JPH0436022Y2 - - Google Patents
Info
- Publication number
- JPH0436022Y2 JPH0436022Y2 JP1393486U JP1393486U JPH0436022Y2 JP H0436022 Y2 JPH0436022 Y2 JP H0436022Y2 JP 1393486 U JP1393486 U JP 1393486U JP 1393486 U JP1393486 U JP 1393486U JP H0436022 Y2 JPH0436022 Y2 JP H0436022Y2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- melting point
- metal body
- point metal
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002844 melting Methods 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 13
- 239000006096 absorbing agent Substances 0.000 claims description 6
- 230000008018 melting Effects 0.000 description 20
- 238000009413 insulation Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
- Fuses (AREA)
Description
【考案の詳細な説明】
＜産業上の利用分野＞
本考案は基板型温度ヒユーズ抵抗器の改良に関
するものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an improvement of a substrate type temperature fuse resistor.
＜先行技術と問題点＞
温度ヒユーズ抵抗器は、回路素子である抵抗器
と温度ヒユーズとを直列に接続すると共に両者を
良好な熱伝達条件下で近接配設せる構成であり、
抵抗器が過電流により発熱すると、その発生熱に
より温度ヒユーズを溶断させて、抵抗器の通電を
遮断し、回路を抵抗器の発生熱から保護するもの
である。<Prior art and problems> A temperature fuse resistor has a configuration in which a resistor, which is a circuit element, and a temperature fuse are connected in series, and both are placed close to each other under good heat transfer conditions.
When the resistor generates heat due to overcurrent, the generated heat blows the temperature fuse, cutting off the current flow to the resistor and protecting the circuit from the heat generated by the resistor.
かかる温度ヒユーズ抵抗器として、第２図に示
すように、絶縁基板１′上に一対の帯状電極２a′，
２b′を設け、電極先端間に層状の低融点金属体
４′を設け、一方の電極２a′の中間に層状の抵抗
体６′を設けたものが公知である。第２図におい
て、３a′，３b′はリード導体、８′は基板上に設
けた絶縁層である。 As such a temperature fuse resistor, as shown in FIG. 2, a pair of band-shaped electrodes 2a',
2b', a layered low melting point metal body 4' is provided between the tips of the electrodes, and a layered resistor 6' is provided in the middle of one electrode 2a'. In FIG. 2, 3a' and 3b' are lead conductors, and 8' is an insulating layer provided on the substrate.
この温度ヒユーズ抵抗器において、過電流によ
り抵抗体６が発熱すると、その発生熱は主に、一
方の電極２a′を介して低融点金属体４′の一端４
a′に伝達する経路Ａと、抵抗体６′と他方の電極
２b′との間の絶縁基板部分b′と他方の電極２b′を
介して低融点金属体４′の他端４b′に伝達する経
路Ｂとによつて低融点金属体に伝達される。 In this temperature fuse resistor, when the resistor 6 generates heat due to overcurrent, the generated heat is mainly transferred to one end 4 of the low melting point metal body 4' through one electrode 2a'.
transmission to the other end 4b' of the low melting point metal body 4' via the path A that transmits to the resistor 6' and the other electrode 2b' and the insulating substrate portion b' between the resistor 6' and the other electrode 2b'. It is transmitted to the low melting point metal body by path B.
而して、経路Ｂの途中には絶縁基板部分b′が存
在するから、経路Ｂに較べて経路Ａが急速に熱を
伝達し、従つて、低融点金属体４′の一端４a′が
他端４b′よりも早く加熱されてしまい、その一端
側のみにおいて低融点金属体４′の溶融球状化が
生じ、この球状化のみによつて低融点金属体の溶
断が行なわれるので、溶断間の距離を長くなし得
ず、従つて、溶断後の絶縁距離を充分に保証し難
い。 Since the insulating substrate portion b' exists in the middle of the path B, the path A transfers heat more rapidly than the path B, and therefore, one end 4a' of the low melting point metal body 4' is transferred to the other end 4a'. The end 4b' is heated faster than the end 4b', and the low melting point metal body 4' is molten and spheroidized only on that one end side, and the low melting point metal body 4' is fused and spheroidized only by this spheroidization. The distance cannot be made long, and therefore it is difficult to ensure a sufficient insulation distance after blowout.
＜考案の目的＞
本考案の目的は、上記低融点金属体の両端を同
等に加熱溶融することにより、溶断後の絶縁距離
を充分に確保し得る基板型温度ヒユーズ抵抗器を
提供することにある。<Purpose of the invention> The purpose of the invention is to provide a substrate-type temperature fuse resistor that can secure a sufficient insulation distance after blowing out by equally heating and melting both ends of the low-melting point metal body. .
＜考案の構成＞
本考案に係る基板型温度ヒユーズ抵抗器は、絶
縁基板上に一対の帯状電極を設け、これらの電極
先端間に低融点金属体を設け、一方の帯状電極の
中間に抵抗体を設け、この抵抗体と上記低融点金
属体との間の電極部分に熱吸収体を付設したこと
を特徴とする構成である。<Structure of the invention> The substrate type temperature fuse resistor according to the invention includes a pair of band-shaped electrodes provided on an insulating substrate, a low melting point metal body provided between the tips of these electrodes, and a resistor placed in the middle of one of the band-shaped electrodes. The structure is characterized in that a heat absorber is attached to an electrode portion between the resistor and the low melting point metal body.
＜実施例の説明＞ 以下、図面により本考案を説明する。<Explanation of Examples> The present invention will be explained below with reference to the drawings.
