JPH0436024Y2 - - Google Patents
Info
- Publication number
- JPH0436024Y2 JPH0436024Y2 JP1657686U JP1657686U JPH0436024Y2 JP H0436024 Y2 JPH0436024 Y2 JP H0436024Y2 JP 1657686 U JP1657686 U JP 1657686U JP 1657686 U JP1657686 U JP 1657686U JP H0436024 Y2 JPH0436024 Y2 JP H0436024Y2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- point metal
- metal body
- resistor
- layered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002844 melting Methods 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 230000008018 melting Effects 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Description
【考案の詳細な説明】
＜産業上の利用分野＞
本考案は抵抗・温度ヒユーズ結合体の改良に関
するものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an improvement of a resistance/temperature fuse combination.
＜先行技術と問題点＞
抵抗・温度ヒユーズ結合体例えば、抵抗付温度
ヒユーズとして、第３図に示すように、絶縁基板
１′上に層状抵抗体２′と層状低融点金属体３′と
を設けたものが公知である（４′，４′並びに６′，
６′は電極５′，５′並びに７′，７′はリード導体、
８は絶縁層）。その使用要領は層体抵抗体２′を被
保護回路に接続し、層状低融点金属体３′を被保
護回路のリレー回路に接続して、被保護回路に過
電流が流れて層状抵抗体２′が発熱すると、その
発生熱で層状低融点金属体３′を溶断させて被保
護回路の通電を遮断することにある。<Prior art and problems> Resistance/temperature fuse combination For example, as a temperature fuse with a resistance, as shown in FIG. Those provided are known (4', 4' and 6',
6' is the electrode 5', 5' and 7', 7' is the lead conductor,
8 is an insulating layer). The method of use is to connect the layered resistor 2' to the circuit to be protected, and connect the layered low-melting point metal body 3' to the relay circuit of the protected circuit. When ' generates heat, the layered low-melting point metal body 3' is fused and cut off from electricity to the circuit to be protected.
しかしながら、この抵抗付温度ヒユーズにおい
ては、抵抗体２′から低融点金属体３′への熱伝達
の指向角度が狭く、而して、熱伝達性が低く、低
融点金属体３′の溶断性、従つて温度ヒユーズの
作動性に問題がある。 However, in this temperature fuse with a resistance, the directivity angle of heat transfer from the resistor 2' to the low melting point metal body 3' is narrow, and therefore the heat transferability is low, and the low melting point metal body 3' is difficult to fuse. Therefore, there is a problem with the operation of the temperature fuse.
＜考案の目的＞
本考案の目的は、抵抗体の発生熱を低融点金属
体に効率よく伝達できる作動性に秀れた抵抗・温
度ヒユーズ結合体を提供することにある。<Purpose of the invention> An object of the invention is to provide a resistance/temperature fuse combination that has excellent operability and can efficiently transfer heat generated by a resistor to a low-melting point metal body.
＜考案の構成＞
本考案に係る抵抗・温度ヒユーズ結合体は、絶
縁基板上に所定パターンの抵抗体と低融点金属体
とを一方が他方を少くとも三方から包囲するよう
に設けたことを特徴とする構成である。<Structure of the invention> The resistance/temperature fuse combination according to the invention is characterized in that a resistor in a predetermined pattern and a low-melting point metal body are provided on an insulating substrate so that one surrounds the other from at least three sides. The configuration is as follows.
＜実施例の説明＞ 以下、図面により本考案を説明する。<Explanation of Examples> The present invention will be explained below with reference to the drawings.
第１図において、１は絶縁基板である。２は絶
縁基板上に設ける層状抵抗体、３は層状低融点金
属体であり、この層状低融点金属体３のパターン
は層状抵抗体２を少くとも三方から包囲する枠状
である。４，４は層状抵抗体２に対する電極、
５，５はリード導体である。６，６は層状低融点
金属体３に対する電極、７，７はリード導体であ
る。８は絶縁層である。 In FIG. 1, 1 is an insulating substrate. 2 is a layered resistor provided on an insulating substrate; 3 is a layered low-melting point metal body; the pattern of this layered low-melting point metal body 3 is a frame shape surrounding the layered resistor 2 from at least three sides. 4, 4 are electrodes for the layered resistor 2;
5, 5 is a lead conductor. 6, 6 are electrodes for the layered low melting point metal body 3, and 7, 7 are lead conductors. 8 is an insulating layer.
