JP3092440B2 - Manufacturing method of multilayer ceramic electronic component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic electronic component such as a multilayer ceramic capacitor and an LC composite component.

[0002]

2. Description of the Related Art For example, a multilayer ceramic capacitor, which is one of typical multilayer ceramic electronic components, usually has a dielectric ceramic layer 51 and an internal electrode 52 as shown in FIG. Are formed by disposing external electrodes 54 that are electrically connected to the internal electrodes 52 that are drawn out to the opposite end faces every other layer on both ends of the elements 53 alternately stacked.

[0003] This multilayer ceramic capacitor is usually
As shown in FIG. 10, a crimp block 63 formed by laminating and crimping a plurality of ceramic green sheets 61 in which a plurality of internal electrodes (more precisely, conductor patterns serving as internal electrodes) 52 are arranged at predetermined positions. Turntable (not shown)
It is placed on the upper surface, and the blade 64 is pressed substantially perpendicularly to the pressure bonding block 63 to cut along a predetermined cutting line B. After firing, the external electrodes 54 are provided on both ends of the element 53 (FIG. 9).
(FIG. 9). In this case, it is necessary to appropriately laminate ceramic green sheets so that the internal electrodes 52 are not exposed on the upper and lower surfaces of the pressure bonding block 63.

The internal electrodes 52 are not limited to those formed by applying and baking a conductive paste (thick film electrodes), but may be formed by a thin film forming method such as a vapor deposition method or a sputtering method. A thin film electrode (metal foil) may be used.

[0005] When a thin film electrode (metal foil) is used as the internal electrode 52, in the step of cutting the pressure bonding block 63, when the blade 64 is pressed against the pressure bonding block 63 and penetrated inside, As shown in FIG. 11, the electrode 52 is not cut at the same position, and the blade is pushed by the blade 64 to cause a slack (deformation), or the internal electrode 52 is pulled and separated from the ceramic green sheet 61. There is a problem that

Therefore, in order to solve such a problem, it has been attempted to cut the pressure bonding block using a dicing saw. However, since the crimp block must be cut in an uncured state,
Cutting with a dicing saw requires several tens of times longer than cutting with the above-mentioned blade, and has a problem that productivity is poor.

Further, in order to reduce the time required for cutting when a dicing saw is used, it is conceivable to heat-treat and harden the block to enable high-speed cutting.
However, in this case, although the time required for cutting can be reduced to about several times as compared with the case of using a blade, there is a problem that the number of steps of heat-treating the pressure-bonded block increases.

The present invention solves the above-described problems, and can reduce the time required for cutting the pressure-bonded block without causing deformation or peeling of the internal electrode, and can provide a laminate excellent in productivity. An object of the present invention is to provide a method for manufacturing a ceramic electronic component.

[0009]

To achieve the above object, a method of manufacturing a multilayer ceramic electronic component according to the present invention comprises:
In a method for manufacturing a multilayer ceramic electronic component having a structure in which internal electrodes are embedded in a ceramic,
In the cutting process after lamination and crimping of the surface of the lean sheet
In the area not including the cutting position, the thin film forming method
Forming a plurality of internal electrodes composed of thin film electrodes
A step of laminating and pressing a plurality of ceramic green sheets in which a plurality of internal electrodes are disposed at predetermined positions and pressing the same to form a pressure-bonded block having no internal electrode at a position corresponding to the cutting line, and a blade . Almost perpendicular to the internal electrode surface
By pressing, the step of cutting the crimp block along a predetermined cutting line to cut out an element, and polishing the cut out element, exposing an internal electrode from a predetermined end surface by polishing the cut out element. Features.

Further, as a method of polishing the element, a barrel polishing method in which a barrel containing the element and a polishing medium is swung is used.

[0011] The swinging of the barrel is a broad concept including rotating or vibrating the barrel.

Further, as a method for polishing the element, a sand blast method is used in which a polishing powder is sprayed on a polishing surface to perform polishing.

Further, as a method of polishing the element, a method of polishing a predetermined end face of the element using a polishing plate is used.

[0014]

In the method of manufacturing a multilayer ceramic electronic component according to the present invention, a plurality of ceramic green sheets having a plurality of internal electrodes formed of thin-film electrodes (metal foils) arranged at predetermined positions are laminated, pressed, and cut. Because the crimp block where the internal electrode does not exist at the position corresponding to the line is formed, when the crimp block is cut along a predetermined cutting line by the blade, the blade does not contact the internal electrode, The internal electrode is not deformed or peeled from the ceramic green sheet.

Therefore, as compared with the conventional dicing saw, the cutting processing time can be greatly reduced and the production efficiency can be improved.

Further, by using a barrel polishing method, a sand blasting method, or a method of polishing with a polishing plate as a method of polishing the element, the present invention can be surely carried out and effectively radiated.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for manufacturing a multilayer ceramic electronic component according to the present invention will be described below with reference to the drawings.

