JP2000049043A - Method and device for forming external electrode for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate an electrode application operation at wraparound parts of the end surface and upper/lower surfaces of an electronic component by applying an electrode paste to a wire of a thickness matched to the width of an external electrode to be formed, having it abut to the end surface of the electronic component and transferring the electrode paste for baking. SOLUTION: A groove 7 is worked to match the formation width of an external electrode 4 at an end surface 2 of a baked body 6, then the baked body 6 is beveled. After an electrode paste is applied to a twisted wire 8 of natural fiber, alignment is performed to the width and interval of the groove 7, the sintered body 6 is made to abut to warp the wire 8, and slid one or two times in the extended direction of the wire 8. Then the electrode paste is transferred so that a wraparound electrode 5 is formed at the external electrode 4 and a flat surface 3, on the inside surface of the groove 7 of the end surface 2. Then the baked body 6 is inverted and the wraparound electrode 5 of the external electrode 4 and the flat surface 3 is transferred likewise on the internal surface of the groove 7 of another end surface 2, which is dried and baked to form the external electrode 4 and the wraparound electrode 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for forming external electrodes of an electronic component for forming external electrodes on end faces of electronic components used in various electronic devices.

[0002]

2. Description of the Related Art In general, a conventional method is to form an external electrode by applying an electrode paste by performing screen printing or tampo printing using a pattern of a predetermined shape on an end face of an electronic component, and then baking the electrode paste. It was done.

[0003]

However, in order to secure the soldering strength of the external electrodes formed on the end face, the above-mentioned screen printing method uses the first pattern to dry the screen face on the end face part first, and then performs the second step. Printing and drying on the upper surface of the electronic component using the second pattern, printing on the lower surface in the same manner, and then baking the electrode,
It was necessary to form a U-shaped external electrode on the lower surface. For this reason, at least three times of electrode printing and drying work are required for one electronic component, which increases the number of processes, and it is very troublesome to align the printed portion on the end face with the printed portion on the upper and lower surfaces. There was a point.

An object of the present invention is to provide a method and an apparatus for forming an external electrode of an electronic component, which can solve the above-mentioned problem and can easily perform an electrode coating operation on a wraparound portion between an end surface and upper and lower surfaces of the electronic component. It is intended for.

[0005]

In order to achieve the above object, the present invention relates to an external electrode formed on an end face of an electronic component, wherein an electrode paste is applied to a line having a thickness corresponding to the width of the external electrode to be formed. After coating, this is brought into contact with the end face of the electronic component, the electrode paste is transferred, and then, by baking, the end face of the electronic component, and the external electrode having the wraparound portion on the upper and lower surfaces are formed in one operation. This enables easy formation.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, in an external electrode formed on an end face of an electronic component, an electrode paste is applied to a line having a thickness corresponding to the width of the external electrode to be formed. The method of forming an external electrode of an electronic component, comprising: abutting the electrode paste on the end surface of the electronic component, transferring the electrode paste, and baking to form an external electrode on the end surface of the electronic component. An electrode having a desired shape by a method in which a line coated with an electrode paste corresponding to the width dimension is brought into contact with the end face of the electronic component and transferring the electrode paste, and having a wraparound portion on the end face of the electronic component and above and below the same. The electrodes can be formed in one operation. Also, by changing the thickness of the line coated with the electrode paste, an external electrode having an arbitrary width can be formed.

According to a second aspect of the present invention, a plurality of lines coated with an electrode paste are provided in parallel at a predetermined interval, and are brought into contact with an end surface of an electronic component to simultaneously apply the electrode paste to a plurality of places. 2. The method for forming an external electrode of an electronic component according to claim 1, wherein a line coated with an electrode paste having a combination of thicknesses according to the width of the external electrode is applied to an end face of the electronic component. By being in contact with each other, it is possible to simultaneously form an external electrode having a wraparound portion on the end surface and the upper and lower surfaces of the electronic component in a single operation, and
This has an effect that it is possible to form the width and interval of any different external electrodes.

According to a third aspect of the present invention, when the wire coated with the electrode paste is brought into contact with the electronic component, the electronic component is strongly pressed so that the wire is bent, and the electrode paste is applied to the end face of the electronic component. The method of forming an external electrode of an electronic component according to claim 1, wherein transferring is performed.
By strongly pressing the end face of the electronic component, the wire is bent, so that an external electrode having a wraparound portion on the end face and its upper and lower surfaces can be formed more easily.

