JP2818506B2 - Manufacturing method of electronic component storage package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a package for housing electronic parts, and more particularly to a method for manufacturing a package for housing glass-sealed electronic parts.

[0002]

2. Description of the Related Art Conventionally, there are a printing method and a preform method as a method of sealing a glass-sealed electronic component housing package. In the printing method, a glass paste is applied by a screen printing method and baked in order to form a glass layer on at least one of a pair of insulators constituting a package. Here, since the glass layer formed by one printing is thin, application and baking are repeated several times until the glass layer reaches a predetermined thickness. The other insulator is overlaid on the completed glass layer, melted, and the two insulators are bonded.

In the preform method, both insulators are bonded by placing and melting a preform glass stamped in a predetermined shape between a pair of insulators.

[0004]

In the conventional printing method, the application and baking of the glass paste needs to be repeated several times, so that the number of steps is increased. Further, when the number of steps of application and baking is large, the problem that the glass paste is scattered at the time of application and adheres to the insulator, and that the dust is baked into the glass paste at the time of baking tends to occur. Therefore, the yield of the package is reduced. Also,
In the printing method, it is difficult to increase the accuracy of the thickness of the glass.

In the preform method, the preform glass is arranged between a pair of insulators and is not fixed, and therefore may be shrunk and deformed independently during melting. As a result, the preform glass does not adhere properly to the insulator, which lowers the package yield. An object of the present invention is to provide a method for manufacturing an electronic component housing package that can be manufactured with a small number of steps and with good yield.

[0006]

SUMMARY OF THE INVENTION According to the present invention, there is provided a method of manufacturing an electronic component storage package, comprising the steps of: storing an electronic component in a space formed by combining a first half and a second half; This is a method for manufacturing a package. This manufacturing method includes a step of superimposing the first half and the preform glass via a glass paste layer, a step of superimposing the second half on the preform glass, and a step of laminating the glass paste layer and the preform glass. Fusing and bonding the two halves.

[0007]

In the method of manufacturing an electronic component housing package according to the present invention, a thick glass paste layer is unnecessary, so that the steps of applying and baking a glass layer can be reduced. For this reason, problems such as scattering of the glass paste during the coating and baking steps of the glass layer are less likely to occur. Further, in this manufacturing method, the preform glass is fixed to the first half by the glass paste prior to melting, so that deformation of the preform glass during melting hardly occurs,
The bonding process is performed with high accuracy. Therefore, the yield of the package is improved.

[0008]

FIG. 1 shows a package 1 for accommodating a semiconductor device to which an embodiment of the present invention can be applied. The semiconductor element storage package 1 mainly includes a base 2 and a lid 3. The base 2 is a substantially rectangular plate-like member, and is made of, for example, an electrically insulating material such as ceramic or glass. A recess 2b is formed in a substantially central portion of the upper surface 2a of the base 2. A semiconductor element 5 is mounted on the bottom surface of the concave portion 2b via an adhesive layer 4 made of low-melting glass. The first glass layer 6 is formed on the upper surface 2a of the base 2.

An external lead terminal 7 made of a conductive material such as aluminum, copper, or Kovar is fixed on the first glass layer 6. Each external lead terminal 7
It is connected to each electrode of the semiconductor element 5 by a bonding wire 8. The lid 3 placed above the base 2 is a substantially rectangular plate-like member, and is made of an electrically insulating material such as ceramic or glass like the base 2. The cover 3 has a recess 3 b corresponding to the recess 2 b on the base 2 side.

A second glass layer 9 is formed on the main surface 3a (lower surface in FIG. 1) of the lid 3. The second glass layer 9 and the first glass layer 6 are cured in a state of being fused with each other, and fix the base 2 and the lid 3 to hermetically seal the inside of the package 1. Next, as an embodiment of the present invention, a method of manufacturing the above-described semiconductor device housing package 1 will be described.

