JPH0220802Y2 - - Google Patents
Info
- Publication number
- JPH0220802Y2 JPH0220802Y2 JP1984172061U JP17206184U JPH0220802Y2 JP H0220802 Y2 JPH0220802 Y2 JP H0220802Y2 JP 1984172061 U JP1984172061 U JP 1984172061U JP 17206184 U JP17206184 U JP 17206184U JP H0220802 Y2 JPH0220802 Y2 JP H0220802Y2
- Authority
- JP
- Japan
- Prior art keywords
- temperature fuse
- resistance
- fuse element
- heat
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 11
- 239000011810 insulating material Substances 0.000 claims description 5
- 239000004568 cement Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
- Fuses (AREA)
Description
【考案の詳細な説明】
〈産業上の利用分野〉
本考案は抵抗・温度ヒユーズの改良に関するも
のである。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to improvements in resistance/temperature fuses.
〈従来の技術〉
抵抗・温度ヒユーズは、温度ヒユーズ素子に電
気抵抗素子を接続し、かつ両者を近接させ、これ
ら全体を無機質良熱伝導性の絶縁材、例えば、セ
メントによつて包囲せる構成であり、その使用要
領は、保護すべき電気機器とは熱伝導的に全く独
立した位置に配設し、電気機器に異常電流が流
れ、その電流によつて抵抗素子が発熱したときそ
の熱によつて温度ヒユーズ素子を溶断させること
にある。第２図Ａ並びに第２図Ｂ（第２図Ａのｂ
−ｂ断面図）は従来の抵抗・温度ヒユーズを示
し、筒型抵抗器A′に温度ヒユーズ素子B′を近接
させ、これら全体をセメント６′でモールドして
ある。<Prior art> A resistance/temperature fuse has a structure in which an electrical resistance element is connected to a temperature fuse element, the two are placed close to each other, and the whole is surrounded by an inorganic insulating material with good thermal conductivity, such as cement. The procedure for using it is to install it in a location that is completely independent of the electrical equipment to be protected in terms of thermal conductivity, and when an abnormal current flows through the electrical equipment and the resistance element generates heat due to the current, the resistance element is The purpose is to melt down the temperature fuse element. Figure 2A and Figure 2B (b of Figure 2A)
2-b sectional view) shows a conventional resistance/temperature fuse, in which a temperature fuse element B' is placed close to a cylindrical resistor A', and the whole is molded with cement 6'.
〈解決しようとする課題〉
しかし、この従来の抵抗・温度ヒユーズにおい
ては、第２図Ｂに示すように、筒型抵抗器A′が
全周の360゜の範囲にわたつて熱を放射するのに対
し、温度ヒユーズ素子B′はその360゜の数分の１に
すぎないαの角度範囲内で受熱するだけであるか
ら、ｘ−ｙ面での放熱量に対する受熱量は数分の
１（ｎ分の１）であり、また、温度ヒユーズ素子
B′の長さ（約10mm）は、筒型抵抗器A′の長さ
（約30mm）の数分の１（ｍ分の１）である。結局、
温度ヒユーズ素子B′に向けて放射される熱量は
抵抗器A′が放射する熱量のｍ×ｎ分の１にずぎ
ず、従つて、温度ヒユーズ素子が受熱する熱量が
少なく温度ヒユーズ素子の温度上昇速度が遅く、
抵抗・温度ヒユーズの作動速度も遅い。<Problem to be solved> However, in this conventional resistance/temperature fuse, as shown in Figure 2B, the cylindrical resistor A' radiates heat over a 360° range around its entire circumference. On the other hand, the temperature fuse element B' only receives heat within the angular range α, which is only a fraction of 360 degrees, so the amount of heat received relative to the amount of heat radiated in the x-y plane is a fraction ( 1/n), and the temperature fuse element
The length of B' (approximately 10 mm) is a fraction (1/m) of the length of cylindrical resistor A' (approximately 30 mm). in the end,
The amount of heat radiated towards the temperature fuse element B' is only 1/m x n of the amount of heat radiated by the resistor A'. Therefore, the amount of heat received by the temperature fuse element is small and the temperature of the temperature fuse element increases. slow speed,
Resistance/temperature fuses are also slow to operate.
本考案の目的は、作動速度を迅速化できる抵
抗・温度ヒユーズを提供することにある。 It is an object of the present invention to provide a resistance-temperature fuse that can be operated quickly.
