JPH05106041A - Vacuum apparatus - Google Patents
Vacuum apparatusInfo
- Publication number
- JPH05106041A JPH05106041A JP26925491A JP26925491A JPH05106041A JP H05106041 A JPH05106041 A JP H05106041A JP 26925491 A JP26925491 A JP 26925491A JP 26925491 A JP26925491 A JP 26925491A JP H05106041 A JPH05106041 A JP H05106041A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cover
- vacuum
- processed
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、真空中でウエハ等を処
理する真空装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum device for processing a wafer or the like in a vacuum.
【０００２】[0002]
【従来の技術】従来の装置の真空排気方法は、スロー排
気，スローリークが最も一般的に行われていた。2. Description of the Related Art Slow evacuation and slow leak are the most commonly used vacuum evacuation methods for conventional devices.
【０００３】図４は、最も一般的な真空処理装置の排気
方法を示す断面図である。図において、１はウエハ等の
被処理基板、２はあらかじめ高真空に保たれた処理室、
３は処理室の排気口、４はウエハ等の被処理基板を処理
室へ処理室内の真空を破ることなく搬出，搬入を行うた
めのロードロック室、５はロードロック室の排気口、６
はロードロック室のガス導入口、７は処理室とロードロ
ック室との間を仕切るゲートバルブ、８は被処理基板を
のせて運ぶ搬送ステージ、９は被処理基板の搬出，搬入
口である。FIG. 4 is a sectional view showing an exhaust method of the most general vacuum processing apparatus. In the figure, 1 is a substrate to be processed such as a wafer, 2 is a processing chamber previously kept in a high vacuum,
3 is an exhaust port of the processing chamber, 4 is a load lock chamber for carrying out and carrying in a substrate to be processed such as a wafer into the processing chamber without breaking the vacuum in the processing chamber, 5 is an exhaust port of the load lock chamber, 6
Is a gas introduction port of the load lock chamber, 7 is a gate valve for partitioning the processing chamber from the load lock chamber, 8 is a transfer stage for carrying the substrate to be processed, and 9 is a carry-in / carry-in port for the substrate.
【０００４】あらかじめゲートバルブ７は閉じられ、処
理室２は排気口３より真空排気され高真空に保たれてい
る。ウエハ１は搬出，搬入口９よりロードロック室４内
の搬送ステージ８にのせられ、搬出，搬入口９が閉じら
れた後、排気口５より真空排気される。そして、ロード
ロック室が所定の圧力に達したら、ゲートバルブ７は開
かれウエハ１は処理室２に運ばれて、ゲートバルブ７が
閉じられ処理が行われる。処理が終わると、ゲートバル
ブ７は開かれウエハ１は処理室２からロードロック室４
に戻されて、ゲートバルブ７が閉じられた後、ガス導入
口６より清浄な空気、あるいは窒素等のガスが導入され
大気状態に戻される。最後に搬入搬出口９より、処理の
終わったウエハ１は取り出される。The gate valve 7 is closed in advance, and the processing chamber 2 is evacuated from the exhaust port 3 to maintain a high vacuum. The wafer 1 is loaded and unloaded from the loading port 9 onto the transfer stage 8 in the load lock chamber 4. After the loading and loading port 9 is closed, the wafer 1 is evacuated from the exhaust port 5. Then, when the load lock chamber reaches a predetermined pressure, the gate valve 7 is opened, the wafer 1 is carried to the processing chamber 2, and the gate valve 7 is closed to perform processing. When the processing is completed, the gate valve 7 is opened and the wafer 1 is transferred from the processing chamber 2 to the load lock chamber 4
Then, after the gate valve 7 is closed, clean air or a gas such as nitrogen is introduced from the gas inlet 6 and the atmosphere is restored. Finally, the processed wafer 1 is taken out from the carry-in / carry-out port 9.
【０００５】このような処理過程の中で、特に、ロード
ロック室の真空排気、及び大気開放時に塵埃の巻き上げ
が発生して、ウエハ１に付着するという欠点があった。Among such processing steps, there is a drawback that dust is picked up and adheres to the wafer 1 especially when the load lock chamber is evacuated and exposed to the atmosphere.
【０００６】このような欠点を改善する目的で、特開昭
61−291032号公報や特開昭62−209825号公報，特開昭62
−128538号公報に示されているような方法がとられてき
た。[0006] For the purpose of improving such a defect, Japanese Patent Laid-Open No.