According to a fourth aspect of the present invention, when the electrode paste is transferred to the end face of the electronic component, the electronic component or the line is slid in the length direction of the line and transferred. The method for forming an external electrode of an electronic component according to any one of claims 1 to 3, whereby the electrodes of the wraparound portion can be more reliably formed on the upper and lower surfaces of the electronic component. This has the effect that an external electrode with high soldering reliability can be obtained.

[0010] According to a fifth aspect of the present invention, the wire for applying the electrode paste is made of a natural fiber or a synthetic fiber. The method for forming external electrodes of electronic parts of the above, wherein a wire formed of natural fiber or synthetic fiber is easily impregnated with the electrode paste, so that a large amount of electrode paste can be applied to the inside of the wire and its surface and held. Has an effect that the electrode paste having a predetermined thickness can be reliably transferred when the end surfaces of the electrodes abut.

According to a sixth aspect of the present invention, the wire to be coated with the electrode paste is a metal twisted wire or a core wire wound around a metal wire in a coil shape. The method for forming an external electrode of an electronic component according to any one of claims 1 to 4, wherein the electrode paste is applied to and held on the surface even when the electrode paste is made of a material that is difficult to impregnate. it can.

The invention according to claim 7 of the present invention is characterized in that the surface of the wire to which the electrode paste is applied is made of a synthetic resin having at least one groove worked along the extended surface of the wire. The method for forming an external electrode of an electronic component according to any one of claims 1 to 4, wherein the electrode paste is formed in a groove formed in the surface of the wire even in a synthetic resin wire made of a material that is difficult to impregnate with the electrode paste. Can be held. The electrode paste held can be easily transferred by bringing the groove into contact with the end face of the electronic component.

[0013] The invention according to claim 8 of the present invention is to provide a method in which a line coated with an electrode paste is brought into contact with an end face of an electronic component to transfer the electrode paste. The method for forming an external electrode of an electronic component according to any one of claims 1 to 7, wherein the cleaning is performed by scraping off and cleaning the electrode paste remaining on the surface of the wire. In order to keep the surface of the wire constant, the electrode paste of a predetermined shape can always be transferred to the end face of the electronic component even if the wire is used repeatedly, and the collected electrode paste is subjected to viscosity adjustment and the like. It has the effect that it can be reused.

According to a ninth aspect of the present invention, the electronic component to which the electrode paste is to be transferred is one obtained by performing a chamfering process. The method of forming an external electrode of an electronic component is such that, by performing chamfering, the ridge between the end surface and the plane of the electronic component becomes an arc shape, and the electronic component is only pressed against the line coated with the electrode paste. The wraparound electrode on the plane portion can be easily transferred, and the connection at the boundary between the end face electrode and the wraparound electrode on the plane has an arc shape, so that it is possible to eliminate electrode breakage at the boundary portion. It has the action of:

When an external electrode is formed on a chamfered electronic component by a screen printing method, an end face and a flat portion are not flat, so that a gap between the printing screen and a printing surface becomes large, and a printing screen is formed. Since the electrode paste oozes out on the back surface, cleaning such as wiping is frequently required.

Further, by chamfering, the end of the internal electrode formed inside the electronic component is completely exposed to the end face, and good electrical connection between the external electrode and the internal electrode can be secured.

According to a tenth aspect of the present invention, there is provided an electronic component in which a groove is formed in a transfer portion on an end face of an electronic component to which an electrode paste is transferred. The method for forming an external electrode of an electronic component according to any one of the above, wherein the external electrode having a uniform thickness is formed on an inner surface portion of the processed groove by using a line corresponding to the position and size of the processed groove portion. And can be formed
The end portion of the internal electrode formed inside the electronic component can be reliably exposed to the end face, so that an excellent electrical connection between the external electrode and the internal electrode can be ensured.

According to the eleventh aspect of the present invention, there is provided an electronic component in which a masking process is applied to a non-transferred portion on an end face of an electronic component to which an electrode paste is to be transferred. The method of forming an external electrode of an electronic component according to any one of the above, wherein a plurality of external electrodes are transferred to the electronic component by performing a masking process on a non-transferred portion, thereby causing a short circuit between adjacent external electrodes. Can be prevented.

