JPH0521320Y2 - - Google Patents

Info

Publication number
JPH0521320Y2
JPH0521320Y2 JP1986121736U JP12173686U JPH0521320Y2 JP H0521320 Y2 JPH0521320 Y2 JP H0521320Y2 JP 1986121736 U JP1986121736 U JP 1986121736U JP 12173686 U JP12173686 U JP 12173686U JP H0521320 Y2 JPH0521320 Y2 JP H0521320Y2
Authority
JP
Japan
Prior art keywords
temperature
surface plate
rotating surface
signal
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986121736U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6330466U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986121736U priority Critical patent/JPH0521320Y2/ja
Publication of JPS6330466U publication Critical patent/JPS6330466U/ja
Application granted granted Critical
Publication of JPH0521320Y2 publication Critical patent/JPH0521320Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP1986121736U 1986-08-08 1986-08-08 Expired - Lifetime JPH0521320Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986121736U JPH0521320Y2 (enExample) 1986-08-08 1986-08-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986121736U JPH0521320Y2 (enExample) 1986-08-08 1986-08-08

Publications (2)

Publication Number Publication Date
JPS6330466U JPS6330466U (enExample) 1988-02-27
JPH0521320Y2 true JPH0521320Y2 (enExample) 1993-06-01

Family

ID=31011278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986121736U Expired - Lifetime JPH0521320Y2 (enExample) 1986-08-08 1986-08-08

Country Status (1)

Country Link
JP (1) JPH0521320Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056460U (ja) * 1983-09-27 1985-04-19 株式会社東芝 研磨装置

Also Published As

Publication number Publication date
JPS6330466U (enExample) 1988-02-27

Similar Documents

Publication Publication Date Title
JPH0929620A (ja) ポリッシング装置
AU3761799A (en) Endpoint detection in chemical mechanical polishing (cmp) by substrate holder elevation detection
US20100203806A1 (en) Semiconductor manufacturing apparatus
US20160074987A1 (en) Film thickness signal processing apparatus, polishing apparatus, film thickness signal processing method, and polishing method
US5517190A (en) Physical measurement from changes in reactance
JPH0521320Y2 (enExample)
US7769483B2 (en) Detection-signal transmitting apparatus
CN115446669B (zh) 一种传感器与晶圆相对轨迹追踪方法
US20030049993A1 (en) Semiconductor polishing apparatus and method of detecting end point of polishing semiconductor
JPH0899265A (ja) 研磨装置
JPS61265262A (ja) 研磨装置
JPH10202520A (ja) ウェーハの厚み加工量測定装置
EP1148403A3 (en) Improvements in or relating to cooling apparatus
JP4943800B2 (ja) 研磨状況モニタシステム
JPH10224239A (ja) データ送信装置、データ送信方法、温度検出装置及び湿度検出装置
KR102412776B1 (ko) 웨이퍼 가장자리에서의 연마층 두께 검출 정확성이 향상된 화학 기계적 연마 장치
JPH0453671A (ja) 熱変形制御型両面研磨装置
JP3731411B2 (ja) ウェーハ研磨装置
JP5016956B2 (ja) 機械加工装置
JPH0322115A (ja) 遠隔操作用カードと遠隔制御装置
JPH01164037A (ja) 回転ステージの温度制御装置
JP2004358638A (ja) 半導体ウェーハの研磨方法および半導体ウェーハの研磨装置
KR100494128B1 (ko) 화학적기계연마 장치의 연마패드 컨디셔너
JPH0447964U (enExample)
JPH0327856B2 (enExample)