First, a preform glass 9b (FIG. 2)
Prepare When manufacturing this preform glass 9b
First, PbO-B_TwoO_ThreeLow melting glass powder
(For example, 78 wt% of PbO, B_TwoO_ThreeIs 6wt
%, TiO_TwoIs 13wt%, ZrO _TwoIs 2 wt%, Si
O_TwoIs 1 wt%) by using a polystyrene-based solvent
And paste it into a doctor.
Form into sheet by blade method (10-100μ thickness)
m). Subsequently, it is dried at a temperature of about 150 to 200 ° C.
After that, it is punched out by a mold and a rectangle as shown in FIG.
(For example, the outer dimension is 39.5 × 8.85m
m, inner dimension is 36.3 × 7.35 mm), preform gas
The lath 9b is obtained.

On the other hand, the lid 3 is formed from the powder material by press molding and firing (FIG. 3). Then, using a glass paste obtained by adding a suitable binder (for example, a polyhydric alcohol-based binder) to the low-melting glass powder, printing is performed once by well-known screen printing, and the main surface 3 a Then, a glass paste layer 9a is formed (FIG. 4). Subsequently, the frame-shaped preform glass 9b shown in FIG. 2 is arranged on the glass paste layer 9a (FIG. 5).
At this time, the preform glass 9b is fixed to the lid 3 by the glass paste layer 9a.

From the state shown in FIG. 5, the lid 3 is passed through a glass firing furnace and heated. Then, the binder in the glass paste layer 9a and the preform glass 9b scatters to the outside, and the glass paste layer 9a and the preform glass 9b fuse to form the second glass layer 9 (FIG. 6). . In the step of forming the second glass layer 9, the glass paste layer 9a is formed by a single screen printing method, and is formed in a smaller number of steps than the conventional printing method. Since it is not necessary to perform screen printing several times, the problem that the glass paste is scattered and adheres to other portions of the lid 3 is less likely to occur. In addition, the problem that dust is burned into the glass paste layer during baking is less likely to occur. Furthermore, the preform glass 9b
Is used, the accuracy of the thickness of the second glass layer 9 is improved. Moreover, in this embodiment, since the preform glass 9b is fixed to the main surface 3a of the lid 3, the preform glass 9b is fixed to the lid 3 in a normal state without being deformed during melting. .

On the other hand, similarly to the lid 3, the base 2 is formed from a powdery material by press molding and firing. Next, the adhesive layer 4 is formed on the bottom surface of the concave portion 2b of the base 2. The adhesive layer 4 is formed by printing a paste of low melting point glass a plurality of times,
It is formed by melting once and scattering the binder inside. Then, a glass paste layer is formed on the upper surface 2a of the base 2 by a single screen printing method. The preform glass is placed on the glass paste layer and baked and melted to form the first glass layer 6. The function and effect in the step of forming the first glass layer 6 on the side of the base 2 are the same as the case of forming the second glass layer 9 on the lid 3.

Next, the external lead terminals 7 are connected to the first glass layer 6.
Temporarily fix on top. At this time, the first glass layer 6 is slightly melted by heating, and the external lead terminals 7 are embedded therein. Thereafter, the semiconductor element 5 is placed on the adhesive layer 4 and the adhesive layer 4 is melted again to attach the semiconductor element 5 to the base 2.
To be fixed. Subsequently, the electrodes of the semiconductor element 5 are connected to the external lead terminals 7 using the bonding wires 8.

Next, as shown in FIG.
Cover from above. From this state, the first glass layer 6 and the second glass layer 9 are integrally melted by heating, and the interior of the package 1 is hermetically sealed by joining the two.
As described above, since the first glass layer 6 and the second glass layer 9 have high accuracy and improved reliability, the yield in manufacturing the semiconductor element housing package 1 is high.

Incidentally, as a result of the experiment, it was found that
In the case where the defect rate was 5%, the method according to the present invention resulted in a defect rate of 5%. [Other Embodiments] (a) In the above embodiment, the cover 3
In the step of forming the glass layer 9, the glass paste layer 9a was formed on the lid 3 first, but the preform glass 9b was formed first.
May be formed with a glass paste layer 9a.

