JP2000315623A - Manufacture of ceramic electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing ceramic electronic parts by which electrode paste can be applied surely to a ceramic element to a uniform thickness and, accordingly, ceramic electronic parts having electrodes can be manufactured efficiently. SOLUTION: In a method for manufacturing ceramic electronic parts, electrode paste 3 for forming electrode is applied to the surface of a ceramic element 1 to a prescribed thickness, in such a way that the paste 3 is applied to the outer peripheral surface 11a of a roller 11 carrying grooves 12 to the prescribed thickness, and the roller 11 is rotated while the element 1 is brought into contact with the paste 3 on the outer peripheral surface 11a of the roller 11. At the same time, the element 1 is moved in the direction corresponding to the direction of rotation of the roller 11 at the speed corresponding to the peripheral velocity of the roller 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a ceramic electronic component, and more particularly, to a method for manufacturing a ceramic electronic component having a structure in which electrodes are provided on a surface of a ceramic element.

[0002]

2. Description of the Related Art For example, as shown in FIG. 8, when manufacturing a ceramic electronic component having a structure in which external electrodes 52a and 52b are provided at both ends of a ceramic element 51, As a method of forming the external electrodes 52a and 52b on the ceramic element 51, generally, a method of applying an electrode paste to the ceramic element and curing or baking the electrode paste is generally used.

In this method, for example, as shown in FIG. 9A, an electrode paste 62 having a metal powder such as Ag powder as a conductive component is applied on a surface plate 60 so as to have a predetermined thickness. As shown in FIG. 9B, after one end (end face) 51a of the ceramic element 51 is immersed in the electrode paste 62, as shown in FIG. Then, after the electrode paste 62 is applied to the other end (end face) 51b of the ceramic element 1 (not shown), the external electrodes 52a and 52b are cured by heating or baking the electrode paste. To form.

However, it is difficult to apply the electrode paste to the end portions (end surfaces) 51a and 51b of the ceramic element 51 with a uniform thickness by the above-mentioned conventional method. 51 end faces 51a, 5
There is a problem that a portion where the coating film of the electrode paste is not formed is formed on the ridge of 1b, and when the thickness of the coating film is increased, the thickness of the coating film becomes large at the center of the end faces 51a and 51b of the ceramic element 51. is there.

[0005] As described above, when the electrode paste cannot be applied in a uniform film thickness, ceramic electronic components with high dimensional accuracy cannot be manufactured, and high-density mounting becomes difficult or the mounting becomes difficult. There is a problem that reliability is reduced. In addition, as the size of the ceramic electronic component increases, the tendency becomes stronger.

Further, in the above-mentioned conventional method, in order to sufficiently adhere the electrode paste to the ceramic element, it may be necessary to repeatedly immerse the same portion of the ceramic element in the electrode paste a plurality of times. There is a problem that productivity improvement is hindered.

The present invention has been made to solve the above-mentioned problems, and has an electrode paste having a uniform thickness on a ceramic element.
It is an object of the present invention to provide a method for manufacturing a ceramic electronic component that can be applied efficiently.

[0008]

In order to achieve the above object, a ceramic electronic component according to the present invention is a method for manufacturing a ceramic electronic component having a structure in which electrodes are provided on the surface of a ceramic element, comprising: An electrode paste for forming an electrode is adhered to the outer peripheral surface of the roller with a predetermined thickness, and the roller is rotated while the ceramic element is in contact with the electrode paste on the outer peripheral surface of the roller. The method includes a step of applying an electrode paste with a predetermined thickness to the surface of the ceramic element by moving the roller at a speed corresponding to the speed in a direction corresponding to the rotation direction of the roller.

The electrode paste is adhered to the outer peripheral surface of the grooved roller at a predetermined thickness. The roller is rotated while the ceramic element is in contact with the electrode paste on the outer peripheral surface of the roller. By moving in a direction corresponding to the rotation direction of the roller at a speed corresponding to the speed, it becomes possible to apply the electrode paste to the surface of the ceramic element with a uniform thickness and quickly, and to apply the electrode paste. By thermosetting or baking, it is possible to efficiently manufacture a ceramic electronic component having external electrodes and high dimensional accuracy.

