JP2000138145A - Manufacture of electronic parts - Google Patents
Manufacture of electronic partsInfo
- Publication number
- JP2000138145A JP2000138145A JP10312907A JP31290798A JP2000138145A JP 2000138145 A JP2000138145 A JP 2000138145A JP 10312907 A JP10312907 A JP 10312907A JP 31290798 A JP31290798 A JP 31290798A JP 2000138145 A JP2000138145 A JP 2000138145A
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical body
- electronic component
- electrode
- manufacturing
- electrode material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は素子への電極形成を
行う電子部品の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component for forming electrodes on an element.
【0002】[0002]
【従来の技術】従来の技術を多連型積層セラミックコン
デンサ用の素子を用いて説明する。2. Description of the Related Art The prior art will be described with reference to elements for a multiple-layer monolithic ceramic capacitor.
【0003】図6に示すごとく予め積層セラミックコン
デンサ製造方法を用いて作製した焼結した素子40の
前,後面43,44に露出した内部電極45端部と、電
気的に接続するように外部電極を形成する際、図6
(a)に示すように、先ず一方の面41の稜に近い部分
に所定間隔をあけ複数個の廻り込み電極47をスクリー
ン印刷し、乾燥を行う。次に図6(b)のごとく前記面
41と対向するもう一方の面42の稜に近い部分に廻り
込み電極48をスクリーン印刷し乾燥を行う。次いで図
6(c)のごとく廻り込み電極47,48を印刷した面
41,42に挟まれた一方の側面43に、廻り込み電極
47の片方と48の片方と接続するように電極49を印
刷し、乾燥する。続いて前面43と対向する後面44に
同様に電極50を印刷し、乾燥を行った後、所定温度で
焼付けを行い多連型積層セラミックコンデンサを完成さ
せていた。As shown in FIG. 6, an external electrode is formed so as to be electrically connected to the end of an internal electrode 45 exposed on the front and rear surfaces 43 and 44 of a sintered element 40 previously manufactured by using a multilayer ceramic capacitor manufacturing method. FIG. 6
As shown in (a), first, a plurality of wraparound electrodes 47 are screen-printed at a predetermined interval in a portion near the ridge of one surface 41, and drying is performed. Next, as shown in FIG. 6B, the electrode 48 is screen-printed on a portion near the ridge of the other surface 42 facing the surface 41 and dried. Next, as shown in FIG. 6C, an electrode 49 is printed on one side surface 43 sandwiched between the surfaces 41 and 42 on which the wraparound electrodes 47 and 48 are printed so as to be connected to one of the wraparound electrodes 47 and 48. And dry. Subsequently, the electrodes 50 were similarly printed on the rear surface 44 facing the front surface 43, dried, and baked at a predetermined temperature to complete the multi-layer monolithic ceramic capacitor.
【0004】[0004]
【発明が解決しようとする課題】前記従来の外部電極の
形成方法では、一つの素子40に対し少なくとも四回
の、素子整列、印刷、乾燥を繰返すために、生産性が非
常に低いという問題点があった。In the conventional method of forming an external electrode, since the element alignment, printing and drying are repeated at least four times for one element 40, the productivity is very low. was there.
【0005】本発明は前記課題を解決し、素子の一度の
保持で、前後面に電極を塗布した後、乾燥、焼付けを行
う外部電極の形成方法を提供することを目的とするもの
である。SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems and to provide a method for forming an external electrode in which the electrodes are applied to the front and rear surfaces, dried and baked after holding the element once.
【0006】[0006]
【発明を解決するための手段】前記目的を達成するため
に本発明は、素子の対向する一対の側面を保持体で挟持
し、保持体で挟持した素子の前面の上下一方の稜部に、
塗布体を当接し電極を塗布する第一工程と、次に他方の
稜部に塗布体を当接し電極を塗布する第二の工程と、次
いで第一工程、第二工程で塗布した電極間を接続するよ
うに、前面に塗布体を押圧し電極を塗布する第三工程を
経た後、続いて前記前面に対向する後面に、第一工程か
ら第三工程を繰返し電極を塗布し、所期の目的を達成す
るものである。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention comprises a pair of opposing side surfaces of an element sandwiched by a holder, and one of upper and lower ridges on the front surface of the element sandwiched by the holder.
The first step of applying the electrode by abutting the applied body, and then the second step of applying the electrode by abutting the applied body to the other ridge, and then the first step, between the electrodes applied in the second step In order to connect, after passing through the third step of applying the electrode by pressing the coating body on the front surface, subsequently, on the rear surface facing the front surface, repeat the first step from the third step to apply the electrode, the expected The purpose is achieved.
【0007】[0007]
【発明の実施の形態】本発明の請求項1に記載の発明
は、直方体形状素子の対向する一対の側面を保持体で挟
持し、保持体で挟持した素子の前面の上下一方の稜部に
塗布体を当接し電極を塗布する第一工程と、次に他方の
稜部に前記塗布体を当接し電極を塗布する第二の工程
と、次いで第一工程、第二工程で塗布した電極間を接続
するように、前記前面に前記塗布体を押圧し、電極を塗
布する第三工程を経た後、続いて前記前面と対向する後
面に前記第一から第三工程を繰返し電極を塗布すること
を特徴とする電子部品の製造方法である。DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a pair of opposing side surfaces of a rectangular parallelepiped element are sandwiched between holders, and one of the upper and lower ridges on the front surface of the element sandwiched between the holders. A first step of applying the electrode by applying the applied body, and a second step of applying the electrode by applying the applied body to the other ridge, and then the first step, between the electrodes applied in the second step. After the third step of applying the electrode by pressing the application body on the front surface so as to connect the electrodes, subsequently, repeating the first to third steps on the rear surface facing the front surface to apply the electrode. A method for manufacturing an electronic component characterized by the following.
【0008】そして以上の製造方法によれば、保持体に
よる素子の一度の挟持で、素子の前面側の稜部、及び側
面に対し第一工程から第三工程を連続的に行い、続いて
前記前面と対向する後面側の稜部、及び側面に対しても
同様に第一工程から第三工程を連続して行うことがで
き、非常に生産性の高いものとなる。According to the above manufacturing method, the first step to the third step are continuously performed on the ridge and the side face on the front surface side of the element by holding the element once by the holding body. Similarly, the first step to the third step can be continuously performed on the ridge portion and the side surface on the rear surface side facing the front surface, resulting in extremely high productivity.
