JP3503501B2 - Manufacturing method of electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component for forming electrodes on an element.

[0002]

2. Description of the Related Art A conventional technique will be described by using an element for a multi-layer type laminated ceramic capacitor.

As shown in FIG. 6, external electrodes are formed so as to be electrically connected to the ends of the internal electrodes 45 exposed on the front and rear surfaces 43 and 44 of the sintered element 40 which has been produced in advance by the method for producing a monolithic ceramic capacitor. 6 when forming the
As shown in (a), first, a plurality of wrap-around electrodes 47 are screen-printed on a portion of the one surface 41 near the ridge at predetermined intervals and dried. Next, as shown in FIG. 6B, a wrap-around electrode 48 is screen-printed on a portion of the other surface 42 facing the surface 41, which is close to the ridge, and dried. Next, as shown in FIG. 6C, an electrode 49 is printed on one side surface 43 sandwiched between the surfaces 41 and 42 on which the wrap-around electrodes 47 and 48 are printed so as to connect with one of the wrap-around electrodes 47 and one of the side electrodes 48. And dry. Subsequently, the electrode 50 was printed on the rear surface 44 facing the front surface 43 in the same manner, dried, and then baked at a predetermined temperature to complete the multi-layer type monolithic ceramic capacitor.

[0004]

In the conventional method of forming an external electrode, since the element alignment, printing and drying are repeated at least four times for one element 40, the productivity is very low. was there.

It is an object of the present invention to solve the above problems and to provide a method for forming an external electrode in which an electrode is applied to the front and rear surfaces of the device, and then dried and baked by holding the device once.

[0006]

Means for Solving the Problems In order to achieve the above object, the present invention has a pair of side surfaces of an element sandwiched by holding bodies, and one of upper and lower ridges of the front surface of the element sandwiched by the holding bodies,
Between the first step of applying the electrode by applying the application body and the second step of applying the electrode by applying the application body to the other ridge, and then between the electrodes applied in the first step and the second step. After the third step of pressing the coating body on the front surface to apply the electrode so as to connect, subsequently, on the rear surface facing the front surface, the electrode is repeatedly applied from the first step to the third step, and the desired electrode is applied. It achieves the purpose.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION According to the first aspect of the present invention, a pair of side surfaces of a rectangular parallelepiped element are sandwiched by a holding body, and one of upper and lower ridges of the front surface of the element sandwiched by the holding body is provided. A first step of applying an electrode by abutting a coating body, then a second step of applying the electrode by abutting the coating body on the other ridge, and then between the electrodes applied in the first step and the second step After applying the third step of applying the electrode to the front surface so as to connect the electrodes, and subsequently applying the electrodes by repeating the first to third steps on the rear surface facing the front surface. Is a method of manufacturing an electronic component.

According to the above manufacturing method, the first step to the third step are continuously performed on the ridge and the side surface on the front surface side of the element by holding the element once by the holding body, and then the above-mentioned steps are performed. Similarly, the first step to the third step can be continuously performed on the ridge on the rear surface side facing the front surface and on the side surface, which results in extremely high productivity.

According to a second aspect of the present invention, the coating body comprises a columnar body and a scraping plate provided in parallel with the columnar body, and the columnar body has a plurality of grooves on its outer peripheral surface at predetermined intervals. 2. The method for manufacturing an electronic component according to claim 1, wherein the scraping plate is formed with a notch at a position facing the groove, wherein the electrode material is applied to the surface of the cylindrical body. , After scraping off the electrode material applied to the area other than the groove with a scraping plate, by contacting or pressing the columnar body with the element, an appropriate amount of the electrode material held in the groove, the ridge of the element, Also, the electrode material can be accurately and simultaneously applied to a plurality of locations on the side surface.