〈課題を解決するための手段〉
本考案に係る抵抗・温度ヒユーズは、片面を凹
凸化して表面距離を長くした絶縁基板の当該凹凸
面に抵抗膜が設けられ、該片面上に良熱伝導性の
絶縁材がモールドされ、リード線間に接続した温
度ヒユーズ素子が上記モールド層に埋入されてい
ることを特徴とする構成である。<Means for Solving the Problems> The resistance/temperature fuse according to the present invention includes a resistive film provided on the uneven surface of an insulating substrate whose one side is made uneven to increase the surface distance, and a resistive film is provided on the uneven surface of the insulating substrate. This structure is characterized in that an insulating material is molded, and a temperature fuse element connected between the lead wires is embedded in the mold layer.
〈実施例の説明〉 以下、図面により本考案の実施例を説明する。<Explanation of Examples> Embodiments of the present invention will be described below with reference to the drawings.
第１図において、１は耐熱性に優れた絶縁基
板、例えば、セラミツクス板であり、片面に凹凸
１１を設けて表面距離を長くしてある。２は絶縁
基板１の凹凸面１１に設けた抵抗膜であり、酸化
金属皮膜、高抵抗金属皮膜（ニツケル、クロム）、
あるいは炭素皮膜等を用いることができる。３，
３は電極、４，４は電極に接続したリード導体で
ある。Ｂは温度ヒユーズ素子であり、上記抵抗膜
２上に近接して配されている。５は温度ヒユーズ
素子Ｂの一端に接続したリード導体であり、温度
ヒユーズ素子Ｂの他端には上記電極３からのリー
ド導体４が接続されている。６は絶縁基板１の凹
凸１１上にモールドした無機質良熱伝導性の絶縁
材、例えば、セメントであり、抵抗膜２を覆い、
かつ温度ヒユーズ素子Ｂを埋入している。 In FIG. 1, reference numeral 1 denotes an insulating substrate having excellent heat resistance, such as a ceramic plate, and has irregularities 11 on one side to increase the surface distance. 2 is a resistive film provided on the uneven surface 11 of the insulating substrate 1, which includes a metal oxide film, a high resistance metal film (nickel, chromium),
Alternatively, a carbon film or the like can be used. 3,
3 is an electrode, and 4, 4 is a lead conductor connected to the electrode. Reference numeral B designates a temperature fuse element, which is placed close to the resistive film 2. A lead conductor 5 is connected to one end of the temperature fuse element B, and a lead conductor 4 from the electrode 3 is connected to the other end of the temperature fuse element B. 6 is an inorganic insulating material with good thermal conductivity, such as cement, which is molded on the unevenness 11 of the insulating substrate 1, and covers the resistive film 2;
In addition, a temperature fuse element B is embedded.
上記抵抗・温度ヒユーズは、保護すべき電気機
器と熱伝導的に全く独立した位置に配設し、電気
機器に異常電流が流れ、その電流によつて抵抗素
子が異常発熱したときその熱によつて温度ヒユー
ズ素子を溶断させ、電気機器への通電を遮断する
態様、または抵抗膜を回路のインピーダンス素子
として用い、このインピーダンス素子が過電流に
より発熱したときにその熱によつて温度ヒユーズ
素子を溶断させてインピーダンス素子への通電を
遮断し、回路を抵抗（インピーダンス）素子の発
熱から保護する態様によつて使用できる。 The above resistance/temperature fuse is placed in a location that is completely independent of the electrical equipment to be protected in terms of thermal conductivity, and when an abnormal current flows through the electrical equipment and the resistance element becomes abnormally heated due to the current, the resistance element will be affected by the heat. In this method, a resistive film is used as an impedance element in a circuit, and when this impedance element generates heat due to overcurrent, the temperature fuse element is fused by the heat generated by the impedance element. It can be used in an embodiment in which the circuit is protected from heat generation by the resistance (impedance) element by cutting off current to the impedance element.
上記抵抗・温度ヒユーズにおいて、抵抗膜近傍
ではジユール熱が絶縁基板側と無機質材モールド
側とにほぼ２分して放射される。また、絶縁基板
の長さを温度ヒユーズ素子の長さに近づけ短くし
ても、絶縁基板の片面を凹凸面にして表面距離を
長くし、この凹凸面上に抵抗膜を設けているか
ら、充分に高い所定の抵抗値を付与できる。従つ
て、抵抗体の発生熱量を多くし得、かつ抵抗体
（抵抗膜付絶縁基板）平面積を温度ヒユーズ素子
の平面積に近づけて抵抗体からの温度ヒユーズ素
子への交叉量を多くできるから、抵抗体から発生
せる熱に対する温度ヒユーズ素子の受熱量を多く
できる。 In the above-mentioned resistance/temperature fuse, the Joule heat is radiated in the vicinity of the resistive film in approximately two directions: to the insulating substrate side and to the inorganic material mold side. In addition, even if the length of the insulating substrate is shortened to near the length of the temperature fuse element, one side of the insulating substrate has an uneven surface to increase the surface distance, and the resistive film is provided on this uneven surface, so it is sufficient. can be given a high predetermined resistance value. Therefore, the amount of heat generated by the resistor can be increased, and the plane area of the resistor (insulating substrate with a resistive film) can be brought closer to the plane area of the temperature fuse element, so that the amount of crossover from the resistor to the temperature fuse element can be increased. , the amount of heat received by the temperature fuse element relative to the heat generated from the resistor can be increased.