【0009】本発明の請求項2に記載の発明は、塗布体
は円柱体とこれに並行に設けた掻き取り板とによりな
り、前記円柱体はその外周表面に所定間隔で複数条の溝
を形成し、掻き取り板は前記溝と対向する位置に切欠き
部を形成したことを特徴とする請求項1に記載の電子部
品の製造方法であり、円柱体の表面に電極材料を塗着
し、これを掻き取り板で溝以外に塗着した電極材料を掻
き取った後、円柱体を素子に当接、または押圧すること
により、溝部で保持した適正量の電極材料を素子の稜
部、及び側面に正確に、しかも同時に複数箇所に電極材
料を塗布することができる。In the invention according to a second aspect of the present invention, the coating body comprises a cylindrical body and a scraping plate provided in parallel with the cylindrical body, and the cylindrical body has a plurality of grooves formed at predetermined intervals on an outer peripheral surface thereof. 2. The method for manufacturing an electronic component according to claim 1, wherein the scraping plate is formed with a notch at a position facing the groove. After scraping the electrode material applied to the groove other than the groove with a scraping plate, by contacting or pressing the cylindrical body to the element, the appropriate amount of electrode material held in the groove portion of the element ridge, In addition, the electrode material can be applied to a plurality of locations accurately and simultaneously on the side surface.
【0010】本発明の請求項3に記載の発明は、円柱体
に形成した溝の底部は円弧状に加工するとともに、溝と
溝との間の表面を鏡面加工したことを特徴とする請求項
1または請求項2に記載の電子部品の製造方法であり、
これにより円柱体表面に塗着された電極材料を掻き取り
板で、表面に施された溝以外から奇麗に除去することが
できる。従って素子に円柱体を当接、または押圧させた
際に溝部に保持した電極材料のみを正確に素子に転写塗
布することができ、形成した電極間の短絡を防ぐことが
可能となると共に、溝の底部を円弧状に加工したので、
溝に保持した電極材料が溝から剥がれやすくなる。According to a third aspect of the present invention, the bottom of the groove formed in the cylindrical body is processed into an arc shape, and the surface between the grooves is mirror-finished. A method for producing an electronic component according to claim 1 or claim 2,
This makes it possible to cleanly remove the electrode material applied to the surface of the cylindrical body from the portions other than the grooves formed on the surface with a scraping plate. Therefore, only the electrode material held in the groove when the cylindrical body is brought into contact with or pressed against the element can be accurately transferred and applied to the element, and a short circuit between the formed electrodes can be prevented, and the groove can be prevented. Because the bottom of was processed into an arc shape,
The electrode material held in the groove is easily peeled from the groove.
【0011】本発明の請求項4に記載の発明は、円柱体
は焼入れした鋼材を用いたことを特徴とする請求項1か
ら請求項3のいずれか一つに記載の電子部品の製造方法
である。つまり、素子へ電極材料の転写塗布作業を連続
的に行うためには、円柱体の表面に塗着した余分な電極
材料を掻き取り板を常にその表面に当接させて掻き取る
必要があり、このため円柱体には長期間の使用に耐える
耐摩耗性が要求され、また表面に一定形状の複数条の溝
を狭い間隔で精度良く加工を施すためにもこの円柱体は
焼入れした鋼材で形成した。According to a fourth aspect of the present invention, there is provided the electronic component manufacturing method according to any one of the first to third aspects, wherein the cylindrical body is made of a hardened steel material. is there. In other words, in order to continuously transfer and apply the electrode material to the element, it is necessary to always scrape off the excess electrode material applied to the surface of the cylindrical body by bringing the scraping plate into contact with the surface, For this reason, the cylindrical body is required to have abrasion resistance that can withstand long-term use, and in order to accurately form a plurality of grooves with a constant shape on the surface at narrow intervals, this cylindrical body is formed of quenched steel material did.
【0012】本発明の請求項5に記載の発明は、掻き取
り板切欠き部の底部を円弧状に加工するとともに、切欠
き部の幅を円柱体の溝の幅より狭くしたことを特徴とす
る請求項2〜請求項4のいずれか一つに記載の電子部品
の製造方法である。つまり、円柱体の表面の溝以外に塗
着した電極材料を掻き取り板で除去する際に、掻き取り
板の切欠き部の幅を円柱体の溝の幅より狭くしているた
め、切欠き部の端部が電極材料を溝内部に強く押しつ
け、溝に適正量の電極材料を確実に保持させることがで
きると共に、電極材料の表面部を切欠き部の幅に沿って
外方に円弧状に成形することができる。従って円柱体を
素子に当接、または押圧した際に、素子に適正量の電極
材料を確実に転写塗布することができる。また円柱体の
溝以外に余分な電極材料が塗着されていないため、狭い
間隔の電極を短絡させる事なく転写塗布することが可能
となる。The invention according to claim 5 of the present invention is characterized in that the bottom of the scraping plate notch is machined into an arc shape, and the width of the notch is smaller than the width of the groove of the cylindrical body. A method of manufacturing an electronic component according to any one of claims 2 to 4. In other words, when removing the electrode material applied to other than the groove on the surface of the cylindrical body with the scraping plate, the width of the cutout portion of the scraping plate is made smaller than the width of the groove of the cylindrical body. The edge of the part presses the electrode material firmly into the groove, ensuring that an appropriate amount of electrode material is held in the groove, and the surface of the electrode material is formed in a circular arc outward along the width of the notch. Can be molded into Therefore, when the cylindrical body is brought into contact with or pressed against the element, an appropriate amount of electrode material can be reliably transferred and applied to the element. Further, since no extra electrode material is applied to the portions other than the grooves of the columnar body, it is possible to perform transfer application without short-circuiting electrodes at narrow intervals.
【0013】本発明の請求項6に記載の発明は、掻き取
り板を弾性のある金属薄板で構成したことを特徴とする
請求項2〜請求項5のいずれか一つに記載の電子部品の
製造方法である。つまり、掻き取り板を弾性のある金属
板で形成することにより、この掻き取り板を円柱体に押
し当てた状態では、円柱体表面に沿って撓むこととな
り、これにより円柱体表面に塗着した余分な電極材料を
奇麗に除去することができると共に、溝内部に電極材料
を押しつけ、適量を保持させることができる。According to a sixth aspect of the present invention, in the electronic component according to any one of the second to fifth aspects, the scraping plate is formed of an elastic thin metal plate. It is a manufacturing method. In other words, by forming the scraping plate with an elastic metal plate, when the scraping plate is pressed against the cylinder, the scraping plate bends along the surface of the cylinder, thereby coating the surface of the cylinder. The excess electrode material thus removed can be removed neatly, and the electrode material can be pressed into the inside of the groove to maintain an appropriate amount.
