JPH0514434Y2 - - Google Patents
Info
- Publication number
- JPH0514434Y2 JPH0514434Y2 JP1109887U JP1109887U JPH0514434Y2 JP H0514434 Y2 JPH0514434 Y2 JP H0514434Y2 JP 1109887 U JP1109887 U JP 1109887U JP 1109887 U JP1109887 U JP 1109887U JP H0514434 Y2 JPH0514434 Y2 JP H0514434Y2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- temperature fuse
- point metal
- metal body
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000011247 coating layer Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 230000008018 melting Effects 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000009413 insulation Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000012966 insertion method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、基板型温度ヒユーズの改良に関する
ものである。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to an improvement of a substrate type temperature fuse.
（先行技術と問題点）
基板型温度ヒユーズとして、第５図に示すよう
に、絶縁基板１′上に一対の電極２′，２′を設け、
これらの電極２′，２′の上半部側に低融点金属体
３′を橋設し、絶縁基板１′の上半部に絶縁被覆
６′を施し、電極２′，２′の下半部は露出したま
まにし、絶縁基板１の下半部１０′をソケツト
（被保護機器の温度ヒユーズ装着箇所に取付けた
ソケツト）に差込むものが公知である（実用新案
登録第1625505号）。(Prior art and problems) As a substrate-type temperature fuse, as shown in FIG. 5, a pair of electrodes 2', 2' are provided on an insulating substrate 1',
A low melting point metal body 3' is bridged over the upper half of these electrodes 2', 2', an insulating coating 6' is applied to the upper half of the insulating substrate 1', and the lower half of the electrodes 2', 2' is covered with an insulating coating 6'. It is known to leave the lower half 10' of the insulating substrate 1 exposed and insert it into a socket (a socket attached to the temperature fuse installation location of the equipment to be protected) (Utility Model Registration No. 1625505).
しかしながら、かかる差込式の基板型温度ヒユ
ーズにおいては、差込力に耐え得るに足る充分な
機械的強度を付与する必要があり、このため、上
記の基板型温度ヒユーズにおいては、絶縁基板の
厚みを厚くせざるを得ず、絶縁基板を介しての低
融点金属体への熱伝達速度の低下が避けられな
い。従つて、温度ヒユーズの動作迅速性を保証し
難い。 However, in such a plug-in board type thermal fuse, it is necessary to provide sufficient mechanical strength to withstand the insertion force. Therefore, a decrease in the rate of heat transfer to the low-melting point metal body through the insulating substrate is unavoidable. Therefore, it is difficult to guarantee the speed of operation of the temperature fuse.
（考案の目的）
本考案の目的は、差込式の基板型温度ヒユーズ
の熱伝達速度の向上を図ることにある。(Purpose of the invention) The purpose of the invention is to improve the heat transfer rate of a plug-in board type temperature fuse.
（考案の構成）
本考案に係る基板型温度ヒユーズは、絶縁基板
上に一対の露出導体棒を固設し、これらの導体棒
間に薄厚の低融点金属体を橋設し、この低融点金
属体上に、絶縁被覆を施したことを特徴とする構
成である。(Structure of the invention) The substrate type temperature fuse according to the invention has a pair of exposed conductor rods fixed on an insulating substrate, a thin low melting point metal body is bridged between these conductor rods, and the low melting point metal body is bridged between these conductor rods. This structure is characterized by having an insulating coating applied to the body.
（実施例の説明） 以下、図面により本考案を説明する。(Explanation of Examples) The present invention will be explained below with reference to the drawings.
第１図Ａは本考案に係る基板型温度ヒユーズを
示す上面図、第１図Ｂは第１図Ａにおけるｂ−ｂ
断面図である。 FIG. 1A is a top view showing a substrate type temperature fuse according to the present invention, and FIG. 1B is bb in FIG. 1A.
FIG.
第１図Ａ並びに第１図Ｂにおいて１は耐熱性
で、かつ熱良伝導性の絶縁基板であり、例えば、
セラミツクス板を使用できる。２，２は一対の層
状電極であり、例えば、導電塗料の焼付け、銅箔
のエツチングによつて形成することができる。３
は電極２，２間に橋設せる低融点金属体であり、
箔状または線状体を使用できる。４，４は一対の
導体棒であり、例えば銅棒を使用でき、各電極
２，２にこれらの導体棒４，４を固着してある。
５は低融点金属体上に塗布せるフラツクス、６は
低融点金属体３上に被覆せる樹脂層、例えばエポ
キシ樹脂層である。 In FIG. 1A and FIG. 1B, 1 is a heat-resistant and thermally conductive insulating substrate, for example,
Ceramic plates can be used. Reference numerals 2 and 2 denote a pair of layered electrodes, which can be formed, for example, by baking a conductive paint or etching a copper foil. 3
is a low melting point metal body bridged between the electrodes 2, 2,
Foil or linear bodies can be used. Reference numerals 4 and 4 denote a pair of conductor rods, for example, copper rods can be used, and these conductor rods 4, 4 are fixed to each electrode 2, 2.
5 is a flux that can be coated on the low melting point metal body, and 6 is a resin layer, such as an epoxy resin layer, that can be coated on the low melting point metal body 3.
