JPH0521301A - Method and device for forming electrode on side of substrate - Google Patents

Abstract

PURPOSE:To form an electrode having a longer size than the electrode width at a front and a rear of a substrate by making electrode paste to creep to both the front and the rear of the substrate when an electrode is formed at a substrate side. CONSTITUTION:In an electrode formation method of a substrate side to form a linear electrode at a side 11a of a substrate 11 with rear and front, after one or more filaments 1 whereto electrode paste is attached are stretchingly provided in opposition to the side 11a of the substrate 11, the filament 1 is brought into pressing contact with the substrate side 11a by a pressing member 10 which consists of an elastic material having a thickness W which is larger than a thickness (w) of the substrate 11; thereby, the filament 1 is made to creep also to both the front and the rear of the substrate 11 and electrode paste is transcribed to the side 11a, and the front and the rear 11b, 11c of the substrate 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate side electrode forming method and apparatus for forming electrodes on the substrate side face of a surface mount type component (hereinafter referred to as SMD) which can be mounted on the surface of a circuit board. .

[0002]

2. Description of the Related Art In a chip-type SMD, one or more linear electrodes 13 are provided on a side surface 12 of a substrate 12 as shown in FIG.
What is formed in a is known. This side electrode 13
For example, the signal lines formed on the front and back surfaces of the substrate 12 are connected to each other, or are used as soldering lands for mounting.

Conventionally, the side electrode 13 of the SMD is formed by forming a block 14 of a substrate by stacking a plurality of SMD substrates 12 as shown in FIG. The side surface 14a is screen-printed.

That is, the electrode paste is applied to the upper surface side of the printing screen 15 having the vertical stripe pattern 16 formed by arranging a plurality of lines of a predetermined width in parallel at a predetermined interval.
A squeegee made of an elastic material (not shown) is attached to the screen 15
The vertical stripe pattern 1 is moved by rubbing the upper surface side of the
The electrode paste corresponding to No. 6 is transferred to the block side surface 14 a of the block 14.

[0005]

In the conventional method for forming the electrode on the side surface of the substrate, since the electrode paste is screen-printed on the side surface 12a of the substrate 12, it is difficult to wrap the electrode paste around the front and back sides of the substrate 12. Is. In particular, it is difficult to make the wraparound size of the electrodes 13a formed on the front surface and the back surface of the substrate 12 longer than the electrode width (see FIG. 3). For this reason, the signal lines formed on the front and back surfaces of the substrate 12 may have a poor connection, or the solder attachment area as a soldering land for mounting cannot be sufficiently secured.
The soldering strength of D is insufficient.

Further, as a means for wrapping the electrode paste around the front and back surfaces of the substrate 12, for example, increasing the supply amount of the electrode paste at the time of screen printing can be considered, but in such a case, the electrode paste bleeds, Another problem may occur that the line width of the side surface electrode 13 becomes larger than a predetermined dimension.

Moreover, since the screen 15 for screen printing has to be prepared according to the pattern of the side electrode 13, the manufacturing cost becomes high in a small quantity and a large variety of SMDs.

The present invention has been made in view of the above problems, and provides a method and an apparatus for forming an electrode on a side surface of a substrate, which allows an electrode paste to sufficiently wrap around the front and back surfaces of the substrate when forming an electrode on the side surface of the substrate. The purpose is to provide.

[0009]

The present invention provides a method of forming a linear electrode on a side surface of a substrate having front and back surfaces, in which an electrode paste is attached to form one or more linear stripes. After being stretched so as to face the side surface of the substrate, the linear member is pressed against the side surface of the substrate by a pressing member made of an elastic material having a thickness larger than that of the substrate to form the linear member on the surface of the substrate. Also wrap around the back side,
The electrode paste is transferred onto the side surface and the front and back surfaces of the substrate.

Further, according to the present invention, in an electrode forming apparatus for forming a linear electrode on a side surface of a substrate having front and back surfaces, an electrode paste adhering means for adhering an electrode paste to one or more linear lines. A wire-stretching means for tensioning the wire to which the electrode paste is attached so as to face the side surface of the substrate, and a pressing member made of an elastic material having a thickness greater than the thickness of the substrate. The filaments stretched by a member are pressed against the side surfaces of the substrate so that the filaments also wrap around the front and back surfaces of the substrate, and the electrode paste is transferred to the side surfaces and the front and rear surfaces of the substrate. It is a thing.

