JPH05226383A - Automatic bonding device and frame transfer device installed in the device - Google Patents

Abstract

PURPOSE:To obtain an automatic bonding device capable of coping with a modification of the kind of lead frames, which are handled by the automatic bonding device, swiftly and easily by a method wherein a frame relay means is constituted in such a way that its length in the frame transfer direction of an endless-shaped belt to transfer the frames is variable and the like. CONSTITUTION:An automatic bonding device comprises a bonder to perform a bonding work on frames, which respectively hold a semiconductor component, and a loader, in which a plurality of sheets of the frames are arranged and housed and which feeds in order the frames to the bonder, or an unloader to accept and house the frames made to pass through the bonder. Such the automatic bonding device has a frame relay means 41 to transfer and relay the frames between a frame housing part of the loader or the unloader and the bonder. The means 41 has an endless-shaped belt 110 to make contact to the frames to transfer the frames and a drive/transfer means to drive and transfer the belt 110 and the length of the means 41 in the frame transfer direction of the belt 110 is made variable.

Description

Detailed Description of the Invention

[0001]

The present invention relates to, for example, an IC chip,
That is, a bonder for receiving lead frames sequentially supplied while holding semiconductor components and bonding pads (electrodes) of the IC chip and leads provided on the lead frame with wires, and the bonder. The present invention relates to an automatic bonding apparatus equipped with, as a line, an unloader that receives a large number of lead frames that have been subjected to a bonding process one after another and arranges and accommodates them. The present invention also relates to a frame transfer device to be equipped in such an automatic bonding device.

[0002]

2. Description of the Related Art A conventional example of such an automatic bonding apparatus is shown in FIGS. The automatic bonding apparatus is disclosed in, for example, Japanese Patent Laid-Open No. 3-155140.

As shown in FIG. 22, in the conventional device, a die bonder device A ₂ , a curing device B ₂ , three bonders C _{5 to} C ₇ and a magazine stocker device D _{2 are provided.}
However, it is equipped as a line in one line. The die bonder device A ₂ has a large number of IC chips (not shown) obtained by cutting a wafer (not shown).
For example, using a thermosetting adhesive or the like, the lead frame (described later) is sequentially mounted at predetermined positions, and the curing device B _{2 at} the subsequent stage is mounted.
To send to. In addition, the curing device B ₂
Is to receive the lead frame fed from the die bonder device A ₂ , heat it to solidify the adhesive, and then feed it to the bonders C _{5 to} C ₇ in the subsequent stage.

Each of the bonders C _{5 to} C ₇ is a curing device B ₂
After receiving the lead frame, the leads formed on the lead frame and the pads (electrodes) on the IC chip arranged on the lead frame are bonded using a wire made of gold, aluminum or the like. The configuration will be described in detail below. Since each of the bonders C _{5 to} C ₇ has substantially the same structure,
The structure of the second bonder C ₅ will be described in detail, and the description of the remaining two bonders C ₆ and C ₇ will be omitted.

FIG. 23 is a diagram showing the outline of the structure of a lead frame carrying mechanism provided in the bonder C ₅ . In FIG. 23, the bonding head 2 mounted on the main body 201 (illustrated by a chain double-dashed line) of the bonder C ₅
Reference numeral 02 includes a camera having a camera head, a lens, and an illumination lamp, and is mounted on an XY table drive mechanism (not shown) movable in the X and Y directions. The bonding head 202 is a component to be bonded on a bonding stage (this bonding stage refers to a bonding work part for performing bonding connection and a stage part on which a plurality of chips before and after the chip are mounted and conveyed). The IC chip is imaged and the leads of the lead frame and the pads on the IC chip are bonded and connected. The lead frame on which the IC chip imaged by the bonding head 202 is arranged is the first
Guide rail 203a and second guide rail 203
The positioning is adjusted to the optimum spacing position by b. The distance between the first and second guide rails 203a and 203b and both ends of the lead frame is set to about 0.1 mm. The first and second guide rails 203a and 20
A third transport mechanism 204 is provided in parallel with 3b.
The third transport mechanism 204 is provided with two pairs of rollers 204a and 204b pivotally supported by one shaft, and the two belts 2 wound between the rollers 204a and 204b.
04c and 204d, the roller 204b is formed of a double roller, and the roller 204b and another roller 204e other than the above are stretched by a belt 204f.
The roller shaft and the shaft of the drive motor 204g are connected and driven. The belt 204 of the third transport mechanism 204 is driven by the rotational driving force of the drive motor 204g.
c and 204d are configured to be rotatable in the forward and reverse directions. A detection sensor 205 for detecting the arrival of the lead frame is arranged near the unloader side (lead frame feeding direction side) in the center between the two belts 204c and 204d. The detection sensor 205 is composed of a reflective optical sensor or the like.

Next, the transfer means on the loader side (lead frame receiving side) will be described. The transfer means on the loader side is composed of first and second transfer mechanisms 206 and 207. The first and second transport mechanisms 206 and 207
Are driven by one motor 208.

First, the first and second transport mechanisms 206 and 207 are provided in parallel on the loader unit 209 in a direction parallel to the longitudinal direction of the first and second guide rails 203a and 203b. This loader unit 20
The end of 9 is the shaft 210 of the cylinder 210 for front-back slide.
It is connected to the tip of a and is configured to be movable on the upper surface of the main body 201 of the bonder C _{5 in} a direction orthogonal to the longitudinal direction of the first and second guide rails 203a and 203b. Timing control in the forward and backward movement of the cylinder (switching means) 210 is controlled by a control circuit including a microprocessor (not shown), and the front and rear positions of the cylinder are the first and second transfer mechanisms 206 and 20.
7 center and the first and second guide rails 203a, 20
It is controlled so that the center of 3b and the center of the third transport mechanism 204 (the portion indicated by the alternate long and short dash line) coincide with each other. It goes without saying that the control of the center position is adjustable. The first and second transport mechanisms 206 and 207
Has a configuration substantially the same as that of the third transport mechanism 204 described above, and has a pair of rollers 206a, 20a supported by one shaft.
A pair of 6b is provided, and a transport mechanism composed of two belts 206c and 206d that are stretched between the rollers 206a and 206b is provided in parallel. The first and second transport mechanisms 206 and 207 are connected to each other, and the roller 206b of the first transport mechanism 206 is a double roller.
06b and the roller 206e other than the above are used for the belt 20.
6f, the shaft of the roller 206e and the shaft of the drive motor 208 are connected to each other, and the first and second transport mechanisms 2 are connected.
06 and 207 are configured to be rotationally driven coaxially. In addition, the first and second transport mechanisms 206 and 20
7 includes first and second guide rails 203a and 203
Lead frame detection sensors 211 and 212 are arranged in the vicinity of the lead frame supply side to b.

Next, the fourth and fifth transport mechanisms 213 and 214 are the first and second transport mechanisms 206 and 20 described above.
It has the same structure as the No. 7 and is provided on the unloader side. The third and fourth transfer mechanisms 213 and 214 are also driven by one motor similarly to the first and second transfer mechanisms 206 and 207, but drive the fourth and fifth transfer mechanisms 213 and 214. It may be driven by a driving motor for driving. In addition, the lead frame detection sensor 21
5a and 215b are arranged on the lead frame discharge side, that is, near the tip of the belt in FIG.

Next, FIGS. 24 and 25 are sectional views showing the detailed structure of the loader unit in which the first and second transfer mechanisms shown in FIG. 23 are mounted in a direction orthogonal to the lead frame transfer direction. is there.