【0014】本発明の請求項7に記載の発明は、円柱体
の表面の一部を常に電極材料槽に浸し、回転させながら
その表面に電極材料を塗着させ、これを掻き取り板で掻
き取り円柱体の表面に形成した溝部のみに電極材料を保
持させた後、円柱体より素子に電極材料を転写塗布する
ことを特徴とする請求項1または請求項2に記載の電子
部品の製造方法である。つまり、円柱体の表面の一部を
常に電極材料槽に浸し、円柱体の表面に常にフレッシュ
な電極材料を供給すると共に、表面に付着した電極材料
の溝部以外の余分な電極材料を掻き取り板で掻き取り、
溝部にのみ適正量の電極材料を正しく保持させるもので
あり、これによって電極材料を正確に素子に転写塗布す
ることが可能となる。According to a seventh aspect of the present invention, a part of the surface of the cylindrical body is always immersed in the electrode material tank, and the electrode material is applied to the surface while being rotated, and the surface is scraped with a scraping plate. 3. The method for manufacturing an electronic component according to claim 1, wherein after the electrode material is held only in the groove formed on the surface of the cylindrical body, the electrode material is transferred and applied to the element from the cylindrical body. It is. In other words, a part of the surface of the cylindrical body is always immersed in the electrode material bath, fresh electrode material is always supplied to the surface of the cylindrical body, and excess electrode material other than the groove of the electrode material attached to the surface is scraped off. Scraping with
An appropriate amount of the electrode material is correctly held only in the groove portion, so that the electrode material can be accurately transferred and applied to the element.
【0015】本発明の請求項8に記載の発明は、素子の
稜部に円柱体を当接させ電極を塗布する際、円柱体を停
止した状態で稜部に当接した後、上部稜部の場合は時計
と逆回りに、下部稜部の場合は時計回りに円柱体を回転
させ円柱体の溝部に保持した電極材料を素子に転写塗布
することを特徴とする請求項1に記載の電子部品の製造
方法である。これにより保持体で挟持した素子の正面と
後面の上部稜部、下部稜部にそれぞれ適正量の電極材料
を廻り込ませて転写塗布することができる。According to an eighth aspect of the present invention, in applying an electrode by applying a cylindrical body to the ridge of the element, the cylindrical body is brought into contact with the ridge in a stopped state, and then the upper ridge is formed. 2. The electronic device according to claim 1, wherein the column material is rotated counterclockwise in the case of clockwise, and clockwise in the case of the lower ridge portion, and the electrode material held in the groove of the cylindrical body is transferred and applied to the element. This is a method for manufacturing parts. As a result, it is possible to transfer and apply an appropriate amount of the electrode material to the upper and lower ridges of the front and rear surfaces of the element sandwiched by the holder.
【0016】本発明の請求項9に記載の発明は、素子の
正面または後面に円柱体を押圧し電極を塗布する際、円
柱体を停止した状態で円柱体を押圧し、円柱体の溝部に
保持した電極材料を素子に塗布することを特徴とする請
求項1または請求項8に記載の電子部品の製造方法であ
る。これにより素子に対し均質な厚みの適正量の電極材
料を塗布し、既に電極材料を塗布している素子の上下稜
部の電極の接続を正しく行うことができるという作用を
有するものである。According to a ninth aspect of the present invention, when a cylindrical body is pressed against the front or rear surface of the element to apply an electrode, the cylindrical body is pressed in a state where the cylindrical body is stopped, and a groove is formed in the cylindrical body. The method according to claim 1 or 8, wherein the held electrode material is applied to the element. This has an effect that an appropriate amount of electrode material having a uniform thickness is applied to the element, and the electrodes at the upper and lower ridges of the element already coated with the electrode material can be correctly connected.
【0017】本発明の請求項10に記載の発明は、素子
に電極材料を塗布する第一工程から第三工程で、円柱体
を素子の上下方向に移動させることを特徴とする請求項
1〜請求項9のいずれか一つに記載の電子部品の製造方
法である。これにより素子の上下稜部と、その間の電極
を確実に接続させることができると共に、素子に転写塗
布した電極間隔が狭い場合においても、隣合う電極間で
の短絡を防止することができる。According to a tenth aspect of the present invention, in the first to third steps of applying an electrode material to the element, the column is moved in the vertical direction of the element. A method for manufacturing an electronic component according to claim 9. This makes it possible to reliably connect the upper and lower ridges of the element and the electrodes between them, and to prevent a short circuit between adjacent electrodes even when the distance between the electrodes transferred and applied to the element is small.
【0018】本発明の請求項11に記載の発明は、面取
り加工を施した素子を用いることを特徴とする請求項1
〜請求項10のいずれか一つに記載の電子部品の製造方
法である。これにより素子側面の稜部が円弧状となり、
保持板に挟持した素子に塗布した電極を連続したコの字
型に形成することができる。According to an eleventh aspect of the present invention, an element which has been subjected to chamfering is used.
An electronic component manufacturing method according to claim 10. As a result, the ridge on the side of the element becomes an arc,
The electrodes applied to the elements sandwiched between the holding plates can be formed in a continuous U-shape.
【0019】本発明の請求項12に記載の発明は、素子
が多連型電子部品素子であることを特徴とする請求項1
〜請求項11のいずれか一つに記載の電子部品の製造方
法であり、単一素子内部に複数個の機能素子を形成した
多連型電子部品素子においても、その正面または後面に
内部電極と電気的に接続するように外部電極を形成する
ことが可能となる。According to a twelfth aspect of the present invention, the element is a multiple electronic component element.
The method for manufacturing an electronic component according to any one of claims 11 to 11, wherein a multiple-type electronic component element in which a plurality of functional elements are formed inside a single element also has an internal electrode on the front or rear surface thereof. External electrodes can be formed so as to be electrically connected.
