JP2002270477A - Method for manufacturing ceramic electronic component, method for forming corrugated section, and ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic electronic component for simplifying an apparatus and process for forming an electrode film to be a terminal electrode by using conductive paste, and those ceramic electronic components having the terminal electrode including less bubble in the terminal electrode. SOLUTION: The method for manufacturing a ceramic electronic component comprises: a first process for forming a corrugated section including convex and/or concave section on the surface; a second process for forming a first electrode film to be the terminal electrode, by mutually contacting a tapered section consisting of top of the convex section, or convex and/or concave section; to the end face of the ceramic raw material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component used for various electronic circuits, a method for forming a corrugated portion, and a ceramic electronic component.

[0002]

2. Description of the Related Art Conventionally, in the case of manufacturing a ceramic electronic component including an electronic component represented by, for example, a multilayer ceramic capacitor, a multilayer inductor, a resistor, and the like, a method of forming terminal electrodes thereof will be described below, for example. It is formed by a suitable method.

[0003] First, as shown in FIG. 13 (a), a conductive paste is applied to a film 2 having a smooth surface, and this is formed into a flat forming portion 13 having a smooth surface with a constant thickness by a doctor blade or the like. Form. Thereafter, the ceramic body 1 is placed on the plane forming portion 13, and the ceramic body 1 is pushed (pulled) down in the direction of gravity D1, and
Alternatively, the plane forming part 13 is pushed (pulled) up in the U1 direction opposite to the gravity, or simultaneously,
An electrode film is formed on the end of the ceramic body 1 and then hardened or baked or fired simultaneously with the ceramic body to obtain a ceramic electronic component having terminal electrodes.

[0004]

However, in the above-described method, as shown in FIG. 13 (b), when the end face of the ceramic body 1 comes into contact with the plane forming portion 13, the end face outer edge 1b , 1c come into contact with flat surface forming portion 13 prior to end surface center portion 1a, and the conductive paste starts to wet, thereby forming a remaining wet portion including outside air between end surface center portion 1a and flat surface forming portion 13. There was sometimes. As shown in FIG. 13C, the outside air taken into the remaining wet portion further pushes (pulls) down the end face of the ceramic body 1 in the D1 direction, or pushes the flat surface forming portion 13 further in the U1 direction ( When the ceramic body 1 is immersed to the extent that the ceramic body 1 comes into contact with the film 2 by pulling or raising them at the same time, the ceramic body 1 is extruded sideways to form bubbles 5,
When separating the ceramic body 1 and the plane forming portion 13,
It flows and is pulled back to the vicinity of the end face of the ceramic body 1 as shown in FIG.
3 are included as bubbles 5. When the electrode film 23 containing such bubbles is baked (including simultaneous firing with the ceramic body), a depression portion is formed in the terminal electrode obtained by sintering (firing), or the bonding with the internal electrode is hindered. In addition, there is a possibility that problems such as a decrease in electrical characteristics of the ceramic electronic component and a decrease in moisture resistance may occur.

[0005] To solve such a problem,
As disclosed in Japanese Patent Application Laid-Open No. 7-201687, after a ceramic body fixed to a holder is brought into contact with a plane forming part in an inclined state, an end face of the ceramic body is parallel to the surface of the plane forming part. There is a method of forming a terminal electrode in such a way that the pressure is adjusted so that However, this method has problems that the apparatus becomes complicated and the number of chip-type electronic components that can be applied in one operation is limited.

Further, as disclosed in Japanese Patent No. 2,847,980, bubbles formed in a terminal electrode are formed on a surface plate (film) on the basis of cavitation generated when a plane forming portion and a ceramic body are separated from each other. There is a method of performing uneven processing. However, this method cannot solve the problem that air bubbles are included in the terminal electrode which is painted from the outer peripheral portion of the end face as described above.

Further, as disclosed in Japanese Patent Application Laid-Open No. 8-69950, air bubbles contained in the terminal electrode are pushed up before the electrode film is solidified, and the air bubbles are given by applying ultrasonic vibration. Although there is a method of removing, there is a problem that this method not only complicates the apparatus but also increases the number of steps, which is not suitable for mass production.

In view of the above problems, the present invention simplifies an apparatus and a process in a step of forming an electrode film to be a terminal electrode using a conductive paste, and reduces the inclusion of bubbles in the terminal electrode. It is an object of the present invention to provide a method of manufacturing a ceramic electronic component having the terminal electrode described above, and to provide such a ceramic electronic component.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and a method of manufacturing a ceramic electronic component in which a terminal electrode is formed so that air bubbles are not included in the terminal electrode, and a manufacturing process of the terminal electrode It is an object of the present invention to provide a method of forming a wavy forming portion such that no bubbles are included therein, and such a ceramic electronic component.

[0010]

In order to achieve the above object, a first method of manufacturing a ceramic electronic component according to the present invention comprises:
A first step of using a conductive paste to form a wavy forming portion having a convex portion and / or concave portion on the surface, an apex portion of the convex portion or an inclined portion formed by the convex portion and / or concave portion, and a ceramic element And a second step of forming a first electrode film to be a terminal electrode on the end face of the ceramic body by bringing the end faces of the body into contact with each other.

Further, the second aspect of the ceramic electronic component of the present invention is as follows.
The manufacturing method of (1) includes, using a conductive paste, a first step of forming a plane forming portion on a plane inclined with respect to a plane perpendicular to the direction of gravity, a flat forming section, and an end face of the ceramic body. A second step of forming a first electrode film to be a terminal electrode on the end face of the ceramic body by bringing the electrodes into contact with each other in a direction of gravity or in a direction opposite to gravity.

The third aspect of the ceramic electronic component of the present invention is as follows.
Is characterized by further comprising, after the second step in the above-described second manufacturing method, a post-step of operating the inclined plane forming section to be a plane perpendicular to the direction of gravity.

A first method of forming a wavy forming portion of the present invention is as follows.
After applying the conductive paste, a corrugated portion having a convex portion and / or a concave portion on the surface is formed using a comb-shaped squeegee.

Further, the second aspect of the present invention is a method of forming a wavy part, wherein a conductive paste is poured out to form a wavy part having a convex part and / or a concave part on the surface.

A third method of forming a wavy forming portion of the present invention is a method of forming a wavy forming portion using a squeegee after applying a conductive paste, wherein the wavy forming portion is formed in a direction perpendicular to the wavy forming portion. A squeegee vibrating at regular intervals is used to form a wavy forming portion having a convex portion and / or a concave portion on the surface.

In a fourth method of forming a wavy forming portion according to the present invention, after forming a planar forming portion using a conductive paste, a part of the lower portion of the planar forming portion is pushed up and / or lowered. It is characterized in that a wavy forming portion having a convex portion and / or a concave portion on the surface is formed.

According to a fifth method of forming a wavy forming portion of the present invention, a planar forming portion is formed using a conductive paste on a pair of closed comb-tooth plates, and then the comb-tooth plates are separated from each other. In such a manner that the comb-teeth are opened by sliding in a direction in which the comb-teeth are formed, and the conductive paste forming the planar forming part is caused to flow into the gap between the comb-teeth to form a wavy forming part having a convex part and / or a concave part on the surface. I do.

