JPH0521302A - Method and device for forming electrode on side of substrate - Google Patents

Abstract

PURPOSE:To readily form an electrode not only at a side of a substrate but also at a front and a rear of it by forming an electrode by bringing an electrode paste transcription member into pressing contact with a substrate side by a pressing member which consists of an elastic material having a thickness which is larger than that of the substrate. CONSTITUTION:A substrate 11 is fixed to a specified position and a pressing member 10 is lowered. When the pressing member 10 is lowered to the lowermost point by adjusting a lowering amount of the pressing member 10, a side part of the substrate 11 is buried inside a projecting surface (a) of the pressing member 10 together with a ribbon 1. The ribbon 1 is pushed to a side 11a of the substrate 11 by a specified pressure by the pressing member 10, and it creeps also to a front 11b and a rear 11c of the substrate 11 and is pushed. Thereby, electrode paste applied to the ribbon 1 is transcribed to the side 11a, the front 11b and the rear 11c of the substrate 11, and a linear electrode is formed at the side 11a, the front 11b and the rear 11c of the substrate 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate side electrode forming method and apparatus for forming electrodes on the substrate side face of a surface mount type component (hereinafter referred to as SMD) which can be mounted on the surface of a circuit board. .

[0002]

2. Description of the Related Art In a chip-type SMD, one or more linear electrodes 13 are provided on a side surface 12 of a substrate 12 as shown in FIG.
What is formed in a is known. The side electrode 13
For example, the signal lines formed on the front and back surfaces of the substrate 12 are connected to each other, or are used as soldering lands for mounting.

Conventionally, the side electrode 13 of the SMD is formed by forming a block 14 of a substrate by stacking a plurality of SMD substrates 12 as shown in FIG. The side surface 14a is screen-printed.

That is, the electrode paste is applied to the upper surface side of the printing screen 15 having the vertical stripe pattern 16 formed by arranging a plurality of lines of a predetermined width in parallel at a predetermined interval.
A squeegee made of an elastic material (not shown) is attached to the screen 15
The vertical stripe pattern 1 is moved by rubbing the upper surface side of the
The electrode paste corresponding to No. 6 is transferred onto the block side surface 15a of the block 15.

[0005]

In the conventional method for forming the electrode on the side surface of the substrate, since the electrode paste is screen-printed on the side surface 12a of the substrate 12, it is difficult to wrap the electrode paste around the front and back sides of the substrate 12. Is. In particular, it is difficult to make the wraparound size of the electrodes 13a formed on the front surface and the back surface of the substrate 12 longer than the electrode width (see FIG. 3). For this reason, the signal lines formed on the front and back surfaces of the substrate 12 may have a poor connection, or the solder attachment area as a soldering land for mounting cannot be sufficiently secured.
The soldering strength of D is insufficient.

Further, as a means for wrapping the electrode paste around the front and back sides of the substrate 12, for example, increasing the supply amount of the electrode paste at the time of screen printing can be considered, but in such a case, bleeding of the electrode paste occurs, Another problem may occur that the line width of the side surface electrode 13 becomes larger than a predetermined dimension.

Moreover, since the screen 15 for screen printing has to be prepared according to the pattern of the side electrode 13, the manufacturing cost becomes high in a small quantity and a large variety of SMDs.

The present invention has been made in view of the above problems, and provides a method and an apparatus for forming an electrode on a side surface of a substrate, which allows an electrode paste to sufficiently wrap around the front and back surfaces of the substrate when forming an electrode on the side surface of the substrate. The purpose is to provide.

[0009]

The present invention provides a method of forming a linear electrode on a side surface of a substrate having front and back surfaces, in which a one or more linear electrode pastes are applied on one side. The strip-shaped electrode paste transfer member is stretched with the application surface of the electrode paste facing the side surface of the substrate, and then the electrode paste transfer is performed by a pressing member made of an elastic material having a thickness larger than that of the substrate. By pressing a member against the side surface of the substrate, the electrode paste transfer member is also wrapped around the front and back surfaces of the substrate to transfer the electrode paste to the side surface and front and back surfaces of the substrate.

Further, according to the present invention, in an electrode forming apparatus for forming a linear electrode on a side surface of a substrate having front and back surfaces, a strip-shaped electrode paste transfer means for applying an electrode paste on one side, and the electrode. An electrode paste applying means for applying one or more linear electrode pastes to the paste; a tensioning means for tensioning the electrode paste transfer means with the application surface of the electrode paste facing the side surface of the substrate. A pressing member made of an elastic material having a thickness greater than the thickness of the substrate, and by pressing the electrode paste transfer member to the side surface of the substrate by the pressing member, the electrode paste transfer member is also applied to the front and back surfaces of the substrate. The electrode paste is wrapped around and transferred to the side surface and the front and back surfaces of the substrate.

