JPH0521343B2 - - Google Patents

Info

Publication number
JPH0521343B2
JPH0521343B2 JP61306586A JP30658686A JPH0521343B2 JP H0521343 B2 JPH0521343 B2 JP H0521343B2 JP 61306586 A JP61306586 A JP 61306586A JP 30658686 A JP30658686 A JP 30658686A JP H0521343 B2 JPH0521343 B2 JP H0521343B2
Authority
JP
Japan
Prior art keywords
resin
lead frame
sealed
package
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61306586A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63160367A (ja
Inventor
Masaji Ogata
Hidetoshi Abe
Masanori Segawa
Shigeo Suzuki
Hiroyuki Hozoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP30658686A priority Critical patent/JPS63160367A/ja
Publication of JPS63160367A publication Critical patent/JPS63160367A/ja
Publication of JPH0521343B2 publication Critical patent/JPH0521343B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP30658686A 1986-12-24 1986-12-24 樹脂封止型半導体装置 Granted JPS63160367A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30658686A JPS63160367A (ja) 1986-12-24 1986-12-24 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30658686A JPS63160367A (ja) 1986-12-24 1986-12-24 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS63160367A JPS63160367A (ja) 1988-07-04
JPH0521343B2 true JPH0521343B2 (enrdf_load_html_response) 1993-03-24

Family

ID=17958848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30658686A Granted JPS63160367A (ja) 1986-12-24 1986-12-24 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS63160367A (enrdf_load_html_response)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2973499B2 (ja) * 1990-09-13 1999-11-08 松下電器産業株式会社 チップ型固体電解コンデンサ
JP3228789B2 (ja) * 1992-07-11 2001-11-12 新光電気工業株式会社 樹脂用インサート部材の製造方法
JP3841768B2 (ja) 2003-05-22 2006-11-01 新光電気工業株式会社 パッケージ部品及び半導体パッケージ
JP5555146B2 (ja) 2010-12-01 2014-07-23 株式会社日立製作所 金属樹脂複合構造体及びその製造方法、並びにバスバ、モジュールケース及び樹脂製コネクタ部品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792854A (en) * 1980-11-29 1982-06-09 Toshiba Corp Plastic molded type semiconductor device
JPS5799763A (en) * 1980-12-12 1982-06-21 Hitachi Cable Ltd Manufacture of lead frame for integrated circuit
JPS6097651A (ja) * 1983-11-02 1985-05-31 Hitachi Ltd 半導体装置
JPS60119765A (ja) * 1983-12-02 1985-06-27 Hitachi Ltd 樹脂封止型半導体装置およびそれに用いるリ−ドフレ−ム

Also Published As

Publication number Publication date
JPS63160367A (ja) 1988-07-04

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