According to a twelfth aspect of the present invention, there is provided a part holding a plurality of electronic components, a line having a thickness corresponding to a width dimension of an external electrode formed on an end face of the electronic component, and a line having the thickness. A portion for unwinding and winding the wire, a portion for applying electrode paste to the wire, and a process for transferring the electrode paste from the wire to the electronic component, scraping off excess electrode paste remaining on the wire and wire. An external electrode forming apparatus for an electronic component, comprising: a part for performing washing of a plurality of electronic parts, wherein an external electrode having a wraparound portion on an end face, an upper face, and a lower face is provided once for a plurality of electronic components. Can be formed simultaneously with the above operation, and the surface of the wire can be maintained in a constant state by winding the wire and scraping and cleaning the excess electrode paste remaining on the wire, so that the wire is always formed in a predetermined shape. Roll electrode paste continuously It is possible to become.

Hereinafter, an embodiment of the present invention will be described. (Embodiment 1) FIG. 1 is a perspective view of an electronic component in which an external electrode is formed by forming a groove in an end face, and FIG. 2 is a conceptual view of an electrode paste transfer method. 1 and 2, reference numeral 1 denotes an electronic component having a groove formed on an end face to form an external electrode, 2 denotes an end face, 3 denotes a flat surface, 4 denotes an external electrode on an end face, 5 denotes a wraparound electrode, and 6 denotes a sintered electrode. Body (shows an electronic component before forming external electrodes, and in the first embodiment, a sintered body of ceramics is used, and is hereinafter referred to as a sintered body 6), 7 is a groove formed in the end face 2, and 8 is an electrode. This is a line with paste applied.

First, a groove 7 is formed on the end face 2 of the sintered body 6 in accordance with the width of the external electrode 4 to be formed, and then the sintered body 6 is chamfered.

Next, after the electrode paste is applied to the wire 8 in which the natural fibers are twisted, positioning is performed according to the width and interval of the groove 7 formed in the end face 2 as shown in FIG. So that the line 7 and the groove 7 on one end face 2 of the body 6 overlap,
The wire 8 is brought into contact with the wire 8 so as to bend, and is slid once or twice in the extension direction of the wire 8, and the electrode paste is wound on the inner surface of the groove 7 of the end face 2 so as to wrap around the external electrode 4 and the plane 3 to form the electrode 5. Transcribe. Subsequently, the sintered body 6 is turned over and the groove 7 on the other end face 2 is formed.
The outer electrode 4 and the wraparound electrode 5 on the plane 3 are similarly transferred to the inner surface of the substrate, and then dried at 150 ° C.

Next, the transferred electrode paste was baked at a temperature of 750 ° C. to complete the electronic component 1 having the external electrode 4 and the wraparound electrode 5 shown in FIG.

In the first embodiment, the groove 7 is formed on the end face 2 of the sintered body 6 because the electrode paste is transferred only to the inner surface of the groove 7 to prevent a short circuit between the adjacent external electrodes 4. The purpose is to clarify the position where the electrode paste is to be transferred, and the width can be combined with various shapes as needed. Further, the internal electrode (not shown) formed on the inner surface of the sintered body 6 is fired. It also has the purpose of reliably exposing it to the end face 2 of the union 6 to ensure good connection between the external electrode 4 and the internal electrode, and it is desirable that the bottom surface of the groove 7 be processed into an arc shape.

Further, the chamfering of the sintered body 6 is performed by making the ridge formed by the end face 2 and the plane 3 into an arc shape and pressing the sintered body 6 against the wire 8 to wrap around the external electrode 4. This is because the electrode paste can be easily transferred to the portion of the electrode 5 and the connection at the boundary between the external electrode 4 and the wraparound electrode 5 is ensured.

Further, the reason why the sintered body 6 is slid is to firmly rub the electrode paste against the inner surface of the groove 7 and to secure the applied thickness of the electrode paste of the wraparound electrode 5 transferred to the plane 3. is there.

Further, in the first embodiment, the wire 8 is made of natural fiber which is easily impregnated and coated with the electrode paste on the surface and inside. However, a wire obtained by twisting a synthetic fiber or a metal wire into a coil shape is used. It has been confirmed that similar transfer can be performed even if a material having a shape capable of holding the electrode paste on the surface is used.

In the first embodiment, grooves 7 are formed in the sintered body 6.
After the chamfering of the sintered body without the processing of the groove 7, the chamfering of the sintered body without the processing of the groove 7 was performed first.
After applying a water-repellent masking agent to the electrode paste and processing the groove 7 in accordance with the width of the external electrode 4 formed, the electrode paste is transferred by the above-described method, so that the adjacent external electrode is transferred. Since a short circuit between the electrode 4 and the wraparound electrode 5 can be prevented, the reliability of soldering can be further improved.

