JPH05217900A - Apparatus for manufacturing semiconductor device - Google Patents
Apparatus for manufacturing semiconductor deviceInfo
- Publication number
- JPH05217900A JPH05217900A JP1734792A JP1734792A JPH05217900A JP H05217900 A JPH05217900 A JP H05217900A JP 1734792 A JP1734792 A JP 1734792A JP 1734792 A JP1734792 A JP 1734792A JP H05217900 A JPH05217900 A JP H05217900A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum chamber
- semiconductor substrate
- electrode
- manufacturing apparatus
- atmospheric pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体基板を大気圧中よ
り半導体製造装置内に搬入し、真空中で基板処理を行う
半導体製造装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus in which a semiconductor substrate is loaded into the semiconductor manufacturing apparatus from atmospheric pressure and the substrate is processed in vacuum.
【０００２】[0002]
【従来の技術】従来の半導体製造装置は、真空室中で加
工した半導体基板を搬出する際には、気体を真空室内に
供給して室内を真空から大気圧に戻し、半導体基板を搬
出していた。また、半導体基板を加工する際は、搬入
後、室内を大気圧から真空にし、基板処理を行ってい
た。2. Description of the Related Art In a conventional semiconductor manufacturing apparatus, when a semiconductor substrate processed in a vacuum chamber is carried out, gas is supplied into the vacuum chamber to return the inside of the chamber from atmospheric pressure to atmospheric pressure and carry out the semiconductor substrate. It was In addition, when processing a semiconductor substrate, the chamber is evacuated from atmospheric pressure to carry out the substrate processing after carrying in.
【０００３】[0003]
【発明が解決しようとする課題】前述した従来の装置で
は、真空室内を真空より大気圧に戻す際、または半導体
基板搬入後、真空にする際、真空室内下部に降下し付着
していた塵埃が舞い上がり、半導体基板に付着するとい
う欠点がある。In the above-mentioned conventional apparatus, when returning the inside of the vacuum chamber from the vacuum to the atmospheric pressure, or when bringing the semiconductor substrate into a vacuum state, dust adhering to the lower part of the vacuum chamber and adhering It has the drawback of rising and adhering to the semiconductor substrate.
【０００４】本発明の目的は、半導体基板が塵埃により
汚染されるのを防止する半導体製造装置を提供すること
にある。An object of the present invention is to provide a semiconductor manufacturing apparatus which prevents a semiconductor substrate from being contaminated with dust.
【０００５】[0005]
【課題を解決するための手段】本発明は内部を大気圧に
開放した状態で半導体基板を搬出入する真空室を有する
半導体製造装置において、真空室壁をアースし、真空室
内に半導体基板処理用とは別の正または負に印加できる
電極を有することを特徴とする半導体製造装置である。SUMMARY OF THE INVENTION The present invention is a semiconductor manufacturing apparatus having a vacuum chamber for loading and unloading a semiconductor substrate with the inside opened to atmospheric pressure. The vacuum chamber wall is grounded to process the semiconductor substrate. The semiconductor manufacturing apparatus is characterized by having an electrode that can be applied to the positive or negative side different from the above.
【０００６】[0006]
【実施例】次に本発明について図面を参照して説明す
る。図１は本発明の一実施例の断面図である。真空室７
内には、半導体基板１をカセット２内に収納して搬出，
搬入するための搬送部６を有し、また、真空室壁には、
真空室内を真空から大気圧に戻すための気体供給口３、
および室内を排気し真空にする気体排気口４を有する。The present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of an embodiment of the present invention. Vacuum chamber 7
Inside, the semiconductor substrate 1 is stored in the cassette 2 and carried out.
It has a carrying section 6 for carrying in, and the vacuum chamber wall is
A gas supply port 3 for returning the vacuum chamber from vacuum to atmospheric pressure,
And a gas exhaust port 4 for evacuating the interior of the chamber to create a vacuum.
【０００７】さらに、真空室壁には、真空室壁をアース
するアース部８を取り付け、真空室内には、内壁と対向
させて電極９を設ける。電極９は室外の電源１０に接続
されて正または負に印加できる。なお、この電極９は、
基板処理用の電極とは別に設けている。本実施例によれ
ば、電極９と室内壁との間に電界が発生するため、塵埃
を吸着することができる。Further, a ground portion 8 for grounding the vacuum chamber wall is attached to the vacuum chamber wall, and an electrode 9 is provided in the vacuum chamber so as to face the inner wall. The electrode 9 is connected to an outdoor power source 10 and can be applied positively or negatively. The electrode 9 is
It is provided separately from the substrate processing electrode. According to this embodiment, since an electric field is generated between the electrode 9 and the indoor wall, dust can be adsorbed.
【０００８】[0008]
【発明の効果】以上説明したように本実施例によれば、
真空室壁と電極との間に電界が出来る為、帯電している
塵埃は、その電界の影響により真空室壁又は電極に吸着
され、真空室を大気圧に戻す際、塵埃が舞い上がらず半
導体基板の塵埃による汚染を防止できる。As described above, according to this embodiment,
Since an electric field is generated between the vacuum chamber wall and the electrode, the charged dust is adsorbed to the vacuum chamber wall or the electrode due to the influence of the electric field, and when returning the vacuum chamber to atmospheric pressure, the dust does not rise and the semiconductor substrate It is possible to prevent contamination due to dust.
【図１】本発明の一実施例を示す半導体製造装置の断面
図である。FIG. 1 is a sectional view of a semiconductor manufacturing apparatus showing an embodiment of the present invention.
１ 半導体基板 ２ カセット ３ 気体供給口 ４ 気体排気口 ５ 搬送部 ７ 真空室 ８ アース部 ９ 電極 １０ 電源 1 Semiconductor Substrate 2 Cassette 3 Gas Supply Port 4 Gas Exhaust Port 5 Transfer Section 7 Vacuum Chamber 8 Earth Section 9 Electrode 10 Power Supply
Claims (1)
板を搬出入する真空室を有する半導体製造装置におい
て、真空室壁をアースし、真空室内に半導体基板処理用
とは別の正または負に印加できる電極を有することを特
徴とする半導体製造装置。1. A semiconductor manufacturing apparatus having a vacuum chamber for loading and unloading a semiconductor substrate, the interior of which is opened to atmospheric pressure, wherein a vacuum chamber wall is grounded and a positive or negative electrode different from that for semiconductor substrate processing is provided in the vacuum chamber. A semiconductor manufacturing apparatus having an electrode that can be applied to the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1734792A JPH05217900A (en) | 1992-02-03 | 1992-02-03 | Apparatus for manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1734792A JPH05217900A (en) | 1992-02-03 | 1992-02-03 | Apparatus for manufacturing semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05217900A true JPH05217900A (en) | 1993-08-27 |
Family
ID=11941519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1734792A Withdrawn JPH05217900A (en) | 1992-02-03 | 1992-02-03 | Apparatus for manufacturing semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05217900A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5614600A (en) * | 1994-06-03 | 1997-03-25 | Kashima Oil Co., Ltd. | Fiber-reinforced resin plate and process for producing the same |
-
1992
- 1992-02-03 JP JP1734792A patent/JPH05217900A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5614600A (en) * | 1994-06-03 | 1997-03-25 | Kashima Oil Co., Ltd. | Fiber-reinforced resin plate and process for producing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990518 |