JPH04186646A - Marking method for semiconductor device and fixing method for the semiconductor device - Google Patents

Abstract

PURPOSE:To contrive the effective utilization of a mark and to mark a semiconductor device of good quality by marking a good identification marking member on the rear of a non-defective semiconductor device. CONSTITUTION:In a semiconductor device main surface 23 where many semiconductor devices 22 are formed in a wafer 21 and the circuit function of those semiconductor devices is formed, probing is conducted for the purpose of judging whether the circuit function of the semiconductor device 22 forming a unit is good or not. That is, a prober terminal 25 is brought into contact with an external lead-through electrode formed on the main surface of the unit semiconductor device 22 and a controller 30 electrically judges whether the circuit function is good or not. As the result of that judgment, when the semiconductor device has the predetermined circuit function, a punch 40 is driven by the output from a driving circuit 34 via the controller 30 to strike a tape 43 composed of good identification marking member to stick the good identification marking member 28 on the rear 24 of a non-defective semiconductor device 26 so that the semiconductor device can be identified as non-defective.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a marking method for determining the function of a semiconductor element incorporated in a semiconductor device and a method for fixing the semiconductor element.

(Prior art) Conventionally, as a technology in this field, for example,
There was one described in the -8140 publication.

FIG. 2 is a perspective view of a conventional marking device for semiconductor devices.

In this figure, IO is an identification tape, and the bottom surface is an adhesive surface. This identification tape 10 is wound around a delivery reel 11 for an appropriate length. A take-up reel 12 is arranged in front of the delivery reel 11 and sequentially takes up the identification tape 10 from the leading end side.

A bunch 13 is placed above the identification tape IO stretched between the delivery reel 11 and the take-up reel 12, and is attached to a bunch holder 14 that is movable up and down.

The bunch 13 has a diameter smaller than that of a semiconductor tip formed on a semiconductor wafer (hereinafter simply referred to as a wafer) 5, and has a sharp lower edge 13a and a flat lower end surface 13b.

Here, as shown in FIG. 4, the identification tape 10 used has a magnetic material 16 adhered to its surface.

When the identification tape 10 to which the magnetic material 16 is adhered is used, the magnetic material 16 is adhered to the identification tape piece 10a affixed to the defective semiconductor pellet 6 during pellet mounting. Using this method, it is possible to automatically sort and remove defective products by means such as magnetic attraction.

The marking device with the above structure wraps the leading end of the identification tape 10 around the take-up reel 12, and then reels it onto the delivery reel! The identification tape 10 is stretched to an appropriate length between the wafer 5 and the take-up reel 12, and placed above the wafer 5 on which a large number of semiconductor pellets 6 have been formed. 7) 6.6
Performs characteristic inspection of...

When a defective semiconductor pellet 6 is detected as a result of the inspection,
Identification tape 10 and bunch 1 onto the semiconductor pellet 6
3, then the punch holder 14 is moved, and as shown in FIG. 3(a), the identification tape 10 is punched out with the bunch 13, and the punched identification tape piece tOa is
As shown in FIG. 3(b), the lower end surface 13b of the bunch 13
is pressed onto the surface of the defective semiconductor pellet 6. Thereafter, when the punch holder 14 is raised and the bunch 13 is removed from the identification tape 10, the winding wheel 12 rotates to wind up the identification tape 10 a little, and the perforated portion 15 is shifted from the bunch 13.

Each time a defective semiconductor pellet 6 is detected, the above operation is repeated to attach an identification tape piece 10a to the surface of the defective semiconductor pellet 6.

After the inspection, the wafer 5 is sent to a pellet mounting process, where each semiconductor pellet 6, 6, . . . is divided and individually mounted on a lead frame or the like. At the time of pellet mounting, the semiconductor pellet to which the identification tape piece 10a is attached is excluded.

(Problem to be Solved by the Invention) However, in the marking device having the above configuration, a magnetic material identification mark is attached to defective products and automatically sorted and removed by means such as magnetic attraction. Since the marks are affixed to defective products, after sorting, the affixed marks must be discarded along with the semiconductor elements with defective circuit functions, which poses an economical problem.