That is, the electrode paste is applied to the ceramic element while moving the ceramic element at a speed corresponding to the peripheral speed of the roller in the direction corresponding to the rotation direction of the roller. This can be applied to the element, and the productivity can be improved.

In addition, a roller having a groove formed on the outer peripheral surface is used. The groove has a function of overcoming the wettability of the electrode paste on the outer peripheral surface of the roller and the electrode paste to facilitate transfer to the ceramic element. The surface where the electrode paste of the element is to be applied may have a portion where the electrode paste is not applied, or the thickness of the coating film may be large at the center of the applied surface and small at the periphery. The electrode paste can be prevented from being generated, and the electrode paste can be applied to the ceramic element with a uniform film thickness. In addition,
In the present invention, the electrode paste includes a conductive paste in which Ag powder, Cu powder, Ni powder, or the like is used as a conductive component and glass frit or an organic vehicle is added thereto, or a conductive resin in which a conductive component and a resin are mixed. It is a broad concept.

According to a second aspect of the present invention, in the method for manufacturing a ceramic electronic component, the ceramic element is rotated while the ceramic element is in contact with the outer peripheral surface of the roller on which the electrode paste is adhered, and the ceramic element is adapted to the peripheral speed of the roller. The electrode paste is applied at a predetermined thickness to the surface of the ceramic element by moving the roller in a direction corresponding to the rotation direction of the roller at a predetermined speed.

[0013] By moving the ceramic element with the rotation of the roller while making contact with the outer peripheral surface of the roller to which the electrode paste is attached, it is possible to stably apply the electrode paste on the outer peripheral surface of the roller to the surface of the ceramic element. Will be possible.

According to a third aspect of the present invention, in the method for manufacturing a ceramic electronic component, the groove formed on the outer peripheral surface of the roller may include:
(B) a plurality of grooves formed in parallel with the axial direction of the roller, and (c) a plurality of grooves formed in parallel with the circumferential direction of the roller. It is characterized by being one kind of a lattice-shaped groove composed of a plurality of parallel grooves.

As the roller, on the outer peripheral surface thereof,
By using a roller in which any one of the grooves (a), (b) and (c) is formed, the electrode paste can be reliably held at a predetermined thickness on the outer peripheral surface of the roller, and the uniformity can be obtained. The present invention can be effectively applied to a ceramic element with a suitable thickness.

According to a fourth aspect of the present invention, in the method of manufacturing a ceramic electronic component, the roller is rotated while the ceramic element is in contact with the electrode paste on the outer peripheral surface of the roller, and the ceramic element is rotated at substantially the same speed as the peripheral speed of the roller. so,
An electrode paste having a predetermined thickness is applied to the surface of the ceramic element by moving the roller in a tangential direction corresponding to the rotation direction of the roller.

By rotating the roller and moving the ceramic element at a speed substantially equal to the peripheral speed of the roller in a tangential direction corresponding to the rotational direction of the roller, the electrode paste on the outer peripheral surface of the roller can be more reliably removed. In addition, it is possible to uniformly adhere (apply) the ceramic element to the ceramic element, and the present invention can be further made effective.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be shown and features thereof will be described in more detail.

FIG. 1 is a view showing a state in which an electrode paste is applied to a ceramic element in one step of a method of manufacturing a ceramic electronic component according to an embodiment of the present invention, and FIG. FIG. 3 is a diagram showing an arrangement pattern of grooves formed, and FIG. 3 is a diagram showing a cross-sectional shape of the grooves.

In this embodiment, as shown in FIG. 4, a ceramic having a structure in which the internal electrodes 2 are disposed so as to face each other via a ceramic layer 4 and are alternately drawn to end faces on different sides. A case of manufacturing a multilayer ceramic capacitor in which a pair of external electrodes 3a and 3b are arranged at both ends of the element 1 so as to be electrically connected to the internal electrode 2 will be described as an example.

