KR100778864B1 - Tape laminating apparatus - Google Patents

Tape laminating apparatus Download PDF

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Publication number
KR100778864B1
KR100778864B1 KR1020060137292A KR20060137292A KR100778864B1 KR 100778864 B1 KR100778864 B1 KR 100778864B1 KR 1020060137292 A KR1020060137292 A KR 1020060137292A KR 20060137292 A KR20060137292 A KR 20060137292A KR 100778864 B1 KR100778864 B1 KR 100778864B1
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KR
South Korea
Prior art keywords
wafer
protective film
protection plate
laminating apparatus
tape laminating
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KR1020060137292A
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Korean (ko)
Inventor
남정현
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동부일렉트로닉스 주식회사
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Priority to KR1020060137292A priority Critical patent/KR100778864B1/en
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Publication of KR100778864B1 publication Critical patent/KR100778864B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

Abstract

A tape laminating apparatus is provided to prevent scratches on a wafer or a breakdown of the wafer by cutting a wafer protection film after loading a wafer protection plate on a wafer. A wafer(204) is loaded on a taping table(200). A protective film(202) is attached to the wafer. A cylinder(208) includes a wafer protection plate(206) formed at a lower end thereof. The wafer protection plate is loaded on the taping table in order to be loaded on the wafer to which the protective film is attached. The wafer protection plate of the cylinder is loaded on the wafer. A rotary cutter is formed to cut the protective film of the wafer along a shape of the wafer. The protective plate is formed with ceramic.

Description

테이프 라미네이팅 장치{Tape Laminating Apparatus}Tape Laminating Apparatus

도 1은 종래 기술에서 웨이퍼의 보호 필름 커팅시 깨진 웨이퍼 이미지.1 is a broken wafer image when cutting a protective film of the wafer in the prior art.

도 2a 내지 도 2b는 본 발명에 따른 테이프 라미네이팅 장치를 설명하기 위하여 도시한 사시도.Figures 2a to 2b is a perspective view for explaining the tape laminating apparatus according to the present invention.

*** 도면의 주요 부분에 대한 부호의 설명 ****** Explanation of symbols for the main parts of the drawing ***

200: 테이핑 테이블(Taping table) 202: 웨이퍼 보호 필름200: taping table 202: wafer protection film

204: 웨이퍼(wafer) 206: 웨이퍼 보호 플레트(plate)204: wafer 206: wafer protection plate

208: 실린더(cylinder)208: cylinder

본 발명은 테이프 라미네이팅 장치에 관한 것으로, 특히, 웨이퍼의 보호 필름 커팅 중에 웨이퍼가 깨지는 것을 방지하는 테이프 라미네이팅 장치에 관한 것이다.TECHNICAL FIELD The present invention relates to a tape laminating apparatus, and more particularly, to a tape laminating apparatus for preventing a wafer from breaking during cutting of a protective film of a wafer.

반도체 패키지의 크기를 더욱 작게 하고 두께를 더욱 얇게 하기 위하여 반도체 웨이퍼(wafer)에 대하여 배면 연마(backside grinding)를 행하고 있으며, 반도체 제조공정용 테이프 라미네이팅 공정은 배면 연마 공정 전의 처리 공정이다. 이 라미네이팅 공정은, 웨이퍼의 배면 연마 공정시 사용되는 연삭수, 또는 연삭 후 발생하는 웨이퍼 파티클 등으로부터 웨이퍼의 전면을 보호하기 위하여 웨이퍼의 전면에 테이프를 접착하는 공정에 해당한다.In order to make the size of the semiconductor package smaller and the thickness thinner, backside grinding is performed on the semiconductor wafer, and the tape laminating process for the semiconductor manufacturing process is a processing step before the back polishing process. This laminating process corresponds to the process of adhering a tape to the front surface of a wafer in order to protect the front surface of a wafer from the grinding water used at the back grinding process of a wafer, or the wafer particle which generate | occur | produces after grinding.

이러한 라미네이팅 공정은 웨이퍼(Wafer)의 상면이 상방을 향하도록 척 테이블(chuck table)에 웨이퍼를 안착한 상태에서 보호 필름을 웨이퍼의 상면으로 진행시키고, 롤러(roller)(미도시)를 이용하여 보호필름을 압착시켜 웨이퍼(W)의 상면에 부착한다.In this laminating process, the protective film is advanced to the upper surface of the wafer while the wafer is placed on the chuck table so that the upper surface of the wafer faces upward, and the protective film is used by using a roller (not shown). Is pressed and adhered to the upper surface of the wafer (W).