In order to eliminate the above-mentioned problems, the present invention makes it possible to effectively utilize the marking material by marking the back surface of a non-defective semiconductor element instead of the main surface on which the circuit is formed.
Moreover, it is an object of the present invention to provide a method for marking a semiconductor element with high quality and a method for fixing the semiconductor element.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a method for marking semiconductor elements, including a step of determining whether or not the circuit functions of a large number of semiconductor elements formed on a semiconductor wafer are good or bad. This method includes a step of attaching an identification mark member to the back surface of a non-defective semiconductor element and marking it.

Further, the process includes a process of determining whether the circuit functions of a large number of semiconductor elements formed on a semiconductor wafer are good or bad, and a process of attaching a good identification mark to the back surface of non-defective semiconductor elements using a laser.

Furthermore, the method for fixing semiconductor devices includes a step of determining whether the circuit functions of a large number of semiconductor devices formed on a semiconductor wafer are good or bad, a step of marking a good identification mark member on the back side of the good semiconductor device, and a step of marking the back side of the good semiconductor device. A step of fixing the semiconductor element using the formed good identification mark member is performed.

(Operation) According to the present invention, as described above, the circuit functions of a large number of semiconductor elements formed on a semiconductor wafer are determined to be good or bad, and a good identification mark member is attached to the back surface of the good semiconductor elements to mark them.

In addition, the circuit functions of a large number of semiconductor elements formed on a semiconductor wafer are determined to be good or bad, and a good identification mark is attached to the back surface of the good semiconductor elements using a laser.

Furthermore, the circuit functions of a large number of semiconductor elements formed on the semiconductor wafer are determined to be pass/fail, and a good identification mark member is marked on the back side of the non-defective semiconductor element. to fix.

Therefore, the mark can be used effectively, and high-quality semiconductor elements can be marked.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a block diagram of a probing and marking system for determining the quality of circuit functions of a large number of semiconductor elements formed on a wafer, showing a first embodiment of the present invention. It should be noted that the same components as those in the prior art are given the same numbers and the explanation thereof will be omitted.

In the figure, 21 is a semiconductor wafer, 22 is a semiconductor element, 23 is a semiconductor, the main surface of the element, 24 is the back surface of the semiconductor element, 25 is a prober terminal, 26 is a good semiconductor element, 27 is a defective semiconductor element, and 28 is a good identification a mark member, 29 an A/D converter, 30 a controller, 31 an input interface,
32 is a central processing unit (CPU), 33 is an output interface, 34 is a drive circuit, 40 is a punch, 41 is a feed reel, 42 is a take-up reel, and 43 is a tape consisting of an identification mark member.

In FIG. 1, a wafer 21 includes a large number of semiconductor elements 22.
Blobbing is performed on the main surface 23 of the semiconductor element on which the circuit function is formed, in order to determine the quality of the circuit function of the semiconductor element 22 serving as a unit. That is, the prober terminal 25 is brought into contact with an external lead-out electrode (not shown) formed on the main surface of the unit semiconductor element 22, and the controller 30 electrically determines whether the circuit function is good or bad.

As a result of the determination, if the circuit has a predetermined function, the output from the drive circuit 34 via the controller 30 causes the
The punch 40 is driven to hit the tape 43 made of a non-defective identification mark member on the non-defective semiconductor element 26, thereby pasting the non-defective identification mark member 2B on the back surface 24 of the semiconductor element, thereby identifying the non-defective semiconductor element 26. It can be so.

The good identification mark member 28 is not attached to the semiconductor element 27 whose circuit function is defective.

In the next step, from among the semiconductor elements that have been scribed and divided into individual pieces, the individual pieces without the good identification mark member 28 are excluded as defective products.

FIG. 5 is a block diagram of a probing and marking system for determining the circuit functions of a large number of semiconductor elements formed on a wafer, showing a second embodiment of the present invention. Note that the same numbers are given to the same parts as in the above embodiment, and the explanation thereof will be omitted.

In this embodiment, a laser device 50 is used instead of the punch 40. That is, one terminal of the prober and two
5 in contact with an external lead-out electrode (not shown) formed on the main surface 23 of the unit semiconductor element 22, and the controller 30
The circuit function is determined electrically.

As a result of the determination, if the semiconductor device 26 has a predetermined circuit function, the output from the drive circuit 34 via the controller 30 is driven by a laser and the device 50 to mark a good identification mark 51 on the back surface of the non-defective semiconductor device 26.