In this embodiment, as a device for applying the electrode paste 3 to the ceramic element 1, a roller 11 having a lattice-like groove 12 (FIGS. 2 and 3) formed on the outer peripheral surface is provided.
A coating apparatus including a scraper 13 (FIG. 1) for uniformizing the thickness of the electrode paste 3 attached to the outer peripheral surface 11a of the roller 11 and a paste bath 14 (FIG. 1) for storing the electrode paste 3 is used. I have. In addition, this coating device
Although not shown, a roller driving mechanism for rotating the roller 11, a holding mechanism for holding the ceramic element 1, a moving mechanism for moving the ceramic element 1 by moving the holding mechanism, and the like are also illustrated. Have.

The outer peripheral surface 11a of the roller 11 has grooves 12a parallel to the circumferential direction of the roller 11, as shown in FIG.
And grooves 12 having a lattice pattern formed of grooves 12b parallel to the axial direction. As shown in FIG. 3, the grooves 12a and 12b formed on the outer peripheral surface 11a of the roller 11 have a V-shaped cross section, a width W of 0.4 mm, and an angle θ of 60 °.

As described above, the shape of the groove 12 is V-shaped in consideration of the fact that the electrode paste 3 is easily removed. The grooves 12a and 12b can be easily formed by machining such as lathing. In addition, it can also be formed by other methods.

In determining the shape of the groove 12, the thickness (film thickness) T of application of the electrode paste 3 to the end faces 1a and 1b of the ceramic element 1, the size of the application area, the application shape, and the like are taken into consideration. It is desirable to determine

As a constituent material of the roller 11, it is desirable to use a metal, a resin, or the like, which has excellent compatibility (affinity) with the electrode paste 3.

Next, a method for applying an electrode paste to a ceramic element by using the above-described coating apparatus will be described. First, while rotating the roller 11, the electrode paste 3 is supplied to the outer peripheral surface 11a of the roller 11, and the scraper 13 is supplied.
As a result, a constant film thickness T1 is obtained. Here, the film thickness T
1 affects the dimension E of the folded portion to the side surface adjacent to the end faces 1a and 1b of the ceramic element 1, but has a small influence on the film thickness T applied to the end faces 1a and 1b of the ceramic element 1. Absent.

Then, the end surface 1a of the ceramic element 1 on which the electrode is to be formed is brought into contact with the electrode paste 3 formed on the outer peripheral surface 11a of the roller 11 in such a manner as not to contact the outer peripheral surface 11a of the roller 11. , Roller 11
Is rotated at a predetermined speed, and the ceramic element 1 is rotated.
At approximately the same speed as the peripheral speed of the roller 11
The electrode paste 3 is applied to the end face 1a of the ceramic element 1 by moving the electrode paste 3 in the tangential direction (the direction of arrow A) corresponding to the rotation direction of. The "moving in the tangential direction corresponding to the rotation direction of the roller" in claim 4 means that, as described above, the linear movement is performed in the tangential direction (the direction of arrow A) along the rotation direction of the roller 11 as it is. This is a concept meaning that the ceramic element 1 is moved.

In applying the electrode paste to the ceramic element, the above operation may be repeated a plurality of times using the same roller, or a plurality of rollers may be used, each of which has a different thickness. In this way, it is also possible to apply a configuration in which the electrode paste is repeatedly applied a plurality of times using the respective rollers, and the electrode paste is applied to the ceramic element.

Then, although not particularly shown, the ceramic element 1 is inverted, and an electrode paste is applied to the opposite end face 1b in the same manner as described above. When the electrode paste is repeatedly applied to the end face of the ceramic element a plurality of times, the electrode paste may be repeatedly applied to the same end face, or the electrode paste may be applied alternately to different end faces. Good.

As described above, the electrode paste 3 is applied to the outer peripheral surface 11a of the roller 11 in which the grooves 12 are formed in a lattice shape, and the electrodes of the ceramic element 1 are attached to the outer peripheral surface 1 of the roller 11.
The roller 11 is rotated while being in contact with the electrode paste 3a, and the ceramic element 1 is moved in a tangential direction corresponding to the rotation direction of the roller 11 at substantially the same speed as the peripheral speed of the roller 11 to remove the electrode paste. Since the electrode paste is applied to the surface of the ceramic element, it is possible to apply the electrode paste in a uniform thickness and continuously to the surface of a large number of ceramic elements continuously and quickly. By baking, it is possible to efficiently manufacture a ceramic electronic component having electrodes on the surface and having high dimensional accuracy.