In FIG. 24, the first base 217 is fixed on the main body 201 of the bonder C ₅ . This first
A cam 218 is disposed on the base 217 of the. A continuous inclined surface is formed at the center of the cam surface of the cam 218 so that it can be moved linearly.
Further, on the left side of the first base 217, a support frame 22 that supports the front-rear slide cylinder 210 (216).
0 is provided vertically. A second base 221 having a substantially U-shaped cross section is connected to the tip of the shaft of the cylinder 210. A connecting shaft 222 that connects the first and second transport mechanisms 206 and 207 is provided in the second base 221, and the other end of the connecting shaft 222 is the second base 2.
It is connected to the motor shaft of the belt driving motor 208 which is fixed to 21 via a coupling 223. The first transport mechanism 206 has the support base 22 that supports the roller shaft around which the two belts are stretched, as described above with reference to FIG.
4a and 224b are vertically formed on the second base 221. Further, the second transport mechanism 207 also has a support base 225a that supports the roller shaft similarly to the first transport mechanism 206.
And 225b are formed vertically on the second base 221. A holding table 226 having a substantially U-shaped cross section is provided on both sides of the supporting tables 225a and 225b of the second transport mechanism 207, and a vertical guide 227a is provided on a side surface of the holding table 226. This upper and lower guide 227a
Is fitted in a groove formed in the bearing 227b so that it can slide up and down. Lower surface 226a of holding table 226
A column 228 is provided on the column, and a ball bearing 229 is rotatably provided at the tip of the column 228.
The pillar 228 is a hole 2 formed in the second base 221.
The tip of the ball bearing 229 is in contact with the cam surface of the cam 218 through 30. Also, the holding table 2
At the upper end of 26, guide rails 231a and 231b having a substantially L-shaped cross section are provided. This guide rail 231
a and 231b are configured to be adjustable depending on the width of the lead frame. These guide rails 231a and 231
The height of the guide surface of b is the first and second guide rails 20.
The heights of the lead frames 3a and 203b are set to be at least the same as or substantially the same as the heights of the lead frame transport surfaces.

The above-mentioned configuration has the same configuration on the loader side and the unloader side.

The operation of the loader unit 209 including up and down will be described below with reference to FIGS. 24 and 25.

FIG. 24 shows a state where the shaft 210a of the cylinder 210 is sucked, and the position of the second base 221 connected to the tip of the shaft is controlled in a pulled state. At this time, the first and second transport mechanisms 206 and 207 have the first and second guide rails 203a, 203
03b and the conveyance path of the third conveyance mechanism 204, that is, the state shown in FIG. 23. At this time, the bearing 229 provided on the lower surface of the holding table 226 is located at the uppermost portion 218H of the cam surface. is doing. Therefore, FIG.
When the lead frame is located at the lowermost portion 218L of the cam surface shown by 5, the lead frame is the belt 207c, 2
What was placed on 07d is the guide rails 231a and 2 of the holding table 226 due to the suction action of the cylinder.
Both ends of the lead frame are held and raised by 31b,
The belts 207c and 207d are gently separated from each other. This is because the cam 218 allows continuous movement. In the state of FIG. 24, the first transport mechanism 206
The lead frame is also mounted on the belt of the curing device B ₂ (Fig. 2
2). Therefore, in this state, the lead frame can be continuously transported on the transport path of the third transport mechanism 204.

Next, the second transport mechanism 2 is operated as described above.
When the lead frame placed on the guide surfaces of the guide rails 231a and 231b of No. 07 is pushed out by the lead frame pusher cylinder 219 (see FIG. 23) onto the conveyance path of the first and second guide rails 203a and 203b, it slides back and forth. The shaft 210a of the working cylinder 210 projects and shifts to the state of FIG. That is, the second base 221 is moved from 218H to 218L along the cam surface. At this time, the guide rail 231 of the holding table 226
Since the guide surfaces of a and 231b are lowered to a position lower than the position of the upper surface of the belt (see FIG. 25), a new lead frame is conveyed by the curing device B ₂ shown in FIG. At this time, the lead frame is not placed on the belt because the first transport mechanism 206 is located away from the transport path.

The above is the operation of the loader unit 209. Similar operation is performed on the unloader side as well.

Next, the route along which the lead frame is conveyed by using this apparatus will be described in detail with reference to FIGS. 26 to 28.

First, the shaft 210a of the front / rear slide cylinder 210 on the loader side projects from the state of FIG. 23 to move the loader unit 209 to the state of FIG. Second
The lead frame (L \
F) is supplied in the direction of the arrow. When the lead frame is detected by the detection sensor 212, the rotation of the drive motor 208 for transporting the belt is stopped by a command from the control circuit. After that, the front-rear cylinder 210 operates in the suction direction to move the loader unit 209 to the state shown in FIG. At this time, the transport paths of the first and second transport mechanisms 206 and 207 are the first and second guide rails 203a and 203b having the bonding stage.
And the conveyance path of the third conveyance mechanism 204 are stopped. The lead frame mounted on the guide rails 231a and 231b of the second transport mechanism 207 shown in FIG.
9, the first and second guide rails 203a and 20
It is pushed out to the guide surface on 3b. This guide rail 2
The lead frames sent to 03a and 203b are clamped by a carrying mechanism (not shown) and are intermittently fed one pitch at a time, and then heated to a predetermined temperature on the bonding stage and bonded. During this time, since the transport path of the first transport mechanism 206 coincides with the transport path of the third transport mechanism 204, the bonder C other than the main bonder C _{5 is connected.
The} lead frame can be supplied to ₆ or C ₇ via the fifth transport mechanism 214. Next, the lead frame bonding-bonded on the bonding stage is discharged onto the transport path of the fourth transport mechanism 213 provided on the unloader side, and the lead frame detection sensor 215a.
After that, the rotation of the motor is stopped, and the front-rear cylinder 216 on the unloader side acts in the protruding direction to move the unloader unit to the state of FIG. And
The lead frame after the bonding connection is carried to the magazine stocker device D ₂ (see FIG. 22) side through the bypass carrying path of the next bonders C ₆ and C ₇ (see FIG. 22).

The above is a series of operations for bonding the lead frame and the like.

Next, the structure of the magazine stocker device D ₂ as the unloader shown in FIG. 22 will be described.

FIG. 29 is a side view of the automatic magazine feeder provided in the magazine stocker device D ₂ .

In FIG. 29, this automatic magazine feeder is mounted on a base 300 fixed to the main body of the magazine stocker device D ₂ , and has a first magazine discharge side storage space 250 and a second magazine supply side storage space. It is composed of a magazine storage space in which 260 is arranged vertically, an elevator 270, a discharge mechanism 290, and the like.

Details of the above configuration will be described below.

As shown in FIG. 29, a slide base 301 is slidably mounted on a base 300 fixed to the main body of the magazine stocker device D ₂ . A nut 302 is provided at an end of the slide base 301, and a screw 303 is screwed and coupled to the nut 302. Further, the screw 303 is screwed and coupled to a nut 302a fixed to the base 300, and the slide base 301 can be moved back and forth by rotating an adjusting knob 304 provided at an end of the screw 303. Is configured. This slide base 3
By moving 01, the center of the magazine can be adjusted to the center of the transport path of the transport mechanism. The center of the transfer path of the transfer mechanism is adjusted to a position that is coincident with or parallel to the center of the bonding stage. Further, although the adjusting knob 304 is configured to be manually rotated, it may be driven by a pulse motor or the like.

Next, the structure of the elevator 270 will be described. An elevating shaft 271 having a screw formed on the slide base 301 is vertically supported by an elevating shaft supporting frame 272 parallel to the elevating shaft 271. A nut 273 is screwed and coupled to the elevating shaft 271, and the nut 273 is rotated by rotating the elevating shaft 271.
An elevator stage 279 attached to an elevator back plate 278 connected to the above is configured to be movable up and down. The lower part of the elevating shaft 271 is connected to a coupling 274, a timing pulley 275 and the like, and the timing pulley 275 is connected to a pulley 276 attached to the shaft of a motor 277 via a belt. The lifting shaft 27 is driven by the driving force of the motor 277.
1 is rotated. The motor 277 is a base 300.
It is fixed to a motor mounting plate 282 fixed to a cylinder mounting frame 281 which is vertically supported above. A magazine mounting cylinder 283 and a magazine pushing cylinder 28 are provided above the cylinder mounting frame 281.
4 are arranged vertically and fixedly attached. A mounting plate 283a is attached to the shaft end of the magazine mounting cylinder 283. When the cylinder is turned on, the mounting plate 283a projects forward and temporarily mounts the magazine on the elevator stage 279. An extruding piece 284a is attached to the shaft end of the magazine extruding cylinder 284, and when the cylinder is turned on, the extruding piece 284a is pushed forward and placed on the placing plate 283a. It is pushed out onto the storage space 250 on the magazine discharge side.

This first magazine ejection side storage space 2
The base plate 251 has a base plate 251 fixed to columns (not shown) attached to the slide base 301. Guide plates 2 for guiding the magazine are provided at both ends of the base plate 251.
52 are provided at both ends. On this guide plate 252, a plurality of magazines arranged in a direction that intersects the lead frame housing direction (longitudinal direction) horizontally, that is, in the width direction of the lead frame can be continuously arranged.