The invention according to claim 3 of the present invention is characterized in that the bottom of the groove formed in the cylindrical body is processed into an arc shape, and the surface between the grooves is mirror-finished. 1 is a method of manufacturing an electronic component according to claim 2,
As a result, the electrode material applied to the surface of the cylindrical body can be neatly removed by the scraping plate from portions other than the grooves formed on the surface. Therefore, it is possible to accurately transfer and coat only the electrode material held in the groove portion to the element when the columnar body is brought into contact with or pressed against the element, and it is possible to prevent a short circuit between the formed electrodes and to form the groove. Since the bottom part of is processed into an arc shape,
The electrode material held in the groove is easily peeled off from the groove.

The invention according to claim 4 of the present invention is the method for manufacturing an electronic component according to any one of claims 1 to 3, characterized in that a hardened steel material is used for the cylindrical body. is there. In other words, in order to continuously perform the transfer coating work of the electrode material on the element, it is necessary to scrape off the excess electrode material coated on the surface of the cylindrical body by always bringing the scraping plate into contact with the surface, For this reason, the columnar body is required to have wear resistance to withstand long-term use, and in order to precisely machine multiple grooves on the surface at narrow intervals, this columnar body is made of hardened steel material. did.

According to a fifth aspect of the present invention, the bottom of the scraping plate notch is processed into an arc shape, and the width of the notch is made narrower than the width of the groove of the cylindrical body. The method for manufacturing an electronic component according to any one of claims 2 to 4. That is, when removing the electrode material applied to the surface of the columnar body with a scraping plate, the width of the notch of the scraping plate is made narrower than the width of the groove of the columnar body. The end of the part strongly presses the electrode material into the groove, so that the groove can hold a proper amount of electrode material securely, and the surface of the electrode material is arcuate outward along the width of the notch. Can be molded into. Therefore, when the columnar body is brought into contact with or pressed against the element, an appropriate amount of electrode material can be surely transferred and applied to the element. Further, since no extra electrode material is applied to the portions other than the groove of the columnar body, it is possible to perform transfer application without short-circuiting the electrodes having a narrow interval.

The invention according to claim 6 of the present invention is characterized in that the scraping plate is constituted by an elastic metal thin plate, and the electronic component according to any one of claims 2 to 5 is characterized. It is a manufacturing method. In other words, by forming the scraping plate with an elastic metal plate, when the scraping plate is pressed against the columnar body, the scraping plate bends along the surface of the columnar body. The extra electrode material can be removed neatly, and an appropriate amount can be held by pressing the electrode material inside the groove.

In the invention according to claim 7 of the present invention, a part of the surface of the cylindrical body is always immersed in the electrode material tank, the electrode material is applied to the surface while rotating, and the surface is scraped with a scraping plate. 3. The method for manufacturing an electronic component according to claim 1, wherein the electrode material is held only in the groove formed on the surface of the take-up cylinder, and then the electrode material is transfer-coated from the cylinder to the element. Is. In other words, a part of the surface of the cylinder is always immersed in the electrode material bath, fresh electrode material is always supplied to the surface of the cylinder, and the excess electrode material other than the groove of the electrode material adhering to the surface is scraped off. Scrape with
An appropriate amount of electrode material is properly held only in the groove portion, which makes it possible to accurately transfer and apply the electrode material to the element.

According to an eighth aspect of the present invention, when a columnar body is brought into contact with a ridge portion of an element to apply an electrode, after contacting the ridge portion with the cylinder body stopped, the upper ridge portion is contacted. 2. The electron material according to claim 1, wherein the electrode material held in the groove of the cylinder is transferred and applied to the element by rotating the cylinder in the counterclockwise direction in the case of 1 and clockwise in the case of the lower ridge. It is a method of manufacturing a component. This makes it possible to transfer and apply an appropriate amount of electrode material around the upper and lower ridges of the front and rear surfaces of the element sandwiched by the holders.

According to a ninth aspect of the present invention, when the columnar body is pressed on the front surface or the rear surface of the element to apply the electrode, the cylindrical body is pressed while the columnar body is stopped, and the groove portion of the columnar body is pressed. 9. The method for manufacturing an electronic component according to claim 1, wherein the held electrode material is applied to the element. This has the effect that an appropriate amount of electrode material having a uniform thickness can be applied to the element and the electrodes at the upper and lower ridges of the element to which the electrode material has already been applied can be properly connected.

