JPH05206206A - Electronic parts - Google Patents

Electronic parts

Info

Publication number
JPH05206206A
JPH05206206A JP3437392A JP3437392A JPH05206206A JP H05206206 A JPH05206206 A JP H05206206A JP 3437392 A JP3437392 A JP 3437392A JP 3437392 A JP3437392 A JP 3437392A JP H05206206 A JPH05206206 A JP H05206206A
Authority
JP
Japan
Prior art keywords
electronic component
package substrate
package
electronic parts
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP3437392A
Other languages
Japanese (ja)
Inventor
Tadashi Inoue
正 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP3437392A priority Critical patent/JPH05206206A/en
Publication of JPH05206206A publication Critical patent/JPH05206206A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

PURPOSE:To make connection part material like wire unnecessary and miniaturize a package, by joining an electronic parts element to each electrode of a package substrate by using solder or conductive adhesive material. CONSTITUTION:An electronic parts element 4 is mounted on a package substrate 1, and electrodes are mutually connected by using solder bumps (conductive adhesive material) 10 for electric connection. Sealing member (cap) 2 is arranged so as to cover the electronic parts element 4, and bonded and fixed to the package substrate 1 by using adhesive agent 5. Thereby an electronic parts A is formed. Since the electrodes are mutually connected, a process like wire bonding is unnecessary, and the manufacturing process is simplified. A space for accommodating wire or the like is unnecessary, and the package size is reduced, so that a product is miniaturized. Connection reliability can be improved as compared with the case using a wire bonding method.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】この発明は、電子部品に関し、詳
しくは、電子部品素子をパッケージ内に収納、封止して
なる電子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, and more particularly to an electronic component in which electronic component elements are housed and sealed in a package.

【０００２】[0002]

【従来の技術】従来の、電子部品は、例えば、図４に示
すように、パッケージ（ケース）２３内に電子部品素子
２４を収納することにより形成されている。この電子部
品Ｂにおいては、パッケージ２３は、セラミック基板上
に電極（図示せず）を配設してなるパッケージ基板２１
と、同じくセラミックからなる封止部材（キャップ）２
２から構成されている。そして、電子部品素子２４は、
パッケージ基板２１上に載置され、接着剤２５ａにより
パッケージ基板２１上に接着固定されており、かつ、電
子部品素子２４の電極（図示せず）とパッケージ基板２
１の電極（図示せず）が、ワイヤ２６により電気的に接
続されている。さらに、電子部品素子２４は、封止部材
（キャップ）２２を接着剤２５ｂを用いてパッケージ基
板２１に接着することにより、パッケージ基板２１と封
止部材（キャップ）２２から構成されるパッケージ２３
内に収納、封止されている。2. Description of the Related Art A conventional electronic component is formed, for example, by housing an electronic component element 24 in a package (case) 23 as shown in FIG. In this electronic component B, the package 23 is a package substrate 21 in which electrodes (not shown) are arranged on a ceramic substrate.
And a sealing member (cap) 2 also made of ceramic
It consists of two. Then, the electronic component element 24 is
It is placed on the package substrate 21 and is adhesively fixed on the package substrate 21 by the adhesive 25a, and the electrodes (not shown) of the electronic component element 24 and the package substrate 2 are mounted.
One electrode (not shown) is electrically connected by a wire 26. Further, the electronic component element 24 is formed by bonding the sealing member (cap) 22 to the package substrate 21 using the adhesive 25b, so that the package 23 including the package substrate 21 and the sealing member (cap) 22.
It is housed and sealed inside.

【０００３】[0003]

【発明が解決しようとする課題】しかし、上記従来の電
子部品Ｂにおいては、ワイヤ２６により電子部品素子２
４の電極とパッケージ基板２１の電極とを接続するよう
にしているので、ワイヤボンディングの工程が必要とな
り、製造工程が複雑化してコストが増大するという問題
点があり、また、図４に示すように、パッケージ２３内
にワイヤ２６の形状に対応した空間を確保する必要があ
ることから、パッケージ２３の寸法が大きくなり、製品
の小型化を妨げるという問題点がある。However, in the above conventional electronic component B, the electronic component element 2 is formed by the wire 26.
Since the four electrodes and the electrodes of the package substrate 21 are connected to each other, there is a problem that a wire bonding process is required, which complicates the manufacturing process and increases cost, and as shown in FIG. In addition, since it is necessary to secure a space corresponding to the shape of the wire 26 in the package 23, there is a problem that the size of the package 23 becomes large, which hinders downsizing of the product.