This first magazine ejection side storage space 2
The second magazine supply side storage space 26 is at the bottom of 50.
0 is provided. This second magazine supply side storage space 260 also includes the first magazine discharge side storage space 2
A plurality of magazines can be arranged in the same direction as 50 (lead frame width direction), and the magazines are provided with guide plates 261 at both ends. A transfer mechanism 262 for transferring a magazine is provided between the guide plates 261. This transfer mechanism 262 is shown in detail in FIG.

As shown in FIG. 30, this transfer mechanism 262.
Is a belt 262e stretched between the rollers 262b and 262c, a drive roller 262a connected to the roller 262c and a belt 262f, and the belt 262e.
And a belt support plate 262d that prevents the dripping of the belt. The magazine arranged on the belt 262e is transferred to the elevator stage 279 side by the rotational driving force of the driving roller 262a. The transferred magazine is stored in the stocker guide 2 fixed to the elevator back plate 278.
It is configured to come into contact with 85 and stop. Also,
A chuck mechanism 280 for holding a magazine is provided on the elevator stage 279. The chuck mechanism 28
The configuration of 0 will be described later.

Next, the magazine transferred by the transfer mechanism 262 is regulated by the stocker guide 285 and stopped by a command from a control circuit including a microprocessor (not shown). In this state, the elevator stage 279 moves up to separate only one magazine above the belt of the belt 262e of the transfer mechanism 262. The structure of this operating mechanism will be described with reference to FIGS. 31 and 32. FIG. 31 is a sectional view seen from the side, and FIG. 32 is a front view thereof.

In FIG. 31, the operating mechanism is mounted on a slide base 301, and the operating mechanism has an operating member 287 having an operating piece 287a fixed to the upper end.
And a sliding member 288a that is attached to the side surface of the operating member 287 and is slidably provided in the guide receiving member 288b in the arrow direction, and one end is fixed to the operating member 287 and the other end is fixed to the guide receiving member 288b. This operating member 28
7 and a tension coil spring 286 that constantly biases 7 upward. A bearing 289 is provided on the side surface of the operating member 287.

Since this actuating mechanism of the above construction is normally urged upward by the urging force of the tension spring 286, the actuating piece 287 is located at the position indicated by the alternate long and short dash line in FIG.
There is a. At this time, the height of the tip of the operating piece 287a is set to a position higher than the belt 262e of the transfer mechanism 262 shown in FIG.
The tip of a is configured so as to abut against the lower surface of the magazine and can be lifted. The biasing force of the tension spring 286 is adjustable.

The operating member 287 includes an elevator stage 279, which is indicated by a chain double-dashed line in FIG.
It is configured so as to come to a position lower than the surface of the belt 262e of the transfer mechanism 262 by coming into contact with 89 and being pushed down.

This will be further described with reference to FIG. 33. Two operating pieces 287a are arranged along the accommodating direction of the lead frame in the magazine. The operating piece 287a is configured to be pushed down against the urging force of the tension coil spring 286 when the lower surface of the elevator stage 279 contacts the bearing 289.

Here, the elevator stage 2 shown above is used.
The chuck mechanism 280 provided at 79 will be described in detail with reference to FIG.

As shown in FIG. 34, this chuck mechanism 2
In 80, the chuck 32 is attached to the tip of the movable member 320.
1 is fixed, and the lower end of the movable member 320 and the lower end of the elevator stage 279 fixed to the nut 273 via the elevator back plate 278 are the spring 32.
The movable member 320 is always urged to the right side in the drawing. A starting member 324 is provided below the elevator stage 320, and a sliding member 325 fixed to the movable member 320 is guided by the starting member 324 to be slidable. A roller 326 is provided at the other end of the movable member 320.
26 is configured to roll along the cam surface of the cam 327. In such a configuration, the magazine mounted on the elevator stage 279, that is, when the magazine is supplied, the roller 326 pushes the chuck 321 forward against the urging force of the spring 322 by the convex portion of the cam 327, so that the magazine 321 There is a space between the chuck 321 and the chuck 321. When the elevator stage 279 descends and the roller 326 is positioned in the concave portion of the cam surface of the cam 327, that is, when the magazine is fixed, the chuck 321 holds the magazine by the action of the spring 322. When it is further lowered, the chuck 321 again projects forward due to the convex portion of the cam surface to release the state in which the magazine is held and is ready to be ejected.

The operation of the magazine automatic feeder having the above construction will be described below. 29 and 30
A plurality of magazines in which lead frames are not housed are arranged in the second magazine supply side housing space 260 shown in FIG. 2 in a direction that intersects the lead frame housing direction horizontally. These magazines are placed on the belt 262e of the transfer mechanism 262, and are sent to the elevator stage 279 side according to a command from the control circuit. Elevator stage 2
At this time, 79 is lowered to the lowermost portion and stands by, and the operating member 287 (see FIGS. 31 and 32) is also pushed down by the lower surface of the elevator stage 279 contacting the bearing 289. At this time, the chuck mechanism 280
34 is also spread by the action of a cam 327 arranged along the elevating shaft 271 as shown in FIG. The magazine transferred in this state collides with the stocker guide 285 and is regulated. Thereafter, the control circuit stops the transfer mechanism and moves the elevator stage 279 by the amount corresponding to the height indicated by the chain double-dashed line in FIG. 32, when the spring force of the tension coil spring 286 of the operating member 287 is released. Then, the stocker guide 285 is moved by the operating piece 287a.
Since the magazine regulated by is lifted,
The control circuit issues a reverse rotation command to the transfer mechanism to lift the magazines other than the magazine being lifted by the elevator stage 27.
9 away (second magazine supply side storage space 260
Direction) and move to the position to stop. Then, when the elevator stage 279 is raised, the magazine lifted by the operating member 287 causes the chuck mechanism 280 to move.
It is securely held by the action of. In this state, the elevator stage 279 accommodates the bonded lead frame while rising intermittently. This elevator stage 279 is the first magazine ejection side storage space 250.
When a sensor (not shown) detects that the magazine mounting cylinder 283 has risen to a position higher than the magazine storage surface, the magazine mounting cylinder 283 is turned on by a control command and pushes the mounting plate 283a onto the lower surface of the elevator stage 279. After that, the elevator stage 279 descends to the lowermost part, but since the chuck mechanism 280 is opened again, the magazine can be easily placed on the placing plate 283a. Then, the magazine pushing cylinder 284 is turned on by the control command to push the pushing piece 284a to push the magazine first.
It is pushed out to the magazine discharge side storage space 250 side.

By repeating the above steps, the lead frames that have completed bonding are automatically stored in the magazine in sequence.

Although the first and second transport mechanisms 206 and 207 are described as having two rails,
Although more cylinders may be provided and a cylinder is used as the switching means, it is of course possible to appropriately combine them by using other configurations.

Although wire bonding has been described above as an example, it may be used for tape bonding or the like.

Here, the curing device B ₂ shown in FIG.
And the die bonder device A ₂ which is the device at the preceding stage
The relationship with is explained.

As described above, the curing device B ₂ receives the lead frame sent from the die bonder device A ₂ and fixes the lead frame and the IC chip attached to the lead frame to each other with an adhesive or the like. Is.

As shown in FIG. 35, the curing device B ₂ is
It has a furnace 340. In this furnace 340, the nozzle 3
Hot nitrogen gas is supplied through 41. A discharge pipe 342 for discharging the nitrogen gas is connected to the bottom of the furnace 340.

Then, as is apparent from FIG. 36, the furnace 34
Inside the 0, a large number of heat blocks 342 are arranged in a line. As shown in FIG. 36, the lead frame (L \ F) is carried on a predetermined pitch while being placed on the upper surface of each heat block 342 and heated.

Incidentally, as shown in FIG. 36, the lead frame is changed from the die bonder device A ₂ to the curing device B ₂
When brought to the factory, the lead frame is first passed through the path 3 parallel to the flow direction L of the line of the automatic bonding apparatus.
44, a path 345 continuous to the downstream end of the path 344 and directed to the back side of the automatic bonding apparatus, and the path 34
5 is continuously conveyed to the vicinity of the back side of the curing device B ₂ via a path 346 parallel to the flow direction L of the line at the downstream end of 5. After that, it is conveyed to the front side of the curing device B ₂ while being heated by the heat block 342 as described above, and then supplied to the bonders C _{5 to} C ₇ via the path 347 parallel to the line flow direction L. To be done.