【0020】本発明の請求項13に記載の発明は、保持
体は櫛状でそれぞれ一対の櫛歯間に素子をそれぞれ挟持
した状態で円柱体と当接、または押圧し電極材料を塗布
することを特徴とする請求項1に記載の電子部品の製造
方法である。これにより同時に大量の素子に対し同一形
状の電極材料を転写塗布することが可能となり、生産性
を向上させることができる。According to a thirteenth aspect of the present invention, the electrode material is applied by abutting or pressing the cylindrical body in a state where the element is sandwiched between a pair of comb teeth, and the holder is in a comb shape. The method for manufacturing an electronic component according to claim 1, wherein: This makes it possible to simultaneously transfer and apply the same shape of electrode material to a large number of elements, thereby improving productivity.
【0021】本発明の請求項14に記載の発明は、素子
を予め整列搬送板に長手方向に整列し搬送した後、保持
体の櫛歯間の上部をV状突起を有する治具で押し広げた
隙間に、素子を90度回転させ挿入挟持することを特徴
とする請求項13に記載の電子部品の製造方法であり、
電極材料を転写塗布する素子側面を櫛歯で正しく挟持す
ることができる。According to a fourteenth aspect of the present invention, after the elements are preliminarily aligned and transported on an alignment and transport plate in a longitudinal direction, the upper portion between the comb teeth of the holding member is pushed and spread by a jig having a V-shaped projection. The method for manufacturing an electronic component according to claim 13, wherein the element is rotated by 90 degrees and inserted and clamped in the gap.
The side surface of the element to which the electrode material is transferred and coated can be properly held between the comb teeth.
【0022】本発明の請求項15に記載の発明は、電極
材料を転写塗布し乾燥後、保持体の櫛歯間を上部よりV
状突起を有する治具で押し広げた状態で、ノズルより圧
縮空気を噴き出し素子を取り出すことを特徴とする請求
項13または請求項14に記載の電子部品の製造方法で
あり、電極材料を塗布後の素子を櫛歯間から容易に取り
出すことができる。According to a fifteenth aspect of the present invention, the electrode material is transferred and dried, and then the space between the comb teeth of the holder is V
The method for producing an electronic component according to claim 13 or 14, wherein the element is taken out by blowing out compressed air from a nozzle in a state of being spread by a jig having a projection. Can be easily taken out from between the comb teeth.
【0023】以下本発明の一実施形態について単一素体
内に四つの積層セラミックコンデンサを形成した多連型
積層セラミックコンデンサ用素子を用いて説明する。Hereinafter, an embodiment of the present invention will be described with reference to an element for a multi-layered multilayer ceramic capacitor in which four multilayer ceramic capacitors are formed in a single body.
【0024】(実施の形態1)先ず、公知の積層セラミ
ックコンデンサ製造方法を用い、図1のごとくセラミッ
ク誘電体層12と内部電極13を交互に複数層積層し、
内部電極13の一方の端部をセラミック誘電体層12を
挟んで一層おき交互に、対向する前面4と後面7に露出
するようにした積層セラミックコンデンサを、単一素子
内に四個形成した四連型積層セラミックコンデンサ用の
長方形状の焼結体1(素子の一例)を作成する。(Embodiment 1) First, a plurality of ceramic dielectric layers 12 and internal electrodes 13 are alternately laminated as shown in FIG.
Four monolithic ceramic capacitors in which one end of the internal electrode 13 is alternately exposed with the ceramic dielectric layer 12 interposed therebetween and exposed on the opposing front surface 4 and rear surface 7 are formed in a single element. A rectangular sintered body 1 (an example of an element) for a continuous multilayer ceramic capacitor is prepared.
【0025】次に、焼結体1の面取りを行い、図1に示
すように焼結体1内部に形成した内部電極13の端部全
体を完全に前,後面4,7に露出させる。Next, the sintered body 1 is chamfered, and the entire end of the internal electrode 13 formed inside the sintered body 1 is completely exposed to the front and rear surfaces 4, 7 as shown in FIG.
【0026】次いで、図2に示すように、整列板Aで焼
結体1を長手方向に整列させた後、焼結体1を吸着ピン
Bで吸着し90度回転させて、横向きとし、この状態
で、V状の突起Cで櫛歯21間を押し広げた保持板20
に、それぞれの一対の櫛歯21間に焼結体1を挿入す
る。この時焼結体1の内部電極13端部が露出した前,
後面4,7が水平になるよう挿入されている。続いて、
V状の突起Cを上方に移動させることで、焼結体1の側
面10,11を挟持する。Next, as shown in FIG. 2, after the sintered bodies 1 are aligned in the longitudinal direction by the alignment plate A, the sintered bodies 1 are sucked by the suction pins B and rotated 90 degrees to be turned sideways. In the state, the holding plate 20 in which the space between the comb teeth 21 is expanded by the V-shaped protrusion C
Then, the sintered body 1 is inserted between each pair of comb teeth 21. At this time, before the end of the internal electrode 13 of the sintered body 1 was exposed,
The rear faces 4, 7 are inserted so as to be horizontal. continue,
By moving the V-shaped protrusion C upward, the side surfaces 10 and 11 of the sintered body 1 are sandwiched.
【0027】その後、図3に示すように、溝23内に電
極材料24を付着させた円柱体22の表面に、溝23に
対応する切欠き部26を有する掻き取り板25を押し当
て、円柱体22の溝23内部に凸状の電極材料24を保
持させると共に、円柱体22表面に付着した余分な電極
材料24の掻き取りを行う。Thereafter, as shown in FIG. 3, a scraping plate 25 having a notch 26 corresponding to the groove 23 is pressed against the surface of the cylindrical body 22 having the electrode material 24 adhered in the groove 23. The convex electrode material 24 is held inside the groove 23 of the body 22, and excess electrode material 24 attached to the surface of the cylindrical body 22 is scraped off.