上記基板型温度ヒユーズは、ソケツトに差込ん
で使用する。この場合、基板上の導体棒４，４を
絶縁被覆６よりも突出させておけば、ソケツト内
の接点に導体棒４，４を絶縁被覆６で邪魔される
ことなしに確実に接触させ得る。 The substrate type temperature fuse is used by being inserted into a socket. In this case, if the conductor rods 4, 4 on the board are made to protrude beyond the insulation coating 6, the conductor rods 4, 4 can be reliably brought into contact with the contacts in the socket without being obstructed by the insulation coating 6.
上記において、導体棒４，４には第２図に示す
ように、角棒を用いることもできる。低融点金属
体３は第３図に示すように導体棒４，４に平行な
向きで設けることもできる。 In the above, square rods can also be used for the conductor rods 4, 4, as shown in FIG. The low melting point metal body 3 can also be provided parallel to the conductor bars 4, 4, as shown in FIG.
上記絶縁被覆６には、第４図に示すように、絶
縁ケースを使用でき、この場合、絶縁ケースの前
壁、並びに後壁（後壁は図には現われていない）
に凹部６１を設け、この凹部６１に接着剤をつめ
込んで絶縁ケース６を絶縁基板１に固定すること
ができる。 As shown in FIG. 4, an insulation case can be used for the insulation coating 6, and in this case, the front wall and rear wall of the insulation case (the rear wall is not shown in the figure).
The insulating case 6 can be fixed to the insulating substrate 1 by providing a recess 61 in the recess 61 and filling the recess 61 with adhesive.
上記導体棒にはリード部を設け、使用に際して
リード部を切断するようにすれば、基板型温度ヒ
ユーズをリード線方式とソケツト差込方式との両
方式に併用できる。 If the conductor rod is provided with a lead portion and the lead portion is cut off before use, the substrate type temperature fuse can be used in combination with both the lead wire method and the socket insertion method.
本考案に係る基板型温度ヒユーズにおいては、
絶縁基板上における薄厚の低融点金属体の近傍に
薄膜抵抗体を設け、この抵抗体の過電流下での発
熱により、低融点金属体を溶断させることもでき
る。 In the substrate type temperature fuse according to the present invention,
It is also possible to provide a thin film resistor near a thin low-melting point metal body on an insulating substrate and melt the low-melting point metal body by the heat generated by this resistor under overcurrent.
（考案の効果）
本考案に係る基板型温度ヒユーズは、上述した
通りの構成であり、絶縁基板上に一対の導体棒を
固着しているので、温度ヒユーズをソケツトに差
込む際の差込力の一部を導体棒に分担させ得、そ
れだけ、絶縁基板の差込力負担分を少なくできる
ので、絶縁基板を薄くできる。而して、絶縁基板
の薄厚化により、低融点金属体への熱伝達速度を
高速化でき、温度ヒユーズの作動迅速性を向上で
きる。(Effects of the invention) The board-type temperature fuse according to the invention has the configuration as described above, and has a pair of conductor rods fixed on an insulating board, so that the insertion force when inserting the temperature fuse into a socket is reduced. A portion of the insertion force can be shared by the conductor rod, and the insertion force burden on the insulating board can be reduced accordingly, allowing the insulating board to be made thinner. By making the insulating substrate thinner, the speed of heat transfer to the low-melting point metal body can be increased, and the speed of operation of the temperature fuse can be improved.
第１図Ａは本考案に係る基板型温度ヒユーズを
示す上面説明図、第１図Ｂは第１図Ａにおけるｂ
−ｂ断面図、第２図、第３図並びに第４図はそれ
ぞれ本考案の別実施例を示す説明図、第５図は従
来例を示す説明図である。
図において、１は絶縁基板、３は低融点金属、
４，４は導体棒、６は絶縁被覆である。
FIG. 1A is an explanatory top view showing a substrate-type temperature fuse according to the present invention, and FIG. 1B is b in FIG. 1A.
-B sectional view, FIGS. 2, 3, and 4 are explanatory views showing other embodiments of the present invention, and FIG. 5 is an explanatory view showing a conventional example. In the figure, 1 is an insulating substrate, 3 is a low melting point metal,
4, 4 is a conductor rod, and 6 is an insulating coating.
Claims (1)
れらの導体棒間に薄厚の低融点金属体を橋設
し、この低融点金属体上に絶縁被覆を施したこ
とを特徴とする基板型温度ヒユーズ。 (2) 絶縁被覆層の上面を露出導体棒の厚みよりは
低くしたことを特徴とする実用新案登録請求の
範囲第１項記載の基板型温度ヒユーズ。[Claims for Utility Model Registration] (1) A pair of exposed conductor rods is fixed on an insulating substrate, a thin low-melting point metal body is bridged between these conductor rods, and an insulating layer is placed on the low-melting point metal body. A board-type temperature fuse characterized by being coated. (2) The substrate-type temperature fuse according to claim 1, wherein the upper surface of the insulating coating layer is lower than the thickness of the exposed conductor bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1109887U JPH0514434Y2 (en) | 1986-09-24 | 1987-01-27 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14700486 | 1986-09-24 | ||
| JP1109887U JPH0514434Y2 (en) | 1986-09-24 | 1987-01-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63127048U JPS63127048U (en) | 1988-08-19 |
| JPH0514434Y2 true JPH0514434Y2 (en) | 1993-04-16 |
Family
ID=33100119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1109887U Expired - Lifetime JPH0514434Y2 (en) | 1986-09-24 | 1987-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514434Y2 (en) |
-
1987
- 1987-01-27 JP JP1109887U patent/JPH0514434Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63127048U (en) | 1988-08-19 |
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