[0044]

In the above automatic bonding apparatus, various lead frames having different lengths are handled. These lead frames are bonded through the respective bonders C _{5 to} C ₇ for each lot, and are sequentially housed and collected in the magazine equipped in the magazine stocker device D ₂ . When the frame is taken into the magazine from the bonder, the frame stocker device D ₂ is a frame relay means (shown in FIG. 1) including a belt conveyor provided on the frame receiving side. However, reference numerals are not attached. ) Through.

However, each time the type of frame to be bonded is changed as described above, the above frame relay means must be replaced in order to adapt to the length of the frame to be newly handled, which wastes time. Not only does it have a drawback that it gives an operator a troublesome feeling.

Therefore, the present invention has been made in view of the above-mentioned drawbacks of the prior art, and provides an automatic bonding apparatus and a frame transfer apparatus capable of quickly and easily coping with a change in the type of lead frame to be handled. The purpose is to do.

[0047]

SUMMARY OF THE INVENTION According to the present invention, a bonder for receiving a frame holding a semiconductor component and performing a bonding process on the frame, and a plurality of the frames arranged in an array are accommodated and sequentially supplied to the bonder. A frame relay for transporting and relaying the frame between the loader or the frame accommodating portion of the unloader and the bonder. And a means for driving the belt in the frame transport direction, wherein the frame relay means includes an endless belt for contacting the frame and transporting the frame, and a driving means for driving the belt. The length is variable. Further, the frame transfer device according to the present invention includes a base part, a plurality of belt wheels that are arranged side by side in the first direction in which the frame is to be transferred on the base part, and are relatively contactable and separable, and the belt. An endless belt which is hung on each of the cars and abuts on the frame to convey the frame; and an endless belt which is arranged on the base portion and spaced apart from each of the belt cars in a direction intersecting the first direction. It is configured to include another belt wheel that is movable in the intersecting direction and on which the belt is hung, and a torque applying unit that applies torque to the belt wheel.

[0048]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an automatic bonding apparatus according to the present invention will be described with reference to the accompanying drawings. The automatic bonding apparatus is configured in the same manner as the conventional automatic bonding apparatus shown in FIGS. 22 to 36, except for the main parts described below, and thus detailed description of the other parts will be omitted. To do. Further, in the following description, the same or corresponding parts as those of the conventional device are designated by the same reference numerals.

As shown in FIG. 1, in the automatic bonding apparatus according to the present invention, three bonders C _{1 to} C are provided after the die bonder apparatus A ₂ and the curing apparatus B _1.
3 are arranged in a line, and an unloader D ₁ and a molding device E are provided behind each of these bonders. The die bonder device A ₂ is the same as that included in the conventional automatic bonding device shown in FIG. 22, and a large number of IC chips (not shown) obtained by cutting a wafer (not shown). Are sequentially mounted at predetermined positions on a lead frame (described later) using, for example, a thermosetting adhesive, and are sent out toward the curing device B ₁ . The curing device B ₁ receives the lead frame sent from the die bonder device A ₂ , heats it so as to solidify the adhesive or the like, and then sends it to the bonders C _{1 to} C ₃ . Each of the bonders C _{1 to} C ₃ receives the lead frame that has passed through the curing device B ₁ and attaches the lead formed on the lead frame and the pad (electrode) of the IC chip on the lead frame to gold, aluminum, or the like. Bonding is performed using a wire made of. As shown in FIG. 1, each of the bonders C _{1 to} C ₃ is equipped with a push mechanism 1 for pushing the received lead frame to a bonding position. In addition, each bonder C _{1 to} C
₃ is configured in the same manner as each of the three bonders C _{5 to} C ₇ equipped in the above-described conventional automatic bonding apparatus, except for the configuration of the identification mark giving means described later. Therefore, the description is omitted except for the structure of the identification mark giving means and its periphery. Further, as described above, in the following description of the bonder C ₁ , the same reference numerals are given to the same or corresponding parts as the constituent members of the conventional bonder. In addition, each bonder C _{1 to} C ₃
Since each of them has almost the same configuration, the configuration of the _first bonder C ₁ will be described in detail, and the description of the remaining two bonders C ₂ and C ₃ will be omitted.

On the other hand, in the unloader D ₁ shown in FIG. 1, the lead frames that have been subjected to the bonding process through the above bonders C _{1 to} C ₃ are received and accommodated, and the lead frames are also accommodated. Are sequentially sent to the molding device E in the subsequent stage. The molding device E receives each of the lead frames sent out and coats the IC chip on the lead frame with a synthetic resin.

Now, the structure of the bonder C ₁ will be described in detail below. As shown in FIG. 1, the bonder C ₁ includes a push mechanism 1 for pushing out the lead frame received from the curing device B ₁ toward the bonding position. Here, the operation of the push mechanism 1 will be described with reference to FIG.
A brief description will be given based on 6. That is, the lead frame (L \ F) from the curing device is brought onto the second transport mechanism 207 by the operation of the transport mechanism from the state of FIG. 26 to the state of FIG. In this state, the push mechanism 1 operates to push the lead frame on the second transport mechanism 207 onto the id rails 203a and 203b at the bonding position.

As shown in FIGS. 2 to 4, the push mechanism 1 includes a frame 5 attached to the main body of the bonder C ₁ via a plurality of fixed shafts 3, and a pusher 6.
push means 6 provided on the frame 5 including a,
It has a lead frame pusher cylinder 7 for applying a driving force to the pushing means 6. As is apparent from FIG. 3, in the push mechanism 1, the pusher 6a operates by contacting the rear end of the lead frame (L \ F), and pushes out the lead frame in parallel to the line flow direction L.

By the way, as shown in FIGS. 2 to 4, an identification mark corresponding to the bonder C ₁ having the push mechanism 1 is provided on the lead frame at a predetermined position of the frame body 5 of the push mechanism 1 described above. An identification mark giving means 10 to be attached is attached. More specifically, as shown in FIGS. 5 and 6, this identification mark giving means 10 has a bracket 11 as a base portion, and the bracket 11 is fastened to the frame body 5 of the push mechanism 1 with bolts 11a. There is. The support plate 12 is provided on the bracket 11.
Are attached such that their positions can be adjusted in the direction L of flow of the line, that is, in the length direction of the lead frame (L \ F). Specifically, as shown in FIG. 5, the support plate 11 extends along the direction L in which the line flows.
Longitudinal through-holes 11b of the strip are formed, and each through-hole 1 is formed.
The two bolts 13 which are respectively inserted in the bracket 1b
It is screwed into 1. That is, the position of the support plate 11 can be adjusted by loosening the bolts 13.

Similarly, as shown in FIG. 5, a cylinder 15 utilizing hydraulic pressure or pneumatic pressure is mounted on the support plate 12 with its output shaft side facing downward. This cylinder 15 has a support plate 12
In the above, position adjustment is possible in the direction perpendicular to the line flow direction L, in this case, the width direction of the lead frame (L \ F). More specifically, as shown in FIGS. 5 and 6, the support plate 12 is formed with a single long insertion hole 12a extending in the direction in which the position of the cylinder 15 should be adjusted. The two bolts 17 are inserted into the insertion holes 12a, and nuts 18 are screwed into the bolts 17 on the back side of the support plate 12, as shown in FIG. Therefore, the position of the cylinder 15 can be adjusted by loosening the bolt 17 and the nut 18.

As is particularly apparent from FIGS. 4 and 6, the punch 21 is attached to the output shaft of the cylinder 15 via the intermediate block 20. Specifically, the intermediate block 20 is screwed into a male screw portion formed on the output shaft, the punch 21 is inserted into the lower end portion of the intermediate block 20 so that only the tip portion thereof is exposed, and the set screw 2
It is fixed by 2.

The punch 21 is a lead frame L.
A predetermined portion of \ F is provided with a marking as an identification mark, which is pressed against the lead frame by the cylinder 15. As shown in FIGS. 4 and 6, a receiving member 24 is provided for receiving the pressure contact force applied to the punch 21 by the cylinder 15 on the lower side of the lead frame.

The stamp 26 formed by the punch 21 is attached to a portion as shown in FIG. 7, and its shape is, for example, circular as shown. In addition, as shown in FIG. 1, in the automatic bonding apparatus, three bonders C _{1 to} C _{3 are used.}
Therefore, as shown by the chain double-dashed line in FIG. 7, in the other bonders C ₂ and C ₃ , the positions where the markings 26 are attached in order to correspond to these bonders are the first bonder. The position of the marking 26 (shown by the solid line in FIG. 7) marked with C ₁ is changed.
In addition to the simple circle shown in FIG. 7, various forms such as a double circle, a triangle, a quadrangle and a pentagon can be applied to the mark 26 as shown in FIG. Further, as described above, the position of the marking on the lead frame may be changed for each bonder, or the shape of the marking for each bonder may be changed. Further, not limited to the marking, for example, a through hole having a predetermined shape may be formed in the lead frame and the through hole may be used as an identification mark.