Embodiment 1 FIG. 1 is a cross-sectional view showing a main part of a crimp block formed in one step of a manufacturing method according to this embodiment, and FIGS. 2 (a) and 2 (b).
Is a plan view showing a ceramic green sheet in which a thin film electrode (metal foil) serving as an internal electrode is provided at a predetermined position, which constitutes a crimping block. FIG. 3 is a diagram showing a crimping block cut along a predetermined cutting line. FIG. 4 is a cross-sectional view showing an element obtained by the above.

In the method of manufacturing a multilayer ceramic electronic component (multilayer ceramic capacitor) of this embodiment, first, as shown in FIGS. 2A and 2B, the position of the internal electrode 2 is shifted by a predetermined amount. To prepare two types of ceramic green sheets 1 (1a, 1b). In addition,
In the ceramic green sheet 1 (1a, 1b), a thin film electrode (metal foil) formed by a sputtering method is used as the plurality of internal electrodes 2 disposed at predetermined positions.

Then, the ceramic green sheets 1 (1a, 1b) are alternately laminated and pressed, whereby
As shown in FIG. 1, the internal electrode 2 is arranged at a predetermined position inside, and a crimp block 3 where the internal electrode 2 is not formed is obtained at a position corresponding to the cutting line A.

Then, the pressure-bonding block 3 is cut along the cutting line A by pressing the blade 4 substantially perpendicularly to the internal electrode surface, so that the pressure-blocking block 3 is moved to a predetermined position inside as shown in FIG. An element 13 on which the electrode 2 is formed is obtained. In this element 13, the internal electrode 2 is not exposed at the end face.

Next, the element 1 before firing together with the cobblestone and the like was used.
3 is placed in a barrel (not shown), the barrel is polished by rotating the barrel at a predetermined rotation speed, for example, and the internal electrode 2 is disposed in a ceramic dielectric 11 as shown in FIG. A device 1 having internal electrodes 2 exposed from both end surfaces thereof
3a is obtained.

After the element 13a is fired, external electrodes 14 that are electrically connected to the internal electrodes 2 are formed on both end surfaces of the element 13a, and are fired to obtain a multilayer ceramic electronic component (laminate) as shown in FIG. Ceramic capacitor) is obtained. In this case, baking of the element is not necessarily performed after polishing, but may be performed before polishing.

In the manufacturing method of the above embodiment, a plurality of ceramic green sheets 1 (1a, 1b) in which a plurality of internal electrodes 2 are disposed at predetermined positions are alternately laminated and pressure-bonded to the cutting line A. Since the crimping block 3 in which the internal electrode 2 does not exist at the corresponding position is formed, when the crimping block 3 is cut by the blade 4 along a predetermined cutting line A, the blade 4 Therefore, it is possible to reliably prevent the internal electrode 2 from dripping (deformation) and peeling off from the ceramic green sheet 1 without contact with the ceramic green sheet 1.

Therefore, the cutting time can be greatly reduced as compared with the conventional dicing saw.

Embodiment 2 FIGS. 6 and 7 are views showing another embodiment of the method for manufacturing a multilayer ceramic electronic component of the present invention.

In this embodiment, a sand blast method is used as a method for polishing a predetermined end face of the element. That is, as shown in FIG. 6, for example, a holder 23 in which a holding member 21 is formed with a double-sided adhesive 22 is formed.
Then, by holding the element 13 and spraying the abrasive powder 25 from a spraying machine 24, a predetermined end surface of the element 13 is polished to expose the internal electrode. Then, as shown in FIG. 7, the element 13a having the internal electrode exposed at a predetermined end face is brought into contact with a conductive paste 26 for forming an external electrode while being held by the holder 23, and the conductive paste is applied to the end face of the element 13a. 26 is deposited. And conductive paste 2
After the element 6 is dried, the element 13a is removed from the holder 23 and baked to obtain a multilayer ceramic electronic component (multilayer ceramic capacitor) having the external electrodes 14 formed at predetermined positions as shown in FIG.

The other steps of the method for manufacturing the multilayer ceramic electronic component of this embodiment are the same as those of the first embodiment.

Embodiment 3 FIG. 8 is a view showing still another embodiment of the method for manufacturing a multilayer ceramic electronic component of the present invention.

In this embodiment, a method of polishing a predetermined end face of the element by a polishing plate is used. That is, as shown in FIG.
While the holder is held by the holder 23, a predetermined end surface of the element 13 is brought into contact with the polishing plate 27, and the predetermined end surface of the element 13 is polished by sliding on the polishing plate 27. Then, an external electrode is formed on the element polished until the internal electrode is exposed at a predetermined end face in the same manner as in the second embodiment, so that the external electrode 14 is positioned at a predetermined position as shown in FIG. The formed multilayer ceramic electronic component (multilayer ceramic capacitor) is obtained.

The other steps of the method for manufacturing the multilayer ceramic electronic component of this embodiment are the same as those of the first embodiment.

In each of the above embodiments, the case where the element is polished by the barrel polishing method, the sand blast method, and the method using a polishing plate has been described. However, the method of polishing the element is not limited to these. Further, other polishing methods can be used. Further, such polishing may be performed before or after firing the element.