【０００４】この発明は、上記問題点を解決するもので
あり、製造が容易で、しかも小型化への対応性に優れた
電子部品を提供することを目的とする。The present invention solves the above problems, and an object of the present invention is to provide an electronic component which is easy to manufacture and has excellent adaptability to miniaturization.

【０００５】[0005]

【課題を解決するための手段】上記目的を達成するため
に、この発明の電子部品は、パッケージ基板と封止部材
とを備えてなるパッケージ内に電子部品素子を収納、封
止した電子部品であって、電子部品素子の電極とパッケ
ージ基板の電極を、半田や導電性ペーストなどの導電性
接着材料で接着することにより、ワイヤなどの接続用部
材を用いることなく直接に接続したことを特徴とするIn order to achieve the above object, the electronic component of the present invention is an electronic component in which an electronic component element is housed and sealed in a package including a package substrate and a sealing member. It is characterized in that the electrodes of the electronic component element and the electrodes of the package substrate are directly connected without using a connecting member such as a wire by adhering them with a conductive adhesive material such as solder or conductive paste. Do

【０００６】[0006]

【作用】電子部品素子の電極とパッケージ基板の電極と
が導電性接着材料により直接に接続され、ワイヤなどの
接続用部材を用いる必要がなくなり、ワイヤボンディン
グを行う工程が不要になることから、製造工程が大幅に
簡略化されるとともに、ワイヤを収納する空間が不要に
なるため、パッケージの寸法を小さくして製品を小型化
することが可能になる。Since the electrode of the electronic component element and the electrode of the package substrate are directly connected by the conductive adhesive material, it is not necessary to use a connecting member such as a wire, and the step of performing wire bonding is not required. Since the process is greatly simplified and the space for accommodating the wires is not necessary, the size of the package can be reduced and the product can be miniaturized.

【０００７】また、電子部品素子の電極とパッケージ基
板の電極とを、ワイヤボンディングの方法による場合よ
りも確実に接続することが可能になる。Further, the electrode of the electronic component element and the electrode of the package substrate can be connected more reliably than in the case of the wire bonding method.

【０００８】[0008]

【実施例】以下、この発明の実施例を図に基づいて説明
する。図１はこの発明の一実施例にかかる電子部品を示
す図、図２及び図３はこの実施例の電子部品の製造工程
を示す図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing an electronic component according to an embodiment of the present invention, and FIGS. 2 and 3 are diagrams showing a manufacturing process of the electronic component of this embodiment.

【０００９】この実施例の電子部品Ａは、図１に示すよ
うに、パッケージ基板１及び封止部材（キャップ）２か
ら形成されるパッケージ３内に電子部品素子４を収納、
封止することにより形成されている。すなわち、この電
子部品Ａにおいては、セラミック基板上に電極（図示せ
ず）を配設してなるパッケージ基板１上に、電子部品素
子４を載置し、導電性接着材料１０を用いて電子部品素
子４の電極（図示せず）とパッケージ基板１の電極（図
示せず）を接着することにより、電子部品素子４がパッ
ケージ基板１に固定されるとともに、電子部品素子４の
電極（図示せず）とパッケージ基板１の電極（図示せ
ず）が電気的に接続されている。そして、セラミックか
らなる封止部材（キャップ）２を電子部品素子４を覆う
ように施し、接着剤５により封止部材２をパッケージ基
板１に接着、固定することにより電子部品Ａが形成され
ている。In the electronic component A of this embodiment, as shown in FIG. 1, an electronic component element 4 is housed in a package 3 formed of a package substrate 1 and a sealing member (cap) 2.
It is formed by sealing. That is, in this electronic component A, the electronic component element 4 is placed on the package substrate 1 in which electrodes (not shown) are provided on the ceramic substrate, and the electronic component is formed by using the conductive adhesive material 10. By bonding the electrode (not shown) of the element 4 and the electrode (not shown) of the package substrate 1, the electronic component element 4 is fixed to the package substrate 1 and the electrode (not shown) of the electronic component element 4 is fixed. ) And an electrode (not shown) of the package substrate 1 are electrically connected. Then, a sealing member (cap) 2 made of ceramic is applied so as to cover the electronic component element 4, and the sealing member 2 is adhered and fixed to the package substrate 1 with an adhesive 5 to form the electronic component A. ..

