JPH0541524Y2 - - Google Patents
Info
- Publication number
- JPH0541524Y2 JPH0541524Y2 JP8847488U JP8847488U JPH0541524Y2 JP H0541524 Y2 JPH0541524 Y2 JP H0541524Y2 JP 8847488 U JP8847488 U JP 8847488U JP 8847488 U JP8847488 U JP 8847488U JP H0541524 Y2 JPH0541524 Y2 JP H0541524Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- cement
- terminal plate
- resistor
- stainless steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 11
- 239000004568 cement Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 229910052742 iron Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、セラミツクケースに抵抗素子を入
れ、耐熱無機質材（セメント）を充填してなる電
力型セメント抵抗器に関し、特にそのリード端子
板に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to a power-type cement resistor, which is made by putting a resistance element in a ceramic case and filling it with a heat-resistant inorganic material (cement), and particularly relates to its lead terminal board. It is something.
（従来技術及び考案が解決しようとする課題）
従来、この種の抵抗器では、リード端子板とし
て、通常鉄系又は銅系の材質が使用されていた。
ところが、第４図に示したように、プリント配線
板に搭載する型のものは、セラミツクケース１１
内にセメントで封入されている抵抗素子から発生
した熱がリード端子板１２を伝わつてプリント配
線板１３に達し、繰返しヒートサイクルがかかる
うちに、そのストレスによりはんだ付部１４にク
ラツクが発生したり、配線銅箔１５が剥離すると
いう問題があつた。そこで、リード端子板１２に
窓を開けるなどの形状的設計で対応しているが、
必ずしも効果的ではなく、従つて、リード端子板
の先端温度を１℃でも低減することが重要な課題
となつていた。(Prior art and problems to be solved by the invention) Conventionally, in this type of resistor, an iron-based or copper-based material has usually been used for the lead terminal plate.
However, as shown in Fig. 4, the type mounted on a printed wiring board has a ceramic case 11.
The heat generated from the resistance element sealed inside with cement is transmitted through the lead terminal board 12 and reaches the printed wiring board 13, and as the heat cycle is repeated, cracks may occur in the soldered portion 14 due to the stress. There was a problem that the wiring copper foil 15 peeled off. Therefore, we have responded by creating a geometrical design such as opening a window in the lead terminal board 12.
This is not necessarily effective, and therefore, it has become an important issue to reduce the temperature at the tip of the lead terminal plate by even 1°C.
最近のエレクトロニクスの展開は、適用分野の
拡大及びハードウエアの小型化とともに、制御方
式の多様化等により、瞬時過負荷特性の要求が高
まつており、前記課題は益々重要になつてきた。 Recent developments in electronics have increased the demand for instantaneous overload characteristics due to expansion of application fields, miniaturization of hardware, and diversification of control methods, and the above-mentioned problem has become increasingly important.
本考案は、上記課題を解決しようとするもの
で、リード端子板の先端温度を従来のものに比較
して大幅に低減することのできるセメント抵抗器
を提供するものである。 The present invention aims to solve the above-mentioned problems, and provides a cement resistor that can significantly reduce the temperature at the tip of the lead terminal plate compared to conventional ones.
（構成）
上記課題を解決するために、抵抗素子の両端か
ら引き出されるリード端子板をステンレス鋼によ
り形成し、かつ銅メツキの下地に錫又はニツケル
メツキを施してはんだ付性を付与した構成とす
る。(Structure) In order to solve the above problem, the lead terminal plate drawn out from both ends of the resistance element is made of stainless steel, and the base of the copper plating is coated with tin or nickel plating to impart solderability.
（作用）
ステンレス鋼は鉄系材質に比較して熱伝導率が
１／４程度と低く、従つて、抵抗素子から配線基板
への熱伝達量が少なくなり、瞬時過負荷特性が向
上し、その結果、小型化及びコスト低減を図るこ
とができる。(Function) Stainless steel has a low thermal conductivity of about 1/4 compared to iron-based materials. Therefore, the amount of heat transferred from the resistance element to the wiring board is reduced, improving instantaneous overload characteristics and As a result, size reduction and cost reduction can be achieved.
（実施例）
以下、図面に基づいて実施例を詳細に説明す
る。第１図は、本考案の一実施例を示したもの
で、１はセラミツクケース、２は抵抗素子で、そ
の両端の端子部３からリード端子板５がそれぞれ
引き出されている。４は充填されたセメントであ
る。The embodiment will be described in detail below with reference to the drawings. Fig. 1 shows an embodiment of the present invention, in which 1 is a ceramic case, 2 is a resistor element, and 5 is led out from terminals 3 on both ends of the resistor element. 4 is filled cement.