According to a sixth aspect of the present invention, there is provided a method of forming a wavy forming portion, comprising: forming a planar forming portion on a pair of open comb-shaped plates by using a conductive paste; The method is characterized in that the comb teeth are closed by sliding in the inserting direction, the conductive paste that has flowed into the gap between the comb teeth is pushed up, and a wavy forming section having a convex portion and / or a concave portion on the surface is formed.

According to a seventh aspect of the present invention, in the method of forming a wavy forming portion, a flat forming portion is formed on a plate having a through hole using a conductive paste, and then the conductive paste is extruded from a lower portion of the plate. And a wavy forming portion having a convex portion and / or a concave portion on the surface.

An eighth method of forming a wavy forming portion according to the present invention is directed to a roll for rotating a back surface of a flexible plate having a plurality of protrusions arranged on a front surface at predetermined intervals. After forming a flat portion using a conductive paste on the surface of a curved plate using a conductive paste, the back surface side of the plate on which the flat portion is formed is supported so as to be a straight plane. Thus, the conductive paste filled in the gaps between the plurality of protrusions is extruded onto the surface of the planar forming portion to form a wavy forming portion having a convex portion and / or a concave portion on the surface.

Further, the fourth aspect of the ceramic electronic component of the present invention.
Is the first method for manufacturing a ceramic electronic component described above, wherein the corrugated portion formed in the first step is formed by any one of the first to eighth corrugated portion forming methods described above. It is characterized by being performed.

Further, the fifth aspect of the ceramic electronic component of the present invention.
The method comprises: a first step of extruding a conductive paste from a lower portion of a plate having a through hole to form a paste reservoir on the plate; an apex portion of the paste reservoir or an inclined portion formed by the paste reservoir; A second step of forming a first electrode film to be a terminal electrode on the end face of the ceramic body by bringing the end faces of the body into contact with each other.

Further, the sixth aspect of the ceramic electronic component of the present invention.
Is a third step of forming a plane forming portion using a conductive paste after the second step in the above-described first to fifth manufacturing methods, a ceramic including the plane forming portion, and the first electrode film. And a fourth step of forming the second electrode film on the first electrode film by bringing the element body into contact with each other.

A ceramic electronic component according to the present invention is characterized by being obtained by the above-described method for manufacturing a ceramic electronic component.

[0025]

[Embodiment 1] The first embodiment according to the present invention.
The embodiment will be described in detail with reference to FIG.
The first embodiment specifically shows a method of forming an electrode film on a ceramic body.

First, as shown in FIG. 1 (a), a wavy forming portion 3 having a ceramic body 1 and a film 2 provided with a conductive paste on the surface and having a convex portion 3a is prepared.

Next, the ceramic body 1 is moved to the wavy forming section 3.
And pushes (pulls) down the ceramic body 1 in the direction of gravity D1 or pushes (pulls) the wavy forming portion 3 in the direction U1 opposite to the direction of gravity, or These operations are performed simultaneously, and the ceramic body 1 and the corrugated portion 3 are brought into contact with each other as shown in FIG.
At this stage, the projections 3a of the corrugated portion 3 start to come into contact with the vicinity of the center 1a of the end face of the ceramic body 1, so that no bubbles enter the corrugated portion 3.

Next, by further pushing (pulling) down the ceramic body 1 or further pushing (pulling) up the wavy forming portion 3, or by performing these simultaneously, the conductive paste constituting the wavy forming portion 3 becomes Following the end surface center 1a of the ceramic body 1, the end surface peripheral portions 1b and 1c are wetted. Also at this stage, bubbles are generated in the wavy forming portion 3.
It does not penetrate inside.

Next, the ceramic body 1 is further pushed (pulled) down, or the wavy forming part 3 is further pushed (pulled) up, or by simultaneously performing these, as shown in FIG. The conductive paste forming the portion 3 is located at the side surface wetting position 1 of the ceramic body 1.
d, 1d.

Next, the ceramic body 1 is pulled (pushed) up in the direction opposite to D1, or the wavy forming portion 3 is pulled (pushed) down in the direction opposite to U1, or these operations are performed simultaneously. An electrode film is formed in the vicinity of the end face of the substrate, and the electrode film is baked to form a terminal electrode. The terminal electrodes may be formed by simultaneous firing together with the ceramic body. The same applies to all the following embodiments.

[Second Embodiment] A second embodiment according to the present invention will be described in detail with reference to FIG. The second embodiment also specifically shows a method for forming an electrode film on a ceramic body.

First, as shown in FIG. 2 (a), a wavy forming portion 3 having a ceramic body 1 and a film 2 provided with a conductive paste on the surface and having convex portions or concave portions on the surface.
Prepare Note that such a wavy forming portion 3 includes an inclined portion 3b between the convex portion and the concave portion.

Next, the ceramic body 1 is moved
And pushes (pulls) down the ceramic body 1 in the direction of gravity D1 or pushes (pulls) the wavy forming portion 3 in the direction U1 opposite to the direction of gravity, or These operations are performed simultaneously to bring the ceramic body 1 into contact with the inclined portion 3b of the corrugated portion 3, as shown in FIG. At this stage, since the inclined portion 3b of the corrugated portion 3 starts to come into contact with the vicinity of the peripheral portion 1b of the end surface of the ceramic body 1, bubbles do not enter the corrugated portion 3.

Then, the ceramic paste 1 is further pushed (pulled) down, or the wavy coating film 3 is further pushed (pulled) up or at the same time, so that the conductive paste constituting the wavy forming portion 3 becomes After the end surface peripheral portion 1b and the end surface central portion 1a of the ceramic body 1, the wettability proceeds to the end surface peripheral portion 1c. Even at this stage, the bubbles do not enter the wavy forming portion 3.

Next, the ceramic body 1 is further pushed (pulled) down, or the corrugated coating film 3 is further pushed (pulled) up or simultaneously, thereby forming a corrugated film as shown in FIG. 2 (c). The conductive paste forming the portion 3 is located at the side surface wetting position 1 of the ceramic body 1.
e, 1f.

Next, the ceramic body 1 is pulled (pushed) up in the direction opposite to D1, or the wavy forming portion 3 is pulled (pushed) down in the direction opposite to U1, or these operations are performed simultaneously. An electrode film is formed in the vicinity of the end face, and the electrode film is baked to form a terminal electrode.

Third Embodiment A third embodiment according to the present invention will be described in detail with reference to FIG. The third embodiment also specifically shows a method of forming an electrode film on a ceramic body.

First, as shown in FIG. 3A, a ceramic substrate 1 and a plane forming portion 13 in which a conductive paste is provided on a film 2 are prepared. In addition, the plane forming part 1
3 is formed on a plane inclined with respect to a plane perpendicular to the direction of gravity. The method of obtaining the plane forming portion 13 formed on the inclined plane is not particularly limited. For example, an inclined plane is prepared in advance, the film 2 is prepared thereon, and the plane is formed on the film 2. The portion 13 may be formed, and the plane forming portion 13 is formed on the film 2 prepared in a plane perpendicular to the direction of gravity, and then one end of the film 2 is pushed (pulled) up in the U2 direction, or 2 may be pushed (pulled) down in the direction D2.

