG. 10 is a front view showing a transmission side routing board of the pachinko ball detection device according to one embodiment of the present invention.

FIG. 11 is a front view showing a transmission-side folded substrate of the pachinko ball detection device according to one embodiment of the present invention.

FIG. 12 is a front view showing a receiving-side routing board of the pachinko ball detection device according to one embodiment of the present invention.

FIG. 13 is a front view showing a receiving-side folded substrate of the pachinko ball detection device according to one embodiment of the present invention.

FIG. 14 is a sectional view taken along line XIV-XIV of the pachinko ball detection device shown in FIG. 4 according to one embodiment of the present invention.

15 is a sectional view of the pachinko ball detecting device shown in FIG. 4 taken along the line XV-XV of one embodiment of the present invention.

FIG. 16 is a schematic configuration diagram of a pachinko ball detection device according to one embodiment of the present invention.

FIG. 17 is a block diagram of a transmission circuit of a matrix I / O transmission / reception board according to one embodiment of the present invention.

FIG. 18 is a block diagram of a receiving circuit of a matrix I / O transmitting / receiving board according to one embodiment of the present invention.

FIG. 19 is a block diagram of a reception and transmission circuit of the CPU memory control board according to one embodiment of the present invention.

FIG. 20 is a flowchart of scanning of the pachinko ball detection device according to one embodiment of the present invention.

[Explanation of symbols]

B: Pachinko ball, 10: Pachinko game machine, 11: Board surface, 14a: Safe hole, 15: Out hole, 17: Inner glass body, 17a: Internal protective glass plate, 17b: Receiving glass base substrate, 17c: Transmitting side Glass base substrate, 1
7d: outside glass plate, 19a, 29a: folded substrate, 19
b, 29b: routing board, 20: matrix sensor, 20
a: detection unit, 22: transmission line, 22a, 26a: folded part, 23: transmission terminal, 25: routing part, 26: reception line, 2
7 ... receiving terminal, 28 ... wire, 30 ... CPU unit,
31, 33: conductive pad, 40: transmitting circuit, 50: receiving circuit, 61: matrix I / O transmitting / receiving board, 62
... CPU memory control board, 81 inner shield layer, 82 inner insulating layer, 83 outer insulating layer, 84 outer shield layer.

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-2-279186 (JP, A) JP-A-2-279190 (JP, A) JP-A-60-122587 (JP, A) (58) Field (Int.Cl. ⁶ , DB name) A63F 7/02

Claims (4)

(57) [Claims] 1. A pachinko ball detection device provided along a board of a pachinko game machine, wherein a plurality of parallel folded transmission lines are attached to one side of a substantially square glass base substrate, and electromagnetic characteristics are obtained by approaching the pachinko balls. A plurality of parallel folded reception lines, which vary, are electromagnetically coupled to the transmission lines in a crossing direction and arranged on the opposite surface of the glass base substrate, and an enclosing portion of each transmission line and each reception line Forming a planar matrix sensor having a detection unit in the glass base substrate, providing a transmission-side folded substrate, a transmission-side folded substrate, a reception-side folded substrate, and a reception-side folded substrate, The side turn-back board and the transmission side routing board,
The glass base substrate is provided so as to face the end of the one surface, and the receiving-side folded substrate and the receiving-side laid substrate are the glass base in a direction crossing the transmitting-side folded substrate and the transmitting-side laid substrate. The transmission line and the reception line are provided so as to face each other at an end of the opposite surface of the substrate, and the transmission line and the reception line are configured by a folded portion, a transmission terminal, a routing portion, and a wire. The transmission terminal is formed on the transmission-side folded board by a conductor pattern, the transmission terminal is formed on the transmission-side routing board, and the transmission line routing section is formed on the transmission-side routing board. The receiving line is formed with a conductor pattern on the receiving-side folded substrate, and the receiving terminal is connected to the receiving side. Formed on the routing board The routing part of the reception line is formed of a conductor pattern on the reception-side routing board, and one end is connected to the corresponding reception terminal. The transmission line and the reception line are connected to the end of the folded part. And a conductive pad at the other end of the wiring part, and the wire is connected to the corresponding conductive pad of the folded part and the conductive pad of the wiring part, Pachinko ball detector. 2. The transmission line and the reception line, wherein the conductive pad of at least one of the end of the folded portion and the other end of the routing portion extends in a length direction of the wire. The pachinko ball detection device according to claim 1, wherein 3. The transmission-side folded board, the transmission-side folded board, the reception-side folded board, and the reception-side folded board are each connected to the conductive pad by soldering. An insulating layer on the folded portion and the wiring portion other than the conductive pad, a shield layer on each insulating layer, and covering the one surface of the glass base substrate and covering each shield layer. A transmission-side protection glass is provided on the one surface, and a reception-side protection glass that covers the opposite surface of the glass base substrate and extends over each shield layer is provided on the opposite surface. The transmission-side folded substrate and the transmission-side routing Soldering portions of the wires are accommodated in an interval from the substrate to the transmission-side protection glass and an interval from the reception-side folded substrate and the reception-side routing substrate to the reception-side protection glass. The pachinko ball detection device according to claim 1. 4. A pachinko game machine wherein the pachinko ball detecting device according to claim 1, 2 or 3 is mounted on a mounting frame of an inner glass body along the board surface.