JPH0521443U - TAB type semiconductor device assembling apparatus - Google Patents

Abstract

(57) [Abstract] [Purpose] TA that simplifies the number of steps by simultaneously bonding the inner lead and outer lead of the TA tape to the bump electrode of the semiconductor pellet and the lead frame, respectively.
An apparatus for assembling a B-type semiconductor device is provided. [Structure] Lead frame 20 on which TAB tape 9 is stacked
Is transported to the bonding position P through the transport path 16 provided with the through hole 21 opened vertically. Then, the bonding stage 17 for mounting the semiconductor pellet 1 having the bump electrodes 4 on the upper surface is moved up and down in the through hole 21, and the bonding tool 18 is arranged so as to be vertically movable so as to face the bonding stage 17. Bump electrode 4 of pellet 1, inner lead of TAB tape 9, and T
The outer lead of the AB tape and the lead frame 20 are simultaneously bonded.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a device for assembling a TAB type semiconductor device having a structure in which a semiconductor pellet and a lead frame are bonded via a TAB tape.

[0002]

[Prior Art]

 The TAB type semiconductor device is used, for example, in a camera IC or the like assembled on a flexible film-like printed circuit board or the like. An example of the IC device is shown below with reference to FIGS. (Hereinafter, referred to as pellets.), (2) is a frame-shaped film, and (3) is a metal foil lead. The pellet (1) has bump electrodes (4) ... Formed by gold plating on the outer peripheral edge of the surface. The frame-shaped film (2) is formed by cutting a long insulating film having a window opening at a predetermined pitch. The metal foil leads (3) are arranged radially from the inner side to the outer side of the frame-shaped film (2), the middle portion thereof is bonded to the frame-shaped film (2), and the inner lead (3a ) And the bump electrode (4) are thermocompression bonded to support the pellet (1) inside the frame-shaped film (2).

When assembling the TAB semiconductor device (A), the assembling device (5) shown in FIG. 5 is used. In the drawing, (6) is a tape guide, (7) is a heater block, and (8) is A bonding tool, (9) is a TAB tape. The tape guide (6) is formed by bending both ends of a long sheet metal and forming a window hole (10) in the middle part. The heater block (7) is arranged below the tape guide (6) so that it can be moved up and down, the pellet (1) is positioned and placed, and the heating means is built in to mount the pellet (1) on the ground before mounting. To heat. The bonding tool (8) is arranged facing the heater block (7) above the window hole (10) of the tape guide (6) so as to be movable up and down, and has a built-in heating means like the heater block (7). The TAB tape (9) is formed by adhering and forming a metal foil lead (3) on a long insulating film (12) having a window opening (11), and cutting the frame film (2) at a predetermined pitch. ) Is formed.

In the assembling apparatus (5), first, the TAB tape (9) is fed along the tape guide (6), and the window opening (11) is made to correspond to the window hole (10) of the tape guide (6). And position it. Then, after positioning the pellet (1) on the heater block (7) and heating the base, the bump electrodes (4) of the pellet (1) are connected to the inner leads (3) of the metal foil leads (3). 3a). Therefore, the bonding tool (8) is lowered while being heated, and the bump electrodes (4) ... And the inner leads (3a) of the metal foil leads (3) ... are thermocompression bonded.

In recent years, as shown in FIG. 3, the outer leads (3b) of the metal foil leads (3) are bonded to the leads (14) of the external lead frame with respect to the TAB semiconductor device (13). Then, the main part including the pellet (1) is resin-sealed, and the tie part is further cut to form the flat package type semiconductor device (15) shown in FIG.

[0006]

[Problems to be solved by the device]

 The problem to be solved is to form the flat package type semiconductor device (15) from the TAB type semiconductor device (13) by forming the inner leads (3a) of the metal foil leads (3). 4) ... and after thermocompression bonding, the outer lead (3b) ... is bonded to the lead (14) of the lead frame in a separate process, so the development time is increased to 2 processes and the processing cost is increased. Is also a high point. Furthermore, the outer leads (3b) are independent during bonding, and are easily bent by an external force and easily misaligned with respect to the lead (13). It requires precise and careful work to reduce the noise.

[0007]

[Means for Solving the Problems]

 The present invention has a semiconductor pellet having a bump electrode and a transport path for transporting a lead frame at the bonding position for vertically transporting the lead frame and supporting the TAB tape on the lead frame at the through hole position. Is mounted on the upper surface, and the bonding stage is moved up and down in the through hole. The bonding stage is arranged above the bonding position so as to be vertically movable so as to face the bonding stage. The bump electrode of the semiconductor pellet and the TAB tape. And a bonding tool for simultaneously bonding the outer lead of the TAB tape and the lead frame at the same time.