61-291032, JP-A-62-209825, JP-A-62
The method as shown in the -128538 publication has been taken.
【０００７】[0007]
【発明が解決しようとする課題】従来技術は、真空装置
の排気時、及び、大気開放時に発生する巻き上げ塵埃が
被処理基板上に付着するという問題がある。The prior art has a problem in that hoisting dust generated when the vacuum device is evacuated and opened to the atmosphere adheres to the substrate to be processed.
【０００８】また、従来技術では、カバーの構造が複雑
であり、フィルタを使用する場合、フィルタの汚染につ
いて考慮がされていないので、フィルタが汚染されたと
きに、不良が発生する問題がある。また、フィルタの交
換を行うとすれば、作業を停止しなければならない。さ
らに、フィルタ自身が発塵源となる恐れもある。Further, in the prior art, the structure of the cover is complicated, and when the filter is used, the contamination of the filter is not taken into consideration, so that there is a problem that a defect occurs when the filter is contaminated. Also, if the filter is to be replaced, the work must be stopped. Furthermore, the filter itself may become a dust source.
【０００９】本発明の目的は、カバーを設けたことによ
り巻き上げ塵埃の付着を低減することができる真空装置
を提供することにある。An object of the present invention is to provide a vacuum device which can reduce the adherence of hoisted dust by providing a cover.
【００１０】本発明の他の目的は、被処理基板の搬送，
ハンドリング時は十分な空間を確保してこれらを妨げな
いようにし、かつ、真空排気、及び大気開放時には単純
な構造をもつカバーを用いて塵埃の付着を低減すること
ができる真空装置を提供することにある。Another object of the present invention is to convey a substrate to be processed,
(EN) To provide a vacuum device capable of ensuring a sufficient space during handling so as not to interfere with these, and using a cover having a simple structure during vacuum exhaust and opening to the atmosphere to reduce dust adhesion. It is in.
【００１１】[0011]
【課題を解決するための手段】上記目的を達成するため
に、真空排気、及び大気開放時にウエハ等の被処理基板
上にカバーがかかる構造をもつものである。In order to achieve the above object, a structure is adopted in which a cover is placed on a substrate to be processed such as a wafer during vacuum evacuation and opening to the atmosphere.
【００１２】上記他の目的を達成するために、被処理基
板の搬送，ハンドリング時には、カバーを被処理基板か
ら離れた状態にし、真空排気及び大気開放時のみ、単純
な形のカバーを使用したものである。In order to achieve the above-mentioned other objects, the cover is kept away from the substrate to be processed during transportation and handling of the substrate to be processed, and a simple cover is used only during vacuum evacuation and opening to the atmosphere. Is.
【００１３】[0013]
【作用】被処理基板の搬送，ハンドリング時にはカバー
は被処理基板から離れているので、十分な空間が確保さ
れ、搬送，ハンドリングを妨げない。真空排気、及び大
気開放時には、ウエハ等の被処理基板上にカバーをかけ
るので、巻き上げ塵埃の付着は低減される。Since the cover is separated from the substrate to be processed during the transportation and handling of the substrate to be processed, a sufficient space is secured and the transportation and handling are not hindered. At the time of vacuum evacuation and opening to the atmosphere, a cover is placed on the substrate to be processed such as a wafer, so that the adhesion of dust that is wound up is reduced.
【００１４】[0014]
【実施例】以下、本発明の実施例を図により説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１５】図１は本発明の真空装置の実施例を示した
ものである。図において、１はウエハ等の被処理基板、
２はあらかじめ高真空に保たれている処理室、３は処理
室の排気口、４はウエハ等の被処理基板を処理室へ処理
室内の真空を破ることなく搬出，搬入を行うためのロー
ドロック室、５はロードロック室４の排気口、６はロー
ドロック室４のガス導入口、７は処理室２とロードロッ
ク室４との間を仕切るゲートバルブ、８は被処理基板１
をのせて運ぶ搬送ステージ、９は被処理基板１の搬出，
搬入口である。FIG. 1 shows an embodiment of the vacuum device of the present invention. In the figure, 1 is a substrate to be processed such as a wafer,
Reference numeral 2 is a processing chamber which is kept in a high vacuum in advance, 3 is an exhaust port of the processing chamber, and 4 is a load lock for loading and unloading a substrate such as a wafer into the processing chamber without breaking the vacuum in the processing chamber. Chamber 5 is an exhaust port of the load lock chamber 4, 6 is a gas inlet of the load lock chamber 4, 7 is a gate valve for partitioning the processing chamber 2 from the load lock chamber 4, and 8 is a substrate 1 to be processed.