Next, the ceramic body 1 is placed in the plane forming portion 1.
3 and the ceramic body 1 is placed in the direction of gravity D1.
3 (b), or pushes (pulls) down or pushes up the plane forming portion 13 in the U1 direction opposite to the direction of gravity, or simultaneously performs these operations, as shown in FIG. 3 (b). 1 and the plane forming portion 13 are brought into contact with each other. At this stage, air bubbles do not enter the flat surface forming portion 13 because the flat surface forming portion 13 starts to come into contact with the vicinity of the end surface peripheral portion 1b of the ceramic body 1.

Next, by further pushing (pulling) down the ceramic body 1 or further pushing (pulling) up the plane forming portion 13, or by simultaneously performing these operations, the conductive paste constituting the plane forming portion 13 becomes After the end surface peripheral portion 1b and the end surface central portion 1a of the ceramic body 1, the wettability proceeds to the end surface peripheral portion 1c. At this stage,
Bubbles do not enter the planar forming portion 13.

Next, the ceramic body 1 is further pushed (pulled) down, or the plane forming section 13 is further pushed (pulled) up, or these operations are performed at the same time, thereby forming a plane as shown in FIG. The conductive paste forming the portion 13 reaches the side surface wet-up positions 1 g and 1 h of the ceramic body 1.

Next, the ceramic body 1 is pulled (pushed) up in the direction opposite to D1, or the plane forming portion 13 is pulled (pushed) down in the direction opposite to U1, or these operations are performed simultaneously. An electrode film is formed in the vicinity of the end face, and the electrode film is baked to form a terminal electrode.

[Fourth Embodiment] A fourth embodiment according to the present invention will be described in detail with reference to FIG. The fourth embodiment specifically shows a method for forming an electrode film on a ceramic body, which is a development of the third embodiment described above.

First, as shown in FIG. 4A, a plane forming portion 13 in which a conductive paste is provided on a ceramic body 1 and a film 2 is prepared. In addition, the plane forming part 1
3 is formed on a plane inclined with respect to a plane perpendicular to the direction of gravity. The method of inclining the plane forming part 13 is as follows.
This is the same as the third embodiment described above.

Next, the ceramic body 1 is moved to the plane forming portion 1.
3 and the ceramic body 1 is placed in the direction of gravity D1.
4 (b), or pushes (pulls) the plane forming part 13 in the U1 direction which is opposite to the direction of gravity, or simultaneously performs these operations, as shown in FIG. 4 (b). 1 and the plane forming portion 13 are brought into contact with each other. At this stage, air bubbles do not enter the flat surface forming portion 13 because the flat surface forming portion 13 starts to come into contact with the vicinity of the end surface peripheral portion 1b of the ceramic body 1.

Next, by further pushing (pulling) down the ceramic body 1 or further pushing (pulling) up the plane forming portion 13, or by simultaneously performing these operations, the conductive paste constituting the plane forming portion 13 becomes After the end surface peripheral portion 1b and the end surface central portion 1a of the ceramic body 1, the wettability proceeds to the end surface peripheral portion 1c. At this stage,
Bubbles do not enter the planar forming portion 13.

Next, the ceramic body 1 is further pushed (pulled) down, or the plane forming portion 13 is further pushed (pulled) up, or simultaneously.
The plane forming section 13 is operated so that the inclination of the plane forming section 13 becomes an original plane, that is, a plane perpendicular to the direction of gravity. Thus, FIG.
As shown in (c), the conductive paste forming the plane forming portion 13 is placed on the side surface wetting position 1 of the ceramic body 1.
i, 1i.

Next, the ceramic body 1 is pulled (pushed) up in the direction opposite to D1, or the plane forming portion 13 is pulled (pushed) down in the direction opposite to U1, or these operations are performed simultaneously. An electrode film is formed in the vicinity of the end face, and the electrode film is baked to form a terminal electrode.

Embodiment 5 A fifth embodiment according to the present invention will be described in detail with reference to FIGS. The fifth embodiment specifically shows a method of forming a wavy forming portion having a convex portion and a concave portion on the surface.

As shown in FIG. 5, after the conductive paste is applied onto the film 2, the squeegee 14
By moving in one direction, the wavy forming part 3 having a predetermined thickness is formed. At this time, since the squeegee 14 has a comb-like shape, the surface of the wavy forming portion 3 has a convex portion and a concave portion. The comb tooth shape of the squeegee 14 is not particularly limited, but for example, a square 15 as shown in FIG.
a, a fan shape 15b as shown in FIG. 6 (b), a corrugated shape 15c as shown in FIG. 6 (c), and a V-shaped shape 15d as shown in FIG. 6 (d), that is, the squeegee 14a , 14
b, 14c and 14d can be used.

When the wavy forming part 3 is formed by using the squeegees 14a and 14d having the square 15a and the V-shaped 15d, the shape changes with time because the wavy forming part 3 has a constant viscosity. After a certain time, for example, a fan 15
b, the shape is substantially the same as that of the wavy part 3 formed using the squeegees 14b and 14c having the corrugations 15c.

In the fifth embodiment, the squeegee 14e has a structure in which the conductive paste is supplied to the nozzle 15e at a constant speed through the paste supply pipe 16 and the conductive paste is discharged from the nozzle 15e at a constant speed. By using this, it is possible to form the wavy forming portion 3 having substantially the same shape as the wavy forming portion 3 formed by using the squeegees 14b and 14c having the fan shape 15b and the wave shape 15c. At this time, even if the conductive paste is not applied just before the squeegee 14 is pulled, it is possible to form the wavy forming portion 3 having the convex portion and the concave portion on the surface.

Although not shown, a squeegee that vibrates at regular intervals in a direction perpendicular to the wavy forming portion when forming the wavy forming portion using the squeegee after applying the conductive paste is used. Thus, a wavy forming portion having a convex portion and / or a concave portion on the surface can be formed.

Embodiment 6 A sixth embodiment according to the present invention will be described in detail with reference to FIG. The sixth embodiment specifically shows a method of forming a wavy forming portion having a convex portion and a concave portion on the surface and a method of forming an electrode film on a ceramic body.

First, as shown in FIG.
The plurality of holding units 21 that are movable around a are installed such that the upper surfaces thereof are substantially flat. Next, the plurality of holding units 21 described above are used.
The film 2 is laid thereon, a conductive paste is applied on the film 2, and the squeegee 24 is used to form the plane forming portion 13 having a predetermined thickness.

Next, as shown in FIG.
A plurality of holding portions 21 are operated around the center 1a, and the film 2
By pushing (pulling) up the contact point of the holding portion 21 in the U1 direction opposite to the gravity, the corrugated forming portion 3 having the convex portion 3a and the concave portion on the surface is formed. Note that such a wavy forming portion 3 includes an inclined portion 3b between the convex portion 3a and the concave portion. In FIG. 7B, the film 2 and the holding unit 2
1 contact is pushed (pulled) up in the U1 direction.
You can push (pull) down in the opposite direction.