As described above, the following effects can be obtained by providing the lead frame with the bonding marks C _{1 to} C ₃ which are subjected to the bonding process and corresponding identification marks.

That is, it is possible to surely determine by which bonder the lead frame is bonded by the identification mark attached to the lead frame, and if the lead frame has a defective bonding or the like. Based on the inspection result, the bonder to be repaired and adjusted can be immediately known and appropriate treatment can be taken.

By the way, as is clear from FIG. 7, the portion to be marked as an identification mark is the lead frame L \.
Each IC chip 35 mounted on F, that is, the outside of the semiconductor component. Therefore, by attaching an identification mark, IC
The tip 35 is not damaged. If the identification mark is outside the IC chip 35, the IC chip 35
May be provided at a position extremely close to, for example, a lead provided on the lead frame so as to be connected to the pad of the IC chip. In this case, ball bonding as an identification mark may be performed on the lead instead of for bonding connection. So in this case,
Bonding head 2 for bonding wires
02 (illustrated in FIG. 23) acts as an identification mark giving means. Further, it goes without saying that the wire as the identification mark may be attached not to the lead but to the separated portion of the IC chip.

Next, the structure of the unloader D ₁ shown in FIG. 1 will be described in detail.

As shown in FIG. 1, the unloader D ₁ is a magazine stocker device 4 as a frame accommodating portion for accommodating a large number of lead frames which have been bonded.
0, a frame transfer device 41 as a frame relay means for sequentially relaying the lead frames passing through the bonders C _{1 to} C ₃ described above and transferring the lead frames toward the magazine stocker device 40, and the bonders C _{1 to} C _The lead frame L \ is provided between the frame transport path from ₃ to the magazine stocker device 40 and a predetermined position deviating from the frame transport path.
It has a frame moving means 43 for moving F. A frame inspection microscope 45 is provided above the frame moving means 43.

Hereinafter, first, the magazine stocker device 40
Will be described in detail.

As shown in FIG. 9, the magazine stocker device 40 includes an elevating mechanism base 48 and adjusting means 4 for moving and adjusting the elevating mechanism base 48 in the direction of arrow C in FIG.
9 and a lifting mechanism 50.

The elevating mechanism base 48 has an adjusting means 49.
It is configured to be movable in the direction of the arrow C by means of the adjusting means 49, and the adjusting mechanism 49 has a lifting mechanism base 48 as shown in FIG.
A nut 51 having a female thread is fixed to the end of the nut 51, and the nut 51 and a screw rod 52 having a male thread are screwed together. The threaded rod 52 is screwed to a bearing 53 fixed to a bonder body 54, and a knob 55 is attached to the end portion. By rotating this knob 55, the lifting mechanism base 48 can be moved in the direction of arrow C in FIG. If a control motor composed of a pulse motor is used instead of the knob 55, the amount of movement of the lifting mechanism base 48 can be automatically digitally controlled. The lifting mechanism base 48 is provided with a fixed guide 56 shown in FIG.
a, 56b, guide bearing 57, eccentric guide 58
Both ends are regulated by so that it can slide. With this guide bearing 57 and the eccentric guide 58, the lifting mechanism base 48 is guided to the guide rails 203a and 203b.
By adjusting the adjustment in the direction orthogonal to the longitudinal direction (see FIG. 23), the mounting error of the lifting mechanism 50 fixed on the lifting mechanism base 48 can be corrected.

Next, in the elevating mechanism 50, as shown in FIG. 10, the lower end of the elevating shaft 59 formed with a male screw is pivotally supported by the bearing 48a of the elevating mechanism base 48, and the upper end thereof is driven by the pulse motor. Is connected to the control motor 60 (may be indirectly driven by a gear, a pulley, etc.). An elevating member 62 having a male screw is screwed to the elevating shaft 59, and the elevating member 61 can be moved up and down by rotating the control motor 60 in the forward and reverse directions.

The elevating member 61 is guided by two guide shafts (not shown) parallel to the elevating shaft 59.
The amount of movement of the elevating member 61 is controlled by a control means such as a microcomputer (not shown). An upper sensor 62 and a lower sensor 63 that detect the upper and lower limit positions of the elevating member 61 are attached to predetermined positions of the elevating mechanism 50. Optical sensors are used for these sensors 62 and 63. Lifting member 6
A magazine receiving portion 65, which has a substantially L-shaped cross section and receives the lower end portion of the magazine 64, is attached to the apparatus 1. A chuck 66 for pressing and holding the end of the magazine 64 is slidably attached to the free end of the magazine receiving portion 65, and the other end of the chuck 66 is arranged along the elevating shaft 59. The cam surface of the cam 59a is abuttable. As shown in FIG. 11, the cam 59a is used for the lifting shaft 5
Projections are formed on the upper and lower positions of the cam 9, and when the magazine receiving portion 65 moves upward to receive and hold the magazine 64 or lower to eject the magazine 64, the cam 59
It is configured to be pushed forward and projected by the convex portion formed on the cam surface of a.

The details of the configuration of the magazine receiving portion 65 are shown in FIG.
1, the chuck 66 is fixed to the tip of the fixing member 65a, the lower end of the fixing member 65a and the lower end of the holding base 65e are connected by a spring 65b, and the fixing member 65a always holds the holding base 65e. Biased to the side. A starting member 65c is provided below the holding table 65e,
The sliding member 65d fixed to the fixed member 65a is configured to be slidable by being guided by the starting member 65c. A roller 65f is provided at the other end of the fixing member 65a, and the roller 65f moves along the cam surface.

Now, as shown in FIG. 11, the magazine 64 placed on the holding table 65e, that is, when the magazine is supplied,
Since the roller 65f pushes the chuck 66 forward against the biasing force of the spring 65b by the convex portion of the cam 59a, there is a space between the magazine 64 and the chuck 66. When the elevating member 61 descends and is positioned in the concave portion of the cam surface of the cam 59a, that is, when fixing the magazine, the spring 65b is used.
The chuck 66 holds the magazine 64 by the action of.
When it is further lowered, the chuck 66 is again caused by the convex portion of the cam surface.
Is projected to the front to release the state in which the magazine 64 is held and is ready for ejection.

The magazine 64 is held by a chuck 66, and the lead frame bonded on the bonding stage is stored in the magazine 64.
A lifting member 6 of the lifting mechanism 50 by a pusher (not shown)
As they are lowered by 1, they are sequentially stored. This pusher
It is arranged almost parallel to the bonding stage surface,
It is configured to be driven by an air cylinder (not shown).

On the other hand, the side surface of the magazine 64 is shown in FIGS.
0 is regulated by a stocker guide 67 formed in a substantially L shape, and the first guide plates 71a and 71b and the second guide plates 72a and 72b are movably fixed to the stocker guide 67. ing. This first
And second guide plates 71a, 71b and 72a, 72b
Is fixed to the regulation surface of the stocker guide 67, it can be expanded by moving the stocker guide 67 in the directions of arrows E and E ′ shown in FIG. 9, and the second guide plates 72a and 72b can be expanded. Guide rail 2
By moving along the restriction surface of the stocker guide 67 in a direction perpendicular to 03a and 203b (see FIG. 23), it is possible to move in the directions of arrows D and D '. As a result, it is possible to deal with exchanging magazines 64 of different sizes. The plurality of magazines 64 inserted between the first and second guide plates 71a, 71b and 72a, 72b from above as shown in FIG. 10 hold the magazine receiving portion 65 raised to a predetermined position. Until that time, the magazine pusher 70 locks the magazine pusher 70 against the stocker guide 67 (first guide plates 71a, 71b) that serves as a reference surface. Therefore, with this configuration, the magazine 24 is reliably regulated by the regulation surfaces of the first guide plates 71a and 71b fixed to the stocker guide 67 as shown in FIG. The timing of turning on and off the magazine pusher 70 is controlled by a control means (not shown), but as shown in FIG. 10, the magazine pusher 70 is turned on until the elevating member 61 rises and holds the magazine 64, and the magazine receiving portion 65 is provided. Turns off when held by. Then, when the elevating member 61 descends and the magazine 64 is ejected, it is turned on again to lock the next magazine 64 (the portion indicated by the broken line in the figure), and control is performed to wait until the elevating member 61 rises. Has been done. The magazine pusher 70 is driven by an air cylinder (not shown).