A transfer stage for carrying a substrate, 9 for carrying out the substrate 1 to be processed,
This is the entrance.
【００１６】以上の装置構成は、従来例と同じである
が、本発明の装置は更に、カバー１０，シール１１，カ
バーを上下させるための駆動装置１２から構成される。Although the above-mentioned device structure is the same as that of the conventional example, the device of the present invention further comprises a cover 10, a seal 11, and a drive device 12 for moving the cover up and down.
【００１７】このように構成された装置で、あらかじめ
ゲートバルブ７は閉じられ、処理室２は排気口３より真
空排気され高真空に保たれている。ウエハ１は搬出，搬
入口９よりロードロック室４内の搬送ステージ８にのせ
られ、搬出，搬入口９が閉じられる。次に駆動装置１２
により、カバー１０をウエハ１との隙間ぎりぎりまで下
げ、排気口５より真空排気を行う。In the apparatus thus constructed, the gate valve 7 is closed in advance, and the processing chamber 2 is evacuated from the exhaust port 3 to maintain a high vacuum. The wafer 1 is placed on the transfer stage 8 in the load lock chamber 4 through the carry-out / carry-in port 9, and the carry-out / carry-in port 9 is closed. Next, drive device 12
As a result, the cover 10 is lowered to the very end of the gap with the wafer 1, and vacuum exhaust is performed from the exhaust port 5.
【００１８】この時、ウエハ１はカバー１０で覆われて
いるため、真空排気時の巻き上げ塵埃の付着は低減され
る。また、開閉機構が被処理基板１の上方にあるため、
カバー１０により、開閉に伴って発生する塵埃の付着を
防ぐことができ、クリーン度が確保できる。そして、ロ
ードロック室４が所定の圧力に達したら、カバー１０が
上げられた後、ゲートバルブ７が開かれ、ウエハ１は処
理室２に運ばれて、ゲートバルブ７が閉じられ処理が行
われる。処理が終了すると、ゲートバルブ７が開かれウ
エハ１はロードロック室４へ戻される。ゲートバルブ７
が閉じられウエハ１が、再び、カバー１０で覆われた
後、ロードロック室４はガス導入口６より大気状態に戻
される。この時、ウエハ１は、カバー１０で覆われてい
るため、やはり、大気開放時の巻き上げ塵埃の付着は低
減される。At this time, since the wafer 1 is covered with the cover 10, the adhesion of hoisting dust during vacuum evacuation is reduced. Further, since the opening / closing mechanism is above the substrate to be processed 1,
By the cover 10, it is possible to prevent adhesion of dust generated due to opening and closing, and to secure cleanliness. When the load lock chamber 4 reaches a predetermined pressure, the cover 10 is lifted, the gate valve 7 is opened, the wafer 1 is transferred to the processing chamber 2, and the gate valve 7 is closed to perform the processing. .. When the processing is completed, the gate valve 7 is opened and the wafer 1 is returned to the load lock chamber 4. Gate valve 7
Is closed and the wafer 1 is again covered with the cover 10, and then the load lock chamber 4 is returned to the atmospheric state through the gas introduction port 6. At this time, since the wafer 1 is covered with the cover 10, the adhesion of the dust to be taken up when the atmosphere is opened is also reduced.
【００１９】このようなカバーを備えた真空装置によ
り、ウエハ等の被処理基板に塵埃が付着するのを防ぐこ
とができる。The vacuum device having such a cover can prevent dust from adhering to a substrate to be processed such as a wafer.
【００２０】図２は、本装置の第二の実施例を示したも
のである。駆動装置１２は試料台１３に取付けられてい
る。本実施例によれば、真空排気、及び大気開放時には
試料台１３の上昇により被処理基板１がロードロック室
の天井に取り付けられたカバー１０に接近し、隙間が少
なくなるので、巻き上げ塵埃の付着が低減される。FIG. 2 shows a second embodiment of this device. The drive device 12 is attached to the sample table 13. According to the present embodiment, when the vacuum pumping and the atmospheric opening are performed, the substrate 1 to be processed approaches the cover 10 mounted on the ceiling of the load lock chamber due to the rise of the sample table 13 and the gap is reduced, so that the dust to be wound up is attached. Is reduced.