【００１０】次に、上記電子部品Ａの製造方法について
説明する。上記電子部品Ａを製造するにあたっては、ま
ず、図２に示すように、電子部品素子４の電極（図示せ
ず）上に半田材料（導電性接着材料）からなる半田バン
プ１０を形成する。そして、電子部品素子４の半田バン
プ１０を形成した面をパッケージ基板１に対向させ、半
田バンプ１０がパッケージ基板１の電極（図示せず）と
対向する位置に電子部品素子４を載置した後、所定の温
度に加熱してボンディングを行う。それから、接着剤５
をパッケージ基板１との接触面に塗布した封止部材（キ
ャップ）２を、電子部品素子４を覆うようにパッケージ
基板１に載置して、両者を接着することにより電子部品
素子４をパッケージ基板１及び封止部材（キャップ）２
から形成されるパッケージ３内に電子部品素子４を収
納、封止する。Next, a method of manufacturing the electronic component A will be described. In manufacturing the electronic component A, first, as shown in FIG. 2, the solder bumps 10 made of a solder material (conductive adhesive material) are formed on the electrodes (not shown) of the electronic component element 4. After the surface of the electronic component element 4 on which the solder bumps 10 are formed faces the package substrate 1, the electronic component element 4 is placed at a position where the solder bumps 10 face electrodes (not shown) of the package substrate 1. Bonding is performed by heating to a predetermined temperature. Then, the adhesive 5
The sealing member (cap) 2 applied to the contact surface with the package substrate 1 is placed on the package substrate 1 so as to cover the electronic component element 4, and the both are adhered to form the electronic component element 4 on the package substrate. 1 and sealing member (cap) 2
The electronic component element 4 is housed and sealed in the package 3 formed from.

【００１１】このようにして製造された上記実施例の電
子部品Ａにおいては、電子部品素子４の電極とパッケー
ジ基板１の電極とが半田バンプ（導電性接着材料）１０
により直接に接続されることから、ワイヤボンディング
などの工程が不要になり、製造工程を簡略化することが
できるとともに、ワイヤなどを収納する空間が不要にな
るため、パッケージ３の寸法（高さＨや幅Ｗなど）を小
さくして、製品を小型化することが可能になる。さら
に、電子部品素子４の電極とパッケージ基板１の電極と
の接続信頼性を、ワイヤボンディングの方法による場合
よりも向上させることができる。In the electronic component A of the above-described embodiment manufactured in this way, the electrodes of the electronic component element 4 and the electrodes of the package substrate 1 are solder bumps (conductive adhesive material) 10
Since it is directly connected by means of, the steps such as wire bonding are unnecessary, the manufacturing process can be simplified, and the space for accommodating wires and the like is not required. Therefore, the size of the package 3 (height H And width W) can be made smaller to make the product smaller. Furthermore, the connection reliability between the electrode of the electronic component element 4 and the electrode of the package substrate 1 can be improved as compared with the case of the wire bonding method.

【００１２】なお、上記実施例では、半田材料を用いて
半田バンプを形成した場合について説明したが、この発
明の電子部品においては、導電性接着材料の種類に特に
制約はなく、クリーム半田を印刷するようにして用いて
もよく、また、Ａｇペーストのような導電性ペーストを
用いることも可能である。In the above embodiment, the case where the solder bump is formed by using the solder material has been described. However, in the electronic component of the present invention, the type of the conductive adhesive material is not particularly limited, and the cream solder is printed. Alternatively, a conductive paste such as Ag paste can be used.