The above is the configuration of the magazine stocker device 40.

Next, the structure of the frame transfer device 41 as the frame relay means included in the unloader D ₁ shown in FIG. 1 will be described.

As shown in FIGS. 12 to 16, the frame transfer device 41 has a base portion 81 fixed to the unloader body by bolts or the like (not shown). The base portion 81 includes an upper plate 82 that is separated from each other in the vertical direction.
And a bottom plate 83 and two intermediate plates 84 and 85 interposed between the top plate 82 and the bottom plate 83, and these plates are fixed to each other with bolts or the like. The intermediate plates 84 and 85 are connected to each other in a T shape.

As is apparent from FIGS. 12 and 13, on the upper plate 82 of the base portion 81, 2 in the first direction in which the lead frame is to be conveyed, that is, in the line flow direction L.
A total of four belt wheels 87 and 88 are provided separately from each other. Of these four belt pulleys, two belt pulleys 87 arranged on the upstream side in the line flowing direction L
Are attached to the upper plate 82 as follows.

That is, a pair of brackets 90 are fixedly mounted on the upper plate 82, and a ball bearing (see FIG. 1) is attached to an end of a shaft 91 attached to each bracket 90.
5 but not attached with reference numerals).

On the other hand, the other two belt pulleys 88 arranged on the upstream side of these belt pulleys 87 are attached as follows.

12 and 13 and FIGS. 15 and 16
As shown in FIG. 5, the slide plate 9 is provided on the upper plate 82 of the base 81 so that the position of the slide plate 9 can be adjusted along the line flowing direction L.
Two are provided. In detail, as is clear from FIG. 13, the slide plate 92 is formed with two long insertion holes 92a extending in the direction in which the position should be adjusted, and the bolts 93 inserted into these insertion holes 92a. Are screwed onto the upper plate 82. That is, the position of the slide plate 92 can be adjusted by loosening the bolt 93. In addition, as shown in FIG.
The upper plate 82 has a screw hole 82a into which the bolt 93 is screwed.
Are arranged in a line in a direction in which the position adjustment should be performed. As is apparent from FIG. 16, a pair of brackets 90 are fixedly mounted on the slide plate 92, and ball bearings 95 are provided on both brackets.
A spindle 96 is rotatably attached via the. The above two belt pulleys 88 have the spindle 96
Is stuck to. That is, by adjusting and changing the position of the slide plate 92, the two belt wheels 87 and 88 on the upstream side and the belt wheels 87 and 88 on the downstream side are configured to relatively approach and separate from each other. The position of the slide plate 92 can be automatically adjusted by providing a dedicated drive means therefor.

As shown in FIGS. 13 and 16, another belt wheel 97 is fixed to the end of the spindle 96. A flat plate-shaped support plate 99 is fastened to the side portion of the slide plate 92 with bolts, and the motor 100 is attached to the support plate 99.
A belt wheel 101 is fixed to the output shaft of the motor 100, and an endless belt 102 is wound around the belt wheel 101 and the belt wheel 97. That is, the spindle 96 is rotated by the motor 100.

On the other hand, as shown in FIGS. 12 to 15, the outer main surface of the intermediate plate 84 forming a part of the base 81 is
The guide rails 105 are fastened with bolts so as to extend in the direction L in which the line flows, that is, the direction that intersects the direction in which the lead frame should be transported, in this case, the vertical direction. A slider 106 is slidably attached along the guide rail 105. A pair of brackets 107 is fixedly provided on both left and right sides of the slider 106, and a ball bearing (not shown in FIG. 14 but attached with a reference numeral is attached to an end of a shaft 108 attached to each bracket 107). Not)
A belt wheel 109 is attached via. An endless belt 110 is wound around the belt wheel 109 and the above-described belt wheels 87 and 88 on the upper plate 82.
The belt 110 contacts the lead frames L \ F and conveys the lead frames. In addition,
As shown in FIGS. 12 and 13, on the base 81, pulleys 112, 113 for abutting the belt 110 to guide the belt 110 and to apply a required tension thereto.
Is provided.

As shown in FIGS. 12, 14 and 15, a positioning plate 115 is fastened by bolts 116 to the side end portion of the slider 106 which can carry the belt wheel 109 and move up and down. As shown in FIG. 12, the slider 106 is attached to the positioning plate 115.
Is formed with a single elongated insertion hole 115a extending in the vertical direction. The bolt 117 is inserted into the insertion hole 115a and is screwed to the side end of the intermediate plate 84. That is, the position of the slider 106 can be adjusted by loosening the bolt 117. As shown in FIG. 12, a plurality of screw holes 84a into which the bolts 117 are screwed are formed in the intermediate plate 84 in a line in the direction in which the position adjustment should be performed. Further, as shown in FIGS. 12, 13 and 16, on the slide plate 92 provided on the base portion 81, the left and right side portions of the lead frame L \ F are slidably provided to guide the lead frame. Pair of guide members 120
Is provided.

The motor 100, the belt wheels 97 and 101, and the belt 102 described above constitute torque applying means for applying torque to the belt wheels 87, 88, and 109. Further, the belt 110 is formed by the torque applying means, the belt wheels 87, 88 and 109, the base 81, and peripheral members related thereto.
A driving means for driving the vehicle is configured.

In the frame carrying device 41 having the above-mentioned structure, the bolts 93 and 117 are loosened to adjust the positions of the slide plate 92 and the slider 106, so that the belt on the movable side of the belt wheel 87 on the fixed side is adjusted. The cars 89 and 109 move. That is, in the direction in which the lead frame L \ F should be conveyed, the belt 1
The length of 10 is variable. in this way,
Since the length of the belt 110 for conveying the lead frame is variable in the lead frame conveying direction, the length of the belt 110 should be changed even if the type of the lead frame handled changes and the length of the lead frame changes. Can be dealt with quickly and easily.

In this embodiment, the frame transfer device 41 as the frame relay means has the magazine stocker device 40 and the bonders C _{1 to} C ₃ which are the frame accommodating portions of the unloader D ₁ (see FIG. 1). are disposed between, provided sequentially supplies loader (not shown) of the respective lead frames to each bonder C ₁ -C ₃ by a number accommodate a lead frame which is not bonded processed yet is subjected In this case, this loader and each bonder C ₁ ~
The frame transfer device 41 may be provided between the frame transfer device 41 and C ₃ .

Next, the structure of the frame moving means 43 included in the unloader D ₁ shown in FIG. 1 will be described. As described above, the frame moving means 43 is provided in each of the bonders C ₁ ...
The lead frame L \ F is moved between a frame conveyance path extending from C ₃ to the magazine stocker device 40 as the frame accommodating section and a predetermined lateral position deviating from the frame conveyance path. As shown in Figure 1,
A microscope 45 is arranged above the frame moving means 43. The microscope 45 is mounted on the IC chip 35 of the lead frame which is moved from the frame transport path to the predetermined position, that is, the inspection position.
This is for performing various inspections regarding the connection state of the wire to the pad and the lead (see FIG. 7) and the tension of the wire. After these inspections, if there is no problem, the frame moving means 43 is operated in the reverse direction to return the lead frame to the frame transport path again. Since the frame moving means 43 is provided, the lead frame can be inspected without stopping the line work, the bonding work efficiency is improved, and the respective inspections can be easily performed.

The frame moving means 43 as described above is used.
The position at which the lead frame L \ F is to be installed is not limited to the position between the bonder C ₃ and the frame transfer device 41 (see FIG. 1 for the disposition position) as in the present embodiment. It may be installed at any position. Further, the number of the frame moving means 43 installed is not limited to one, but a plurality of the frame moving means 43 may be provided at appropriate positions.

Details of the frame moving means 43 are as follows.