The invention according to claim 10 of the present invention is characterized in that the columnar body is moved in the vertical direction of the element in the first to third steps of applying the electrode material to the element. A method of manufacturing an electronic component according to claim 9. This makes it possible to reliably connect the upper and lower ridges of the element and the electrodes between them, and to prevent a short circuit between adjacent electrodes even when the distance between the electrodes transferred and applied to the element is narrow.

The invention according to claim 11 of the present invention is characterized in that a chamfered element is used.
The method for manufacturing an electronic component according to claim 10. As a result, the ridge on the side surface of the element becomes arcuate,
The electrodes applied to the elements sandwiched by the holding plates can be formed in a continuous U-shape.

According to a twelfth aspect of the present invention, the element is a multiple electronic component element.
The method of manufacturing an electronic component according to any one of claims 11 to 11, wherein in a multiple-type electronic component element in which a plurality of functional elements are formed inside a single element, an internal electrode is provided on a front surface or a rear surface thereof. The external electrodes can be formed so as to be electrically connected.

According to a thirteenth aspect of the present invention, the holding body is comb-shaped, and the electrode material is applied by abutting or pressing the columnar body in a state where the element is sandwiched between a pair of comb teeth. The method of manufacturing an electronic component according to claim 1, wherein As a result, it becomes possible to transfer and apply the electrode material having the same shape to a large number of devices at the same time, and the productivity can be improved.

According to a fourteenth aspect of the present invention, after the elements are preliminarily aligned in the longitudinal direction on the aligning and conveying plate and conveyed, the upper part between the comb teeth of the holder is spread by a jig having a V-shaped projection. 14. The method of manufacturing an electronic component according to claim 13, wherein the element is rotated 90 degrees and inserted and clamped in the gap.
The side surface of the element on which the electrode material is transferred and applied can be properly held by the comb teeth.

According to a fifteenth aspect of the present invention, the electrode material is transferred and applied, and after drying, the space between the comb teeth of the holder is V
15. The method for manufacturing an electronic component according to claim 13 or 14, wherein compressed air is blown out from the nozzle to extract the element in a state where the element is spread by a jig having a protrusion. The element can be easily taken out from between the comb teeth.

An embodiment of the present invention will be described below by using an element for a multi-layer type laminated ceramic capacitor in which four laminated ceramic capacitors are formed in a single element body.

(Embodiment 1) First, using a known method for manufacturing a laminated ceramic capacitor, a plurality of ceramic dielectric layers 12 and internal electrodes 13 are alternately laminated as shown in FIG.
Four monolithic ceramic capacitors were formed in a single element such that one end of the internal electrode 13 was sandwiched between the ceramic dielectric layers 12 and were alternately exposed to the front surface 4 and the rear surface 7 facing each other. A rectangular sintered body 1 (an example of an element) for a continuous monolithic ceramic capacitor is prepared.

Next, the sintered body 1 is chamfered to completely expose the entire end portions of the internal electrodes 13 formed inside the sintered body 1 to the front and rear surfaces 4 and 7, as shown in FIG.

Next, as shown in FIG. 2, after the sintered compacts 1 are aligned in the longitudinal direction by the aligning plate A, the sintered compacts 1 are attracted by the suction pins B and rotated 90 degrees to be turned sideways. In this state, the holding plate 20 in which the comb teeth 21 are pushed apart by the V-shaped protrusion C
Then, the sintered body 1 is inserted between each pair of comb teeth 21. At this time, before the end of the internal electrode 13 of the sintered body 1 is exposed,
The rear surfaces 4 and 7 are inserted horizontally. continue,
By moving the V-shaped protrusion C upward, the side faces 10 and 11 of the sintered body 1 are sandwiched.

After that, as shown in FIG. 3, a scraping plate 25 having a notch 26 corresponding to the groove 23 is pressed against the surface of the cylindrical body 22 having the electrode material 24 adhered in the groove 23, and the cylinder The convex electrode material 24 is held inside the groove 23 of the body 22, and the excess electrode material 24 attached to the surface of the cylindrical body 22 is scraped off.