By the way, when marking the surface of a defective semiconductor element with a laser as in the past, the molten wafer surface material scatters from the marking area, which becomes instantly hot, and adheres to the main surface of the non-defective semiconductor element. Therefore, defects such as scratches and cracks in the electrode portion occur during wire bonding, scribing, etc.

In this embodiment, such inconvenience can be eliminated.

FIG. 6 is a diagram showing a marking state of a wafer showing a third embodiment of the present invention. It should be noted that the same components as those in the prior art are given the same numbers and the explanation thereof will be omitted.

In this embodiment, a tape 60 made of a good identification mark die-bonding member with an adhesive formed on both sides of a good identification mark member processed into a predetermined shape from a polyester tube, for example, is pressed onto the back surface 24 of the semiconductor element using a punch 40. Then, a good identification mark die bonding member 61 is attached to form a good identification mark. Alternatively, indium metal, which is a relatively soft metal with great adhesive properties, is processed into a tape shape.
It may be used as an identification mark die-bonding member tape, punched into a predetermined shape, and affixed to the back surface of a semiconductor element to be used as an identification mark.

In this way, a non-defective identification mark is formed on the back surface of the non-defective semiconductor element.

Furthermore, when manufacturing a semiconductor element, the identification mark is used as a die bond material and the semiconductor element is fixed to the element mounting part, such as an island or a substrate, by methods such as melting or adhesion. Materials can be used together, simplifying the process and making effective use of resources.

In the first and third embodiments, an upward force is applied to the wafer during marking, so a fixing jig such as a clamper is used to hold the wafer corner in order to receive this force.

Furthermore, the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

(Effects of the Invention) As described above in detail, according to the present invention, a good identification mark member is marked on the back side of a non-defective semiconductor element, so that it is possible to effectively utilize the mark, and to improve quality. It is possible to mark semiconductor devices with high accuracy.

Moreover, by making the identification mark member also serve as a fixing material for non-defective semiconductor elements, the process can be simplified and the semiconductor device can be manufactured at low cost.

Furthermore, since a laser can be used for marking, the working time is quick, the handling is easy, and it is cheaper than, for example, using ink.

[Brief explanation of the drawing]

Fig. 1 is a block diagram of a blobbing and its marking system for determining the circuit functions of a large number of semiconductor elements formed on a wafer, showing a first embodiment of the present invention, and Fig. 2 is a conventional marking apparatus for semiconductor elements. 3 is a diagram of a conventional marking process for semiconductor devices, FIG. 4 is a cross-sectional view of an identification tape used for conventional marking of semiconductor devices, and FIG. 5 is a wafer showing a second embodiment of the present invention. FIG. 6 is a block diagram of a probing and marking system for determining the circuit functions of a large number of semiconductor elements formed in a semiconductor device, and FIG. 6 is a diagram showing a marking state of a wafer showing a third embodiment of the present invention. 21... Wafer, 22... Semiconductor element, 23...
Semiconductor element main surface, 24... Semiconductor element back surface, 25.
... Prober one terminal, 26 ... Good semiconductor element, 27
Defective semiconductor element, 28 Good identification mark member, 29 A/D converter, 30 Controller,
31... Input interface, 32... Central processing unit (CPU), 33... Output interface, 34.
... Drive circuit, 40... Punch, 41... Delivery reel, 42... Take-up reel, 43... Tape made of identification mark member, 50... Laser device, 51...
... Mark, 60... Tape made of good identification mark die-bonding member, 61... Good identification mark die-bonding member. Nノ＼ノFig.6

Claims (3)

[Claims] (1) (a) A process of determining whether the circuit functions of a large number of semiconductor elements formed on a semiconductor wafer are good or bad; (b) A process of attaching a good identification mark member to the back side of a good semiconductor element to mark it. A marking method for semiconductor devices characterized by: (2) (a) A step of determining whether the circuit functions of a large number of semiconductor elements formed on a semiconductor wafer are good or bad; and (b) a step of attaching a good identification mark to the back side of a non-defective semiconductor element using a laser. marking method for semiconductor devices. (3) (a) A process of determining whether the circuit functions of a large number of semiconductor elements formed on a semiconductor wafer are acceptable; (b) a process of marking a good identification mark member on the back side of a non-defective semiconductor element; (c) a process of marking a non-defective semiconductor element; 1. A method for fixing a semiconductor device, comprising the step of fixing the semiconductor device using a good identification mark member formed on the back surface of the device.