[0011]

According to the present invention, the electrode paste is adhered to one or more filaments and the filaments are stretched. Then, the stretched filament is pressed against the side surface of the substrate arranged facing the filament by a pressing member made of an elastic material having a thickness larger than that of the substrate. At this time, the tip pressure contact portion of the pressing member is deformed, and the side surface portion of the substrate is embedded in the tip portion of the pressing member together with the line. As a result, the filament is pressed against the side surface of the substrate while wrapping around to the front and back surfaces of the substrate, and the attached electrode paste is transferred to the side surface and front and back surfaces of the substrate to form electrodes.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view of essential parts showing a structure for carrying out a method for forming electrodes on a side surface of a substrate according to the present invention.

In the figure, reference numeral 1 is a line for forming a linear electrode. The filament 1 is composed of a string, a metal wire or the like, and the number thereof is set according to the electrode pattern to be formed.

Further, each line 1 is selected to have a diameter corresponding to the line width of the electrode to be formed, for example, a range of 0.2 to 0.3 mm. In addition, the distance D between the filaments 1 is set appropriately according to the electrode pattern to be formed.

The line 1 is adapted to be moved by a predetermined distance L in the horizontal direction (direction A in the drawing) by a drive roller (not shown) every time an electrode is formed. This line 1
The movement of is performed by winding the finite length of the wire 1 by the drive roller or by rotating the infinite end wire 1 by the drive roller.

Numerals 2 to 5 are guide rollers for tensioning the filament 1 in parallel at a predetermined interval D and guiding the movement of the filament 1 and rotating it on a side plate (not shown) or the like. Supported as possible. Further, 6 and 7 are rotatable between the guide rollers 2 and 3 and between the guide rollers 4 and 5, respectively.
In addition, the cushioning roller is arranged so as to be vertically swingable.

Reference numeral 8 is an electrode paste attaching device for attaching the electrode paste to the filament 1. The electrode paste attaching device 8 is for ejecting the electrode paste by, for example, an ejection nozzle to attach the electrode paste to each filament 1. The filament 1 may be dipped in the electrode paste to attach the electrode paste. Further, 9 is a substrate 11
This is an electrode paste removing device for removing the electrode paste remaining on the filament 1 after forming the electrode. The line 1
The electrode paste remaining while passing through the electrode paste removing device 9 is wiped and removed.

A pressing member 10 is arranged above the filament 1 so as to be vertically movable, and presses the filament 1 downward.
The pressing member 10 is made of an elastic material such as rubber or silicon resin, has a thickness W larger than the thickness w of the substrate 11, and has a semicircular convex surface 10a. Also, 11
Is a substrate on which side surface electrodes are formed, and is arranged below the filament 1 and below the pressing member 10. The substrate 11 is fixed at a predetermined position by a positioning member (not shown) so that the side surface 11a faces the filament 1 (the substrate side surface 11a faces upward).

In the above structure, the side surface 11a of the substrate 11
In the case of forming a linear electrode on the
A predetermined distance L (distance required for forming electrodes on the side surface of the substrate) is conveyed in the A direction. During the transportation, the wire paste 1 is attached with the electrode paste by the electrode paste attaching device 8 and the portion to which the electrode paste is attached is stretched above the arrangement position of the substrate 11 with a predetermined pressure.

Next, the substrate 11 is fixed at a predetermined position,
Then, the pressing member 10 is lowered. Pressing member 10
The amount of descent of the substrate 1 is the tip of the convex surface 10a of the pressing member 10.
It is adjusted so as to be slightly lower than the side surface 11a of No. 1 (the lower side by the distance d in the figure). For this reason, when the pressing member 10 descends to the lowest point, the side surface portion of the substrate 11 is buried in the lower surface 10a of the pressing member 10 together with the filament 1 as shown in the sectional view of FIG. At this time, line 1
The upstream side (front surface 11b side) and the downstream side (back surface 11c side) of the substrate 11 are pulled to the substrate 11 side, but the cushioning rollers 6 and 7 move upward to form a linear strip. 1
Is maintained at a predetermined value.