【0028】次に、第一のステーションで図4(a)に
示すように保持板20で挟持した焼結体1の前面4の上
部の稜5部に、電極材料24を付着させた円柱体22の
回転を停止した状態で当接し、その後円柱体22を時計
回りと反対方向に回転させ、上部稜5部分に廻り込み電
極14を塗布する。この時の塗布位置は焼結体1の前面
4に露出した内部電極13端部に合わせた垂直方向の上
部稜5部分とする。続いて、図4(b)に示すように、
円柱体22を焼結体1から離し垂直下部方向に移動し、
焼結体1側面4の下部稜6部分に円柱体22を停止した
状態で当接し、その後円柱体22を時計回り方向に回転
させ下部稜6部分に廻り込み電極15を塗布する。この
時の塗布位置は焼結体1の側面4に露出した内部電極1
3端部に合わせた垂直方向の下部稜6部分とする。続い
て更に、円柱体22を焼結体1から離し垂直上部方向に
移動し、図4(c)に示すように円柱体22の回転を停
止した状態で焼結体1の前面4に押圧し、焼結体1を櫛
歯21間で後方にスライドさせながら電極16を転写塗
布する。この時の塗布位置は焼結体1の前面4に露出し
た内部電極13端部位置と一致させると共に、上部稜5
部の廻り込み電極14と下部稜6部の廻り込み電極15
と接続するように塗布する。これにより保持板20に挟
持した焼結体1の上部稜5部分に廻り込み電極14、前
面4に電極16、下部稜6部分に廻り込み電極15が形
成され、内部電極13端部と電気的に接続されたコの字
型の四個の外部電極が形成される。Next, at the first station, as shown in FIG. 4A, a columnar body having an electrode material 24 adhered to the upper ridge 5 of the front surface 4 of the sintered body 1 sandwiched by the holding plate 20. The rotation of the cylinder 22 is stopped, and then the columnar body 22 is rotated in a direction opposite to the clockwise direction, and the electrode 14 is applied to the upper ridge 5. The application position at this time is a vertical upper ridge 5 portion corresponding to the end of the internal electrode 13 exposed on the front surface 4 of the sintered body 1. Subsequently, as shown in FIG.
The cylinder 22 is moved away from the sintered body 1 in the vertical lower direction,
The cylindrical body 22 is brought into contact with the lower ridge 6 of the side surface 4 of the sintered body 1 in a stopped state, and then the cylindrical body 22 is rotated clockwise to wrap around the lower ridge 6 to apply the electrode 15. The application position at this time is the internal electrode 1 exposed on the side surface 4 of the sintered body 1.
The vertical lower ridge 6 is aligned with the three ends. Subsequently, the columnar body 22 is further moved vertically upward away from the sintered body 1 and pressed against the front surface 4 of the sintered body 1 while the rotation of the cylindrical body 22 is stopped as shown in FIG. Then, the electrode 16 is transferred and applied while the sintered body 1 is slid backward between the comb teeth 21. The application position at this time is matched with the end position of the internal electrode 13 exposed on the front surface 4 of the sintered body 1 and the upper ridge 5
Electrode 14 around the lower edge and the electrode 15 around the lower ridge 6
Apply to connect. As a result, a wraparound electrode 14 is formed on the upper ridge 5 portion of the sintered body 1 sandwiched by the holding plate 20, an electrode 16 is formed on the front surface 4, and a wraparound electrode 15 is formed on the lower ridge 6 portion. Are formed, four U-shaped external electrodes are formed.
【0029】次いで、保持板20を第二のステーション
に移動し、第一のステーションと同様に溝23部に電極
材料24を保持した円柱体22を、焼結体1の後面7の
上部稜8部分に廻り込み電極17、下部稜9部分に廻り
込み電極18、後面7に電極19を形成し、内部電極1
3端部と電気的に接続されたコの字型の四個の外部電極
を形成した後、焼結体1を保持板20と共に乾燥する。Next, the holding plate 20 is moved to the second station, and the columnar body 22 holding the electrode material 24 in the groove 23 is placed on the upper ridge 8 of the rear surface 7 of the sintered body 1 as in the first station. A wraparound electrode 17 is formed on the lower electrode 9, a wraparound electrode 18 is formed on the lower ridge 9, and an electrode 19 is formed on the rear surface 7.
After forming four U-shaped external electrodes electrically connected to the three ends, the sintered body 1 is dried together with the holding plate 20.
【0030】次に、保持体20の上部より、V状の突起
Cを下降させて櫛歯21間に挿入し、保持体20の後方
から圧縮空気を吹きつけ、焼結体1の取り出しを行う。Next, the V-shaped projection C is lowered from above the holder 20 and inserted between the comb teeth 21, and compressed air is blown from behind the holder 20 to take out the sintered body 1. .
【0031】次いで、焼結体1を所定温度で外部電極焼
付けを行い四連型積層セラミックコンデンサを完成し
た。尚、焼結体1の前,後面4,7に露出した各内部電
極13端部の隣合う間隔は0.8mmの1608タイプを
用いた。Next, the sintered body 1 was baked at a predetermined temperature to form an external electrode, thereby completing a quadruple-type multilayer ceramic capacitor. A 1608 type of 0.8 mm was used as the interval between adjacent ends of the internal electrodes 13 exposed on the front and rear surfaces 4 and 7 of the sintered body 1.
【0032】また円柱体22の材質は直径が10mmの焼
入鋼を用い、焼結体1の前,後面4,7に押圧した際、
この円柱体22の表面が、焼結体1の前,後面4,7に
ほぼ直線的に接するように焼結体1より十分に大きくし
ている。またこの円柱体22の表面に形成した溝23の
幅は0.25mm、深さは0.2mmでその底部は円弧状に
加工を施している。さらに溝23の間隔は0.8mmで、
焼結体1に対し四本設けており、この溝23部以外の円
柱体22表面は鏡面加工を施している。なお溝23内を
円弧状にしたのは焼結体1に円柱体22を当接した際
に、溝23内に保持した電極材料24が溝23から剥が
れ易くするためである。The material of the cylindrical body 22 is hardened steel having a diameter of 10 mm, and when pressed against the front and rear surfaces 4, 7 of the sintered body 1,
The surface of the cylindrical body 22 is sufficiently larger than the sintered body 1 so that the front surface and the rear surfaces 4 and 7 of the sintered body 1 are almost in contact with each other in a straight line. The width of the groove 23 formed on the surface of the cylindrical body 22 is 0.25 mm, the depth is 0.2 mm, and the bottom is machined in an arc shape. Further, the interval between the grooves 23 is 0.8 mm,
Four sintered bodies 1 are provided, and the surface of the cylindrical body 22 other than the groove 23 is mirror-finished. The reason why the inside of the groove 23 is formed in an arc shape is that the electrode material 24 held in the groove 23 is easily peeled off from the groove 23 when the cylindrical body 22 comes into contact with the sintered body 1.