Next, as shown in FIG. 7C, the plurality of ceramic bodies 1 attached to the support portion 25 are arranged on the projections 3a of the corrugated forming section 3, and the ceramic body 1 is moved in the direction of gravity. Pushing (pulling) down in a certain D1 direction or pushing (pulling) up the wavy forming portion 3 in the U1 direction, or simultaneously performing these operations, as shown in FIG. 7 (d), the ceramic body 1 and the wavy forming portion 3 is brought into contact.

Next, as shown in FIG.
A plurality of holding parts 21 are operated around 1a, and FIG.
Then, the contact between the film 2 pushed (pulled) up in the U1 direction (or pushed (pulled down) in the opposite direction to U1) and the holding unit 21 is returned to the original position, and the plane forming unit 13 is formed again. By pulling (pushing) the ceramic body 1 in the direction opposite to D1 and pulling (pushing) the plane forming portion 13 in the direction opposite to U1, or by simultaneously performing these, the vicinity of the end face of the ceramic body 1 An electrode film is formed,
By firing this, a terminal electrode is formed.

In the sixth embodiment described above, the plurality of ceramic bodies 1 attached to the support portion 25 are arranged on the projections 3a of the wavy forming section 3, and the ceramic body 1 is pushed in the direction D1. The electrode film was formed near the end face of the ceramic body by (pulling) lowering or pushing (pulling) the wavy forming portion 3 in the U1 direction, or simultaneously. The method for forming the electrode film according to the first embodiment, that is, the convex portion 3 of the wavy forming portion 3
a and the method for forming an electrode film by contacting the ceramic body 1 or the method for forming an electrode film in the above-described second embodiment, that is, an inclined portion between the convex portion 3a and the concave portion of the wavy forming portion 3. A method for forming an electrode film by bringing 3b into contact with ceramic body 1, or a method for forming an electrode film by another method within the scope of the present invention may be used.

In the sixth embodiment, as shown in FIG. 7A, a film 2 is laid on a plurality of holding portions 21 and a conductive paste is applied on the film 2.
Planar forming section 1 having predetermined thickness using squeegee 24
3 is formed, and as shown in FIG.
a, the plurality of holding portions 21 are operated around
By pushing (pulling) up in the U1 direction (or pushing (pulling) down in the opposite direction to U1) the contact between the b and the holding portion 21, the corrugated forming portion 3 having the convex portion 3 a and the concave portion on the surface.
For example, the film 2 is laid on the plurality of holding portions 21 described above, and the plurality of holding portions 21 are actuated in advance around the fulcrum 21a, and the contact point between the film 2 and the holding portion 21 is set to U1.
In a state where the film is pushed (pulled up) in the direction (or a state where the film is pushed (pulled) down in the opposite direction to U1), a conductive paste is applied on the film 2 and a flat surface having a predetermined thickness is formed using a squeegee 24. After forming the portion 13, the fulcrum 21a
, A plurality of holding portions 21 are operated, and the contact between the film 2 and the holding portion 21 which is pushed (pulled) up in the U1 direction (or pushed (pulled down) in the opposite direction to U1) is returned to the original position. Thus, the wavy forming portion 3 having the convex portion 3a and the concave portion on the surface may be formed.

In the above-described sixth embodiment, after the ceramic body 1 and the corrugated portion 3 are brought into contact with each other as shown in FIG. 7D, as shown in FIG. 21
7 (b), the contact between the film 2 and the holding unit 21 pushed (pulled) up (or pushed (pulled) down in the opposite direction to U1) in FIG. 7 (b). Is returned to the original position, and the plane forming portion 13 is again formed. However, the ceramic body 1 is pulled (pushed) up in the direction opposite to D1, or the wavy forming portion 3 is pulled (pushed) down in the direction opposite to U1, and Alternatively, it is not always necessary to return the contact point between the film 2 and the holding portion 21 to the original position before performing these at the same time.

[Seventh Embodiment] A seventh embodiment according to the present invention will be described in detail with reference to FIG. The seventh embodiment specifically shows a method of forming a wavy forming portion having a convex portion and a concave portion on the surface.

First, as shown in FIG.
The plurality of movable portions 31b provided between the first fixed portion 31a and the plurality of fixed portions 31a are installed such that the upper surfaces thereof are substantially flat. Then
The film 2 is laid on the plurality of fixed portions 31a and the movable portions 31b, and a conductive paste is applied on the film 2,
Planar forming section 1 having predetermined thickness using squeegee 24
Form 3

Next, as shown in FIG. 8B, the plurality of movable parts 31b are slid, and the contact point between the film 2 and the movable parts 31b is pushed (pulled) in the direction U1 opposite to the direction of gravity.
By raising, the wavy forming part 3 provided with the convex part 3a and the concave part on the surface is formed. In addition, such a wavy forming portion 3
Has an inclined portion 3b between the convex portion 3a and the concave portion. In FIG. 8B, the contact point between the film 2 and the movable portion 31b is pushed (pulled) up in the U1 direction, but may be pushed (pulled) down in the direction opposite to U1.

Next, a ceramic body is prepared, and an electrode film is formed in the vicinity of the end face of the ceramic body. The method of forming the electrode film is the same as the method of forming the electrode film in the above-described first embodiment, that is, the wavy shape. The method of forming an electrode film by contacting the protrusion 3a of the forming portion 3 with the ceramic body 1, or the method of forming an electrode film in the above-described second embodiment, that is, the method of forming the electrode film in the second embodiment, A method of forming an electrode film by bringing the inclined portion 3b between the concave portions into contact with the ceramic body 1, or a method of forming an electrode film by another method within the scope of the present invention may be used.

In the above-described seventh embodiment, as shown in FIG. 8A, a fixing portion 31a and a plurality of fixing portions 3
1a, a plurality of movable parts 31b are installed such that the upper surfaces thereof are substantially flat, a film 2 is spread on the plurality of fixed parts 31a and the movable parts 31b, and a conductive paste is applied on the film 2. After forming the plane forming portion 13 having a predetermined thickness using the squeegee 24, as shown in FIG.
By pushing (pulling) up (or pushing (pulling) down in the direction opposite to U1) the contact point of the movable portion 31b and the movable portion 31b, the corrugated forming portion 3 having the convex portion 3a and the concave portion on the surface.
Is formed, for example, a plurality of fixed parts 31a and movable parts 3
1b, the film 2 is spread, the plurality of movable parts 31b are slid in advance, and the contact point between the film 2 and the movable part 31b is pushed (pulled) in the U1 direction (or pushed (pulled) in the opposite direction to U1). (In a lowered state), a conductive paste is applied on the film 2 to form a plane forming portion 13 having a predetermined thickness using a squeegee 24, and then pushed (pulled) up in the U1 direction (or U1). The contact between the film 2 (pressed (pulled down) in the opposite direction) and the movable portion 31b may be returned to the original position, and the wavy forming portion 3 having the convex portion 3a and the concave portion on the surface may be formed.

