JPH05203924A - Method and device for polishing liquid crystal glass plate - Google Patents

Abstract

PURPOSE:To obviate chipping of the fracture surface of a liquid crystal glass plate, flawing of an operator and coating of the plate with a synthetic resin. CONSTITUTION:The method for polishing the fracture surface of the liquid crystal glass plate 1 includes at least a stage for holding the liquid crystal glass plate 1 in a prescribed holding means 4, an alignment stage for setting the liquid crystal glass plate 1 held in this holding means 4 at a prescribed position, a chamfering stage for chamfering the liquid crystal glass plate 1 and a polishing stage for polishing the flanks of the liquid crystal glass plate 1. The holding means 4 for holding the liquid crystal glass plate 1, an alignment means for setting the liquid crystal glass plate 1 at the prescribed position, a 1st polishing means 5 for executing chamfering of the liquid crystal glass plate 1 and a 2nd polishing means 7 for polishing the flanks are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for polishing a liquid crystal glass plate and an apparatus therefor.

[0002]

2. Description of the Related Art As shown in FIG. 5, a liquid crystal glass plate used for a display device or the like is formed by laminating two transparent glasses a and b so as to hold a predetermined distance with a seal member c interposed therebetween. The large-sized liquid crystal glass plate A is cut at a predetermined location to separate it into a small-sized liquid crystal glass plate B. Liquid crystal is injected into the space surrounded by the seal member c, and the small size liquid crystal glass plate B is provided on the inner surface side of the lower glass plate b by cutting the upper glass plate a as shown in FIG. The exposed wiring pad portion d is exposed, and a predetermined external wiring is connected to the wiring pad portion d.

[0003]

To form a small-sized liquid crystal glass plate B (FIG. 6) from the large-sized liquid crystal glass plate A (FIG. 6), scribing is performed using a glass cutting machine based on the cross-shaped alignment mark e. It is formed by breaking. Further, the liquid crystal glass plate B ′ (FIG. 7) is formed by scribing along the line f ′ slightly inside to remove the line f for preventing electrostatic charge, and the fracture surface g is shown in FIG. As shown in Fig. 8, the uneven surface was finely wavy, and was sharp and easily chipped. In such a liquid crystal glass plate B ', the fracture surface g is chipped and dropped in the subsequent process, which adversely affects the wiring processing to the wiring pad portion d, and the operator cuts the hand at the fracture surface. There was a problem. To solve this problem, for example, the fracture surface g of the liquid crystal glass plate B'may be coated with synthetic resin. However, as shown in FIG. 9, when the synthetic resin h covers the wiring pad portion d, wiring work is performed. In addition, it takes time to cover the synthetic resin h, which causes new problems such as deterioration of workability.

The present invention has been made in view of the above-mentioned conventional problems, and it is necessary to coat a synthetic resin without breaking the fractured surface of the separated liquid crystal glass plate or injuring an operator. It is an object of the present invention to provide a method for polishing a liquid crystal glass plate and a device therefor which are free from the above.

[0005]

As a means for technically solving this problem, the present invention is a polishing method for polishing a fractured surface of a liquid crystal glass plate, wherein the liquid crystal glass plate is held by a predetermined holding means. Holding the liquid crystal glass plate held by the holding means at a predetermined position, an alignment process for positioning the liquid crystal glass plate at a predetermined position, a chamfering process for chamfering the liquid crystal glass plate, and a polishing process for polishing the side surfaces. The method is the gist. Further, according to the present invention, a holding means for holding the liquid crystal glass plate, an alignment means for positioning the liquid crystal glass plate at a required position, a first polishing means for chamfering the liquid crystal glass plate, and a first polishing means for polishing the side surface. The gist is a liquid crystal glass plate polishing apparatus including two polishing means.

[0006]

[Operation] A small size liquid crystal glass plate (B '), which has been cut and separated from a large-sized liquid crystal glass plate and from which the electrostatic charge prevention line f has been removed, is held by the holding means and positioned by the alignment means. By chamfering the broken surface of the liquid crystal glass plate by polishing means and polishing the side surface, the broken surface can be processed flat to prevent chipping, and the sharpness of the edges can be eliminated to prevent injury to workers. It is not necessary to coat the cross section with synthetic resin.

[0007]

The present invention will be described in detail below with reference to the illustrated embodiments. In FIG. 1, reference numeral 1 denotes a liquid crystal glass plate indicated by B'in FIG. 7, which is cut from the large-sized liquid crystal glass plate A shown in FIG. And a scribe line 1a, 1 which is the same as the rupture face g shown in FIG.
b, 1c, and the periphery of the upper glass plate 2 is cut along the edge of the fracture surface to expose the wiring pad portions 3, respectively.

The liquid crystal glass plate 1 is adsorbed and held on a holding table 4a which is a holding means 4, and the holding table 4a is preferably formed so as to be indexed and rotatable by 360 °.