〈考案の効果〉
このように本考案に係る抵抗・温度ヒユーズに
よれば、抵抗素子から発生する熱の多くを温度ヒ
ユーズ素子に受熱させ得、温度ヒユーズ素子を迅
速に加熱できるので、作動速度の高速化を図り得
る。<Effects of the invention> As described above, according to the resistance/temperature fuse according to the present invention, most of the heat generated from the resistance element can be received by the temperature fuse element, and the temperature fuse element can be quickly heated, so that the operating speed can be reduced. It is possible to increase the speed.
第１図は本考案の一実施例を示す説明図、第２
図Ａは従来例を示す説明図、第２図Ｂは第２図Ａ
におけるｂ−ｂ断面図である。
１……絶縁基板、２……抵抗膜、Ｂ……温度ヒ
ユーズ素子、６……無機質良熱伝導性絶縁材。
Fig. 1 is an explanatory diagram showing one embodiment of the present invention;
Figure A is an explanatory diagram showing a conventional example, Figure 2B is Figure 2A
It is a bb sectional view in . 1...Insulating substrate, 2...Resistive film, B...Temperature fuse element, 6...Inorganic insulating material with good thermal conductivity.
Claims (1)
の当該凹凸面に抵抗膜が設けられ、該片面上に良
熱伝導性の絶縁材がモールドされ、リード線間に
接続した温度ヒユーズ素子が上記モールド層に埋
入されていることを特徴とする抵抗・温度ヒユー
ズ。 A resistive film is provided on the uneven surface of an insulating substrate whose one side is made uneven to increase the surface distance, an insulating material with good thermal conductivity is molded on the one side, and a temperature fuse element connected between the lead wires is molded into the mold. A resistance/temperature fuse characterized by being embedded in a layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984172061U JPH0220802Y2 (en) | 1984-11-12 | 1984-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984172061U JPH0220802Y2 (en) | 1984-11-12 | 1984-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6186902U JPS6186902U (en) | 1986-06-07 |
| JPH0220802Y2 true JPH0220802Y2 (en) | 1990-06-06 |
Family
ID=30729731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984172061U Expired JPH0220802Y2 (en) | 1984-11-12 | 1984-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0220802Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4663610B2 (en) * | 2006-09-29 | 2011-04-06 | 内橋エステック株式会社 | Connection structure of thermal fuse and resistor and resistor with thermal fuse |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5533604U (en) * | 1978-08-17 | 1980-03-04 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59125801U (en) * | 1983-02-15 | 1984-08-24 | 松下電器産業株式会社 | chip resistor |
-
1984
- 1984-11-12 JP JP1984172061U patent/JPH0220802Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5533604U (en) * | 1978-08-17 | 1980-03-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6186902U (en) | 1986-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4783587A (en) | Self-regulating heating article having electrodes directly connected to a PTC layer | |
| JP2001509945A (en) | Electric fuse | |
| JPH0220802Y2 (en) | ||
| JP3782176B2 (en) | Method of using protective element and protective device | |
| JPH0723863Y2 (en) | Thermal fuse | |
| JPH1050184A (en) | Chip fuse element | |
| JPH0436021Y2 (en) | ||
| JPH0514438Y2 (en) | ||
| JP2524859B2 (en) | Resistance / temperature fuse and manufacturing method thereof | |
| JPH0436023Y2 (en) | ||
| JPH0229652Y2 (en) | ||
| JPH0436022Y2 (en) | ||
| JPH0711393Y2 (en) | Substrate type thermal fuse | |
| JPS6239568Y2 (en) | ||
| JPH10261353A (en) | Resistance/temperature fuse | |
| JPS6350809Y2 (en) | ||
| JPH0521814Y2 (en) | ||
| JPH0514433Y2 (en) | ||
| JPS6238290Y2 (en) | ||
| JPS6041632Y2 (en) | temperature fuse resistor | |
| JPH0514437Y2 (en) | ||
| JPH073558Y2 (en) | Resistance temperature fuse composite | |
| JPS636832Y2 (en) | ||
| JP2000188174A (en) | Electric hob | |
| JP2000133501A (en) | Resistor |