Although not shown, the corrugated portion 3 and the ceramic body are brought into contact with each other so that the conductive paste constituting the corrugated portion 3 reaches a predetermined wet-up position on the side surface of the ceramic body. Then, the plurality of movable portions 31b are slid again, and the contact between the film 2 and the movable portion 31b pushed (pulled) up in the U1 direction (or pushed (pulled) down in the opposite direction to U1) in FIG. May be returned to the original position and the plane forming portion 13 may be formed again.

[Eighth Embodiment] An eighth embodiment according to the present invention will be described in detail with reference to FIG. The ninth embodiment specifically shows a method of forming a wavy forming portion having a convex portion and a concave portion on the surface.

First, as shown in FIG.
A pair of comb-shaped plates 42a and 42b are prepared on the upper side.
The comb-shaped plates 42a and 42b have a structure in which a gap is substantially eliminated by inserting the comb teeth of each other.
This state is referred to as a closed state. On the other hand, by sliding the pair of comb-shaped plates in a closed state in a direction away from each other, a gap is created between the comb teeth. This state is referred to as an open state.

Next, a pair of closed comb tooth plates 42
After the conductive paste is applied to a and b, the plane forming portion 13 is formed using a conventional plane squeegee 24.

Next, as shown in FIG. 9 (b), the comb teeth are opened by sliding the comb-shaped plates 42a and 42b in the directions M2 and M3 which are separated from each other, and the plane forming portion 13 is formed in the gap 42c between the comb teeth. Is formed, and a wavy forming portion 43 having a convex portion and a concave portion on the surface is formed.
According to the present embodiment, since the conductive paste flows into the gap between the comb teeth, a feature is that a concave portion is formed in the planar forming portion 13. For convenience, they will be referred to as convex portions. Further, such a wavy forming portion 43 includes an inclined portion between the convex portion and the concave portion.

Next, a ceramic body is prepared, and an electrode film is formed near the end face of the ceramic body. The method for forming the electrode film is the same as the method for forming the electrode film in the above-described first embodiment, that is, the wavy shape. The method for forming an electrode film by contacting the convex portion of the forming portion 3 with the ceramic body 1, or the method for forming an electrode film in the above-described second embodiment, that is, the method of forming the convex portion and the concave portion of the wavy forming portion 3 A method of forming an electrode film by bringing the ceramic body 1 into contact with the inclined portion between them, or a method of forming an electrode film by another method within the scope of the present invention may be used.

Although not shown, after a conductive paste is applied to a pair of open comb-tooth plates, a plane forming portion is formed using a conventional flat squeegee. Slide in the inserting direction to close the comb teeth,
The conductive paste forming the plane forming portion that has flowed into the gap between the comb teeth is pushed up to form a wavy forming portion having a convex portion and a concave portion on the surface, and then a ceramic body is prepared. An electrode film may be formed near the end face.

Embodiment 9 A ninth embodiment according to the present invention will be described in detail with reference to FIG. The ninth embodiment specifically shows a method of forming a wavy forming portion having a convex portion and a concave portion on the surface and a method of forming an electrode film on a ceramic body.

First, as shown in FIG. 10, a plate 52a having a plurality of through holes 52b is prepared. Through hole 52
The shape, number, and arrangement position of b are not particularly limited. For example, a plate 52a having a plurality of cylindrical through holes 52b arranged at equal intervals is preferable.

Next, the inside of the case 52 having the plate 52a as the upper surface is filled with the conductive paste 53, and the pressing member 54 is operated in the U1 direction opposite to the direction of gravity.
The conductive paste 53 is extruded from the plurality of through holes 52b to form a paste reservoir on the plate 52a. The paste reservoir extruded onto the plate 52a has a convex shape.

Next, a ceramic body is prepared, and an electrode film is formed near the end face of the ceramic body. The method for forming the electrode film is the same as the method for forming the electrode film in the above-described first embodiment, that is, the paste method. A method of forming an electrode film by bringing the reservoir into contact with the ceramic body 1, or a method of forming an electrode film by another method within the scope of the present invention may be used.

Although not shown, the plate 52a
After applying the conductive paste on the upper surface, a plane forming portion is formed using a conventional flat squeegee, and then the conductive paste 53 is filled in a case 52 having a plate 52a as an upper surface, and a pressing fixture 54 is formed. By operating in the U1 direction, the conductive paste 53 is extruded from the plurality of through-holes 52b to form a wavy forming portion having a convex portion and a concave portion on the surface, and then an electrode film is formed near the end face of the ceramic body. No problem.

In the ninth embodiment, the pressing support 54 is used as a means for extruding the conductive paste 53 from the plurality of through holes 52b. For example, a pump is prepared and the conductive Means for filling the conductive paste 53 may be used.

[Embodiment 10] A tenth embodiment according to the present invention will be described in detail with reference to FIG. The tenth embodiment specifically shows a method of forming a wavy forming portion having a convex portion and a concave portion on the surface.

First, as shown in FIG. 11, a rotating small roll 61a, a large roll 61b, a plastic plate 62a having a plurality of protrusions 62b on its surface, a conventional squeegee 24, and a conductive paste 63 are prepared. The back side of 62a is supported in a caterpillar shape using a large roll 61b, and a part of the surface of the supported plate 62a is made to approach the small roll 51a. Next, the lower part of the small roll 61a is immersed in the conductive paste 63 and rotated, and the large roll 61b is rotated in a direction opposite to the rotation of the small roll 61a, so that the conductive paste 63 attached to the small roll 61a is removed. It is provided on the surface of the plate 62a having a curved surface. Next, the squeegee 24 forms the plane forming portion 13 on the plate 62a.

Next, the plate 62a on which the plane forming portion 13 is formed is supported such that the rear surface side is a straight plane.
Specifically, for example, the plate 62a is
There is a method of supporting the lower portion of the plate 62a such that the lower surface is separated from the support of the plate 62a so that the back surface side of the plate 62a is a linear plane. At this time, the gap between the plurality of protrusions 62b on the plate 62a is narrowed, so that the planar forming portion 13 is formed and the plurality of protrusions 62b
The conductive paste 63 filled in the gap between them is extruded onto the surface of the planar forming portion 13 to form the wavy forming portion 3 having the convex portion 3a and / or the concave portion on the surface. Note that such a wavy forming portion 3 includes an inclined portion 3b between the convex portion 3a and the concave portion.

The small roll 61a and the large roll 6
The size and material of the projection 1b, the material of the plate 62a and the projection 62b, and the interval between the plurality of projections 62b are not particularly limited.
b is appropriately adjusted so as to have a desired size and shape.

Next, a ceramic body is prepared, and an electrode film is formed near the end face of the ceramic body. The method for forming the electrode film is the same as the method for forming the electrode film in the above-described first embodiment, that is, the wavy shape. The method for forming an electrode film by contacting the convex portion of the forming portion 3 with the ceramic body 1, or the method for forming an electrode film in the above-described second embodiment, that is, the method of forming the convex portion and the concave portion of the wavy forming portion 3 A method of forming an electrode film by bringing the ceramic body 1 into contact with the inclined portion between them, or a method of forming an electrode film by another method within the scope of the present invention may be used.