As shown in FIGS. 17 to 19, the frame moving means 43 has a fixed base 131 fixed on the unloader body. On this fixed base 131,
Two guide rails 132 are fixedly provided so as to extend perpendicularly to the flow direction L of the line and parallel to each other. As shown in FIGS. 18 and 19, two sliders 1 are provided on each of the guide rails 132, two sliders 1 in total.
35 is slidably attached. Then, a flat plate-shaped movable table 136 is fastened to these sliders 135 by bolts (reference numerals are not attached). Then, as shown in FIGS. 17 and 18, the fixed base 1
A cylinder 138, which is operated by hydraulic pressure or compressed air pressure, is fixed to the rear portion of 31. The output shaft of the cylinder 138 is connected to the movable table 136.
That is, the movable table 136 is moved to the guide rail 1 by the operation of the cylinder 138 and the withdrawal of the output shaft thereof.
It is configured to reciprocate along 32. These guide rails 132, sliders 135,
The movable table 136 and the cylinder 138 constitute drive means for synchronously moving a pair of frame guide mechanisms described below in a direction traversing the frame transport path.

As is apparent from FIG. 17, on the movable table 136, a pair of frame guide mechanisms 141 and 142 which are parallel to each other and each of which can form a frame transport path are provided. As shown in FIG. 18, the one frame guide mechanism 141 is made of a relatively thin steel plate or the like as a material, and a pair of left and right guide members 141a and 141 for slidingly guiding the lead frame to guide the lead frame.
b, which is fixed to the movable table 136.

On the other hand, the other frame guide mechanism 142 is detachable from the movable table 136.
It is configured as follows.

That is, as shown in FIG. 20 and FIG. 21, the frame guide mechanisms 142 are arranged in parallel with each other and each has a frame guide surface 144a having an L-shaped cross section inside.
It has two rod-shaped guide members 144 in which the guide members 144 are formed, and two connecting plates 145 for connecting the guide members 144 to each other near both ends of the guide members. It should be noted that these connecting plates 145 are provided on both guide members 1.
It is fastened to 44 with a bolt 145a. Each of the guide members 144 is formed with a taper surface 144b for smoothly introducing the lead frame L \ F into a frame guide surface 144a included therein. A knob 146 is attached to the upper surface side of the coupling plate 145. In detail, the knob 146 is fastened to the coupling plate 145 by a bolt 146a inserted in the lower surface side of the coupling plate 145, as shown in FIG.

As described above, the frame guide mechanism 142 for guiding the lead frame L \ F is detachably attached to the movable table 136 carrying the frame guide mechanism 142.
The following effects can be obtained.

That is, when the lead frame L \ F is brought onto the frame guide mechanism 142 through the frame conveying path of the preceding stage, the operator holds the knob 146 and holds the frame guide mechanism 142. Frame L \ F
At the same time, it can be removed from the movable table 136 and can be carried to a higher magnification microscope or a work area where electrical continuity inspection and the like can be performed, and more advanced inspection and the like can be performed on the lead frame. .. Further, as a result of these inspections, when it is confirmed that the lead frame is normal, if the frame guide mechanism 142 is mounted again on the movable table 136, the lead frame is returned to the transport path. Be done.

By the way, the above-mentioned frame moving means 43
Guides the lead frame L \ F to the above-mentioned frame guide mechanism 1
It is provided with a frame carrying means for carrying along 41 and 142. The frame carrying means will be described below.

First, the first frame carrying means for carrying the lead frame along the one frame guide mechanism 141 will be described. As shown in FIG. 17 and FIG. 18, this first frame conveying means is the frame guide mechanism 14
1 has a motor 151 arranged on the left end side. The motor 151 is fixed to the movable table 136. As shown in FIG. 18, two brackets 15 are provided on the lower surface side of the movable table 136 and near the motor 151.
2 is fixed, and a spindle 153 is supported by these brackets 152 via ball bearings 154. The spindle 153 is connected to the output shaft of the motor 151 by the coupler 151a. In addition, as also shown in FIG.
A belt wheel 156 is fixed to the end portion of 53.

On the other hand, as shown in FIG. 17, the movable table 1 is arranged so as to correspond to the position of the bracket 152.
Two brackets 157 are also fixedly installed on the upper surface side of 36. These brackets 157 allow the spindle 15 to pass through the ball bearings (reference numerals are not attached).
8 is rotatably held. This spindle 158
A belt wheel 159 is fixed to an end of the belt wheel 159, and an endless belt 160 is wound around the belt wheel 159 and the belt wheel 156 located below the belt wheel 159. Further, two belt wheels 162 are fixed to the spindle 158 at a position sandwiched by two brackets 157 supporting the spindle 158.

As shown in FIG. 17, two brackets 163 are fixedly provided on the right end side of the frame guide mechanism 141 and on the upper surface side of the movable table 136.
A shaft 164 is attached to these brackets 163, and a belt wheel 165 is rotatably attached to each shaft via a ball bearing or the like (not shown). Then, the frame guide mechanism 141
The belt wheel 162 provided on the left end side and the belt wheel 165 on the right end side are wound around a belt 167 for contacting the lead frame L \ F and conveying the lead frame L \ F. That is, these belts 167 are driven by the rotation of the motor 151.

The first frame carrying means for carrying the lead frame L \ F along the one frame guide mechanism 141 is constructed as described above.

Next, the second frame carrying means for carrying the lead frame L \ F along the other frame guide mechanism 142 will be described. As shown in FIG. 17, the second frame conveying means is provided with the frame guide mechanism 14
2 has a motor 171 arranged at the right end thereof, and the motor 171 is attached to the movable table 136. Figure 1
As shown in FIG. 9, a bracket 172 is fixedly provided on the lower surface side of the movable table 136, and the bracket 172 rotatably supports a spindle 173 connected to the output shaft of the motor 171. A belt wheel 174 is fixed to the end of the spindle 173.

On the other hand, two brackets 176 are fixedly provided on the upper surface side of the movable table 136 so as to correspond to the above brackets 172. A spindle 178 is rotatably held by a ball bearing (not shown) by these brackets 176. A belt wheel 179 is fixed to the end of the spindle 178.
An endless belt 180 is wound around the belt wheel 179 and the belt wheel 174 located below the belt wheel 179. Then, the spindle 178 has the spindle 17
In the position that is sandwiched by the two brackets 176 that support the 8
Two belt wheels 183 are fixed.

As shown in FIG. 18, two brackets 181 are fixedly provided on the left end side of the frame guide mechanism 142 and the upper surface side of the movable table 136. A shaft 182 is attached to these brackets 181, and a belt wheel 18 is attached to each shaft.
3 is rotatably mounted via a ball bearing (reference numeral is not shown). Then, the belt wheel 17 provided on the right end side of the frame guide mechanism 142.
An endless belt 184 for abutting the lead frame L \ F and conveying the lead frame L \ F is wound around the belt wheel 183 and the belt wheel 183 on the left end side. That is, the motor 171
These belts 184 are driven by the rotation of the.

The second frame carrying means for carrying the lead frame L \ F along the other frame guide mechanism 142 is constructed as described above. Note that FIG. 17 and FIG.
As shown in FIG. 8, one end of a flexible cable 185 for powering on the two motors 151 and 171 is connected to the rear end of the movable table 136.

The frame moving means 43 having the above-mentioned structure operates as follows.

First, when operating the frame moving means 43, the operator performs the following operation.

For example, a lead of a lead frame and an IC
Various inspections regarding the connection state of the wire to the pad of the chip, the tension of the wire, and the like are performed by, for example, the lead frame bonded by the _first bonder C ₁ among the bonders C _{1 to} C ₃ shown in FIG. If you want the, operator, unloader D ₁ of the three selection buttons corresponding to bonder C ₁ -C ₃ disposed like the front of the (shown in FIG. 1) (not shown), the 1 Press the select button corresponding to the _first bonder C ₁ . Then, a control unit (not shown) that controls the operation of the entire automatic bonding apparatus performs the following operation control according to the selection signal.

First, the lead frame bonded by the bonder C ₁ is brought onto the fourth transport mechanism 213 shown in FIG. Then, the sensor 215a issues a detection signal indicating that the lead frame has arrived on the transport mechanism 213 to the control unit.
As a result, the cylinder 216 is operated, and the fourth transport mechanism 213 moves to the position shown in FIG. Subsequently, the transport mechanism included in the _first bonder C ₁ , each transport mechanism included in the other bonders C ₂ and C _3, and the frame transport unit including the belt 184 provided in the frame moving unit 43 illustrated in FIG. Each of them operates, whereby the lead frame is moved to the frame guide mechanism 1 of the frame moving means.
42 is conveyed. And this frame guide mechanism 1
It is detected that a lead frame has arrived on the frame guide mechanism 142 by a detection unit such as an optical sensor (not shown) provided below the control unit 42, and the control unit outputs a detection signal output from the detection unit. Belt 18 based
Stop 4 After that, the following operation is performed.