By the above operation, the linear member 1 is pressed against the side surface 11a of the substrate 11 by the pressing member 10 with a predetermined pressure, and the front surface 11b and the rear surface 11c of the substrate 11 are also pressed.
The electrode paste attached to the filament 1 is transferred to the side of the substrate 11 and pressed around, and linear electrodes are formed on the side surface 11a and the front and back surfaces 11b and 11c of the substrate 11.

As described above, according to the present invention, the filament 1 to which the electrode paste is attached is brought into pressure contact with the side surface 11a of the substrate 11 by the pressing member 10 made of an elastic material.
Not only the side surface 11a of the substrate, but also the front and back surfaces 11b of the substrate 11,
A linear electrode can be easily formed on 11c.

Particularly, by adjusting the descending position of the tip of the lower surface 10a of the pressing member 10, that is, the distance d, the winding size of the electrodes formed on the front and back surfaces 11b and 11c of the substrate 11 can be adjusted. There is an advantage that an electrode width, that is, an electrode longer than the wire diameter of the filament 1 can be easily formed. Thereby, for example, the substrate 11
It is possible to reliably connect the signal lines formed on the front and back surfaces 11b and 11c by the side electrodes. Further, it is possible to sufficiently secure the solder attachment area as the soldering land.

In the above embodiment, the filament 1 was moved in one direction each time the electrode was formed, but the filament 1 may be moved back and forth every time the electrode is formed.

[0025]

As described above, according to the present invention,
One or more wire rods to which the electrode paste is attached are stretched, and the wire rods are pressed against the side surface of the substrate by a pressing member made of an elastic material having a thickness larger than that of the substrate to form an electrode. Therefore, the filaments wrap around to the front and back surfaces of the substrate, and the electrodes can be easily formed not only on the side surfaces of the substrate but also on the front and back surfaces.

By adjusting the amount of pressure applied by the pressing member, the wraparound amount of the filament on the front and back surfaces of the substrate can be adjusted, and the wraparound size of the electrodes formed on the front and back surfaces of the substrate can be determined from the electrode width of the electrode. Can also be long. Thereby, for example, the signal lines formed on the front and back surfaces of the substrate can be surely connected. Further, the solder attachment area as the soldering land can be secured, and the quality of the product can be improved.

Further, even when the electrode pattern to be formed differs depending on the product, it suffices to adjust the wire diameter of the filaments and the interval between the filaments. There is no need to provide a pattern or prepare a dedicated jig.

[Brief description of drawings]

FIG. 1 is a perspective view of relevant parts for explaining a method of forming electrodes on a side surface of a substrate according to the present invention.

FIG. 2 is a side sectional view showing a state in which electrodes are formed on the side surface of the substrate.

FIG. 3 is a perspective view showing a substrate having linear electrodes formed on the side surface of the substrate.

FIG. 4 is a perspective view of a main part showing a conventional method of forming electrodes on a side surface of a substrate.

[Explanation of symbols]

1 line 2-5 guide rollers 6,7 Buffer roller 8 Electrode paste attaching device (electrode paste attaching means) 9 Electrode paste remover 10 Pressing member 10a convex 11 board 11a side of substrate 11b Substrate surface 11c Back side of substrate

Claims (2)

[Claims] 1. A method of forming a linear electrode on a side surface of a substrate having front and back surfaces, the method comprising: forming one or more linear strips having an electrode paste on the side surface of the substrate. After being stretched, the filament is also wrapped around the front and back sides of the substrate by pressing the filament on the side surface of the substrate by a pressing member made of an elastic material having a thickness greater than that of the substrate, A method for forming an electrode on a side surface of a substrate, which comprises transferring an electrode paste to the side surface and front and back surfaces of the substrate. 2. An electrode forming device for forming a linear electrode on a side surface of a substrate having front and back surfaces, wherein 1 or 2 is provided.
The electrode paste attaching means for attaching the electrode paste to the above-mentioned filaments, the filament tensioning means for tensioning the filament to which the electrode paste is adhered so as to face the side surface of the substrate, and the thickness greater than the thickness of the substrate. A pressing member made of an elastic material having a thickness, and the linear member stretched by the pressing member is pressed against the side surface of the substrate so that the linear member also wraps around the front and back surfaces of the substrate, and the electrode An electrode forming device for a side surface of a substrate, characterized in that the paste is transferred onto the side surface and front and back surfaces of the substrate.