[0011]

According to the invention, one or more linear electrode pastes are applied to one surface of the belt-shaped electrode paste transfer member, and the electrode paste transfer member is stretched. The stretched electrode paste transfer member is pressed against the side surface of the substrate arranged facing the electrode paste application surface of the electrode paste transfer member by a pressing member made of an elastic material having a thickness larger than that of the substrate. To be done. At this time, the tip pressing portion of the pressing member is deformed, and the side surface portion of the substrate is buried in the tip portion of the pressing means together with the electrode paste transfer member. As a result, the electrode paste transfer member is pressed against the side surface of the substrate while wrapping around the front and back surfaces of the substrate, and the applied linear electrode paste is transferred to the side surface and front and back surfaces of the substrate to form electrodes. It

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view of essential parts showing a structure for carrying out a method for forming electrodes on a side surface of a substrate according to the present invention.

In FIG. 1, reference numeral 1 is a ribbon (electrode paste transfer member) made of a resin film or the like for transferring an electrode paste. On the lower surface of the ribbon 1, a vertical stripe pattern 1a made of an electrode paste corresponding to the electrode pattern to be formed is formed. The line width and the line spacing D of the vertical stripe pattern 1a are appropriately set according to the electrode pattern to be formed.

The ribbon 1 is moved by a predetermined distance L in the horizontal direction (direction A in the drawing) by a drive roller (not shown) each time an electrode is formed. The movement of the ribbon 1 is performed by winding the ribbon 1 having a finite length by the drive roller or rotating the ribbon 1 at an infinite end by the drive roller or the like.

Numerals 2 to 5 are guide rollers for tensioning the ribbon 1 horizontally and guiding the movement of the ribbon 1. The guide rollers are rotatably supported by a side plate (not shown). Further, 6 and 7 are cushioning rollers which are arranged between the guide rollers 2 and 3 and the guide rollers 4 and 5 so as to be rotatable and vertically swingable.

Reference numeral 8 denotes an electrode paste coating device for coating the ribbon 1 with an electrode paste. The electrode paste applying device 8 is for applying an electrode paste to the ribbon 1 by, for example, ejecting the electrode paste from an ejection nozzle. Reference numeral 9 denotes an electrode paste removing device for removing the electrode paste remaining on the ribbon 1 after forming the electrodes on the substrate 11. The ribbon 1 is wiped and removed by the electrode paste remaining while passing through the electrode paste removing device 9.

A pressing member 10 is arranged above the ribbon 1 so as to be vertically movable and presses the ribbon 1 downward. The pressing member 10 is made of an elastic material such as rubber or silicon resin, has a thickness W larger than the thickness w of the substrate 11, and has a semicircular convex surface 10a. Also,
Reference numeral 11 denotes a substrate on which side surface electrodes are formed, which is arranged below the ribbon 1 and below the pressing member 10. The substrate 11 is fixed at a predetermined position by a positioning member (not shown) with the side surface 11a facing the electrode paste applied to the ribbon 1 (the substrate side surface 11a faces upward).

In the above structure, the side surface 11a of the substrate 11
When a linear electrode is formed on the ribbon, first, the ribbon 1 is conveyed by a predetermined distance L (distance required for forming the electrode on the side surface of the substrate) in the A direction in the drawing. The ribbon 1 is coated with the electrode paste by the electrode paste coating device 8 during the transportation, and the portion where the electrode paste is coated is the substrate 1
It is stretched above the installation position of No. 1 with a predetermined pressure.

Next, the substrate 11 is fixed at a predetermined position,
Then, the pressing member 10 is lowered. Pressing member 10
The amount of descent is adjusted so that the tip of the convex surface 10a of the pressing member 10 is slightly lower than the side surface 11a of the substrate 11 (downward by the distance d in the figure). Therefore, when the pressing member 10 descends to the lowest point, the side surface portion of the substrate 11 together with the ribbon 1 is pressed by the pressing member 1 as shown in the sectional view of FIG.
It will be buried in the convex surface 10a of 0. At this time, the upstream (front surface 11b side) and downstream (back surface 11c side) portions of the ribbon 1 with respect to the substrate 11 are pulled to the substrate 11 side, but the buffer required rollers 6 and 7 move upward. The tension of the ribbon 1 is maintained at a predetermined value.

By the above operation, the ribbon 1 is pressed against the side surface 11a of the substrate 11 by the pressing member 10 with a predetermined pressure, and the front surface 11b and the back surface 11c of the substrate 11 are also pressed.
The electrode paste applied to the ribbon 1 is also transferred to the side surface 11a, the front surface 11b, and the back surface 11c of the substrate 11, and the linear electrode is applied to the side surface 1 of the substrate 11.
1a and front and back surfaces 11b and 11c.