In this case, first, a glass paste layer 9a is formed on the preform glass 9b (FIG. 8) by a screen printing method (FIG. 9). Then, the main surface 3a of the lid 3 is fixed to the glass paste layer 9a (FIG. 10).
In this step, since the glass paste is not printed on the lid 3 side, the scattered glass paste does not adhere to the lid 3 side.

This method is also effective when forming the first glass layer 6 on the base 2 side. (B) In the above embodiment, the method is for a package in which a glass layer is previously formed on both sides of the base and the lid. However, the present invention may be applied to a package in which a glass layer is previously formed only on the lid. . (C) Semiconductor device housing package 11 shown in FIG.
The present invention may be adopted for This package 11
Then, the lid 13 is provided on the main surface 12 a of the base 12 with the glass layer 1.
8, and hermetically seals a recess 12 b formed substantially at the center of the main surface 12 a of the base 12.

At the time of manufacturing the package 11, first, a glass paste layer 19a is formed on the outer peripheral portion on the main surface 12a side of the lid 13 by a known screen printing method (FIG. 12). On this glass paste layer 19a, a preform glass 19b stamped into a predetermined frame shape is fixed (FIG. 13). From this state, the glass paste layer 19
is melted to form a glass layer 19 on the lid 13.
Next, the lid 13 is placed so that the glass layer 19 is on the side of the base 12.
Is placed on the substrate 12. Finally, high-temperature heating is performed to melt the glass layer 19, fix the lid 13 to the base 12, and hermetically seal the recess 12b of the base 12 (FIG. 1).
4). In this embodiment, the same effects as in the above embodiment can be obtained. (D) Although the above embodiment is directed to a method for accommodating a semiconductor element package, the present invention may be applied to other electronic component accommodating packages.

[0021]

According to the method of manufacturing an electronic component housing package according to the present invention, the first half and the preform glass are overlapped via the glass paste layer. for that reason,
The number of steps can be reduced, and the yield of the package is improved.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a package for housing a semiconductor element to which an embodiment of the present invention is applied.

FIG. 2 is a plan view of the preform glass.

FIG. 3 is a partial vertical cross-sectional view showing one process of a manufacturing process of the lid.

FIG. 4 is a partial vertical cross-sectional view showing one process of a manufacturing process of the lid.

FIG. 5 is a partial vertical cross-sectional view showing one process of a manufacturing process of the lid.

FIG. 6 is a partial vertical cross-sectional view showing one process of a manufacturing process of the lid.

FIG. 7 is a partial vertical cross-sectional view showing one process of a manufacturing process of the package for housing a semiconductor element.

FIG. 8 is a partial vertical cross-sectional view showing one step in a manufacturing process of a lid according to another embodiment.

FIG. 9 is a partial vertical cross-sectional view showing one step in a manufacturing process of the lid according to the embodiment.

FIG. 10 is a partial vertical cross-sectional view showing one step in a manufacturing process of the lid according to the embodiment.

FIG. 11 is a view corresponding to FIG. 1 of still another embodiment.

FIG. 12 is a partial vertical cross-sectional view showing one process of a manufacturing process of the lid.

FIG. 13 is a partial vertical cross-sectional view showing one process of a manufacturing process of the lid.

FIG. 14 is a partial vertical cross-sectional view showing one step in a process of manufacturing the semiconductor element housing package.

DESCRIPTION OF SYMBOLS 1,11 Package for storing semiconductor element 2,12 Base 3,13 Lid 5 Semiconductor element 9a, 19a Glass paste layer 9b, 19b Preform glass

Claims (1)

(57) [Claims] 1. A method for manufacturing an electronic component storage package for storing an electronic component in a space formed by combining a first half and a second half, wherein the first half, a preform glass, Laminating via a glass paste layer; laminating the second half on the preform glass; melting the glass paste layer and the preform glass to form the two halves. A method of manufacturing a package for storing electronic components, the method including: bonding.