In the electronic component 1 completed by the above method, a good electrical connection between the internal electrode formed therein and the external electrode 4 is ensured, and the performance of the electronic component 1 can function sufficiently. When the electronic component 1 is soldered to a circuit board (not shown), good solderability and soldering strength can be ensured.

(Embodiment 2) FIG. 3 is a perspective view of an electronic component having chamfered external electrodes, FIG. 4A is a perspective view of a grooved synthetic resin wire, and FIG. FIG. 5 is a cross-sectional view showing an electrode paste applied state, and FIG. 5 is a conceptual diagram of external electrode transfer. 3, 4, and 5, reference numeral 9 denotes an electronic component on which chamfering is performed to form an external electrode; 10, an end surface;
Is a flat surface, 12 is an external electrode on an end face, 13 is a wraparound electrode on a flat surface, 14 is a sintered body (shows an electronic component before forming an external electrode. In Embodiment 2, a ceramic sintered body is used. Therefore, the sintered body is hereinafter referred to as a sintered body 14), 15 is a line made of a synthetic resin, 16 is a groove processed in the length direction of the line, 17
Denotes an electrode paste applied to the groove, and 18 denotes a scraping plate of the electrode paste.

First, the sintered body 14 is chamfered as shown in FIG. Next, as shown in FIG. 4B, an electrode paste 17 is applied to the grooves 16 of the synthetic resin wire 15 in which the grooves 16 are machined in the length direction shown in FIG. 1
At 8, the electrode paste attached to portions other than the grooves 16 is removed.

Next, as shown in FIG. 5, one end face 1 of the sintered body 14 is applied to the surface of the wire 15 on which the electrode paste 17 is applied.
0 is pressed so that the wire 15 is bent, the sintered body 14 is slid once or twice, and the electrode paste 17 applied to the groove 16 is applied to the end face 1.
The electrode paste 17 is transferred so that the external electrode 12 and the wraparound electrode 13 are formed on the plane 0 and the plane 11. At this time, since the sintered body 14 is chamfered, the end face 10 and the flat face 1
Because the ridge formed by 1 is arc-shaped, the plane 11
Also, the electrode paste 17 can be easily transferred.
Subsequently, the sintered body 14 is inverted, and the other end face 10 is similarly pressed against the wire 15, and the external electrode 12 and the flat surface 11
After the electrode 13 is transferred in the same manner, drying is performed at 150 ° C.

Next, the electrode paste transferred at a temperature of 750 ° C. was baked to complete the electronic component 9 shown in FIG.

In the second embodiment, chamfering of the sintered body 14 is performed only by pressing the sintered body 14 against the line 15 by making the ridge formed by the end face 10 and the plane 11 of the sintered body 14 into an arc shape. The electrode paste 17 is transferred so that the external electrode 12 and the surrounding electrode 13 are easily formed by
And an internal electrode (not shown) formed on the inner surface of the sintered body 14 to secure the connection at the boundary between the
Is securely exposed to the end face 10 of the sintered body 14 so that the external electrode 12
It also has the purpose of ensuring a good connection between the electrode and the internal electrode.

Further, the grooves 16 are formed in the lines 15 by forming a predetermined amount of the electrode paste 1 in accordance with the shape of the grooves 16.
7 and the end face 10 of the sintered body 14 and the flat surface 1
An external electrode 12 having a constant thickness and a wraparound electrode 13 are partly provided.
To ensure that the electrode paste 17 is transferred to the
Thereby, the external electrode 1 formed on the end face 10 and the plane 11 is formed.
2, and the solderability of the wraparound electrode 13 can be ensured.

In the second embodiment, the electrode paste 17 was transferred after chamfering the sintered body 14.
After chamfering, a water-repellent masking agent is applied to the electrode paste on a portion of the end face 10 of the sintered body 14 where the external electrode 12 is not formed, and then the electrode paste is transferred by the above-described method, so that baking is performed. Since the short circuit between the adjacent external electrode 12 and the wraparound electrode 13 can be prevented, the reliability of soldering can be further improved.

In the electronic component 9 completed by the above-described method, a good electrical connection is secured between the internal electrode and the external electrode 12 formed therein, and the performance of the electronic component 9 can be sufficiently functioned. An electronic component 9 is soldered to a circuit board (not shown) to secure a constant thickness of the external electrode 12 and the wraparound electrode 13 with an appropriate amount of electrode paste 17 held in the groove 16 of the wire 15. At this time, good solderability and soldering strength can be ensured.