[Eleventh Embodiment] The eleventh embodiment is obtained by developing the first to fourth and ninth embodiments described above.
It specifically shows a method of forming an electrode film on a ceramic body. First, a first electrode film to be a terminal electrode is formed on the end face of the ceramic body by the methods of the first to fourth and ninth embodiments described above. Since the first electrode film is formed by the manufacturing method of the present invention, no air bubbles are included in the terminal electrode. In comparison, the accuracy of the wetting position of the end face of the ceramic body may be reduced. Then, a new conductive paste is applied to form a planar forming portion, and the planar forming portion and the ceramic body having the first electrode film are brought into contact with each other, and the second electrode is formed so as to cover the first electrode film. Preferably, a film is formed. As shown in FIG. 13A, which is a conventional example, a plane of an object surrounded by a straight line plane and a plane forming portion, such as a ceramic body, are formed.
When the electrodes are immersed so that the surfaces come into contact with each other as shown in (1), there is a problem that air bubbles are included in the terminal electrode. However, when the first electrode film is formed on the end surface of the ceramic body by the manufacturing method of the present invention, Since the electrode film is an electrode film formed by coating, the electrode film has a slightly curved surface with R. Even if the first electrode film is immersed in the newly formed flat portion, bubbles are generated in the second electrode film. There is no problem of inclusion. Further, by forming the second electrode film by such a method, the accuracy of the wet-up position of the second electrode film becomes equivalent to that of the prior art, and the effect of the present invention that no air bubbles are included in the terminal electrode. Is also obtained.

The conductive paste forming the first electrode film and the second electrode film may be made of the same material.
Also, they may be made of different materials.

[0087]

[Embodiment] First, as shown in FIG.
The length L is 3.2 mm, the width W is 2.5 mm, and the thickness T is 1.
A plurality of ceramic element bodies 1 each having a length of 5 mm are prepared, and the pitch P1 is set to 4.0 m on the element holder 25 made of silicon rubber.
m were fixed to 20 pieces each. Note that the diagonal length A of the width W and the thickness T is 2.92 mm.

Next, 20% by volume of copper powder, 5% by volume of glass frit, and 75% by volume of an organic vehicle obtained by mixing an acrylic resin and terpineol are mixed to prepare a conductive paste having a viscosity of about 20 Pa · s. did.

Next, using the squeegee 14c shown in FIG. 6C in the fifth embodiment described above, FIG.
As shown in FIG. 12A and FIG. 12B, the corrugated portions 3 of the samples 1 to 6 were formed on the film 2. For samples 1 to 3 in which the pitch P2 (the distance between the apexes of the convex portions) of the wavy forming portion 3 is 4.0 mm, which is the same as the pitch P1, the convex portion thickness H1, the concave portion thickness H2 of the wavy forming portion, The height Δh (difference between H1 and H2) of the ridge of the forming portion was measured, and the pitch P3 of the wavy forming portion 3 was 8.0 mm, which is twice the pitch P1.
For Samples 4 to 6, the inclination angle θ of the inclined portion where the ceramic body 1 is in contact and the thickness H3 of the corrugated portion in the inclined portion where the ceramic body 1 is in contact are measured, and these are summarized in Table 1. Was.

[0090]

[Table 1]

Next, using the above-mentioned conductive paste, a plane-formed portion of a conventional sample 7 having a thickness of 0.6 mm was formed.

Next, as shown in FIG. 12 (a), the above-mentioned ceramic body 1 was placed above the convex portions 3a of the corrugated portions 3 of the samples 1 to 3, and the entire element holder 25 was 5.0 mm.
/ S until the end surface of the ceramic body 1 comes into contact with the film 2, and after standing still for 3 seconds in a state of contact,
Again, the ceramic body 1 was raised together with the element holder 25 at a speed of 5.0 mm / s, and the first electrode films of the samples 1 to 3 were formed on the end surfaces of the ceramic body 1.

Similarly, the above-described ceramic body 1 is arranged above the inclined portion 3b of the corrugated portion 3 of the samples 4 to 6, and the end face of the ceramic body 1 is moved together with the element holder 25 at a speed of 5.0 mm / s. After being lowered until it comes into contact with the film 2, and kept still for 3 seconds while in contact with the film 2, the ceramic body 1 is again raised together with the element holder 25 at a speed of 5.0 mm / s, and the sample 4 is placed on the end face of the ceramic body 1. To 6 first electrode films were formed.

Further, the above-mentioned ceramic body is arranged on the upper surface of the plane forming portion of the sample 7 formed on the plane perpendicular to the direction of gravity, and the ceramic body is placed together with the element holder at a speed of 5.0 mm / s. After lowering in the direction of gravity until the end surface contacts the film 2 and resting for 3 seconds in the state of contact, the ceramic body together with the element holder is raised again at a speed of 5.0 mm / s. A first electrode film of Sample 7 was formed.

Next, the electrode films of Samples 1 to 7 were heated at 100 ° C.
And then baking in air at 750 ° C. for 10 minutes under a peak condition, and 100% of each of the test samples 1 to 7 having the first dry electrode film to be a terminal electrode by baking. I got one by one.

Next, for Samples 1 and 4, the ceramic body having the first electrode film before drying was further placed on a plane forming portion having a thickness of 0.6 mm formed on a plane perpendicular to the direction of gravity. The second electrode film was formed on the first electrode film by the same method as that of the above-described sample 7, and was dried to obtain 100 test samples each including the second dry electrode film.

Therefore, for the test samples of Samples 1 to 7, the bubble mixing ratio and the shape defect ratio in the first dry electrode film were measured, and for Samples 1 and 4, the shape of the test sample having the second dry electrode film was measured. Measure the defect rate,
This was evaluated and summarized in Table 2.

The bubble mixing ratio was determined by counting the number of test samples including bubbles in the first dry electrode film and calculating the ratio of occurrence in all 100 samples.

The shape defect rate is calculated based on the wetting position (e
Dimensions) The number of test samples having a defect and a gap (g dimension) defect between the first dry electrode films was counted, and the total number was 1
The occurrence rate was set at 00 pieces.

The evaluation was as follows: 試 料 for the sample within the particularly excellent range of the present invention, ○ for the next most excellent sample, and the sample slightly inferior to the above-mentioned ○ but within the range of the present invention. Is marked with Δ, and with respect to the conventional example outside the scope of the present invention, x is marked. In addition, the evaluation of the sample 1 and the sample 4 was the evaluation of the test sample provided with the second dry electrode film.