上記において、層状低融点金属体３のパターン
を層状抵抗体２を包囲せる枠状としてあるから、
層状抵抗体２が発熱すると、その発生熱層状低融
点金属体３に全ゆる方向から伝達でき、従つて、
その層状低融点金属体３を効率よく加熱できる。 In the above, since the pattern of the layered low-melting point metal body 3 is a frame shape that surrounds the layered resistor 2,
When the layered resistor 2 generates heat, the generated heat can be transmitted to the layered low-melting point metal body 3 from all directions.
The layered low melting point metal body 3 can be efficiently heated.
上記層状低融点金属体３を抵抗体に、層状抵抗
体２を低融点金属体に変更すること、すなわち互
いに逆の構成にすることもできる。第２図は本考
案に係る温度ヒユーズ付抵抗素子を示し、層状抵
抗体２をほぼ四方から層状低融点金属体３で包囲
し、層状抵抗体２と層状低融点金属体３とを電極
２３，２３により直列に接続し、電極２４，２４
においてリード導体５，５を連結してある。この
温度ヒユーズ付抵抗素子において、過電流により
枠状の層状抵抗体２が発熱すると、その発生熱で
その廻りの層状低融点金属体３を全ゆる方向から
加熱できるので熱効率よく低融点金属体３を加
熱・溶断できる。従つて、抵抗素子２の異常発熱
から回路を良好に保護できる。第２図に示す温度
ヒユーズ付抵抗素子においても、抵抗体と低融点
金属体とを互に逆の構成になし得る。 It is also possible to change the layered low-melting point metal body 3 to a resistor and the layered resistor 2 to a low-melting point metal body, that is, to have mutually opposite configurations. FIG. 2 shows a resistance element with a temperature fuse according to the present invention, in which a layered resistor 2 is surrounded by layered low melting point metal bodies 3 from almost all sides, and electrodes 23, 23 and connected in series by electrodes 24, 24.
Lead conductors 5, 5 are connected at. In this resistance element with a temperature fuse, when the frame-shaped layered resistor 2 generates heat due to an overcurrent, the generated heat can heat the surrounding layered low-melting point metal body 3 from all directions, so that the low-melting point metal body 3 can be thermally efficiently heated. can be heated and cut. Therefore, the circuit can be well protected from abnormal heat generation of the resistance element 2. Also in the resistance element with a temperature fuse shown in FIG. 2, the resistor and the low melting point metal body can be configured in reverse.
＜考案の効果＞
本考案に係る抵抗・温度ヒユーズ結合体におい
ては、上述した通り、抵抗体と低融点金属体とを
何れか一方で他方を包囲するように設けてあるか
ら、抵抗体の発生熱を低融点金属体に効率よく伝
達でき、抵抗・温度ヒユーズ結合体の作動性をよ
く向上できる。<Effects of the invention> As described above, in the resistance/temperature fuse combination according to the invention, since either the resistor or the low-melting point metal body is provided so as to surround the other, the generation of the resistor is prevented. Heat can be efficiently transferred to the low melting point metal body, and the operability of the resistance/temperature fuse combination can be improved.
第１図は本考案に係る抵抗・温度ヒユーズ結合
体を示す説明図、第２図は本考案の別実施例を示
す説明図、第３図は従来の抵抗・温度ヒユーズ結
合体を示す説明図である。
図において、１は絶縁基板、２は低融点金属
体、３は抵抗体である。
Fig. 1 is an explanatory diagram showing a resistance/temperature fuse combination according to the present invention, Fig. 2 is an explanatory diagram showing another embodiment of the invention, and Fig. 3 is an explanatory diagram showing a conventional resistance/temperature fuse combination. It is. In the figure, 1 is an insulating substrate, 2 is a low melting point metal body, and 3 is a resistor.
Claims (1)
属体とを一方が他方を少なくとも三方から包囲す
るように設けたことを特徴とする抵抗・温度ヒユ
ーズ結合体。 1. A resistance/temperature fuse combination comprising a predetermined pattern of a resistor and a low melting point metal body provided on an insulating substrate so that one surrounds the other from at least three sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1657686U JPH0436024Y2 (en) | 1986-02-06 | 1986-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1657686U JPH0436024Y2 (en) | 1986-02-06 | 1986-02-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6314337U JPS6314337U (en) | 1988-01-30 |
| JPH0436024Y2 true JPH0436024Y2 (en) | 1992-08-26 |
Family
ID=30808559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1657686U Expired JPH0436024Y2 (en) | 1986-02-06 | 1986-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436024Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0515126Y2 (en) * | 1988-02-19 | 1993-04-21 |
-
1986
- 1986-02-06 JP JP1657686U patent/JPH0436024Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6314337U (en) | 1988-01-30 |
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