【0033】また更に掻き取り板25は厚さ0.2mmの
バネ鋼を用い、円柱体22の溝23に対応する位置に幅
0.2mmの円弧状の切欠き部26を設け、円柱体22の
表面に圧接するようにして取り付けている。掻き取り板
25の切欠き部26を円弧状にしたのは、円柱体22の
溝23に保持させた電極材料24を焼結体1に当接した
際に、電極材料24の塗布面積が必要以上に広がらない
ように配慮したものである。Further, the scraping plate 25 is made of spring steel having a thickness of 0.2 mm, and an arc-shaped notch 26 having a width of 0.2 mm is provided at a position corresponding to the groove 23 of the cylindrical body 22. It is attached in such a way as to be pressed against the surface. The notch 26 of the scraping plate 25 is formed in an arc shape because the electrode material 24 held in the groove 23 of the cylindrical body 22 is required to have an application area of the electrode material 24 when the electrode material 24 contacts the sintered body 1. Consideration has been given so that it will not spread further.
【0034】円柱体22に電極材料24を塗着保持する
方法は、図5に示すように電極材料24を収納した槽2
4aの下部コーナー位置で、回転自在に取り付けた円柱
体22を時計回りと逆方向に回転させることによりその
表面に電極材料24を塗着させ側壁27で溝23以外に
付着した電極材料24を取り除く。続いて、円柱体22
の表面に圧接させるように側壁27の表面に取り付けて
いる掻き取り板25で、溝23部以外の電極材料24を
完全に掻き取ると共に、円柱体22の溝23と対応し溝
23の幅より狭い切欠き部26で溝23部に保持した電
極材料24の表面を円弧状に成形する。これによって溝
23内部に電極材料24を強く押しつけ、溝23部に適
量の電極材料24を保持させることができる。また槽2
4a内に円柱体22の一部表面を常時浸しているのは、
円柱体22の表面に常にフレッシュな電極材料24を供
給するためである。また更に電極材料24槽のもう一方
のコーナー部に設けたローラー28は、これを回転する
ことで電極材料24を常時攪拌し、電極材料24の粘度
を一定に保つためである。As shown in FIG. 5, the electrode material 24 is applied to and held on the cylindrical body 22 by a tank 2 containing the electrode material 24.
At the lower corner position of 4a, the rotatably mounted cylindrical body 22 is rotated in the opposite direction to the clockwise direction so that the electrode material 24 is applied to the surface thereof, and the electrode material 24 attached to portions other than the grooves 23 on the side walls 27 is removed. . Subsequently, the cylindrical body 22
The scraping plate 25 attached to the surface of the side wall 27 so as to be in pressure contact with the surface of the cylindrical member 22 completely scrapes off the electrode material 24 except for the groove 23, and corresponds to the groove 23 of the columnar body 22. The surface of the electrode material 24 held in the groove 23 by the narrow notch 26 is formed into an arc shape. As a result, the electrode material 24 is strongly pressed into the groove 23, and an appropriate amount of the electrode material 24 can be held in the groove 23. Tank 2
The reason why a part of the surface of the cylindrical body 22 is always immersed in 4a is as follows.
This is for always supplying the fresh electrode material 24 to the surface of the cylindrical body 22. Further, the roller 28 provided at the other corner portion of the electrode material 24 tank rotates the roller 28 to constantly stir the electrode material 24 to keep the viscosity of the electrode material 24 constant.
【0035】前記一連の作業工程で、焼結体1の前,後
面4,7に露出した内部電極12端部位置に合わせ、稜
5,6,8,9及び前,後面4,7に精度よく、適量の
電極材料24を塗布することが可能となる。尚、電極材
料24の粘度は形成する電極幅に適した粘度に予め調整
する必要があることは言うまでもない。In the above series of operation steps, the ridges 5, 6, 8, 9 and the front and rear surfaces 4, 7 are precisely aligned with the end positions of the internal electrodes 12 exposed on the front and rear surfaces 4, 7 of the sintered body 1. It is possible to apply an appropriate amount of the electrode material 24. Needless to say, the viscosity of the electrode material 24 must be adjusted in advance to a viscosity suitable for the width of the electrode to be formed.
【0036】本発明の方法で四連型積層セラミックコン
デンサは、焼結体1の前,後面4,7に露出した内部電
極13端部と電気的に接続した四本の外部電極を、隣合
う電極間同士で短絡する事なく、狭い間隔で精度良く形
成することができる。尚、稜5,6,8,9部に挟まれ
た面2,3に形成した廻り込み電極14,15,17,
18は四連型積層セラミックコンデンサをプリント基板
(図示せず)等にハンダ実装する際のハンダ付け性を確
保するために設けたものである。According to the method of the present invention, in the quadruple-type multilayer ceramic capacitor, four external electrodes which are electrically connected to the ends of the internal electrodes 13 exposed on the front and rear surfaces 4 and 7 of the sintered body 1 are adjacent to each other. The electrodes can be formed accurately at narrow intervals without short-circuiting between the electrodes. The wraparound electrodes 14, 15, 17, formed on the surfaces 2, 3 sandwiched between the ridges 5, 6, 8, and 9 portions,
Numeral 18 is provided to ensure solderability when soldering the quadruple-type multilayer ceramic capacitor to a printed board (not shown) or the like.
【0037】[0037]
【発明の効果】以上説明した如く、本発明によれば多連
型電子部品素子内部に形成した内部電極の端部が露出し
た前,後面に、これと電気的に接続する複数条の外部電
極を、隣合う電極間同士で短絡する事なく、狭い間隔で
精度良く形成することができる。As described above, according to the present invention, a plurality of external electrodes electrically connected to the ends of the internal electrodes formed inside the multiple-type electronic component element are exposed before and after the ends of the internal electrodes are exposed. Can be accurately formed at a narrow interval without short-circuiting between adjacent electrodes.
【図1】本発明の一実施形態の四連型積層セラミックコ
ンデンサ焼結体の斜視図FIG. 1 is a perspective view of a quadruple-type multilayer ceramic capacitor sintered body according to an embodiment of the present invention.
【図2】同、四連型積層セラミックコンデンサ焼結体を
整列し、保持板に挟持する状態を示す斜視図FIG. 2 is a perspective view showing a state in which the sintered body of the quadruple-type multilayer ceramic capacitor is aligned and sandwiched between holding plates.