[0008]

[Action]

 According to the above technical means, the pellet bump electrode and the TAB tape inner lead, and the TAB tape outer lead and the lead frame are simultaneously bonded, and the TAB tape inner lead and the outer lead are bonded in the same step. To do.

[0009]

【Example】

 An embodiment of the present invention will be described below with reference to FIG. In the figure, (16) is a conveyance path, (17) is a bonding stage (heater block), and (18) is a bonding tool. The transport path (16) transports a lead frame (20) provided with a window opening (19) in a state where TAB tapes (9) fed by a tape guide are stacked in parallel or at right angles, and At the bonding position (P), a through hole (21) having an upper opening and a lower opening is provided. The bonding stage (17) mounts the pellet (1) having the bump electrodes (4) on the upper surface thereof, moves up and down in the through hole (21), and further incorporates a heating means (not shown). .. The bonding tool (18) is arranged above the bonding position (P) so as to be vertically movable so as to face the bonding stage (17), has a heating means (not shown) built therein, and is provided with a tape tape (9). The metal foil leads (3) have pressure contact surfaces (18a) (18b) for simultaneously pressing the inner leads (3a) and the outer leads (3b).

The operation of the present invention based on the above configuration will be described below. First, the TAB tape (9) is fed along the tape guide (6) (see FIG. 5) so that the window opening (11) corresponds to the window hole (10) of the tape guide (6) (see FIG. 5). ) Together with the window opening (19) of the lead frame (20). Then, after positioning the pellet (1) on the bonding stage (17) and heating the underlayer, the bonding stage (17) is raised and the bump electrodes (4) of the pellet (1) are connected to the metal foil leads ( 3) Abutting on the inner leads (3a) of ..., And abutting the outer leads (3b) on the leads of the lead frame (20). Then, as the bonding stage (17) is raised, the bonding tool (18) is lowered while being heated. Then, the inner leads (3a) of the respective metal foil leads (3) ... and the respective bump electrodes (4), and the outer leads (3b) and the leads of the lead frame (20) of the bonding tool (18), respectively. Simultaneously at the press contact surfaces (18a) (18b) ... And properly irrespective of variations in the thickness of the lead frame (20), thermocompression bonding is performed for bonding. (In the illustrated example, the connecting portion between the outer lead and the lead frame is omitted.)

In the illustrated example, the pressure contact surfaces (18a) and (18b) of the bonding tool (18) are flush with each other, but a step is provided by the thickness of the TAB tape (9) so that the pressure contact surface (18b) faces downward. You may make it project.

In addition, the through hole (21) of the transport path (20) may be expanded and a supporting member for supporting the lead frame (20) at the bonding position of the outer lead (3b) may be vertically movable. ..

Further, a cutting device for cutting the outer lead (3b) prior to bonding can be arranged.

[0014]

[Effect of the device]

 According to the present invention, since the inner lead and the outer lead of the TAB type semiconductor device are simultaneously bonded to the bump electrode and the lead frame, respectively, the man-hour is reduced, the development time is shortened, and the cost is reduced. Will be simpler and workability will be improved.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional side view showing an embodiment of an assembly device for a TAB type semiconductor device according to the present invention.

FIG. 2 is a partial cross-sectional side view showing an example of a TAB semiconductor device.

FIG. 3 is a plan view of FIG.

FIG. 4 is a perspective view showing an example of a flat package type semiconductor device.

FIG. 5 is a partial sectional side view showing an example of a conventional TAB type semiconductor device assembling apparatus.

[Explanation of symbols]

 1 Semiconductor Pellet 3a Inner Lead 3b Outer Lead 9 TAB Tape 16 Conveying Path 17 Bonding Stage 18 Bonding Tool 20 Lead Frame

Claims (2)

[Scope of utility model registration request] 1. A semiconductor pellet having a bump electrode and a transport path having a through hole vertically penetrating at a bonding position for transporting a lead frame and superposing and supporting a TAB tape on the lead frame at the through hole position. A bonding stage that is placed on the upper surface and that moves up and down in the through hole; and a bump electrode of the semiconductor pellet and an inner lead of a TAB tape, which is arranged above the bonding position so as to face the bonding stage and is vertically movable. And a bonding tool for simultaneously bonding the outer lead of the TAB tape and the lead frame at the same time. 2. A device for assembling a TAB semiconductor device according to claim 1, wherein a supporting member for supporting the lead portion of the lead frame is arranged so as to be vertically movable so as to face the bonding tool.