Since the end of the ceramic element is not immersed in the electrode paste and pulled up as in the prior art, overflow from the end face to the side face can be greatly reduced. It is also possible to make the electrode paste wrap around from the end face side to the side face side by adjusting the thickness of the coating on the roller. In the above embodiment, the outer peripheral surface 11a of the roller 11 has
5 (a), the roller 11 in which only a plurality of grooves 12a parallel to the circumferential direction are formed, as shown in FIG. 5 (a), or the roller 11 in the axial direction as shown in FIG. 5 (b). It is also possible to use a roller 11 in which only a plurality of parallel grooves 12b are formed.

However, when a roller having no groove formed on the outer peripheral surface 11a is used, the transfer of the electrode paste to be attached becomes unstable, and it is difficult to uniformly apply the electrode paste to the ceramic element. After coating, a step for improving smoothness may be required.

Further, as shown in FIG.
Groove 12c having an angle of about 45 ° with respect to the axial direction
6B, or as shown in FIG. 6B, when the grooves 12c and 12d are formed at an angle of about 45 degrees with respect to the axial direction of the roller 11 and are orthogonal to each other to form a lattice shape. However, it is difficult to uniformly apply the electrode paste to the ceramic element, and a step for improving the smoothness after applying the electrode paste is required.

In the above embodiment (FIG. 1), the case where the electrode paste is applied to the lower end face of the ceramic element has been described. For example, as shown in FIG.
It is also possible to change the direction of the ceramic element 1 so that the surface on which the electrode paste 3 is to be applied (1a in FIG. 7) is the upper end surface.

In the above embodiment, the end faces 1a and 1b of the ceramic element 1 do not contact the outer peripheral face 11a of the roller 11 but only contact the electrode paste 3. 1a and 1b are rollers 1
It is also possible to configure so as to come into contact with the outer peripheral surface 11a. In this case, since the positional relationship between the ceramic element 1 and the roller 11 becomes constant (the interval is always 0),
A stable coating operation can be performed.

In the above embodiment, the multilayer ceramic capacitor has been described as an example.
Not only multilayer ceramic capacitors but also plate capacitors,
The present invention can be applied to various ceramic electronic components such as a multilayer varistor, an LC composite component, and a multilayer substrate.

The present invention is not limited to the above embodiment, but includes the specific configuration of the roller (the diameter of the roller, the specific shape and arrangement of the groove), the type of electrode paste, and the type of the roller. Regarding the rotation speed, the specific shape of the ceramic element, the application position and the application thickness of the electrode paste, various applications and modifications can be made within the scope of the invention.

[0038]

As described above, according to the method for manufacturing a ceramic electronic component of the present invention (claim 1), the electrode paste is adhered to the outer peripheral surface of the grooved roller at a predetermined thickness, and the ceramic element is mounted. The roller is rotated while being in contact with the electrode paste on the outer peripheral surface of the roller, and the ceramic element is moved in a direction corresponding to the rotation direction of the roller at a speed corresponding to the peripheral speed of the roller. It is possible to quickly apply the paste to the ceramic element, and it is possible to suppress variations in the applied thickness and shape when the electrode paste is applied to the surface of the ceramic element. Further, it is possible to suppress the electrode paste from flowing from the end face to the side face. Therefore, it is possible to efficiently manufacture a ceramic electronic component having electrodes having excellent smoothness on the surface and high dimensional accuracy.

Further, as in the method for manufacturing a ceramic electronic component according to the second aspect, the roller is rotated while the ceramic element is in contact with the outer peripheral surface of the roller to which the electrode paste is adhered, thereby forming the ceramic element 1 and the roller 11. Since the positional relationship is constant (the interval is always 0), a stable application operation can be performed.

Further, as in the method for manufacturing a ceramic electronic component according to the third aspect, as the roller, (a) a plurality of grooves formed parallel to the circumferential direction of the roller, and (b) a plurality of grooves formed parallel to the axial direction of the roller. A plurality of grooves formed, (c) a roller in which any one of a plurality of grooves parallel to the circumferential direction of the roller and a plurality of grooves in the form of a lattice formed of a plurality of grooves parallel to the axial direction is formed on the outer peripheral surface thereof. This makes it possible to more efficiently form an external electrode having excellent shape accuracy and thickness uniformity more reliably.