【図3】(a)同、円柱体と掻き取り板の関係を示す正
面図 (b)同、円柱体の溝に電極材料を保持した状態を示す
正面図FIG. 3A is a front view showing a relationship between a cylindrical body and a scraping plate. FIG. 3B is a front view showing a state where an electrode material is held in a groove of the cylindrical body.
【図4】(a)焼結体上部稜部に廻り込み電極を塗布す
る状態を示す図 (b)焼結体下部稜部に廻り込み電極を塗布する状態を
示す図 (c)焼結体側面に電極を塗布する状態を示す図FIG. 4 (a) is a view showing a state in which a wraparound electrode is applied to an upper ridge of a sintered body; and (b) is a view showing a state in which a wraparound electrode is applied to a lower ridge of the sintered body. Diagram showing the state of applying electrodes on the side
【図5】同、塗布体全体位置関係を示す平面図FIG. 5 is a plan view showing the overall positional relationship of the application body.
【図6】(a)従来方法の電極塗布方法で焼結体上面に
廻り込み電極を塗布した状態の斜視図 (b)同焼結体下面に廻り込み電極を塗布した状態の斜
視図 (c)同焼結体側面に外部電極を塗布した状態の斜視図FIG. 6A is a perspective view of a state in which a wraparound electrode is applied to the upper surface of a sintered body by a conventional electrode coating method. FIG. 6B is a perspective view of a state in which a wraparound electrode is applied to the lower surface of the sintered body. ) Perspective view of the state where an external electrode is applied to the side surface of the sintered body
1 焼結体 2 上面 3 下面 4 前面 5,8 上部稜 6,9 下部稜 7 後面 10,11 側面 12 誘電体セラミック層 13 内部電極 14,17 廻り込み電極 15,18 廻り込み電極 16,19 電極 20 保持板 21 櫛歯 22 円柱体 23 溝 24 電極材料 25 掻き取り板 26 切欠き部 27 電極材料槽側壁 28 ローラー DESCRIPTION OF SYMBOLS 1 Sintered body 2 Upper surface 3 Lower surface 4 Front surface 5, 8 Upper ridge 6, 9 Lower ridge 7 Back surface 10, 11 Side surface 12 Dielectric ceramic layer 13 Internal electrode 14, 17, Surrounding electrode 15, 18, Surrounding electrode 16, 19 Electrode Reference Signs List 20 holding plate 21 comb teeth 22 cylindrical body 23 groove 24 electrode material 25 scraping plate 26 notch 27 electrode material tank side wall 28 roller
───────────────────────────────────────────────────── フロントページの続き (72)発明者 浅田 育孝 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 内山 秀雄 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 5E001 AB03 AC04 AD04 AF02 AF03 AF06 AH01 AJ03 5E082 AA01 AB03 CC20 EE04 EE23 EE35 FF05 FG06 FG26 FG46 GG10 GG28 JJ03 JJ06 JJ23 MM12 MM13 MM17 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Ikutaka Asada 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. Terms (Reference) 5E001 AB03 AC04 AD04 AF02 AF03 AF06 AH01 AJ03 5E082 AA01 AB03 CC20 EE04 EE23 EE35 FF05 FG06 FG26 FG46 GG10 GG28 JJ03 JJ06 JJ23 MM12 MM13 MM17
Claims (15)
保持体で挟持し、保持体で挟持した素子の前面の上下一
方の稜部に塗布体を当接し電極を塗布する第一工程と、
次に他方の稜部に前記塗布体を当接し電極を塗布する第
二の工程と、次いで第一工程、第二工程で塗布した電極
間を接続するように、前面に前記塗布体を押圧し電極を
塗布する第三工程を経た後、続いて前記前面と対向する
後面に、前記第一から第三工程を繰返し電極を塗布する
ことを特徴とする電子部品の製造方法。A first step of sandwiching a pair of opposing side surfaces of a rectangular parallelepiped element with a holder, and applying an electrode by applying an application body to one of upper and lower ridges on the front surface of the element sandwiched by the holder;
Next, the second step of applying the electrode by abutting the applied body on the other ridge, and then pressing the applied body to the front surface, so as to connect the electrodes applied in the first step and the second step. A method of manufacturing an electronic component, comprising: after a third step of applying an electrode, subsequently repeating the first to third steps to apply an electrode to a rear surface facing the front surface.
掻き取り板とによりなり、前記円柱体はその外周表面に
所定間隔で複数条の溝を有し、掻き取り板は前記溝と対
向する位置に切欠き部を有することを特徴とする請求項
1に記載の電子部品の製造方法。2. The coating body comprises a cylindrical body and a scraping plate provided in parallel with the cylindrical body. The cylindrical body has a plurality of grooves at predetermined intervals on an outer peripheral surface thereof, and the scraping plate is provided with the grooves. The method for manufacturing an electronic component according to claim 1, further comprising a notch at a position facing the electronic component.
工するとともに、溝と溝との間の表面を鏡面加工したこ
とを特徴とする請求項1または請求項2に記載の電子部
品の製造方法。3. The electronic component according to claim 1, wherein the bottom of the groove formed in the cylindrical body is processed into an arc shape, and a surface between the grooves is mirror-finished. Manufacturing method.
特徴とする請求項1から請求項3のいずれか一つに記載
の電子部品の製造方法。4. The method for manufacturing an electronic component according to claim 1, wherein the cylindrical body is made of a hardened steel material.
工するとともに、切欠き部の幅を円柱体の溝の幅より狭
くしたことを特徴とする請求項2〜請求項4のいずれか
一つに記載の電子部品の製造方法。5. The scraper according to claim 2, wherein the bottom of the cutout portion is machined into an arc shape, and the width of the cutout portion is smaller than the width of the groove of the cylindrical body. A method for manufacturing an electronic component according to any one of the preceding claims.
ことを特徴とする請求項2〜請求項5のいずれか一つに
記載の電子部品の製造方法。6. The method for manufacturing an electronic component according to claim 2, wherein the scraping plate is formed of an elastic thin plate.