Reference numeral 5 denotes a first polishing means, and a polishing blade 6 for chamfering is attached to the tip of the rotary shaft.
Reference numeral 7 denotes a second polishing means, which is arranged next to the first polishing means 5 in parallel, and a polishing blade 8 for side surface polishing is attached to the tip of the rotary shaft. This first polishing means 5 and the second
The polishing means 7 is formed so as to be movable in the x direction and the y direction shown in FIG.

The liquid crystal glass plate 1 has the fracture surface 1a,
1b, 1c so that the line L of the edge of the fracture surface to be polished is parallel to the x direction and properly receives the polishing action of the first and second polishing means 5, 7. Alignment is performed by an alignment means (not shown) including a known optical means while moving the holding table 4a.

After the liquid crystal glass plate 1 holding process and alignment process are completed, the fracture surface of the liquid crystal glass plate 1 is
Polishing is performed by moving in the x direction relative to the second polishing means 5 and 7. In the illustrated example, the first and second polishing means 5 and 7 are moved in the x direction.

First, the upper edge of the fracture surface 1a of the liquid crystal glass plate 1 is chamfered P by the first polishing means 5 as shown in FIG. 3B, and then by the second polishing means 7. The side surface is subjected to plane polishing Q as shown in FIG.
The wiring pad portion 3 has its end edges aligned along the line M of the upper edge of the chamfered P surface as shown in FIG.

Next, the holding table 4a is rotated by 90 ° to index the fracture surface 1b or 1c to the polishing position, and the end face of the fracture surface 1b or 1c is aligned parallel to the x direction by the alignment means, and then the first and second polishing operations are performed. Polishing is performed by means 5 and 7. Finally, the holding table 4a is rotated again to index the remaining fracture surface to the polishing position, and the end face thereof is aligned parallel to the x direction by the alignment means, and then the first and second polishing means 5, 7 are provided. The polishing process is performed by.

Thus, the fracture surfaces 1a, 1b, 1c in the three directions of the liquid crystal glass plate 1 are all chamfered P on the upper edge and polished Q on the side surface. Since the fracture surface of the liquid crystal glass plate 1 is flattened and polished, chipping can be prevented in advance, and the chamfering process can eliminate the sharpness of the edge to prevent injury to the operator's hand. Since it is not necessary to cover the wiring pad portion 3, the wiring pad portion 3 can be protected and the wiring work can be performed smoothly.

However, as shown in FIG. 4, the fracture surface 2a of the upper glass plate 2 is left as it is without being processed, but this portion is located inside the outer peripheral edge of the liquid crystal glass plate 1, Since there is almost no direct contact with the operator's hands, no trouble occurs. Of course, it is even better if the fracture surface 2a of the upper glass plate 2 is processed similarly to the fracture surface of the liquid crystal glass plate. Further, the present invention can be effectively utilized if it has the fracture surface g shown in FIG. 8, and the gist of the invention is not limited by the manufacturing process of the liquid crystal plate, the number of fracture surfaces, and the like.

[0016]

As described above, according to the present invention,
Since the fracture surface of the liquid crystal glass plate is ground flat and the upper edge is chamfered, the fracture surface does not chip and fall, and it is possible to prevent worker's hand injury. It is possible to obtain an excellent effect that it is not necessary to cover the fracture surface with a synthetic resin or the like.

[Brief description of drawings]

FIG. 1 is a plan view of an essential part showing an embodiment of the present invention.

FIG. 2 is a schematic front view thereof.

3A to 3C are explanatory views showing a state of polishing a fracture surface of a liquid crystal glass plate.

FIG. 4 is a partial perspective view of a liquid crystal glass plate after polishing.

FIG. 5 shows a large-format liquid crystal glass plate, (a) is a plan view and (b) is a front view thereof.

FIG. 6 is a plan view of a small-sized liquid crystal glass plate separated from a large-sized liquid crystal glass plate.

FIG. 7 is a perspective view of the liquid crystal glass plate with a wiring pad portion exposed.

FIG. 8 is an enlarged view of an R portion in FIG.

FIG. 9 shows a conventional example in which a fracture surface of a liquid crystal glass plate is coated with a synthetic resin, (a) is a plan view, and (b) is a cross-sectional view.

[Explanation of symbols]

1 ... Liquid crystal glass plate 1a, 1b, 1c ... Broken surface 2
… Upper glass plate 2a… Fracture surface 3… Wiring pad
4 ... Holding means 4a ... Holding table 5 ... First polishing means 6 ... Polishing blade 7 ... Second polishing means 8 ... Polishing blade P ... Chamfering processing Q ... Flat surface polishing processing

Claims (2)

[Claims] 1. A polishing method for polishing a fractured surface of a liquid crystal glass plate, the method comprising: holding the liquid crystal glass plate in a predetermined holding means; and positioning the liquid crystal glass plate held in the holding means at a predetermined position. A liquid crystal glass plate polishing method comprising at least an alignment process, a chamfering process for chamfering a liquid crystal glass plate, and a polishing process for polishing side surfaces. 2. A holding means for holding the liquid crystal glass plate, an alignment means for positioning the liquid crystal glass plate at a required position, a first polishing means for chamfering the liquid crystal glass plate, and a second side surface for polishing. Liquid crystal glass plate polishing apparatus comprising the above polishing means.