JPH05226467A - Chip dividing method of semiconductor wafer - Google Patents

Abstract

PURPOSE:To enable a semiconductor device provided with an air-bridge wiring to be broken high in yield. CONSTITUTION:A semiconductor wafer 1 is pasted on an adhesive tape 2 and cut into chips 7 in a semi-full cut state through a dicing device, and a protective tape 3 is pasted thereon. Then, dicing traces 5' are continuously pushed up with a jig 4 of continuously disposed needles following a sequence as shown in a figure 1 (g), whereby the semiconductor wafer 1 is broken, extended, and divided into chips 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for dividing a semiconductor wafer into chips, and more particularly to a semiconductor wafer including a semiconductor device having air bridge wiring.

[0002]

2. Description of the Related Art In the conventional chip dividing method for a semiconductor wafer, a semiconductor wafer 1 is attached to an adhesive tape 2 as shown in FIG. 3 (a), and then a semiconductor is cut by a dicing device as shown in FIG. 3 (b). The wafer 1 is put into a half-cut state and the protective tape 3 is attached. Next, the semiconductor wafer 1 is sandwiched by rollers 6 as shown in FIG. 3C, and the adhesive tape 2 is extended to divide the chip 7 as shown in FIG. 3E. As a second dividing method, the semiconductor wafer 1 is attached to the adhesive tape 2 as shown in FIG. 4 (a), and then the semiconductor wafer 1 is half-cut by a dicing device as shown in FIG. 4 (b). And put the protective tape 3 on. Next, FIG. 4 (c)
The adhesive tape 2 is broken by rubbing it from the back side of the adhesive tape 2 with a needle jig 4 such as
Is extended to divide the chip 7.

[0003]

In the conventional method of dividing a semiconductor wafer into chips described above, a semiconductor wafer of a semiconductor device having an air bridge wiring is half-cut using a dicing device and then sandwiched by a roller for braking. However, there is a problem that the yield is reduced by crushing or destroying the air bridge wiring. Further, in the second division method, there is a problem in that a defective appearance causes a drop in yield due to dirt, chips, and scratches on the chip during braking.

[0004]

A method of dividing a semiconductor wafer into chips according to the present invention comprises a step of attaching a semiconductor wafer to an adhesive tape, a step of dicing the semiconductor wafer into a semi-full cut state, and a needle-shaped jig. The method includes a step of continuously pushing up the dicing trace of the semiconductor wafer from the back side by using at least one or more and braking, and a step of stretching the adhesive tape.

[0005]

The present invention will be described below with reference to the drawings. FIG. 1 is a process drawing showing a method of dividing a semiconductor wafer into chips according to a first embodiment of the present invention. The semiconductor wafer 1 is attached to the adhesive tape 2 as shown in FIG. Next, as shown in FIG. 1B, the semiconductor wafer 1 is cut into a semi-full cut state by a dicing device, and the protective tape 3 is attached. Next, as shown in FIG. 1C, the needle jigs 4 arranged continuously are used to
Braking is performed by successively pushing up the dicing marks 5'from the back side of the semiconductor wafer 1 with the needle jig 4 in the route as shown in FIG.
In the step shown in FIG. 1B, braking is performed in the direction orthogonal to the needle jig 4 as shown in FIG. 1H, and then the adhesive tape 2 is stretched as shown in FIG. To do. According to this embodiment, the appearance defect due to braking is 12
It was possible to reduce by about%.

FIG. 2 is a process diagram showing a method of dividing a semiconductor wafer into chips according to a second embodiment of the present invention. Figure 2
As shown in (a), the semiconductor wafer 1 is attached to the adhesive tape 2
Stick to. Next, as shown in FIG. 2B, the semiconductor wafer 1 is cut into a semi-full cut state by a dicing device, and the protective tape 3 is attached. Next, using the needle jigs 4 that are continuously arranged as shown in FIG. 2C, the semiconductor wafer 1 is routed as shown in FIGS. 2G and 2H.
Braking is performed by raising the dicing trace 5'from the back side of the needle by moving the needle jig 4 linearly and raising it in the parallel and vertical directions to the orientation flat.
Next, as shown in FIG. 2F, the adhesive tape 2 is stretched to divide the chip 7. According to this example, the appearance defect due to braking could be reduced by about 12%.

[0007]

As described above, according to the present invention,
It is possible to prevent the air bridge wiring from being crushed and broken during braking of the semiconductor device having the air bridge wiring, and to reduce appearance defects due to bracing.

[Brief description of drawings]

FIG. 1 is a process diagram (a) to (h) showing a chip dividing method according to a first embodiment of the present invention.

FIG. 2 is a process diagram (a) to (h) showing a chip dividing method according to a second embodiment of the present invention.

FIG. 3 is a process diagram (a) showing a conventional chip dividing method.
(E).

FIG. 4 is a process diagram (a) showing another conventional chip dividing method.
~ (E).

[Explanation of symbols]

 1 Semiconductor Wafer 2 Adhesive Tape 3 Protective Tape 4 Needle Jig 5 Dicing Trace 5'Dicing Trace (Back) 6 Roller 7 Chip

Claims (1)

[Claims] 1. A step of attaching a semiconductor wafer to an adhesive tape, a step of dicing the semiconductor wafer into a semi-full cut state, and a dicing trace of the semiconductor wafer continuously using at least one or more needle jigs. A method of dividing a semiconductor wafer into chips, which comprises a step of pushing up the substrate from the back side and braking, and a step of stretching the adhesive tape.