Further, as in the method for manufacturing a ceramic electronic component according to the fourth aspect, the roller is rotated and the ceramic element is moved at a speed substantially equal to the peripheral speed of the roller in a tangential direction corresponding to the rotation direction of the roller. In this case, the electrode paste on the outer peripheral surface of the roller can be more securely and evenly adhered (applied) to the ceramic element, and the present invention can be further effectively demonstrated.

[Brief description of the drawings]

FIG. 1 is a view showing a state in which an electrode paste is applied to a ceramic element in one step of a method for manufacturing a ceramic electronic component according to an embodiment of the present invention.

FIG. 2 is a view showing an arrangement pattern of grooves formed on an outer peripheral surface of a roller used in one step of a method for manufacturing a ceramic electronic component according to an embodiment of the present invention.

FIG. 3 is a diagram showing a cross-sectional shape of a groove formed on an outer peripheral surface of a roller used in one step of a method for manufacturing a ceramic electronic component according to an embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a ceramic electronic component (multilayer ceramic electronic component) manufactured by a manufacturing method according to an embodiment of the present invention.

FIGS. 5A and 5B are views showing a modified example of a roller that can be used in the method for manufacturing a ceramic electronic component of the present invention.

6 (a) and 6 (b) are diagrams each showing an unfavorable example of a mode of forming a groove on the outer peripheral surface of a roller.

FIG. 7 is a view showing a modification of the method for manufacturing a ceramic electronic component according to one embodiment of the present invention.

FIG. 8 is a view showing a ceramic electronic component manufactured by a conventional method.

FIGS. 9A, 9B and 9C are views showing a conventional method of forming an external electrode on a ceramic element.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Ceramic element 1a, 1b End face of ceramic element 2 Internal electrode 3 Electrode paste 3a, 3b External electrode 4 Ceramic layer 11 Roller 11a Outer peripheral surface of roller 12 Groove 12a Groove parallel to the circumferential direction of roller 12b Groove parallel to the axial direction of roller Groove 13 Scraper 14 Paste bath T Thickness (film thickness) of electrode paste applied to ceramic element T1 Film thickness of electrode paste on outer peripheral surface of roller

Claims (4)

[Claims] 1. A method for manufacturing a ceramic electronic component having a structure in which electrodes are provided on a surface of a ceramic element, wherein an electrode paste for forming an electrode is coated on a peripheral surface of a roller having a groove with a predetermined thickness. By rotating the roller while contacting the ceramic element with the electrode paste on the outer peripheral surface of the roller, and moving the ceramic element at a speed corresponding to the peripheral speed of the roller in a direction corresponding to the rotation direction of the roller. Applying a predetermined thickness of electrode paste to the surface of the ceramic element. 2. The method according to claim 1, further comprising: rotating the roller while bringing the ceramic element into contact with the outer peripheral surface of the roller on which the electrode paste is adhered; and moving the ceramic element at a speed corresponding to the peripheral speed of the roller, in a direction corresponding to the rotation direction of the roller. 2. The method for manufacturing a ceramic electronic component according to claim 1, wherein the electrode paste is applied with a predetermined thickness to the surface of the ceramic element by moving the electrode paste. 3. A groove formed on the outer peripheral surface of the roller includes: (a) a plurality of grooves formed in parallel with the circumferential direction of the roller; (b) a plurality of grooves formed in parallel with the axial direction of the roller; And (c) one of a plurality of grooves parallel to the circumferential direction of the roller and a plurality of grooves parallel to the axial direction.
The manufacturing method of the ceramic electronic component described in the above. 4. The roller is rotated while contacting the ceramic element with the electrode paste on the outer peripheral surface of the roller, and the ceramic element is moved at substantially the same speed as the peripheral speed of the roller in a tangential direction corresponding to the rotation direction of the roller. The method according to any one of claims 1 to 3, wherein the electrode paste is applied to the surface of the ceramic element with a predetermined thickness by moving the ceramic paste.