第２図は、リード端子板５の断面を示したもの
であり、本考案では、リード端子板５をステンレ
ス鋼６で形成し、その表面に、銅メツキ下地７及
び錫メツキ８を施している。銅メツキ下地７及び
錫メツキ８はリード端子板５にはんだ付性を付与
するものである。なお、錫メツキ８はニツケルメ
ツキでもよい。 FIG. 2 shows a cross section of the lead terminal plate 5. In the present invention, the lead terminal plate 5 is made of stainless steel 6, and its surface is coated with a copper plating base 7 and a tin plating 8. . The copper plating base 7 and the tin plating 8 provide solderability to the lead terminal board 5. Note that the tin plating 8 may be nickel plating.
ステンレスの熱伝導率はｋ＝16.5W・m-1・
K-1で、銅系材のｋ＝395W・m-1・K-1及び鉄系
材のｋ＝72W・m-1・K-1に比べて小さく、従つ
て、第３図に示すように、リード端子板５の先端
の測定点における温度上昇値は、鉄系端子板のそ
れに比較して半分以下になつている。 The thermal conductivity of stainless steel is k=16.5W・m -1・
K -1 is smaller than k = 395 W m -1 K -1 for copper-based materials and k = 72 W m -1 K -1 for iron-based materials, and therefore, as shown in Figure 3. Furthermore, the temperature rise value at the measurement point at the tip of the lead terminal plate 5 is less than half that of the iron terminal plate.
（考案の効果）
以上説明したように、本考案によれば、
(1) リード端子板を熱伝導率の小さいステンレス
鋼で形成したので、抵抗素子で発生した熱の伝
達量が少なく、端子板先端における温度上昇
は、従来の鉄系端子板を使用したものに比べて
50％以下に抑えることができ、その結果、プリ
ント配線板を熱によるダメージから保護し、信
頼性を向上することができる。(Effects of the invention) As explained above, according to the invention: (1) Since the lead terminal plate is made of stainless steel with low thermal conductivity, the amount of heat generated by the resistor element is transmitted is small, and the terminal plate The temperature rise at the tip is lower than that using conventional iron terminal blocks.
As a result, printed wiring boards can be protected from heat damage and reliability can be improved.
(2) 端子板先端における温度上昇が低くなるの
で、従来よりも小型の抵抗器を使用することが
できる。(2) The temperature rise at the tip of the terminal block is reduced, making it possible to use a smaller resistor than before.
(3) 抵抗素子と端子板先端との温度勾配をつける
目的で、従来はリード端子板の長さを長くして
いたが、本考案によれば、リード端子板の長さ
を短くできるので、余分なスペースを必要とせ
ず、機器の小型化を図ることができる。(3) Conventionally, the length of the lead terminal board was increased in order to create a temperature gradient between the resistance element and the tip of the terminal board, but according to the present invention, the length of the lead terminal board can be shortened. It is possible to downsize the device without requiring extra space.
第１図は、本考案の一実施例の構成図、第２図
は、同実施例のリード端子板の断面図、第３図
は、本考案の端子板と従来例のそれとの温度上昇
を比較した特性図、第４図は、従来例のプリント
配線板への実装状態を示す図である。
１……セラミツクケース、２……抵抗素子、３
……端子部、４……セメント、５……リード端子
板、６……ステンレス鋼、７……銅メツキ下地、
８……錫メツキ。
Fig. 1 is a block diagram of an embodiment of the present invention, Fig. 2 is a sectional view of a lead terminal plate of the same embodiment, and Fig. 3 shows the temperature rise between the terminal plate of the present invention and that of the conventional example. The compared characteristic diagram, FIG. 4, is a diagram showing the state of mounting on a conventional printed wiring board. 1... Ceramic case, 2... Resistance element, 3
...Terminal section, 4...Cement, 5...Lead terminal board, 6...Stainless steel, 7...Copper plating base,
8...Tsumetsuki.
Claims (1)
を充填してなる電力型セメント抵抗器において、
前記抵抗素子の両端から引き出されるリード端子
板をステンレス鋼により形成し、かつ銅メツキの
下地に錫又はニツケルメツキを施してはんだ付性
を付与したことを特徴とするセメント抵抗器。 In power type cement resistors, which are made by putting a resistance element in a ceramic case and filling it with cement,
A cement resistor characterized in that lead terminal plates drawn out from both ends of the resistor element are made of stainless steel, and tin or nickel plating is applied to the base of the copper plating to impart solderability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8847488U JPH0541524Y2 (en) | 1988-07-05 | 1988-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8847488U JPH0541524Y2 (en) | 1988-07-05 | 1988-07-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0211303U JPH0211303U (en) | 1990-01-24 |
| JPH0541524Y2 true JPH0541524Y2 (en) | 1993-10-20 |
Family
ID=31313032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8847488U Expired - Lifetime JPH0541524Y2 (en) | 1988-07-05 | 1988-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0541524Y2 (en) |
-
1988
- 1988-07-05 JP JP8847488U patent/JPH0541524Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0211303U (en) | 1990-01-24 |
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