【００２１】図３は、本装置の第三の実施例を示したも
のである。駆動装置１２をロードロック室４の側面に設
け、カバー１０を左右に動かすことにより開閉を行う。
このため、例えば、ロードロック室４の試料の真上にビ
ューポート１４を設けることができ、ロードロック室内
の確認をすることができる。FIG. 3 shows a third embodiment of the present apparatus. The drive device 12 is provided on the side surface of the load lock chamber 4, and the cover 10 is opened and closed by moving the cover 10 left and right.
Therefore, for example, the viewport 14 can be provided right above the sample in the load lock chamber 4, and the inside of the load lock chamber can be confirmed.
【００２２】[0022]
【発明の効果】本発明によれば、被処理基板の搬送，ハ
ンドリング時には十分な空間が確保され、これらが妨げ
られることなく、真空排気及び、大気開放時には、この
時、発生する巻き上げ塵埃のウエハ等の被処理基板への
付着を低減することができ、結果的にクリーン度を確保
できる。According to the present invention, a sufficient space is ensured during the transportation and handling of the substrate to be processed, and the wafer is free from the dust of hoisting that is generated at the time of vacuum exhaustion and opening to the atmosphere without hindering them. It is possible to reduce the adherence of the like to the substrate to be processed, and as a result, it is possible to secure the cleanliness.
【図１】本発明の第一の実施例の側面図。FIG. 1 is a side view of a first embodiment of the present invention.
【図２】本発明の第二の実施例の側面図。FIG. 2 is a side view of the second embodiment of the present invention.
【図３】本発明の第三の実施例の側面図。FIG. 3 is a side view of the third embodiment of the present invention.
【図４】従来例の側面図。FIG. 4 is a side view of a conventional example.
１…被処理基板、２…処理室、３…排気口、４…ロード
ロック室、５…排気口、６…ガス導入口、７…ゲートバ
ルブ、８…搬送ステージ、９…搬出，搬入口、１０…カ
バー、１１…シール部分、１２…駆動装置。DESCRIPTION OF SYMBOLS 1 ... Substrate to be processed, 2 ... Processing chamber, 3 ... Exhaust port, 4 ... Load lock chamber, 5 ... Exhaust port, 6 ... Gas inlet port, 7 ... Gate valve, 8 ... Transfer stage, 9 ... Unloading port, Inlet port, 10 ... Cover, 11 ... Seal part, 12 ... Drive device.
Claims (4)
にカバーがかかる構造をもつことを特徴とする真空装
置。1. A vacuum apparatus having a structure in which a cover is provided on a substrate to be processed when vacuum exhausting and opening to the atmosphere.
気、及び大気開放時に被処理基板の上方から前記カバー
自体が移動し、前記被処理基板を覆うような構造を持つ
真空装置。2. The vacuum apparatus according to claim 1, wherein the cover moves so as to cover the substrate to be processed from above the substrate to be processed during vacuum exhaust and opening to the atmosphere.
の内壁に付属し、前記被処理基板をのせた試料台が真空
排気、及び大気開放時にカバーの方向に移動し、前記被
処理基板を覆うような構造を持つ真空装置。3. The substrate according to claim 1, wherein the cover is attached to an inner wall of a vacuum device, and the sample stage on which the substrate to be processed is placed moves toward the cover when vacuum exhausting and opening to the atmosphere. A vacuum device with a covering structure.
気、及び大気開放時に前記被処理基板の側方から前記被
処理基板上にかかる構造を持つ真空装置。4. The vacuum apparatus according to claim 1, wherein the cover has a structure that is applied to the substrate to be processed from a side of the substrate to be processed during vacuum exhaust and opening to the atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26925491A JPH05106041A (en) | 1991-10-17 | 1991-10-17 | Vacuum apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26925491A JPH05106041A (en) | 1991-10-17 | 1991-10-17 | Vacuum apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05106041A true JPH05106041A (en) | 1993-04-27 |
Family
ID=17469795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26925491A Pending JPH05106041A (en) | 1991-10-17 | 1991-10-17 | Vacuum apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05106041A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020053530A (en) * | 2018-09-26 | 2020-04-02 | 三菱電機株式会社 | Semiconductor manufacturing device |
-
1991
- 1991-10-17 JP JP26925491A patent/JPH05106041A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020053530A (en) * | 2018-09-26 | 2020-04-02 | 三菱電機株式会社 | Semiconductor manufacturing device |
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