JPH03181198A - Electronic device - Google Patents
Electronic deviceInfo
- Publication number
- JPH03181198A JPH03181198A JP31880689A JP31880689A JPH03181198A JP H03181198 A JPH03181198 A JP H03181198A JP 31880689 A JP31880689 A JP 31880689A JP 31880689 A JP31880689 A JP 31880689A JP H03181198 A JPH03181198 A JP H03181198A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- resin
- base circuit
- case
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims description 18
- 238000005452 bending Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 239000011889 copper foil Substances 0.000 abstract description 5
- 239000006071 cream Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 3
- 239000007787 solid Substances 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は、金属−絶縁層−導体パターンの三層構造から
なる金属ベース回路基板を利用した電子機器に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic device using a metal base circuit board having a three-layer structure of metal, insulating layer, and conductor pattern.
［従来の技術］
金属−絶縁層−導体パターンの三層構造からなる金属ベ
ース回路基板が電子機器、例えば固体素子継電器（以下
、ソリッド・ステート・リレーという）のベース回路基
板として使用されている。[Prior Art] A metal base circuit board having a three-layer structure of metal, an insulating layer, and a conductor pattern is used as a base circuit board for electronic devices, such as solid state relays (hereinafter referred to as solid state relays).
この金属ベース回路基板は、基材として例えばアルミニ
ューム金属を用い、その上に絶縁層を形成し、該絶縁層
上に銅箔からなるあらかじめ定めた電気回路を構成する
導体パターンが形成されている。上記の金属ベース回路
基板を用いた従来のソリッド・ステート・リレーを第５
図に示す。This metal-based circuit board uses, for example, aluminum metal as a base material, an insulating layer is formed thereon, and a conductive pattern made of copper foil that constitutes a predetermined electric circuit is formed on the insulating layer. . The conventional solid-state relay using the metal-based circuit board described above is the fifth
As shown in the figure.
第５図において、金属ベース回路基板１の導体パターン
２上にクリーム半田を塗布し、電子部品３、外部導出端
子４を搭載し、さらに絶縁材で成形された耐熱性ケース
５を上記電子部品３等の搭載部品の位置決め治具と兼用
させ、電気炉を通過させて搭載部品を金属ベース回路基
板１の導体パターン２上に半田固着させる。その後、耐
熱性ケース５の内部空間に樹脂を充填して搭載部品を封
入する。In FIG. 5, cream solder is applied onto the conductor pattern 2 of the metal base circuit board 1, electronic components 3 and external lead-out terminals 4 are mounted, and a heat-resistant case 5 formed of an insulating material is placed on the electronic components 3. The jig is also used as a positioning jig for mounted components, and the mounted components are soldered onto the conductor pattern 2 of the metal base circuit board 1 by passing through an electric furnace. Thereafter, the internal space of the heat-resistant case 5 is filled with resin to encapsulate the mounted components.
最後に、」二部カバー６を被せて所定のソリッド・ステ
ート・リレー７を完成させている。Finally, a two-part cover 6 is placed over the solid state relay 7 to complete the desired solid state relay 7.
［発明が解決しようとする課題］
しかしながら、従来のソリッド・ステート・リレーの構
造では次のような解決すべき課題があった。[Problems to be Solved by the Invention] However, the structure of the conventional solid state relay has the following problems to be solved.
（１−）ソリッド・ステート・リレー自体の構造の小型
化をＩンするには搭載部品の点数を減らす必要があり、
回路構成上の限界があった。(1-) In order to miniaturize the structure of the solid state relay itself, it is necessary to reduce the number of mounted parts.
There were limitations in the circuit configuration.
（２）小型化をしするために、！ｎに金属ベース回路基
板を小さくしたのでは、該回路基板上に搭載された発熱
する電子部品からの放熱が十分むされず、ソリッド・ス
テート・リレーの信頼性の低下に結び付く。(2) To make it smaller! If the metal base circuit board is made smaller than n, the heat dissipation from the heat-generating electronic components mounted on the circuit board will not be sufficiently removed, leading to a decrease in the reliability of the solid state relay.
［発明の目的］
本発明は、搭載部品の個数の制限や金属ベース回路基板
の情積を小さくすることなく、小型化と高信頼性の維持
を図り得る電子機器を提供することを目的とする。[Object of the Invention] An object of the present invention is to provide an electronic device that can be miniaturized and maintain high reliability without limiting the number of mounted components or reducing the space of a metal-based circuit board. .