【００１３】また、上記実施例では、セラミックからな
るパッケージ基板及び封止部材（キャップ）を用いた場
合について説明したが、パッケージ基板及び封止部材
（キャップ）を構成する材料には特に制約はなく、その
用途などに応じて種々の材料から適当な材料を選択して
用いることが可能である。In the above embodiment, the case where the package substrate and the sealing member (cap) made of ceramics are used has been described, but there is no particular limitation on the material forming the package substrate and the sealing member (cap). It is possible to select and use an appropriate material from various materials according to its application.

【００１４】[0014]

【発明の効果】上述のように、この発明の電子部品は、
電子部品素子の電極とパッケージ基板の電極を、ワイヤ
などの接続用部材を用いずに導電性接着材料で直接に接
続するようにしているので、ワイヤボンディングの工程
が不要になり製造工程を簡略化することが可能になると
ともに、パッケージにワイヤなどの接続用部材を収納す
る空間を確保することが不要になり製品の小型化を実現
することができる。As described above, the electronic component of the present invention is
Since the electrodes of the electronic component element and the electrodes of the package substrate are directly connected with a conductive adhesive material without using connecting members such as wires, the wire bonding process is not required and the manufacturing process is simplified. In addition, it is not necessary to secure a space for accommodating a connecting member such as a wire in the package, and the product can be downsized.

【００１５】また、電子部品素子の電極とパッケージ基
板の電極とをより確実に接続することが可能になり製品
の信頼性を向上させることができる。Further, the electrode of the electronic component element and the electrode of the package substrate can be connected more reliably, and the reliability of the product can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図１】この発明の一実施例にかかる電子部品を示す断
面図である。FIG. 1 is a sectional view showing an electronic component according to an embodiment of the present invention.

【図２】この発明の一実施例にかかる電子部品の製造工
程を示す図である。FIG. 2 is a diagram showing a manufacturing process of an electronic component according to an embodiment of the present invention.

【図３】この発明の一実施例にかかる電子部品の製造工
程を示す図である。FIG. 3 is a diagram showing a manufacturing process of an electronic component according to an embodiment of the present invention.

【図４】従来の電子部品を示す断面図である。FIG. 4 is a cross-sectional view showing a conventional electronic component.

【符号の説明】[Explanation of symbols]

Ａ 電子部品 １ パッケージ基板 ２ 封止部材（キャップ） ３ パッケージ ４ 電子部品素子 １０ 導電性接着材料（半田バンプ） A electronic component 1 package substrate 2 sealing member (cap) 3 package 4 electronic component element 10 conductive adhesive material (solder bump)

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 パッケージ基板と封止部材とを備えてな
るパッケージ内に電子部品素子を収納、封止した電子部
品であって、電子部品素子の電極とパッケージ基板の電
極を、半田や導電性ペーストなどの導電性接着材料で接
着することにより、ワイヤなどの接続用部材を用いるこ
となく直接に接続したことを特徴とする電子部品。1. An electronic component in which an electronic component element is housed and sealed in a package including a package substrate and a sealing member, wherein the electrode of the electronic component element and the electrode of the package substrate are soldered or conductive. An electronic component characterized by being directly connected without using a connecting member such as a wire by being bonded with a conductive adhesive material such as paste.
JP3437392A 1992-01-23 1992-01-23 Electronic parts Withdrawn JPH05206206A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3437392A JPH05206206A (en) 1992-01-23 1992-01-23 Electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3437392A JPH05206206A (en) 1992-01-23 1992-01-23 Electronic parts

Publications (1)

Publication Number Publication Date
JPH05206206A true JPH05206206A (en) 1993-08-13

Family

ID=12412369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3437392A Withdrawn JPH05206206A (en) 1992-01-23 1992-01-23 Electronic parts

Country Status (1)

Country Link
JP (1) JPH05206206A (en)

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19990408