JPS6238290Y2 - - Google Patents
Info
- Publication number
- JPS6238290Y2 JPS6238290Y2 JP5252883U JP5252883U JPS6238290Y2 JP S6238290 Y2 JPS6238290 Y2 JP S6238290Y2 JP 5252883 U JP5252883 U JP 5252883U JP 5252883 U JP5252883 U JP 5252883U JP S6238290 Y2 JPS6238290 Y2 JP S6238290Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- heat
- fusible alloy
- electrodes
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 18
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 15
- 230000004907 flux Effects 0.000 claims description 13
- 239000011247 coating layer Substances 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011297 pine tar Substances 0.000 description 1
- 229940068124 pine tar Drugs 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Landscapes
- Fuses (AREA)
Description
【考案の詳細な説明】
本考案は基板型温度ヒユーズの改良に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a substrate type thermal fuse.
従来の基板型温度ヒユーズは、第１図に示すよ
うに耐熱性基板１′の上面に互に離隔せる電極
２′，２′を設け、これら電極２′，２′間を可溶合
金３′により架橋し、可溶合金３′上にフラツクス
層４′を介して密封保護層５′を設けた構成であ
り、耐熱性基板１′には通常セラミツクスが、密
封保護層５′には通常エポキシ樹脂がそれぞれ使
用されている。上記フラツクス層４′の機能は、
密封保護層５′で可溶合金３′を被覆するまでの間
に可溶合金３′が酸化するのを防止すること、並
びに可溶合金３′が溶断したときにその溶断ギヤ
ツプにに侵入して溶断を促進すること等にあり、
可溶合金３′よりも融点の低い松やに、樹脂、ロ
ジン等が用いられている。 As shown in FIG. 1, a conventional substrate-type temperature fuse has electrodes 2', 2' spaced apart from each other on the upper surface of a heat-resistant substrate 1', and a fusible alloy 3' connected between these electrodes 2', 2'. The heat-resistant substrate 1' is usually made of ceramic, and the sealing protection layer 5' is usually made of epoxy. Each resin is used. The function of the flux layer 4' is as follows:
To prevent the fusible alloy 3' from being oxidized until the fusible alloy 3' is covered with the sealing protective layer 5', and to prevent the fusible alloy 3' from entering the fusing gap when the fusible alloy 3' is fused. This is due to the fact that it promotes fusing, etc.
Pine tar, resin, rosin, etc., which have a lower melting point than the fusible alloy 3', are used.
ところで、温度ヒユーズにおいては、当該温度
ヒユーズをセツトする電気機器のヒートサイクル
に応じて、常時加熱、冷却が繰り返えされる。こ
の場合、加熱によるフラツクスの液状化があり、
耐熱性基板の熱膨脹係数（セラミツクスの場合で
0.08×10-4）と密封保護層（エポキシ樹脂の場合
で0.6×10-4）との熱膨脹係数が著しく相違するた
め、上記液状化したフラツクスに作用する圧力が
垂直方向と水平方向とで大きく相違し、フラツク
スの流動が顕著となり、フラツクス層の分布の不
均一化が避けられない。従つて、フラツクス層に
おける上記可溶合金の溶断促進機能の低下が懸念
される。 By the way, in a temperature fuse, heating and cooling are constantly repeated according to the heat cycle of the electrical equipment in which the temperature fuse is set. In this case, the flux liquefies due to heating,
Thermal expansion coefficient of heat-resistant substrate (in the case of ceramics)
Because the thermal expansion coefficients of the sealing protective layer (0.08×10 -4 ) and the sealing protective layer (0.6×10 -4 in the case of epoxy resin) are significantly different, the pressure acting on the liquefied flux is large in the vertical and horizontal directions. On the other hand, the flow of the flux becomes significant, and the distribution of the flux layer becomes non-uniform. Therefore, there is a concern that the fusing promoting function of the above-mentioned fusible alloy in the flux layer may deteriorate.