[0101]

[Table 2]

As is clear from Tables 1 and 2,
Among the test samples of Samples 1 to 3 in which the dry electrode film was formed by bringing the end face of the ceramic body 1 into contact with the projection 3a of the wavy forming portion 3, the height Δh of the ridge was 0.02 times the diagonal length A. The test samples of Sample 1 and Sample 2 which are larger than 0.06 mm, which is less than 0.06 mm, had an excellent rate of air bubbles of 0%. In addition,
The shape defect rate of the first dry electrode film is such that the ridge height Δh is 0.2
Sample 2 having a ridge height of 0.4 mm was 0%, whereas Sample 1 having a ridge height Δh of 0.4 mm was as high as 25%. However, the shape defect rate of the test sample of Sample 1 on which the second dry electrode film was formed was 0%. This is because the formation position of the second dry electrode film could adjust the wetted position of the dry electrode film. Therefore, the test samples of Sample 1 and Sample 2 both have a bubble mixing ratio of 0% and a defective shape ratio of a dry electrode film to be a terminal electrode of 0%, which is within the scope of the present invention. It can be said that. In particular, since the test sample of Sample 2 had no shape defect rate at the time when the first dry electrode film was formed, it was within the particularly excellent range of the present invention.

The height .DELTA.h of the ridge is 0.1 mm of the diagonal length A.
In the test sample of Sample 3 smaller than 0.06 mm, which is 02 times, the shape defect rate of the first dry electrode film was 0%, but the air bubble mixing rate was 1%. The result was slightly inferior to the test sample of No. However, since it is clearly lower and superior compared to the bubble incorporation rate of the test sample of Sample 7 which is a conventional example,
Sample 3 is also within the scope of the present invention.

Further, of the test samples 4 to 6 in which the end surface of the ceramic body 1 was brought into contact with the inclined portion 3b of the wavy forming portion 3 to form a dry electrode film, the sample 5 having an inclination angle θ of more than 1 degree In addition, the test sample of Sample 6 was excellent because the air bubble incorporation rate was 0%. The shape defect rate of the first dry electrode film was 0% for the sample 5 having the inclination angle θ of 5 degrees, but was 56% and high for the sample 4 having the inclination angle θ of 8 degrees. . However, the shape defect rate of the test sample of Sample 4 on which the second dry electrode film was formed was 0%. Therefore, the test samples of Sample 4 and Sample 5 both have a bubble mixing ratio of 0% and a defective shape ratio of a dry electrode film to be a terminal electrode of 0%, and thus are within the scope of the present invention. It can be said that. In particular, the test sample of Sample 5 is
Since there was no shape defect rate at the time of forming the first dry electrode film, it was within the particularly excellent range of the present invention.

In the test sample 6 having an inclination angle θ of 1 degree, the shape defect rate of the first dry electrode film was 0%, but the air bubble mixing rate was 1%. And the result was slightly inferior to the test sample of Sample 5. However, the sample 6 is also within the scope of the present invention because it is clearly lower and superior to the test sample 7 as a conventional sample compared with the test sample.

On the other hand, the test sample of the prior art sample 7, in which the first dry electrode film was formed by bringing the end face of the ceramic body into contact with the plane forming portion formed on the plane perpendicular to the direction of gravity, Although the defective shape rate was 0%, the air bubble mixing rate was 53.0%, which was very poor.

[0107]

As described above, according to the method for manufacturing a ceramic electronic component of the present invention, a first step of forming a corrugated portion having a convex portion and / or a concave portion on a surface thereof using a conductive paste; The top portion of the convex portion or the inclined portion formed by the convex portion and / or the concave portion and the end surface of the ceramic body are brought into contact with each other to form a first electrode film to be a terminal electrode on the end surface of the ceramic body. The second step is characterized in that it is possible to provide a ceramic electronic component in which the terminal electrode is formed such that bubbles are not included in the terminal electrode.

Further, according to the method of manufacturing a ceramic electronic component of the present invention, the first step of forming a plane forming portion having an inclination with respect to a plane perpendicular to the direction of gravity using a conductive paste.
The process, the plane forming portion, and the end face of the ceramic body are brought into contact with each other in the direction of gravity or in the direction opposite to gravity,
A second step of forming a first electrode film to be a terminal electrode on an end face of the ceramic body, wherein the terminal electrode is formed such that bubbles are not included in the terminal electrode. The effect that an electronic component can be provided is obtained.

Further, according to the method of manufacturing a wavy forming portion of the present invention, the wavy forming portion used in the above-described method of manufacturing a ceramic electronic component can be easily formed, so that air bubbles are not included in the terminal electrodes. The effect is obtained that the ceramic electronic component on which the terminal electrodes are formed can be reliably provided.

Further, the method for manufacturing a ceramic electronic component of the present invention includes the third step of forming a plane forming portion using a conductive paste, and a ceramic body having a plane forming portion and a first electrode film. And a fourth step of forming a second electrode film on the first electrode film by contacting each other with each other. The effect of being able to provide a ceramic electronic component including the second electrode film that has been properly wetted to the desired position at the end is obtained.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram relating to a first embodiment according to the present invention, and FIG. 1 (a) is a cross-sectional view illustrating a positional relationship when a corrugated portion and a ceramic body are brought into contact with each other;
FIG. 1B is a cross-sectional view showing a position where the corrugated portion and the ceramic body start contacting, and FIG. 1C shows a state in which the conductive paste has wetted to a predetermined position on the side surface of the ceramic body. FIG.

FIG. 2 is an explanatory view of a second embodiment according to the present invention, and FIG. 2 (a) is a cross-sectional view showing a positional relationship when a corrugated portion and a ceramic body are brought into contact with each other;
FIG. 2B is a cross-sectional view showing a position where the corrugated portion and the ceramic body start contacting, and FIG. 2C shows a state where the conductive paste has wetted to a predetermined position on the side surface of the ceramic body. FIG.

FIG. 3 is an explanatory diagram relating to a third embodiment according to the present invention, and FIG. 3 (a) is a cross-sectional view illustrating a positional relationship when a plane forming portion and a ceramic body are brought into contact with each other;
FIG. 3B is a cross-sectional view showing a position where the plane forming portion and the ceramic body start contacting, and FIG. 3C shows a state where the conductive paste has wetted to a predetermined position on the side surface of the ceramic body. FIG.

FIG. 4 is an explanatory view of a fourth embodiment according to the present invention, and FIG. 4 (a) is a cross-sectional view showing a positional relationship when a plane forming portion and a ceramic body are brought into contact with each other;
FIG. 4B is a cross-sectional view showing a position where the plane forming portion and the ceramic body start contacting each other, and FIG. 4C shows a state where the conductive paste has wetted to a predetermined position on the side surface of the ceramic body. FIG.

FIG. 5 is a perspective view illustrating a method of forming a wavy forming portion having a convex portion and a concave portion on a surface according to a fifth embodiment of the present invention.

FIG. 6 is an explanatory view showing a shape of a squeegee used when forming a wavy forming portion having a convex portion and a concave portion on a surface according to a fifth embodiment of the present invention, and FIG.
6 (b) is a fan-shaped comb, FIG. 6 (c) is a wave-shaped comb, FIG. 6 (d) is a mountain-shaped comb, and FIG. 6 (e) is a nozzle. It is a top view of a squeegee provided with each.