［課題を解決するための手段］
本発明の電子機器は、金属−絶縁層−導体パターンの三
層構造からなる金属ベース回路基板を有し、該回路基板
上の導体パターン上の所定の位置にＩＥ電子部品よび外
部導出端子が搭載・固着され、前記導体パターンに搭載
・固着された電子部品および外部ｉ写出端子が内側にな
るようにして該回路Ｊｋ板の一部を、該導体パターンと
と略直角に折曲げてｒ７− ｌ：げ片を形成し、かつ、
該立上げ片を含めて前記細路基板を包囲するようにケー
スを配置し、該ケース内に樹脂を充填して該回ｇ基板に
搭載・固着された電子部品および外部端子の一部を樹脂
封止してなるものである。[Means for Solving the Problems] The electronic device of the present invention has a metal base circuit board having a three-layer structure of a metal, an insulating layer, and a conductor pattern. IE electronic components and external lead-out terminals are mounted and fixed, and a part of the circuit Jk board is connected to the conductor pattern so that the electronic components and external i-printing terminals mounted and fixed on the conductor pattern are on the inside. Bend at approximately right angles to form r7-l: barb, and
A case is placed so as to surround the narrow circuit board including the stand-up piece, and a resin is filled in the case so that some of the electronic components and external terminals mounted and fixed on the circuit board are covered with resin. It is sealed.
［作用］
本発明の電子機器は、金属ベース回路基板の導体パター
ン上の所定の位置に電子部品および外部導出端子を搭載
し、クリーム半田等を介在させて電気炉に通し、
半田固着させる。上記の搭載部品を半田固着させた後、
金スづ３ベ一ス回路基板の所定の位置から搭載部品が内
側になるように、導体パターンごと略直角に折曲げて立
上げ片を形成する。その後、この立上げ片の周囲を囲む
ようにケースを配置し、該ケース内に樹脂を充填して搭
載部品を樹脂封止する。こうして完成した電子機器は、
金属ベース回路基板の立上げ片の部分にも電子部品等を
搭載・固着させ、当該部分を放熱部として利用すること
ができるため、従来と同一の大きさでもより大電力用の
電子機器とすることができるとともに、放熱効果の向上
により信頼性を高めることができる。[Function] In the electronic device of the present invention, electronic components and external lead-out terminals are mounted on predetermined positions on the conductor pattern of a metal base circuit board, and passed through an electric furnace with cream solder or the like interposed therebetween to be soldered and fixed. After soldering the above mounted parts,
A raised piece is formed by bending the conductor pattern at approximately right angles so that the mounted components are on the inside from a predetermined position of the three-base circuit board. Thereafter, a case is placed so as to surround this upright piece, and the case is filled with resin to seal the mounted components with the resin. The electronic device completed in this way is
Electronic components can also be mounted and fixed on the stand-up piece of the metal base circuit board, and this part can be used as a heat dissipation section, making it possible to create an electronic device with higher power output even though it is the same size as a conventional device. At the same time, reliability can be increased by improving the heat dissipation effect.
［実施例］ 以下に、本発明の実施例を図を参照して説明する。[Example] Embodiments of the present invention will be described below with reference to the drawings.
第１図は、金属ベース回路基板１１の展開図である。こ
の回路基板１１は、金属−絶縁層−導体パターンの三層
構造からなり、金属として例えばアルミニューム金属、
導体パターンとして銅箔により所定のパターンを形成し
たものを用いている。FIG. 1 is a developed view of the metal base circuit board 11. This circuit board 11 has a three-layer structure of metal, insulating layer, and conductor pattern, and the metal is, for example, aluminum metal,
As the conductor pattern, a predetermined pattern formed of copper foil is used.
金属ベース回路基板１１には、中央の底板部１１ａと、
この底板部１１ａの左右に連ねて側板部↓Ｌｂ、１．１
ｃと、訓示の上方に連ねて中央側板部ｌｉｄが形成され
る。底板部１１ａ、側板部１１ｂ、ｌｌｃおよび中央側
板部Ｌｉｄには所定の電子部品１２ａ、１２ｂ、１２ｃ
が図示しない半田クリームを介して４￥ＦＩｉＩ１．さ
れ、また、左右の側板部１１ｂ、ｌｌｃ上には、外部導
出端子１４が半田クリームを介して搭載される。この状
態で電気炉内を通過させ、電子部品１２ａないし１２ｄ
および外部導出端子１４を各部の導体パターン上に搭載
・固着させる。上記の外部導出端子１４は、第２し１か
ら明らかなように断面略コ字状に形成され、左右の側板
部１１ｂ、ｌｌｃの端面部との沿面距離を確保している
。The metal base circuit board 11 includes a central bottom plate portion 11a,
Side plate parts ↓Lb, 1.1 are connected to the left and right sides of this bottom plate part 11a.