本考案に係る基板型温度ヒユーズは上記の不利
を軽減し得る構成であり、耐熱性基板の上面に互
に離隔せる電極を設け、これらの電極間を可溶合
金により架橋し、可溶合金上にフラツクス層を介
して密封保護層を設けた温度ヒユーズにおいて、
上記耐熱性基板の上面に上記密封保護層と熱膨脹
係数のほゞ等しい材質の被覆層を設けたことを特
徴とする構成である。 The substrate-type temperature fuse according to the present invention has a structure that can alleviate the above-mentioned disadvantages, and has electrodes spaced apart from each other on the top surface of a heat-resistant substrate, and these electrodes are bridged by a fusible alloy, and the fusible alloy is In a temperature fuse with a sealed protective layer through a flux layer,
This structure is characterized in that a coating layer made of a material having a coefficient of thermal expansion substantially equal to that of the sealing protection layer is provided on the upper surface of the heat-resistant substrate.
以下、図面により本考案を説明する。 The present invention will be explained below with reference to the drawings.
第２図において、１は耐熱性並びに熱良伝導性
の絶縁基板であり、例えばセラミツクス板であ
る。２は耐熱性基板１の上面に被覆したプラスチ
ツク層であり、その材質には、熱膨脹係数が後述
する密封保護層のそれとほゞ等しいものが使用さ
れている。３，３は箔状電極であり、例えば印刷
法により設けることができる。４は電極３，３間
を架橋せる可溶合金であり、例えばSn，Pb，
Bi，Cd，In系の合金を使用できる。５は可溶合
金４上にほゞ一様厚さでコーテングしたフラツク
ス層であり、その融点は可溶合金４の融点よりも
低く、例えば松やに、ロジン等を使用できる。６
は密封保護層であり、例えば常温硬化型エポキシ
樹脂のコーテング層である。 In FIG. 2, reference numeral 1 denotes an insulating substrate having heat resistance and good thermal conductivity, such as a ceramic plate. Reference numeral 2 denotes a plastic layer coated on the upper surface of the heat-resistant substrate 1, and the material used for the plastic layer has a coefficient of thermal expansion almost equal to that of the sealing protection layer to be described later. Reference numerals 3 and 3 denote foil electrodes, which can be provided by, for example, a printing method. 4 is a soluble alloy that bridges between the electrodes 3, 3, such as Sn, Pb,
Bi, Cd, and In alloys can be used. A flux layer 5 is coated on the fusible alloy 4 with a substantially uniform thickness, and its melting point is lower than that of the fusible alloy 4. For example, pine resin, rosin, etc. can be used. 6
is a sealing protective layer, for example, a coating layer of room temperature curing epoxy resin.
上記実施例においては、耐熱性基板１の上面全
体に被覆層２（熱膨脹係数が密封保護層のそれに
ほゞ等しい）を設け、この被覆層２上に電極３，
３を設けているが、第３図に示すように、耐熱性
基板１に電極３，３を直接設け、電極３，３で覆
われていない基板上面のみに被覆層２を設けるよ
うにしてもよい。この場合、電極３，３は導電性
塗料の焼付けにより設けることもできる。第３図
において、第２図と同一符号の部分は第２図と同
一の構成要素を示している。 In the above embodiment, a coating layer 2 (having a coefficient of thermal expansion approximately equal to that of the sealing protective layer) is provided over the entire upper surface of a heat-resistant substrate 1, and on this coating layer 2, electrodes 3,
However, as shown in FIG. 3, the electrodes 3, 3 may be directly provided on the heat-resistant substrate 1, and the coating layer 2 may be provided only on the upper surface of the substrate that is not covered with the electrodes 3, 3. good. In this case, the electrodes 3, 3 can also be provided by baking a conductive paint. In FIG. 3, parts with the same reference numerals as in FIG. 2 indicate the same components as in FIG.
第４図Ａは本考案の別実施例を示す断面説明
図、第４図Ｂは第４図Ａにおけるｂ−ｂ断面説明
図である。 FIG. 4A is an explanatory cross-sectional view showing another embodiment of the present invention, and FIG. 4B is an explanatory cross-sectional view taken along line bb in FIG. 4A.