FIGS. 7A and 7B are explanatory views of a sixth embodiment according to the present invention. FIG. 7A is a cross-sectional view illustrating a method of forming a plane forming portion, and FIG. FIG. 7 is a cross-sectional view illustrating a method of forming a wavy forming portion having a concave portion, and FIG.
FIG. 7C is a cross-sectional view showing a state in which the ceramic body is disposed on the wavy forming portion, and FIG. 7D is a cross-sectional view showing a state in which the wavy forming portion and the end face of the ceramic body are in contact with each other. FIG. 7 (e) is a cross-sectional view showing a state in which the holding portion is returned to the home position, and the wavy forming portion having the convex portion and the concave portion on the surface is again a planar forming portion.

8A and 8B are explanatory views of a seventh embodiment according to the present invention. FIG. 8A is a cross-sectional view illustrating a method of forming a plane forming portion, and FIG. It is sectional drawing which showed the formation method of the wave-shaped formation part provided with a recessed part.

9A and 9B are explanatory views of an eighth embodiment according to the present invention. FIG. 9A is a perspective view illustrating a method of forming a plane forming portion, and FIG. It is the perspective view which showed the formation method of the wavy formation part provided with a recessed part.

FIG. 10 is a perspective view showing a method for forming a paste reservoir in a ninth embodiment according to the present invention.

FIG. 11 is a cross-sectional view illustrating a method of forming a wavy forming portion having a convex portion and a concave portion on a surface according to a tenth embodiment of the present invention.

FIG. 12 is an explanatory diagram of an embodiment of the present invention.
FIG. 12A is a cross-sectional view illustrating a method of forming a first electrode film by bringing an end face of a ceramic body into contact with a convex portion of a wavy forming portion, and FIG. FIG. 4 is an end view showing a method of forming a first electrode film by bringing end surfaces of a body into contact with each other.

13A and 13B are explanatory views related to a conventional method for manufacturing a ceramic electronic component, and FIG. 13A is a cross-sectional view illustrating a positional relationship when a plane forming portion and a ceramic body are brought into contact with each other; FIG. 13B is a cross-sectional view showing a position where the plane forming portion and the ceramic body start contacting each other, and FIG.
FIG. 5 is a cross-sectional view showing a state in which the conductive paste has wetted up to a predetermined position on the side surface of the ceramic body.

FIG. 14 is an explanatory view of a conventional method for manufacturing a ceramic electronic component, and FIG. 14 (a) illustrates a process in which bubbles are mixed into an applied electrode film when a ceramic body immersed in a plane forming portion is pulled up. FIG. 14 (b)
FIG. 3 is a cross-sectional view of a ceramic electronic component provided with a coating electrode film containing bubbles.

[Explanation of symbols]

 Reference Signs List 1 ceramic body 3 wavy forming portion 3a convex portion 3b inclined portion 13 flat forming portion 14 comb tooth squeegee 42a comb tooth plate 42b comb tooth plate 42c gap between comb teeth 52a plate 52b through hole

Claims (15)

[Claims] 1. A first step of forming a corrugated portion having a convex portion and / or concave portion on a surface thereof using a conductive paste, and a vertex portion of the convex portion or the convex portion and / or concave portion. Inclined part, the end face of the ceramic body,
And forming a first electrode film to be a terminal electrode on the end face of the ceramic element body, the method comprising the steps of: 2. A first step of forming a plane forming part on a plane inclined with respect to a plane perpendicular to the direction of gravity using a conductive paste, the plane forming part, an end face of a ceramic body, A second step of forming a first electrode film to be a terminal electrode on an end face of the ceramic body by bringing the first electrode film into contact with a direction of gravity or a direction opposite to the direction of gravity. The method of manufacturing the part. 3. The method according to claim 2, further comprising, after the second step, a step of operating the plane forming portion having an inclination to be a plane perpendicular to the direction of gravity.
3. The method for manufacturing a ceramic electronic component according to claim 1. 4. A method for forming a wavy forming portion, comprising: forming a wavy forming portion having a convex portion and / or a concave portion on a surface thereof using a comb-shaped squeegee after applying the conductive paste. . 5. A method for forming a wavy forming portion, comprising: pouring out a conductive paste to form a wavy forming portion having a convex portion and / or a concave portion on a surface. 6. A method for forming a wave-shaped portion using a squeegee after applying a conductive paste, wherein the squeegee vibrates at regular intervals in a direction perpendicular to the wave-shaped portion, and the surface is formed on the surface. A method for forming a wavy forming portion, comprising forming a wavy forming portion having a convex portion and / or a concave portion. 7. After forming a plane forming part using a conductive paste, a part of the lower part of the plane forming part is pushed up and / or lowered to form a convex part or / and
A method for forming a wavy forming portion, comprising: forming a wavy forming portion having a concave portion. 8. After forming a plane forming portion using a conductive paste on a pair of closed comb-tooth-shaped plates, the comb-tooth-shaped plates are slid in a direction away from each other to open the comb teeth, A method for forming a wavy forming portion, comprising: flowing the conductive paste constituting the planar forming portion into a gap between comb teeth to form a wavy forming portion having a convex portion and / or a concave portion on a surface. 9. After forming a plane forming portion using a conductive paste on a pair of open comb-tooth-shaped plates, the comb-tooth-shaped plates are slid in a direction to insert each other to close the comb teeth, A method for forming a wavy forming portion, comprising: pushing up the conductive paste flowing into the gap between the comb teeth to form a wavy forming portion having a convex portion and / or a concave portion on the surface. 10. After forming a plane forming portion using a conductive paste on a plate having a through hole, the conductive paste is extruded from a lower portion of the plate to form a wavy shape having a convex portion and / or a concave portion on the surface. A method of forming a wavy forming portion, comprising forming a portion. 11. A back side of a flexible plate having a plurality of protrusions arranged on the front surface at predetermined intervals,
After supporting in a caterpillar shape using a rotating roll and forming a plane forming part using a conductive paste on the surface of the curved plate, the back side of the plate on which the plane forming part is formed is a linear flat surface. By extruding the conductive paste filled in the gaps between the plurality of protrusions onto the surface of the flat surface forming portion to form a wavy forming portion having a convex portion and / or a concave portion on the surface. A method for forming a wavy forming portion, characterized in that: 12. The method according to claim 1, wherein the corrugated portion formed in the first step is formed by the method for forming a corrugated portion according to any one of claims 3 to 11. Of manufacturing ceramic electronic components. 13. A first step of extruding a conductive paste from a lower portion of a plate having a through hole to form a paste reservoir on the plate, and a top portion of the paste reservoir or an inclined portion formed by the paste reservoir. And a end face of the ceramic body, and a second step of forming a first electrode film to be a terminal electrode on the end face of the ceramic body, the method comprising the steps of: . 14. A third step of forming a plane forming portion by using a conductive paste; bringing the plane forming portion and the ceramic body including the first electrode film into contact with each other; The method for manufacturing a ceramic electronic component according to claim 1, further comprising: a fourth step of forming a second electrode film on the film. 15. A ceramic electronic component obtained by the manufacturing method according to any one of claims 1 to 3 and 12 to 14.