JPH05218113A - フラックス残留物の除去を含むハンダ付け方法 - Google Patents

フラックス残留物の除去を含むハンダ付け方法

Info

Publication number
JPH05218113A
JPH05218113A JP4294895A JP29489592A JPH05218113A JP H05218113 A JPH05218113 A JP H05218113A JP 4294895 A JP4294895 A JP 4294895A JP 29489592 A JP29489592 A JP 29489592A JP H05218113 A JPH05218113 A JP H05218113A
Authority
JP
Japan
Prior art keywords
flux
reflow
temperature
substrate
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4294895A
Other languages
English (en)
Japanese (ja)
Inventor
Yinon Degani
デガニ イノン
Dean P Kossives
ポール コッシヴス デアン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of JPH05218113A publication Critical patent/JPH05218113A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP4294895A 1991-11-04 1992-11-04 フラックス残留物の除去を含むハンダ付け方法 Withdrawn JPH05218113A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/787,290 US5125560A (en) 1991-11-04 1991-11-04 Method of soldering including removal of flux residue
US787290 1991-11-04

Publications (1)

Publication Number Publication Date
JPH05218113A true JPH05218113A (ja) 1993-08-27

Family

ID=25141008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4294895A Withdrawn JPH05218113A (ja) 1991-11-04 1992-11-04 フラックス残留物の除去を含むハンダ付け方法

Country Status (5)

Country Link
US (1) US5125560A (enExample)
EP (1) EP0541282B1 (enExample)
JP (1) JPH05218113A (enExample)
KR (1) KR100269834B1 (enExample)
DE (1) DE69216768T2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6820324B2 (en) 2001-01-30 2004-11-23 Sumitomo Electric Industries, Ltd. Method of manufacturing a resistor connector

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3390245B2 (ja) * 1993-06-01 2003-03-24 富士通株式会社 洗浄液及び洗浄方法
JP3194553B2 (ja) * 1993-08-13 2001-07-30 富士通株式会社 半導体装置の製造方法
DE4432774C2 (de) * 1994-09-15 2000-04-06 Fraunhofer Ges Forschung Verfahren zur Herstellung meniskusförmiger Lotbumps
US5919317A (en) * 1994-12-07 1999-07-06 Nippondenso Co., Ltd. Soldering flux, soldering paste and soldering method using the same
JP3104606B2 (ja) 1995-03-24 2000-10-30 株式会社デンソー 基板と被接続材との接続方法及びその接続構造及びその接続用補助材料
US5728035A (en) * 1996-05-03 1998-03-17 Guthy-Renker Corp. Anchor plate for abdominal exercise device
US5992729A (en) * 1996-10-02 1999-11-30 Mcnc Tacking processes and systems for soldering
US5988485A (en) * 1998-03-17 1999-11-23 Advanced Micro Devices, Inc. Flux cleaning for flip chip technology using environmentally friendly solvents
JP3785435B2 (ja) 1998-08-27 2006-06-14 株式会社デンソー はんだペーストおよび表面実装型電子装置
US6279090B1 (en) 1998-09-03 2001-08-21 Micron Technology, Inc. Method and apparatus for resynchronizing a plurality of clock signals used in latching respective digital signals applied to a packetized memory device
JP3649087B2 (ja) 1999-07-28 2005-05-18 株式会社デンソー 熱可塑性樹脂材料の接着方法および接着構造体
US6712260B1 (en) 2002-04-18 2004-03-30 Taiwan Semiconductor Manufacturing Company Bump reflow method by inert gas plasma
KR100499134B1 (ko) * 2002-10-28 2005-07-04 삼성전자주식회사 압축 접합 방법
AU2002354474A1 (en) 2002-12-06 2004-06-30 Tamura Corporation Method for supplying solder
WO2004108345A1 (ja) * 2003-06-09 2004-12-16 Senju Metal Industry Co., Ltd. ソルダペースト
US9059241B2 (en) * 2013-01-29 2015-06-16 International Business Machines Corporation 3D assembly for interposer bow
WO2016022755A2 (en) 2014-08-06 2016-02-11 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963529A (en) * 1970-12-07 1976-06-15 Matsushita Electric Industrial Co., Ltd. Soldering flux
SU810417A1 (ru) * 1979-04-17 1981-03-07 Предприятие П/Я Г-4444 Флюс
AU5919890A (en) * 1989-08-14 1991-02-14 Multicore Solders Limited Manufacture of printed circuit board assemblies

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6820324B2 (en) 2001-01-30 2004-11-23 Sumitomo Electric Industries, Ltd. Method of manufacturing a resistor connector

Also Published As

Publication number Publication date
US5125560A (en) 1992-06-30
EP0541282A2 (en) 1993-05-12
EP0541282B1 (en) 1997-01-15
KR930009693A (ko) 1993-06-21
EP0541282A3 (enExample) 1994-02-23
DE69216768T2 (de) 1997-07-10
KR100269834B1 (ko) 2000-10-16
DE69216768D1 (de) 1997-02-27

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Legal Events

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A300 Application deemed to be withdrawn because no request for examination was validly filed

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Effective date: 20000104