(Embodiment 3) FIG. 6 shows an electrode paste coating apparatus according to an embodiment of the present invention. In FIG. 6, 1
Reference numeral 9 denotes a holding plate of a sintered body, reference numeral 20 denotes an unwinding reel of a wire, reference numeral 21 denotes an electrode paste, reference numeral 22 denotes a line made of a natural fiber, reference numeral 23 denotes a scraping portion of the electrode paste, reference numeral 24 denotes a wire washing portion, and reference numeral 25 denotes a wire. It is a take-up reel.

First, after chamfering the sintered body 14, the sintered body 14 is held on the holding plate 19 at regular intervals as shown in FIG. 6, and is set so as to face both sides of the line 22 made of natural fibers.

Next, the unwinding reel 20 and the take-up reel 25 are driven to unwind the wire 22 coated with the electrode paste 21, and then press one end face of the sintered body 14 from both sides of the wire 22. The electrode paste 21 applied to the wire 22 is transferred. Subsequently, the holding plate 19 is inverted, and the wire 22 is driven to move the unwinding reel 20 and the winding reel 25, and the electrode paste 21 is transferred to the other end surface of the sintered body 14 in the same manner. At this time, the electrode paste 21 transferred to the end face of the sintered body 14 is provided on the unwinding reel 20 and the winding reel 25.
Is designed so that a plurality of wires 22 can be drawn simultaneously at predetermined intervals in accordance with the width of the wire. Further, when the sintered body 14 is pressed from both sides of the wire 22, the holding plates 19 on both sides are provided with a step so that the end faces of the sintered body 14 do not contact the wire 22 at the same position, and the sintered body 14 is pressed. Consideration is given so that the electrode paste 21 can be simultaneously transferred to a plurality of places on the end face and the flat surface without sliding.

Further, the unwind reel 20 and the take-up reel 2
Since a constant tension is always applied to the plurality of wires 22 between the five by the unwinding reel 20 and the take-up reel 25, the electrode paste 21 transferred to the end face may be formed linearly at a predetermined interval. it can.

Further, after the electrode paste 21 remaining on the line 22 after the transfer is removed by the scraping unit 23,
The electrode paste can be reused by being washed in the washing section 24, and can be reused by adjusting the viscosity of the scraped electrode paste.

Subsequently, the electrode paste 21 is applied to the end face and the flat face.
Is dried at a temperature of 150 ° C. together with the holding plate 19, and then removed from the holding plate 19.
The electronic component 9 as shown in FIG. 3 was completed by baking at a temperature of ° C.

By using the above-described apparatus, the operation of applying the electrode paste 21 to the end face of the sintered body 14 is performed continuously, so that the productivity can be improved. A good electrical connection is secured between the internal electrode formed inside and the external electrode 12,
The performance of the electronic component 9 can be made to function sufficiently. Also, since the external electrode 12 and the wraparound electrode 13 are formed at a predetermined interval with a constant thickness, when the electronic component 9 is soldered to a circuit board (not shown), good solderability and good solderability are obtained. The attachment strength can be ensured.

The first to third embodiments described above.
Although the external electrodes indicated by are formed in a single layer, the electrodes formed by the present invention can be coated with nickel plating, solder plating, or the like as necessary.

Further, silver and copper can be used as a conductive material that can be used for the electrode paste for transfer.

The following ten points should be noted in the present invention. 1. Since the straight lines 8, 15, 22 are used, the external electrodes 4, 12 having excellent linearity can be formed.

2. The width of the external electrodes 4 and 12 can be adjusted by changing the thickness of the lines 8, 15 and 22.

3. The U-shaped external electrode can be formed in a single operation by strongly pressing or sliding the wires 8, 15, and 22 to bend.

4. External electrodes 4 and 12 can be formed simultaneously at a plurality of locations by stretching a plurality of lines 8, 15 and 22 in parallel.

5. The materials of the transfer lines 8, 15, 22 include natural fibers and synthetic fibers, and synthetic resins and shaped resins.
Metals and the like can be used.

6. By scraping and washing the excess electrode paste 21 adhered to the lines 8, 15, and 22, the surface can be cleaned and the lines 8, 15, and 22 can be used repeatedly. .