In the above embodiment, the method of manufacturing a multilayer ceramic capacitor has been described as an example. However, the method of manufacturing a multilayer ceramic electronic component of the present invention is not limited to a multilayer ceramic capacitor, but may be an inductor, an LC composite electronic component, or the like. The present invention can be applied to various methods for manufacturing a multilayer ceramic electronic component.

In each of the above embodiments, a method of manufacturing a multilayer ceramic electronic component (multilayer ceramic capacitor) using a thin film electrode (metal foil) formed by a sputtering method as an internal electrode has been described as an example. The present invention relates to a multilayer ceramic in which a thin film electrode formed by various thin film forming methods such as a plating method, a CVD method, a PVD method, or a sputtering method using an ion beam is used as an internal electrode. The present invention can also be applied to a method of manufacturing an electronic component, and in this case, the same effect as that of the above embodiment can be obtained.

The method for manufacturing a multilayer ceramic electronic component according to the present invention is not limited to the above-described embodiment in other respects, and the arrangement pattern of the internal electrodes on the ceramic green sheet and the position of the cutting line are also described. With regard to the specific shape of the blade, various applications and modifications can be made within the scope of the invention.

[0036]

As described above, the method of manufacturing a multilayer ceramic electronic component according to the present invention is formed by a thin film forming method.
A plurality of ceramic green sheets in which a plurality of internal electrodes made of thin-film electrodes are disposed at predetermined positions are laminated and pressed to form a pressure-bonded block in which no internal electrodes are present at positions corresponding to the cutting lines. By cutting along the predetermined cutting line to cut out the element and polishing the obtained element to expose the internal electrode from the end face, the blade is used to cut the crimp block along the predetermined cutting line. When cutting, it is possible to reliably prevent the internal electrode from dripping (deformation) and peeling off from the ceramic green sheet.

Therefore, the cutting time can be greatly reduced as compared with the conventional dicing saw.
Production efficiency can be improved.

Further, by using a barrel polishing method, a sand blast method, or a method of polishing with a polishing plate as a method of polishing the element, the present invention can be surely carried out and effectively realized.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a main part of a pressure bonding block formed in one step of a method for manufacturing a multilayer ceramic electronic component according to one embodiment of the present invention.

FIGS. 2A and 2B are plan views each showing a ceramic green sheet constituting a pressure-bonding block and having a plurality of internal electrodes disposed at predetermined positions.

FIG. 3 is a cross-sectional view showing an element obtained by cutting a crimping block along a predetermined cutting line.

FIG. 4 is a cross-sectional view showing a device in which internal electrodes are exposed from both end surfaces by polishing.

FIG. 5 is a sectional view showing a multilayer ceramic capacitor manufactured by the method for manufacturing a multilayer ceramic electronic component of the present invention.

FIG. 6 is a view showing a polishing step according to another embodiment of the present invention.

FIG. 7 is a view showing an external electrode forming step according to another embodiment of the present invention.

FIG. 8 is a view showing a polishing step according to still another embodiment of the present invention.

FIG. 9 is a cross-sectional view showing the structure of a conventional multilayer ceramic electronic component (multilayer ceramic capacitor).

FIG. 10 is a cross-sectional view illustrating a main part of a crimping block formed in one step of a conventional method for manufacturing a multilayer ceramic electronic component.

FIG. 11 is a view showing a step of cutting a pressure-bonded block formed in one step of a conventional method for manufacturing a multilayer ceramic electronic component.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 ceramic green sheet 2 internal electrode 3 pressure bonding block 4 blade 13 element 13 a element with internal electrode exposed from end face 14 external electrode 24 spraying machine 25 abrasive powder 27 polishing plate A cutting line

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-63-142803 (JP, A) JP-A-63-224210 (JP, A) JP-A-4-94517 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01G 4/00-4/40 H01G 13/00-13/06

Claims (4)

(57) [Claims] 1. A structure in which an internal electrode is embedded in a ceramic
In the method for manufacturing a multilayer ceramic electronic component havingCutting of the surface of ceramic green sheet after lamination and crimping
In the area not including the cutting position in the cutting process,
Depending on the forming method, multiple internal electrodes consisting of thin film electrodes are formed.
The process of  A ceramic group in which a plurality of internal electrodes are arranged at predetermined positions
Laminate multiple sheets and crimp them to meet cutting lines.
To form a crimp block with no internal electrodes
Process and the bladeIs pressed almost perpendicularly to the internal electrode surface.
WhenCuts the crimp block along a predetermined cutting line.
Cutting the element by cutting it, and polishing the cut element to make
Exposing the internal electrode from the
A method for manufacturing a multilayer ceramic electronic component. 2. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein said element is polished by a barrel polishing method in which a barrel containing said element and a polishing medium is oscillated. 3. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein said element is polished by a sandblast method in which a polishing powder is sprayed on a polished surface to perform polishing. 4. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein a method for polishing a predetermined end face of the element using a polishing plate is used as the method for polishing the element.