この別実施例においては、可溶合金４に直列の
抵抗体４０（カーボン皮膜、酸化金属膜、高抵坑
金属膜）を設け、可溶合金４上にのみフラツクス
層５を設けてある。第４図Ａ並びに第４図Ｂにお
いて、１は耐熱基板、２は密封保護層６と熱膨脹
係数がほゞ同一の被覆層、３，…は電極、６は密
封保護層である。 In this other embodiment, a resistor 40 (carbon film, metal oxide film, high resistance metal film) is provided in series with the fusible alloy 4, and a flux layer 5 is provided only on the fusible alloy 4. In FIGS. 4A and 4B, 1 is a heat-resistant substrate, 2 is a coating layer having substantially the same coefficient of thermal expansion as the sealing protection layer 6, 3, . . . are electrodes, and 6 is a sealing protection layer.
上述した通り、本考案に係る温度ヒユーズにお
いては、耐熱性基板上に、熱膨脹係数が密封保護
層のそれにほゞ等しい被覆層を設けてあるから、
この被覆層と密封保護層との間での熱応力の発生
を充分に小さくでき、而して、フラツクス層に作
用する圧力（熱応力に起因する圧力）をよく軽減
できるから、既述したヒートサイクルによるフラ
ツクス層の不均一化、この不均一化のために生じ
る可溶合金の溶断特性の低下等を効果的に排除で
きる。 As mentioned above, in the temperature fuse according to the present invention, a coating layer having a coefficient of thermal expansion approximately equal to that of the sealing protective layer is provided on the heat-resistant substrate.
The generation of thermal stress between the coating layer and the sealing protective layer can be sufficiently reduced, and the pressure acting on the flux layer (pressure caused by thermal stress) can be reduced well. It is possible to effectively eliminate non-uniformity of the flux layer due to cycles and deterioration of the fusing characteristics of the fusible alloy caused by this non-uniformity.
第１図は従来の基板型温度ヒユーズを示す縦断
面説明図。第２図並びに第３図はそれぞれ本考案
の実施例を示す縦断面説明図、第４図Ａは本考案
の別実施例を示す縦断面説明図、第４図Ｂは第４
図Ａにおけるｂ−ｂ断面説明図である。
図において、１は耐熱性基材、２は被覆層、
３，３は電極、４は可溶合金、５はフラツクス
層、６は密封保護層である。
FIG. 1 is an explanatory longitudinal cross-sectional view showing a conventional substrate type temperature fuse. 2 and 3 are longitudinal cross-sectional explanatory views showing an embodiment of the present invention, FIG. 4A is a longitudinal cross-sectional explanatory view showing another embodiment of the present invention, and FIG.
It is a bb cross-sectional explanatory diagram in FIG. A. In the figure, 1 is a heat-resistant base material, 2 is a coating layer,
3, 3 is an electrode, 4 is a fusible alloy, 5 is a flux layer, and 6 is a sealing protection layer.
Claims (1)
これらの電極間を可溶合金により架橋し、可溶合
金上にフラツクス層を介して密封保護層を設けて
なる温度ヒユーズにおいて、上記耐熱性基板の上
面に上記密封保護層と熱膨脹係数のほゞ等しい材
質の被覆層を設けたことを特徴とする基板型温度
ヒユーズ。 Providing electrodes spaced apart from each other on the top surface of a heat-resistant substrate,
In a temperature fuse in which these electrodes are bridged by a fusible alloy and a sealing protective layer is provided on the fusible alloy via a flux layer, the sealing protective layer and the thermal expansion coefficient are approximately equal to each other on the upper surface of the heat-resistant substrate. A substrate type temperature fuse characterized by having a coating layer made of the same material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5252883U JPS59158251U (en) | 1983-04-07 | 1983-04-07 | PCB type temperature fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5252883U JPS59158251U (en) | 1983-04-07 | 1983-04-07 | PCB type temperature fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59158251U JPS59158251U (en) | 1984-10-24 |
| JPS6238290Y2 true JPS6238290Y2 (en) | 1987-09-30 |
Family
ID=30182872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5252883U Granted JPS59158251U (en) | 1983-04-07 | 1983-04-07 | PCB type temperature fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59158251U (en) |
-
1983
- 1983-04-07 JP JP5252883U patent/JPS59158251U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59158251U (en) | 1984-10-24 |
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