浸し、回転させながらその表面に電極材料を塗着させ、
これを掻き取り板で掻き取り円柱体の表面に形成した溝
部のみに電極材料を保持させた後、円柱体より素子に電
極材料を塗布することを特徴とする請求項1または請求
項2に記載の電子部品の製造方法。7. A part of the surface of the cylindrical body is always immersed in an electrode material tank, and the surface is coated with an electrode material while rotating.
The electrode material is applied to the element from the cylindrical body after the electrode material is held only in the groove formed on the surface of the cylindrical body by scraping the electrode material with the scraping plate. Electronic component manufacturing method.
布する際、円柱体を停止した状態で稜部に当接した後、
上部稜部の場合は時計と逆回りに、下部稜部の場合は時
計回りに円柱体を回転させ円柱体の溝部に保持した電極
材料を素子に塗布することを特徴とする請求項1に記載
の電子部品の製造方法。8. When a cylindrical body is brought into contact with the ridge of the element and the electrode is applied, after the column is brought into contact with the ridge in a stopped state,
2. The device according to claim 1, wherein the electrode material held in the groove of the cylindrical body is applied to the element by rotating the cylindrical body clockwise in the case of the upper ridge and clockwise in the case of the lower ridge. Electronic component manufacturing method.
電極を塗布する際、円柱体を停止した状態で円柱体を押
圧し、円柱体の溝部に保持した電極材料を素子に塗布す
ることを特徴とする請求項1または請求項8に記載の電
子部品の製造方法。9. A method of applying an electrode by pressing a cylindrical body on the front or rear surface of the element and applying the electrode material held in the groove of the cylindrical body to the element by pressing the cylindrical body while the cylindrical body is stopped. The method for manufacturing an electronic component according to claim 1, wherein:
ら第三工程で、円柱体を素子の上下方向に移動させるこ
とを特徴とする請求項1〜請求項9のいずれか一つに記
載の電子部品の製造方法。10. The device according to claim 1, wherein in the first to third steps of applying an electrode material to the device, the column is moved in the vertical direction of the device. Electronic component manufacturing method.
を特徴とする請求項1〜請求項10のいずれか一つに記
載の電子部品の製造方法。11. The method for manufacturing an electronic component according to claim 1, wherein an element subjected to chamfering is used.
を特徴とする請求項1〜請求項11のいずれか一つに記
載の電子部品の製造方法。12. The method for manufacturing an electronic component according to claim 1, wherein the element is a multiple-type electronic component element.
間に素子をそれぞれ挟持した状態で円柱体と当接、また
は押圧し電極を塗布することを特徴とする請求項1に記
載の電子部品の製造方法。13. The holding body according to claim 1, wherein the holding body has a comb shape, and the electrodes are applied by abutting or pressing the cylindrical body in a state where the element is sandwiched between a pair of comb teeth. Manufacturing method of electronic components.
列し搬送した後、保持体の櫛歯間の上部をV状突起を有
する治具で押し広げた隙間に、素子を90度回転させて
挿入挟持することを特徴とする請求項13に記載の電子
部品の製造方法。14. After the elements are preliminarily aligned and conveyed on an aligning and conveying plate in the longitudinal direction, the elements are rotated 90 degrees in a gap in which the upper portion between the comb teeth of the holding body is spread by a jig having a V-shaped projection. The method for manufacturing an electronic component according to claim 13, wherein the electronic component is inserted and clamped.
保持体の櫛歯間を上部よりV状突起を有する治具で押し
広げた状態で、ノズルより圧縮空気を素子に吹きつけ
て、保持体から素子を取り出すことを特徴とする請求項
13、または請求項14に記載の電子部品の製造方法。15. An electrode material is transferred and coated on the element, dried and dried.
14. The device according to claim 13, wherein compressed air is blown from a nozzle to the element while the space between the comb teeth of the holding body is pushed out from above by a jig having a V-shaped projection, and the element is taken out of the holding body. A method for manufacturing an electronic component according to claim 14.
Priority Applications (1)
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JP31290798A JP3503501B2 (en) | 1998-11-04 | 1998-11-04 | Manufacturing method of electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31290798A JP3503501B2 (en) | 1998-11-04 | 1998-11-04 | Manufacturing method of electronic components |
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Publication Number | Publication Date |
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JP2000138145A true JP2000138145A (en) | 2000-05-16 |
JP3503501B2 JP3503501B2 (en) | 2004-03-08 |
Family
ID=18034901
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JP31290798A Expired - Lifetime JP3503501B2 (en) | 1998-11-04 | 1998-11-04 | Manufacturing method of electronic components |
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JP (1) | JP3503501B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003188058A (en) * | 2001-12-19 | 2003-07-04 | Matsushita Electric Ind Co Ltd | Method for forming electrode of electronic part |
US6771485B2 (en) | 2002-03-07 | 2004-08-03 | Tdk Corporation | Ceramic electronic device, paste coating method, and paste coating apparatus |
JP2005340371A (en) * | 2004-05-25 | 2005-12-08 | Murata Mfg Co Ltd | Laminated ceramic electronic component and manufacturing method thereof |
JP2008147211A (en) * | 2006-12-06 | 2008-06-26 | Matsushita Electric Ind Co Ltd | Process for manufacturing laminated ceramic electronic component |
-
1998
- 1998-11-04 JP JP31290798A patent/JP3503501B2/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003188058A (en) * | 2001-12-19 | 2003-07-04 | Matsushita Electric Ind Co Ltd | Method for forming electrode of electronic part |
US6771485B2 (en) | 2002-03-07 | 2004-08-03 | Tdk Corporation | Ceramic electronic device, paste coating method, and paste coating apparatus |
US7115302B2 (en) | 2002-03-07 | 2006-10-03 | Tdk Corporation | Paste coating method |
US7318868B2 (en) | 2002-03-07 | 2008-01-15 | Tdk Corporation | Paste coating method |
JP2005340371A (en) * | 2004-05-25 | 2005-12-08 | Murata Mfg Co Ltd | Laminated ceramic electronic component and manufacturing method thereof |
JP4604553B2 (en) * | 2004-05-25 | 2011-01-05 | 株式会社村田製作所 | Multilayer ceramic electronic component and manufacturing method thereof |
JP2008147211A (en) * | 2006-12-06 | 2008-06-26 | Matsushita Electric Ind Co Ltd | Process for manufacturing laminated ceramic electronic component |
Also Published As
Publication number | Publication date |
---|---|
JP3503501B2 (en) | 2004-03-08 |
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