7. Electrode paste 21 recovered by scraping
Can be reused by adjusting the viscosity.

8. An external electrode can be formed even if it is chamfered, grooved and masked. 9. The coating operation can be performed continuously by using a device.

10. As the conductive material that can be used for the electrode paste 21 for transfer, silver and copper can be used.

[0056]

As described above, according to the present invention, the external electrode is formed on the end face of the electronic component by using the line coated with the electrode paste for forming the external electrode of the electronic component. Can be easily adjusted by changing the thickness, spacing, and number of lines, and the external electrode on the end face and the wraparound electrode on the plane with excellent solderability can be easily formed by one transfer. Therefore, workability can be greatly improved as compared with the conventional printing method.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component having a groove according to an embodiment of the present invention.

FIG. 2 is a conceptual diagram of an electrode paste transfer method.

FIG. 3 is a perspective view of the chamfered electronic component.

FIG. 4A is a perspective view of a synthetic resin wire according to another embodiment of the present invention, and FIG. 4B is a cross-sectional view of the same state in which electrode paste is applied and held in grooves of the synthetic resin wire.

FIG. 5 is a conceptual diagram of an electrode paste transfer method.

FIG. 6 is a schematic view of the same electrode paste transfer device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electronic component 2 end face 3 plane 4 external electrode 5 wraparound electrode 6 sintered body 7 groove 8 wire 9 electronic component 10 endface 11 flat 12 external electrode 13 wraparound electrode 14 sintered body 15 wire 16 groove 17 electrode paste 18 scraping Plate 19 Holding plate 20 Unwinding reel 21 Electrode paste 22 Wire 23 Scraping unit 24 Cleaning unit 25 Take-up reel

Claims (12)

[Claims] In an external electrode formed on an end face of an electronic component, an electrode paste is applied to a line having a thickness corresponding to a width dimension of the external electrode to be formed, and this is brought into contact with an end face of the electronic component to make an electrode. A method for forming an external electrode of an electronic component, comprising transferring the paste and baking to form an external electrode on an end face of the electronic component. 2. The method according to claim 1, wherein a plurality of lines on which the electrode paste is applied are provided at predetermined intervals, and the electrode paste is simultaneously transferred to a plurality of locations by contacting the end surface of the electronic component. Method for forming external electrodes of electronic components. 3. The electronic component according to claim 1, wherein, when the wire coated with the electrode paste is brought into contact with the electronic component, the electronic component is strongly pressed so that the wire is bent to transfer the electrode paste to the end face of the electronic component. Alternatively, the method for forming an external electrode of an electronic component according to claim 2. 4. The method according to claim 1, wherein when the electrode paste is transferred to the end face of the electronic component, the electronic component or the line is slid in the length direction of the line and transferred. The method for forming an external electrode of an electronic component according to any one of the preceding claims. 5. The method for forming an external electrode of an electronic component according to claim 1, wherein the line on which the electrode paste is applied is made of a natural fiber or a synthetic fiber. 6. The wire according to claim 1, wherein the wire on which the electrode paste is applied is a metal twisted wire or a metal wire wound in a coil shape around a core wire. The method for forming an external electrode of an electronic component according to any one of the first to third aspects. 7. The surface of a wire to which an electrode paste is applied,
The method for forming an external electrode of an electronic component according to any one of claims 1 to 4, wherein the resin is a synthetic resin having at least one groove processed along an extension surface of the wire. 8. The method according to claim 1, wherein the line on which the electrode paste is applied is brought into contact with the end face of the electronic component to transfer the electrode paste, and then the electrode paste remaining on the line is scraped off and washed. The method for forming an external electrode of an electronic component according to claim 1. 9. An electronic component to which an electrode paste is to be transferred, which has been subjected to chamfering.
The method for forming an external electrode of an electronic component according to claim 1. 10. The electronic component according to claim 1, wherein an electronic component in which a groove is formed in a transfer portion on an end face of the electronic component to which the electrode paste is transferred is used. External electrode formation method. 11. The electronic component according to claim 1, wherein the electronic component to which the electrode paste is transferred has a non-transferred portion on a non-transferred portion of the end face subjected to a masking process. External electrode forming method. 12. A part for holding a plurality of electronic components,
A line having a thickness corresponding to the width of the external electrode formed on the end face of the electronic component, a portion for unwinding and winding the line, a portion for applying an electrode paste to the line, An external electrode forming apparatus for an electronic component, comprising: a portion for transferring an electrode paste to an electronic component, scraping excess electrode paste remaining on the line, and cleaning the line.