A central side plate portion lid is formed in series with c and above the guide. Predetermined electronic components 12a, 12b, 12c are provided on the bottom plate portion 11a, side plate portions 11b, llc, and center side plate portion Lid.
is applied via solder cream (not shown) to ¥4 FIiI1. Further, external lead-out terminals 14 are mounted on the left and right side plate portions 11b and llc via solder cream. In this state, the electronic components 12a to 12d are passed through an electric furnace.
And the external lead-out terminals 14 are mounted and fixed on the conductor patterns of each part. As is clear from the second section 1, the external lead-out terminal 14 is formed in a substantially U-shaped cross section to ensure a creeping distance from the end surfaces of the left and right side plates 11b and llc.
次に、電子部品１２ａないし１２ｃおよび外部導出端子
１４を搭載・固着した金属ベース回路基板１１を一点鎖
線りの部分からそれぞれ略直角に折１ＩＩＩげて、第３
図に示すように立上げ片１５ａ。Next, the metal base circuit board 11 on which the electronic components 12a to 12c and the external lead-out terminals 14 are mounted and fixed is folded approximately at right angles from the portion indicated by the dashed line.
As shown in the figure, a rising piece 15a.
↓５ｂ、 ↓５ｃを形成する。この立」ユげ片Ｊ−５
ａ 。Form ↓5b and ↓5c. “Kono-tachi” Yugegata J-5
a.
１５ｂ、１５ｃの形成工程は、３ｆｉｉＩ所同時に形成
するようにしても良いし、また、１箇所毎に形成するよ
うにして良い。また、上記の回路基板１１を折曲げる場
合、銅箔製の導体パターンもノに材のアルミニューム金
属および絶縁層とともに折曲げるが、各Ｊ７．Ｉｙ開の
接ｉｆ強度が高いため、絶縁層から剥離することはない
。In the step of forming 15b and 15c, they may be formed at the same time in 3 locations, or may be formed at each location. In addition, when the above circuit board 11 is bent, the copper foil conductor pattern is also bent together with the aluminum metal and the insulating layer, but each J7. Since the Iy open contact strength is high, it will not peel off from the insulating layer.
上記の折曲げ加工後に、金属ベース回路基板ｌ↓とは別
体の金属板からなる冷却体１６を、該回路基板１１にお
ける底板部↓１ａの外側底面に取り付ける。冷却体↓６
の取付方法は、良熱伝導性の接着剤で固定しても良いし
、全域ベース回路ノ１（板１１の複数個所に透孔を設け
る一方、冷却体↓６にはねじ孔を設け、これらを利用し
てねじにより雨者を締結するようにしても良い。After the above bending process, a cooling body 16 made of a metal plate separate from the metal base circuit board l↓ is attached to the outer bottom surface of the bottom plate portion ↓1a of the circuit board 11. Cooling body↓6
The mounting method may be fixed using adhesive with good thermal conductivity, or by providing through-holes at multiple locations on the area base circuit No. 1 (plate 11) and screw holes on the cooling body ↓6. It is also possible to use screws to fasten the rain cover.
次に、第４図に示すように、冷却体１６上で、かつ、金
属ベース回路、７に板１１の前記した立上げ片１５ａ、
１５ｂ、１５ｃを包囲するように絶縁性樹脂等からなる
ケース１７を上部から被せ、当該ケース１７内には樹脂
を充填して硬化させることにより、外部導出端子１４の
みが封止樹脂１８から外部に露出した所定の電子機器が
完成する。Next, as shown in FIG. 4, on the cooling body 16 and on the metal base circuit 7,
A case 17 made of insulating resin or the like is placed from above so as to surround 15b and 15c, and by filling the case 17 with resin and hardening it, only the external terminal 14 is exposed to the outside through the sealing resin 18. The exposed predetermined electronic device is completed.
なお、上記の実施例では金属ベース回路基板に立上げ片
を三方に形成した例について図示し、説明したが、例え
ば四方でも一方でもその数に限定されるものではない。In addition, although the above-mentioned embodiment illustrated and described an example in which the raised pieces were formed on three sides of the metal base circuit board, the number is not limited to four sides or one side, for example.
