JPH0521814Y2 - - Google Patents
Info
- Publication number
- JPH0521814Y2 JPH0521814Y2 JP14099586U JP14099586U JPH0521814Y2 JP H0521814 Y2 JPH0521814 Y2 JP H0521814Y2 JP 14099586 U JP14099586 U JP 14099586U JP 14099586 U JP14099586 U JP 14099586U JP H0521814 Y2 JPH0521814 Y2 JP H0521814Y2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- metal body
- point metal
- low melting
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 20
- 238000002844 melting Methods 0.000 claims description 19
- 230000008018 melting Effects 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Description
【考案の詳細な説明】
＜産業上の利用分野＞
本考案は基板型温度ヒユーズの改良に関するも
のである。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an improvement of a substrate type temperature fuse.
＜先行技術と問題点＞
基板型温度ヒユーズにおいては、第２図に示す
ように耐熱性の絶縁基板１′上に一対の層状電極
２′，２′を設け、これらの電極間に低融点金属体
４′を橋設し、この低融点金属体４′上にフラツク
ス層５′を設け、基板１′の全片面に絶縁樹脂層
６′をモールドしてある。而して、その作動機構
は、周囲温度の上昇下、主に絶縁基板を介して熱
が低融点金属体に伝達され、低融点金属体が溶断
されることにある。<Prior art and problems> In the substrate-type temperature fuse, as shown in FIG. A flux layer 5' is provided on the low melting point metal body 4', and an insulating resin layer 6' is molded on one side of the substrate 1'. The operating mechanism is that when the ambient temperature rises, heat is transferred to the low melting point metal body mainly through the insulating substrate, and the low melting point metal body is fused.
しかしながら、従来の基板型温度ヒユーズにお
いては周囲から絶縁基板（セラミツクス板）に伝
わつた熱が、絶縁基板１において拡散されるので
低融点金属体への熱伝達速度が遅く、作動速度に
問題がある。 However, in conventional substrate-type temperature fuses, the heat transferred from the surroundings to the insulating substrate (ceramic plate) is diffused in the insulating substrate 1, so the speed of heat transfer to the low-melting point metal body is slow, causing problems in operating speed. .
＜考案の目的＞
本考案の目的は、基板型温度ヒユーズの作動速
度を迅速化することにある。<Purpose of the invention> The purpose of the invention is to speed up the operation speed of a substrate-type thermal fuse.
＜考案の構成＞
本考案に係る基板型温度ヒユーズは、絶縁基板
上に一対の層状電極を設け、これらの電極間に低
融点金属体を橋設せる温度ヒユーズにおいて、電
極に隣接せる低融点金属体部分に切欠を施したこ
とを特徴とする構成である。<Structure of the invention> The substrate type temperature fuse according to the invention is a temperature fuse in which a pair of layered electrodes is provided on an insulating substrate, and a low melting point metal body is bridged between these electrodes. The structure is characterized by a notch in the body part.
＜実施例の説明＞ 以下、図面により本考案を説明する。<Explanation of Examples> The present invention will be explained below with reference to the drawings.
第１図において、１は耐熱性に秀れ、かつ良熱
伝導性の絶縁基板であり、例えばセラミツクス板
を用いることができる。２，２は絶縁基板に設け
た一対の層状電極であり、銅箔のエツチング銀系
導電性ペーストの焼付け等によつて形成できる。
３，３は各電極２，２に接続せるリード線であ
る。４は線状または、箔状の低融点金属体であ
り、電極２，２間に橋設してある。４０，４０は
電極２，２に近接せる低融点金属体部分に施した
切欠である。５は低融点金属体４上に塗布せるフ
ラツクスである。６は絶縁基板１の全片面にモー
ルド被覆せる樹脂絶縁層である。 In FIG. 1, reference numeral 1 denotes an insulating substrate having excellent heat resistance and good thermal conductivity; for example, a ceramic plate can be used. Reference numerals 2 and 2 denote a pair of layered electrodes provided on an insulating substrate, which can be formed by etching a copper foil, baking a silver-based conductive paste, or the like.
3, 3 are lead wires connected to each electrode 2, 2. Reference numeral 4 denotes a linear or foil-like low melting point metal body, which is provided as a bridge between the electrodes 2 . Reference numerals 40 and 40 indicate notches made in the low melting point metal body portions that are close to the electrodes 2, 2. 5 is a flux that can be applied onto the low melting point metal body 4. Reference numeral 6 denotes a resin insulating layer that is molded onto one side of the insulating substrate 1.