第１図において、１は絶縁基板であり、例え
ば、セラミツク板を用いることができる。２ａ，
２ｂは帯状電極である。３ａ，３ｂはリード導体
である。４は層状の低融点金属体（例えば、Pb
−Sn系合金）であり、電極先端間に設けてある。
５は低融点金属体上に塗布したフラツクスであ
り、省略することもできる。６は層状抵抗体であ
り、一方の電極２ａの途中に設けてある。７は熱
吸収体であり、抵抗体６と低融点金属体４との間
の電極部分２０ａに良好な熱伝導性で付設してあ
る。この熱吸収体には、金属、金属酸化物（例え
ば、BaTi03）、鉛ガラス等を使用できる。８は絶
縁基板上に設けた絶縁層であり、モールド樹脂層
を用いることができる。 In FIG. 1, 1 is an insulating substrate, for example, a ceramic plate can be used. 2a,
2b is a strip electrode. 3a and 3b are lead conductors. 4 is a layered low melting point metal body (for example, Pb
-Sn-based alloy) and is provided between the tips of the electrodes.
5 is a flux coated on the low melting point metal body, and can be omitted. 6 is a layered resistor, which is provided in the middle of one electrode 2a. A heat absorber 7 is attached to the electrode portion 20a between the resistor 6 and the low melting point metal body 4 with good thermal conductivity. This heat absorber can be made of metal, metal oxide (eg BaTiO 3 ), lead glass, or the like. 8 is an insulating layer provided on an insulating substrate, and a molded resin layer can be used.
上記において、抵抗体６→抵抗体６と電極２ｂ
との間の絶縁体部分→電極２ｂ→低融点金属体４
に至る熱伝達路Ｉの熱抵抗をR1、熱容量をC1と
すると、抵抗体６→電極２ａ→低融点金属体４に
至る熱伝達路の熱抵抗R2を第１図における寸
法X1，X2，X3，X4または電極２ａ，２ｂの厚み
等の調整により上記R1に等しくできる。また、
熱伝達路の熱容量C2は熱吸収体の比熱、平面
寸法、厚み等の調整により上記C1に等しくでき
る。 In the above, resistor 6 → resistor 6 and electrode 2b
Insulator part between → electrode 2b → low melting point metal body 4
If the thermal resistance of the heat transfer path I leading to is R 1 and the heat capacity is C 1 , then the thermal resistance R 2 of the heat transfer path leading from the resistor 6 to the electrode 2a to the low melting point metal body 4 is the dimension X 1 in FIG. , X 2 , X 3 , X 4 or the thickness of the electrodes 2a, 2b, etc., it can be made equal to the above R 1 . Also,
The heat capacity C 2 of the heat transfer path can be made equal to the above C 1 by adjusting the specific heat, planar dimensions, thickness, etc. of the heat absorber.
而して、抵抗体の発生熱を低融点金属体の両端
に時間的、量的に等しく伝達でき、低融点金属体
の両端を同時に加熱溶融できる。従つて、低融点
金属体を両端において球状化して溶断でき、溶断
後の距離を充分に確保できる。 Thus, the heat generated by the resistor can be transmitted equally in time and quantity to both ends of the low melting point metal body, and both ends of the low melting point metal body can be heated and melted at the same time. Therefore, the low melting point metal body can be spheroidized at both ends and then fused, and a sufficient distance after fusion can be ensured.
＜考案の効果＞
本考案に係る基板型温度ヒユーズ抵抗器におい
ては、上述した通り、低融点金属体の溶断距離を
充分に確保できるから、溶断後の絶縁距離をよく
保証でき、高電圧用に好適に使用できる。<Effects of the invention> As mentioned above, in the substrate type temperature fuse resistor according to the invention, since a sufficient fusing distance of the low melting point metal body can be ensured, the insulation distance after fusing can be well guaranteed, and it is suitable for high voltage applications. It can be used suitably.
第１図は本考案に係る基板型温度ヒユーズ抵抗
器を示す説明図、第２図は従来の基板型温度ヒユ
ーズ抵抗器を示す説明図である。
図において、１は絶縁基板、２ａ，２ｂは電
極、４は低融点金属体、６は抵抗体、７は熱吸収
体である。
FIG. 1 is an explanatory diagram showing a substrate type temperature fuse resistor according to the present invention, and FIG. 2 is an explanatory diagram showing a conventional substrate type temperature fuse resistor. In the figure, 1 is an insulating substrate, 2a and 2b are electrodes, 4 is a low melting point metal body, 6 is a resistor, and 7 is a heat absorber.
Claims (1)
電極先端間に低融点金属体を設け、一方の帯状電
極の中間に抵抗体を設け、この抵抗体と上記低融
点金属体との間の電極部分に熱吸収体を付設した
ことを特徴とする基板型温度ヒユーズ抵抗器。 A pair of strip-shaped electrodes is provided on an insulating substrate, a low-melting point metal body is provided between the tips of these electrodes, a resistor is provided in the middle of one of the strip-shaped electrodes, and an electrode is provided between the resistor and the low-melting point metal body. A substrate-type temperature fuse resistor characterized by having a heat absorber attached to a portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1393486U JPH0436022Y2 (en) | 1986-01-31 | 1986-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1393486U JPH0436022Y2 (en) | 1986-01-31 | 1986-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62126042U JPS62126042U (en) | 1987-08-10 |
| JPH0436022Y2 true JPH0436022Y2 (en) | 1992-08-26 |
Family
ID=30803455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1393486U Expired JPH0436022Y2 (en) | 1986-01-31 | 1986-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436022Y2 (en) |
-
1986
- 1986-01-31 JP JP1393486U patent/JPH0436022Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62126042U (en) | 1987-08-10 |
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