Next, at the first station, as shown in FIG. 4 (a), a cylindrical body having electrode material 24 attached to the upper ridge 5 of the front surface 4 of the sintered body 1 sandwiched by the holding plates 20. 22 is abutted with the rotation stopped, and then the cylindrical body 22 is rotated counterclockwise to apply the wrap-around electrode 14 to the upper ridge portion 5. The coating position at this time is the upper ridge 5 in the vertical direction, which is aligned with the end of the internal electrode 13 exposed on the front surface 4 of the sintered body 1. Then, as shown in FIG.
The columnar body 22 is separated from the sintered body 1 and moved vertically downward,
The cylindrical body 22 is brought into contact with the lower ridge 6 portion of the side surface 4 of the sintered body 1 in a stopped state, and then the cylindrical body 22 is rotated clockwise to apply the wrap-around electrode 15 to the lower ridge 6 portion. The coating position at this time is the internal electrode 1 exposed on the side surface 4 of the sintered body 1.
There are 6 lower vertical ridges aligned with the 3 edges. Subsequently, the columnar body 22 is further moved away from the sintered body 1 in the vertical upper direction, and is pressed against the front surface 4 of the sintered body 1 in a state where the rotation of the cylindrical body 22 is stopped as shown in FIG. 4 (c). The electrode 16 is transferred and applied while the sintered body 1 is slid backward between the comb teeth 21. The coating position at this time is aligned with the position of the end of the internal electrode 13 exposed on the front surface 4 of the sintered body 1, and the upper edge 5
Part wraparound electrode 14 and lower ridge 6 part wraparound electrode 15
Apply to connect with. As a result, the wrap-around electrode 14 is formed on the upper ridge 5 portion of the sintered body 1 sandwiched between the holding plates 20, the electrode 16 is formed on the front surface 4, and the wrap-around electrode 15 is formed on the lower ridge 6 portion. Four U-shaped external electrodes connected to are formed.

Next, the holding plate 20 is moved to the second station, and the cylindrical body 22 holding the electrode material 24 in the groove 23 is placed on the upper ridge 8 of the rear surface 7 of the sintered body 1 as in the first station. The wrap-around electrode 17 is formed on the portion, the wrap-around electrode 18 is formed on the lower ridge 9, and the electrode 19 is formed on the rear surface 7.
After forming four U-shaped external electrodes electrically connected to the three ends, the sintered body 1 is dried together with the holding plate 20.

Next, the V-shaped protrusion C is lowered from the upper part of the holding body 20 and inserted between the comb teeth 21, and compressed air is blown from the rear side of the holding body 20 to take out the sintered body 1. .

Next, the sintered body 1 was baked at an external electrode at a predetermined temperature to complete a quadruple type monolithic ceramic capacitor. A 1608 type of 0.8 mm was used as the distance between the ends of the internal electrodes 13 exposed on the front and rear surfaces 4 and 7 of the sintered body 1.

Further, the material of the cylindrical body 22 is hardened steel having a diameter of 10 mm, and when it is pressed against the front and rear surfaces 4 and 7 of the sintered body 1,
The surface of the cylindrical body 22 is made sufficiently larger than that of the sintered body 1 so as to contact the front and rear surfaces 4, 7 of the sintered body 1 substantially linearly. The groove 23 formed on the surface of the cylindrical body 22 has a width of 0.25 mm and a depth of 0.2 mm, and its bottom is processed into an arc shape. Furthermore, the distance between the grooves 23 is 0.8 mm,
Four pieces are provided for the sintered body 1, and the surface of the cylindrical body 22 other than the groove 23 is mirror-finished. The inside of the groove 23 is formed in an arc shape so that the electrode material 24 held in the groove 23 is easily separated from the groove 23 when the cylindrical body 22 is brought into contact with the sintered body 1.