As described above, according to the present invention, the ribbon 1 coated with the electrode paste is pressed against the side surface 11a of the substrate 11 by the pressing member 10 made of an elastic material. Front and back of 11
It is possible to easily form linear electrodes on b and 11c.

In particular, by adjusting the lowering position of the tip of the convex surface 10a of the pressing member 10, that is, the distance d, it is possible to adjust the winding size of the electrodes formed on the front and back surfaces 11b and 11c of the substrate 11. There is an advantage that an electrode longer than the width of the formed electrode can be easily formed. Thereby, for example, the front and back surfaces 11 of the substrate 11
The signal lines formed on b and 11c can be reliably connected by the side surface electrodes. Further, it is possible to sufficiently secure the solder attachment area as the soldering land.

In the above embodiment, the ribbon 1 is moved in one direction each time the electrode is formed, but the ribbon 1 may be moved back and forth every time the electrode is formed.

In the above embodiment, the pressing member 10 is lowered to apply the electrode paste applied to the ribbon 1 to the substrate 11
However, the electrode paste applied to the ribbon 1 may be transferred to the side surface of the substrate 11 by moving the pressing member 10 in the horizontal direction.

[0025]

As described above, according to the present invention,
A band-shaped electrode paste transfer member coated with one or more linear electrode pastes is stretched, and the electrode paste transfer member is applied to the side surface of the substrate by a pressing member made of an elastic material having a thickness larger than that of the substrate. Since the electrodes are formed by pressure contact, the electrode paste transfer member wraps around the front and back surfaces of the substrate, and the electrodes can be easily formed not only on the side surfaces of the substrate but also on the front and back surfaces.

Further, by adjusting the pressing amount of the pressing member, the wraparound amount of the electrode paste transfer member to the front and back surfaces of the substrate can be adjusted, and the wraparound dimension of the electrodes formed on the front and back surfaces of the substrate is formed on the side surface of the substrate. It can be made longer than the electrode width of the electrode to be formed. Thereby, for example, the signal lines formed on the front and back surfaces of the substrate can be reliably connected.
Also, it is possible to secure a solder adhesion area as a soldering land,
The quality of the product can be improved.

Further, since the pressing member presses the back surface of the electrode paste transfer member, the electrode paste does not adhere to the pressing member and become dirty.

Further, even when the electrode pattern to be formed differs depending on the product, it is only necessary to adjust the line width and the line interval of the linear electrode paste to be applied. There is no need to provide a printing pattern or prepare a dedicated jig.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a method of forming electrodes on a side surface of a substrate according to the present invention.

FIG. 2 is a diagram showing a state in which electrodes are formed on the side surface of a substrate.

FIG. 3 is a perspective view showing an SMD having a linear electrode formed on a side surface of a substrate.

FIG. 4 is a diagram showing a conventional method for forming electrodes on the side surface of a substrate.

[Explanation of symbols]

1 Ribbon (electrode paste transfer member) 2-5 guide rollers 6,7 Buffer roller 8 Electrode paste coating device (electrode paste coating means) 9 Electrode paste remover 10 Pressing member 10a lower surface 11 board 11a side of substrate 11b Substrate surface 11c Back side of substrate

Claims (2)

[Claims] 1. A method for forming an electrode on a side surface of a substrate, wherein a linear electrode is formed on a side surface of a substrate having front and back surfaces, wherein
Alternatively, a strip-shaped electrode paste transfer member coated with two or more linear electrode pastes is stretched with the coating surface of the electrode paste facing the side surface of the substrate, and then has a thickness larger than the thickness of the substrate. By pressing the electrode paste transfer member onto the side surface of the substrate with a pressing member made of an elastic material, the electrode paste transfer member is also wrapped around the front and back surfaces of the substrate, and the electrode paste is transferred to the side surface and front and back surfaces of the substrate. A method for forming an electrode on a side surface of a substrate, which comprises: 2. An electrode forming apparatus for forming a linear electrode on a side surface of a substrate having front and back surfaces, wherein a strip-shaped electrode paste transfer means for applying an electrode paste on one surface, and 1 or 2 for the electrode paste. An electrode paste applying means for applying two or more linear electrode pastes; a tensioning means for tensioning the electrode paste transfer means with the electrode paste application surface facing the side surface of the substrate; and a thickness of the substrate. And a pressing member made of an elastic material having a large thickness,
By pressing the electrode paste transfer member to the side surface of the substrate by the pressing member, the electrode paste transfer member is also wrapped around the front and back surfaces of the substrate, and the electrode paste is transferred to the side surface and front and back surfaces of the substrate. A characteristic electrode forming device on the side surface of the substrate.