上記基板型温度ヒユーズにおいて、周囲温度が
上昇すると、絶縁基板１並びにリード線３→電極
２を介して熱が低融点金属体４に伝達していき、
電極２に近い低融点金属体部分ほど早く加熱され
る。而るに、この低融点金属体部分には切欠４０
を設け、該部分をモールド最も溶断し易くしてあ
り、切欠がない場合に較べ、それだけ早く溶断で
きる。而して、電極に近い低融点金属体部分が電
極間中央の低融点金属体部分よりも早く加熱され
る時間をΔt1低融点金属体に切欠を設けることに
より、それを設けない場合に較べて早く溶断でき
る時間Δt2とすれば、上記基板型温度ヒユーズに
おいて、電極間中央の低融点金属体部分で溶断す
るとした場合に較べ、作動時間をΔt1＋Δt2時間、
迅速化できる。 In the substrate type temperature fuse, when the ambient temperature rises, heat is transferred to the low melting point metal body 4 via the insulating substrate 1 and lead wire 3 → electrode 2,
The portion of the metal body with a lower melting point that is closer to the electrode 2 is heated more quickly. However, this low melting point metal body part has a notch 40.
This makes it easier to melt and cut this part of the mold, and it can be cut faster than when there is no notch. Therefore, by providing a notch in the low melting point metal body Δ t1 , the time during which the low melting point metal body portion near the electrodes is heated faster than the low melting point metal body portion in the center between the electrodes, compared to the case where no cutout is provided. If Δ t2 is the time during which the fuse can be blown quickly, the operating time will be Δ t1 + Δ t2 hours, compared to the case where the fuse is blown at the low melting point metal part in the center between the electrodes in the substrate type temperature fuse.
It can be done quickly.
＜考案の効果＞
本考案の係る基板型温度ヒユーズにおいては、
上述した通り作動時間を迅速化できる。而して、
基板型温度ヒユーズにおいては、低融点金属体の
溶断が、その溶融金属が絶縁基板に漏れ付いて球
状化分断の進行速度が遅いことを勘案すれば、本
考案は基板型温度ヒユーズの性能効上に極めて有
用である。<Effects of the invention> In the substrate type temperature fuse according to the invention,
As mentioned above, the activation time can be speeded up. Then,
Considering that in substrate-type thermal fuses, when a low-melting point metal body is blown, the molten metal leaks onto the insulating substrate and the rate of spheroidization progresses slowly. extremely useful.
第１図は本考案に係る基板型温度ヒユーズを示
す説明図、第２図は従来の基板型温度ヒユーズを
示す説明図である。
図において、１は絶縁基板、２，２は層状電
極、４は低融点金属体、４０，４０は切欠であ
る。
FIG. 1 is an explanatory diagram showing a substrate type temperature fuse according to the present invention, and FIG. 2 is an explanatory diagram showing a conventional substrate type temperature fuse. In the figure, 1 is an insulating substrate, 2 and 2 are layered electrodes, 4 is a low melting point metal body, and 40 and 40 are notches.
Claims (1)
電極間に低融点金属体を橋設せる温度ヒユーズに
おいて、電極に隣接せる低融点金属体部分に切欠
を施したことを特徴とする基板型温度ヒユーズ。 A temperature fuse in which a pair of layered electrodes is provided on an insulating substrate and a low melting point metal body is bridged between these electrodes, and the substrate type temperature fuse is characterized in that a notch is provided in the low melting point metal body portion adjacent to the electrodes. Hughes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14099586U JPH0521814Y2 (en) | 1986-09-12 | 1986-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14099586U JPH0521814Y2 (en) | 1986-09-12 | 1986-09-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6345950U JPS6345950U (en) | 1988-03-28 |
| JPH0521814Y2 true JPH0521814Y2 (en) | 1993-06-04 |
Family
ID=31048371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14099586U Expired - Lifetime JPH0521814Y2 (en) | 1986-09-12 | 1986-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521814Y2 (en) |
-
1986
- 1986-09-12 JP JP14099586U patent/JPH0521814Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6345950U (en) | 1988-03-28 |
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