Further, the scraping plate 25 is made of spring steel having a thickness of 0.2 mm, and an arcuate notch 26 having a width of 0.2 mm is provided at a position corresponding to the groove 23 of the columnar body 22. It is attached so as to be in pressure contact with the surface of. The notch 26 of the scraping plate 25 has an arc shape because the coating area of the electrode material 24 is required when the electrode material 24 held in the groove 23 of the columnar body 22 is brought into contact with the sintered body 1. It is designed so that it does not spread further.

The method of coating and holding the electrode material 24 on the cylindrical body 22 is as shown in FIG.
At the lower corner position of 4a, the rotatably mounted cylindrical body 22 is rotated in the counterclockwise direction to apply the electrode material 24 on the surface thereof and remove the electrode material 24 attached to the side walls 27 other than the groove 23. . Then, the cylindrical body 22
With the scraping plate 25 attached to the surface of the side wall 27 so as to be pressed against the surface of the electrode 23, the electrode material 24 other than the groove 23 is completely scraped, and the width of the groove 23 corresponding to the groove 23 of the columnar body 22 The surface of the electrode material 24 held in the groove 23 by the narrow cutout portion 26 is formed into an arc shape. As a result, the electrode material 24 can be strongly pressed into the groove 23, and an appropriate amount of the electrode material 24 can be held in the groove 23 portion. Also tank 2
The reason why the part of the surface of the cylindrical body 22 is constantly immersed in 4a is
This is because the fresh electrode material 24 is always supplied to the surface of the columnar body 22. Further, the roller 28 provided at the other corner of the tank of the electrode material 24 is for rotating the roller 28 to constantly agitate the electrode material 24 and keep the viscosity of the electrode material 24 constant.

In the above-mentioned series of working steps, the edges 5, 6, 8, 9 and the front and rear surfaces 4, 7 are precisely aligned with the end positions of the internal electrodes 12 exposed on the front, rear surfaces 4, 7 of the sintered body 1. Well, it becomes possible to apply an appropriate amount of the electrode material 24. Needless to say, the viscosity of the electrode material 24 needs to be adjusted in advance to a viscosity suitable for the width of the electrode to be formed.

According to the method of the present invention, the quadruple type monolithic ceramic capacitor has four external electrodes adjacent to each other and electrically connected to the ends of the internal electrodes 13 exposed on the front and rear surfaces 4 and 7 of the sintered body 1. It is possible to accurately form the electrodes at a narrow interval without short-circuiting between the electrodes. The wrap-around electrodes 14, 15, 17, formed on the surfaces 2, 3 sandwiched by the ridges 5, 6, 8, 9 parts,
Reference numeral 18 is provided to ensure solderability when the four-layer type multilayer ceramic capacitor is mounted on a printed circuit board (not shown) or the like by soldering.

[0037]

As described above, according to the present invention, a plurality of external electrodes electrically connected to the front and rear surfaces of the internal electrode formed inside the multiple electronic component element are exposed. Can be accurately formed at a narrow interval without short-circuiting between adjacent electrodes.

[Brief description of drawings]

FIG. 1 is a perspective view of a quadruple type monolithic ceramic capacitor sintered body according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which quadruple-type laminated ceramic capacitor sintered bodies are aligned and sandwiched between holding plates.

FIG. 3 (a) is a front view showing a relationship between a cylindrical body and a scraping plate. FIG. 3 (b) is a front view showing a state in which an electrode material is held in a groove of the cylindrical body.

FIG. 4A is a diagram showing a state in which a wraparound electrode is applied to an upper ridge of a sintered body, and FIG. 4B is a diagram showing a state in which a wraparound electrode is applied to a lower ridge of a sintered body. Diagram showing how electrodes are applied to the side surface

FIG. 5 is a plan view showing the positional relationship of the entire coated body.