That is, the cylinder 1 shown in FIGS. 17 and 18.
38 is operated, the output shaft thereof projects, and the movable table 136 moves to the lower side in FIG. Therefore,
Until then, as shown in FIG. 17, the fifth transfer mechanism 214 (or the fourth transfer mechanism 21) included in the upper bonder C ₃ is provided.
The frame guide mechanism 142 that forms the frame transport path together with 3) moves to a lateral position deviating from the frame transport path, that is, an inspection position while carrying the lead frame to be inspected. On this inspection position,
A microscope 45 shown in FIG. 1 is provided, and an operator can perform the above-mentioned various inspections with the microscope 45. When a more detailed inspection needs to be performed, the frame guide mechanism 142 is detachable from the movable table 136. Therefore, the frame guide mechanism 142 is detached and carried to the inspection area to perform a required inspection. After removing the frame guide mechanism 142 for inspection, a new frame guide mechanism 142 having the same shape as this may be attached.

On the other hand, when the movable frame 136 moves to cause the inspection frame guide mechanism 142 to reach the inspection position, the outer frame guide mechanism 1 is placed on the movable table 136.
The other frame guide mechanism 141 provided in parallel with 42.
Coincides with the fifth (or fourth) transport mechanism 214 (213) of the former bonder C ₃ , and the frame transport path is secured without division. Therefore, the inspection work can be performed while continuing the line work.

When the inspection of the lead frame is completed as described above, the operator pushes a release button (not shown) other than the above selection button. By doing so, the detection means (disposed below the frame guide mechanism 142)
A reset signal is issued in response to the control command that was controlled by the detection signal, and the normal operating state is restored.

As mentioned above, each bonder C _1-
At C ₃ , since an identification mark (shown in FIGS. 7 and 8) corresponding to each bonder is attached to the lead frame, this is used as a means for confirming the lead frame to be inspected by the control unit or the operator. You can also use it.

By the way, when the lead frame bonded by the bonder C ₁ as described above is conveyed toward the frame guide mechanism 142 which is the inspection position through the conveying path, the other bonders C ₂ and C _{3 are used.} The bonded lead frame is controlled by the sequence of the control unit so as not to be located on the above-mentioned transport path. This is to prevent an accident or the like due to the simultaneous presence of two or more lead frames in the transport path. On the contrary, in order to bring the lead frame sent out from the bonder C ₁ to the inspection position, the bonder C ₁
Even if the selection button corresponding to is pressed, if the lead frame is not yet completely bonded,
The lead frame made by another bonder C ₂ or C ₃ is sent out onto the above-mentioned transport path and arrives at the above-mentioned frame guide mechanism 142. At this time, the belt 184 is moved by a signal from the above-mentioned detection means (not shown). It is not stopped and is sent out toward the subsequent frame transport device 41 (see FIG. 1, FIG. 12, etc.), and is controlled so as to be sequentially stored in the subsequent magazine stocker device 40 via the frame transport device 41. There is.

[0112]

As described above, according to the present invention,
Since the length of the belt for frame conveyance is variable in the frame conveyance direction, when the type of frame to be handled is changed, it can be dealt with quickly and easily by appropriately changing the length of this belt. effective.

[Brief description of drawings]

FIG. 1 is a front view of an automatic bonding apparatus according to the present invention.

FIG. 2 is an enlarged plan view of a part of a bonder equipped in the automatic bonding apparatus shown in FIG.

FIG. 3 is a GG arrow view including a partial cross section with respect to FIG. 2;

FIG. 4 is a view taken along the line HH including a partial cross section with respect to FIG.

5 is an enlarged view of a part of the configuration shown in FIG.

FIG. 6 is a view taken in the direction of an arrow I-I including a partial cross section of FIG. 5.

FIG. 7 is a plan view of a lead frame to be bonded by the automatic bonding apparatus shown in FIG.

8 is a view showing a modification of the identification mark attached to the lead frame shown in FIG.

9 is a plan view of a magazine stocker device as a frame accommodating unit included in the unloader included in the automatic bonding device shown in FIG.

10 is a vertical cross-sectional view of the magazine stocker device shown in FIG.

FIG. 11 is an enlarged view of a part of the magazine stocker device shown in FIGS. 9 and 10.

FIG. 12 is a front view including a partial cross section of a frame transfer device as a frame relay unit included in the unloader included in the automatic bonding device shown in FIG.

FIG. 13 is a J including a partial cross section relating to FIG. 12;
FIG.

FIG. 14 is a view taken in the direction of arrow K-K in FIG.

FIG. 15 is an M including a partial cross section relating to FIG. 12;
FIG.

FIG. 16 is an N including a partial cross section relating to FIG.
FIG.

17 is a plan view of a frame moving means included in the unloader included in the automatic bonding apparatus shown in FIG.

FIG. 18 is a view including a partial cross section P shown in FIG.
It is a P arrow line view.

FIG. 19 is a partial sectional view of FIG. 17 including Q.
FIG.

FIG. 20 is a plan view of a frame guide mechanism included in the frame moving means shown in FIGS. 17 to 19.

FIG. 21 is an R including a partial cross section relating to FIG. 20;
FIG.

FIG. 22 is a front view of a conventional automatic bonding apparatus.

FIG. 23 is a perspective view of a bonder included in the automatic bonding apparatus shown in FIG.

24 is a side view of a part of the bonder shown in FIG. 23, including a partial cross section thereof.

FIG. 25 is an operation explanatory diagram of the portion shown in FIG. 24;

FIG. 26 is an operation explanatory view of the bonder shown in FIG. 23.

FIG. 27 is an operation explanatory view of the bonder shown in FIG. 23.

FIG. 28 is an operation explanatory view of the bonder shown in FIG. 23.

FIG. 29 is a vertical cross-sectional view of a main part of the magazine stocker device included in the automatic bonding device shown in FIG. 22.

FIG. 30 is an enlarged view of a part of the main part shown in FIG. 29.

FIG. 31 is an enlarged view of a part of the main part shown in FIG. 29.

32 is a WW arrow view of FIG. 31. FIG.

33 is a view on arrow XX in FIG. 29. FIG.

FIG. 34 is an enlarged view of a part of the magazine stocker device included in the automatic bonding device shown in FIG. 22.

FIG. 35 is a vertical cross-sectional view of a main part of a curing device included in the automatic bonding device shown in FIG. 22.

FIG. 36 is a schematic perspective view of the curing device shown in FIG. 35 and the die bonder device and the bonder before and after the curing device.

[Explanation of symbols]

A ₂ die bonder device B ₁ cure device C ₁ , C ₂ , C ₃ bonder D ₁ unloader E molding device 10 identification mark giving means 15, 138 cylinder 21 punch 26 marking 35 IC chip (semiconductor component) 40 magazine stocker device (frame accommodation) 41) Frame transport device (frame relay means) 43 Frame moving means 45 Microscope 81 Base body 92 Slide plate 100, 151, 171 Motor 105, 132 Guide rails 120, 144, 141a, 141b Guide member 131 Fixed base 136 Movable table 141 , 142 frame guide mechanism

Claims (3)

[Claims] 1. A bonder that receives a frame holding semiconductor components and performs a bonding process on the frame, and a loader or a bonder that sequentially accommodates a plurality of the frames and sequentially supplies them to the bonder. An automatic bonding apparatus including an unloader for receiving and accommodating a frame, comprising frame relay means for transporting and relaying the frame between a frame accommodating portion of the loader or unloader and the bonder. The means has an endless belt for coming into contact with the frame to convey the frame, and a driving means for driving the belt, and the length of the belt in the frame conveying direction is variable. Automatic bonding equipment characterized by. 2. The driving means includes a base body, and a plurality of belt wheels on which the belt is hung on the base body so as to be spaced apart from each other in the frame transport direction and to be relatively contactable to and separable from each other. , Other belt wheels which are arranged apart from each other in the intersecting direction with respect to the frame conveying direction, and on which the belt is movably mounted in the intersecting direction, and torque imparting for imparting torque to the belt pulley The automatic bonding apparatus according to claim 1, further comprising: 3. A base portion, a plurality of belt wheels that are arranged side by side in the first direction in which a frame is to be transported on the base portion and are spaced apart from each other, and can be relatively contacted and separated from each other. And an endless belt for abutting against the frame to convey the frame, and the endless belt on the base portion separated from each other in the cross direction with respect to the first direction and movable in the cross direction. And a torque applying means for applying a torque to the belt wheel.