また、金属ベース回路基板の導体パターンの材質も銅箔
に限らず、導電性の良好の材料であれば、いずれの材料
でも良い。Further, the material of the conductor pattern of the metal base circuit board is not limited to copper foil, but any material having good conductivity may be used.
［発明の効果コ
以」二のように、本発明によれば、金属ベース回路基板
の立上げ片部分にも電子部品を搭載・固着させ、該立上
げ片部分も放熱面として利用するようにしたので、
放熱面積が大きくなり、従来と同一の大きさであっても
より大電力用の電子機器の製作が可能となる。[Effects of the Invention] As described in Part 2, according to the present invention, electronic components are mounted and fixed on the raised piece of the metal base circuit board, and the raised piece is also used as a heat dissipation surface. As a result, the heat dissipation area becomes larger, making it possible to manufacture electronic devices with higher power output even if they are the same size as conventional devices.
また、電子機器の放熱効果が良好となるので、当該電子
機器の信頼性が向上するなどの優れた効果がある。Furthermore, since the heat dissipation effect of the electronic device is improved, there are excellent effects such as improved reliability of the electronic device.
第１図は、本発明の電子機器に使用する金属ベース回路
基板の展開図、第２図は、その正面図、第３図は、上記
金属ベース回路基板を折曲げた状態の斜視図、第４図は
、冷却体上に所定の形状に折曲げた金属ベース回路基板
をＰ！、ｉしてケースにて包囲し、ケース内部に樹脂を
充填して完成させた電子機器の斜視図、第５図は、従来
の電子機器の構造を説明するために図示したソリッド・
ステート・リレーの斜視図である。
↓１・・・金属ベース回路基板、
１２ａ、１２ｂ、１２ｃ・’ 、電子部品、１４・・・
外部導出端子、↓６・・・冷却体、１７・・・ケース、
■８・・・封止樹脂。FIG. 1 is a developed view of a metal base circuit board used in the electronic device of the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a perspective view of the metal base circuit board in a folded state. Figure 4 shows a metal base circuit board bent into a predetermined shape on a cooling body. Figure 5 is a perspective view of an electronic device completed by enclosing it in a case and filling the inside of the case with resin.
FIG. 2 is a perspective view of a state relay. ↓1...Metal base circuit board, 12a, 12b, 12c・', electronic component, 14...
External lead terminal, ↓6... Cooling body, 17... Case, ■8... Sealing resin.
Claims (1)
ース回路基板を有し、該回路基板上の導体パターン上の
所定の位置に電子部品および外部導出端子が搭載・固着
され、前記導体パターンに搭載・固着された電子部品お
よび外部導出端子が内側になるようにして該回路基板の
一部を、該導体パターンごと略直角に折曲げて立上げ片
が形成され、かつ、該立上げ片を含めて前記回路基板を
包囲するようにケースを配置し、該ケース内に樹脂を充
填して該回路基板に搭載・固着された電子部品および外
部端子の一部を樹脂封止してなる電子機器。It has a metal base circuit board consisting of a three-layer structure of metal-insulating layer-conductor pattern, and electronic components and external lead-out terminals are mounted and fixed at predetermined positions on the conductor pattern on the circuit board, and the conductor pattern is A stand-up piece is formed by bending a part of the circuit board together with the conductor pattern at approximately right angles so that the mounted and fixed electronic components and external lead-out terminals are on the inside; an electronic device in which a case is arranged to surround the circuit board, the case is filled with resin, and a part of the electronic components and external terminals mounted and fixed to the circuit board are sealed with the resin; .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1318806A JP2851655B2 (en) | 1989-12-11 | 1989-12-11 | Manufacturing method of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1318806A JP2851655B2 (en) | 1989-12-11 | 1989-12-11 | Manufacturing method of electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03181198A true JPH03181198A (en) | 1991-08-07 |
| JP2851655B2 JP2851655B2 (en) | 1999-01-27 |
Family
ID=18103150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1318806A Expired - Fee Related JP2851655B2 (en) | 1989-12-11 | 1989-12-11 | Manufacturing method of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2851655B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100415086C (en) * | 2002-08-28 | 2008-09-03 | 株式会社岛野 | Decorative part for outdoor use |
-
1989
- 1989-12-11 JP JP1318806A patent/JP2851655B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100415086C (en) * | 2002-08-28 | 2008-09-03 | 株式会社岛野 | Decorative part for outdoor use |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2851655B2 (en) | 1999-01-27 |
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