FIG. 6 (a) is a perspective view of a state in which a wraparound electrode is applied to the upper surface of a sintered body by a conventional electrode coating method, and (b) is a perspective view of a state in which a wraparound electrode is applied to the lower surface of the sintered body (c). ) A perspective view of the sintered body with external electrodes applied to the side surface

[Explanation of symbols]

1 Sintered body 2 upper surface 3 Lower surface 4 front 5,8 Upper ridge 6,9 Lower ridge 7 Rear 10,11 Side 12 Dielectric ceramic layer 13 internal electrodes 14,17 winding electrodes 15,18 winding electrode 16, 19 electrodes 20 holding plate 21 comb teeth 22 cylinder 23 groove 24 Electrode material 25 scraping plate 26 Notch 27 Electrode material tank side wall 28 rollers

─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Hideo Uchiyama 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP 10-12505 (JP, A) JP 8- 124811 (JP, A) JP-A-5-190404 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01G 4/00-17/00

Claims (15)

(57) [Claims] 1. A first step in which a pair of opposite side surfaces of a rectangular parallelepiped element are sandwiched by holding bodies, and an electrode is applied by abutting an application body on one of upper and lower ridges of the front surface of the elements sandwiched by the holding bodies,
Next, the second step of applying the electrode by abutting the coating body on the other ridge, and then pressing the coating body on the front surface so as to connect between the electrodes coated in the first step and the second step. A method of manufacturing an electronic component, comprising: after the third step of applying electrodes, subsequently applying the electrodes to the rear surface facing the front surface by repeating the first to third steps. 2. The coating body comprises a cylindrical body and a scraping plate provided in parallel with the cylindrical body, and the cylindrical body has a plurality of grooves at predetermined intervals on its outer peripheral surface, and the scraping plate has the grooves. The method of manufacturing an electronic component according to claim 1, further comprising a cutout portion at a position facing to. 3. The electronic component according to claim 1, wherein the bottom of the groove formed in the cylindrical body is processed into an arc shape, and the surface between the grooves is mirror-finished. Manufacturing method. 4. The method of manufacturing an electronic component according to claim 1, wherein the cylindrical body is made of a hardened steel material. 5. The scraping plate notch portion is processed into an arcuate bottom portion, and the width of the notch portion is made narrower than the width of the groove of the columnar body. A method of manufacturing an electronic component according to any one of the above. 6. The method for manufacturing an electronic component according to claim 2, wherein the scraping plate is made of an elastic thin plate. 7. A part of the surface of a cylindrical body is constantly immersed in an electrode material tank, and the electrode material is applied to the surface while rotating,
The electrode material is applied only to the groove formed on the surface of the columnar body by scraping this off with a scraping plate, and then the electrode material is applied to the element from the columnar body. Of manufacturing electronic components of. 8. When a columnar body is brought into contact with the ridge of the element to apply an electrode, after the columnar body is brought into contact with the ridge while being stopped,
The electrode material held in the groove of the cylindrical body is applied to the element by rotating the cylindrical body counterclockwise in the case of the upper ridge and clockwise in the case of the lower ridge. Of manufacturing electronic components of. 9. When pressing a cylinder on the front or rear surface of the element to apply an electrode, the cylinder is pressed while the cylinder is stopped and the electrode material held in the groove of the cylinder is applied to the element. 9. The method for manufacturing an electronic component according to claim 1 or claim 8. 10. The columnar body is moved in the vertical direction of the element in the first step to the third step of applying the electrode material to the element, according to any one of claims 1 to 9. Of manufacturing electronic components of. 11. The method of manufacturing an electronic component according to claim 1, wherein a chamfered element is used. 12. The method for manufacturing an electronic component according to claim 1, wherein the device is a multiple-type electronic component device. 13. The holding body is comb-shaped, and the electrode is applied by abutting or pressing the columnar body in a state where the element is sandwiched between each pair of comb teeth. Electronic component manufacturing method. 14. The elements are preliminarily aligned in the longitudinal direction on an aligning and conveying plate and conveyed, and then the elements are rotated 90 degrees into a gap in which the upper portions between the comb teeth of the holder are spread by a jig having a V-shaped protrusion. 14. The method of manufacturing an electronic component according to claim 13, wherein the electronic component is inserted and clamped. 15. An electrode material is transfer-coated on the device and dried,
14. The element is taken out from the holder by blowing compressed air to the element from the nozzle in a state where the comb teeth of the holder are spread from above by a jig having a V-shaped projection, or The method of manufacturing an electronic component according to claim 14.