이후, 웨이퍼에 부착한 보호필름은 직선 이동용과 회전용 커터(cutter)에 의해 웨이퍼(W)의 플랫존(flat zone)과 가장자리에 맞도록 웨이퍼의 모양대로 커팅된다.Subsequently, the protective film attached to the wafer is cut in the shape of the wafer so as to fit into the flat zone and the edge of the wafer W by a linear cutter for rotation and rotation.

그러나, 웨이퍼의 보호 필름을 커팅하는 중에 웨이퍼의 에지(Wager edge) 부분이 깨끗하지 않아 웨이퍼에 흠집(Scratch) 또는 도 1의 (A)에서 나타낸 바와 같이, 웨이퍼가 깨지(broken)는 문제점이 있다.However, there is a problem that the wafer edge portion is not clean while cutting the protective film of the wafer, and thus the wafer is scratched or broken as shown in FIG. 1A. .

본 발명은 상술한 바와 같은 종래 기술의 문제점을 해결하기 위하여 제안된 것으로, 웨이퍼의 보호 필름 커팅 중에 웨이퍼가 깨지는 것을 방지하는 테이프 라미네이팅 장치를 제공하는 데 목적이 있다.The present invention has been proposed to solve the problems of the prior art as described above, and an object thereof is to provide a tape laminating apparatus for preventing a wafer from being broken during cutting of a protective film of the wafer.

전술한 목적을 달성하기 위한 본 발명의 특징은 테이프 라미네이팅 장치에 있어서, 보호필름을 부착할 웨이퍼를 안착하는 테이핑 테이블과, 상기 테이핑 테이 블에 안착하여 상기 보호 필름을 부착한 상기 웨이퍼 위에 안착하여 상기 웨이퍼를 보호하는 웨이퍼 보호 플레트를 하단부에 구비하고 승강이 가능한 핑커 샤프트와, 상기 웨이퍼 위에 상기 핑커 샤프트의 웨이퍼 보호 플레이트를 안착하여 상기 웨이퍼의 보호 필름을 상기 웨이퍼의 모양대로 커팅(cutting)하는 회전용 커터를 포함하는 테이프 라미네이팅 장치에 관한 것이다.A feature of the present invention for achieving the above object is a tape laminating apparatus, comprising: a taping table for seating a wafer on which a protective film is to be attached; Rotation for cutting the wafer's protective film in the shape of the wafer by mounting a pinkish shaft which can be lifted up and down, and a wafer protection plate for protecting the wafer, and a wafer protection plate of the pinker shaft on the wafer. A tape laminating device comprising a cutter.

본 발명에서 상기 보호 플레이트는 세라믹으로 형성하는 것을 특징으로 한다.In the present invention, the protective plate is formed of a ceramic.

이하에서 첨부된 도면을 참조하여 본 발명에 따른 테이프 라미네이팅 장치에 대해서 상세히 설명한다.Hereinafter, a tape laminating apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

도 2a 내지 도 2b는 본원 발명에 따른 테이프 라미네이팅 장치를 설명하기 위하여 도시한 사시도이다.2A to 2B are perspective views illustrating the tape laminating apparatus according to the present invention.

도 2a에서 나타낸 바와 같이, 웨이퍼(wafer)(202)의 상면이 상방을 향하도록 테이핑 테이블(taping table)(200)에 웨이퍼를 안착한 상태에서 보호필름(204)을 웨이퍼(wafer)(202)의 상면으로 진행시키고, 롤러(roller)(미도시)를 이용하여 압착시켜 웨이퍼의 상면에 보호필름(204)을 부착한다.As shown in FIG. 2A, the protective film 204 of the wafer 202 is placed on the taping table 200 so that the top surface of the wafer 202 faces upward. Proceeding to the upper surface, using a roller (not shown) is pressed to attach a protective film 204 to the upper surface of the wafer.

도 2b에서 나타낸 바와 같이, 웨이퍼(202)에 보호 필름(204)의 부착을 완료한 후 승강 가능한 실리던(208) 하단부에 고정되어 웨이퍼 보호 플레트(plate)(206)를 보호 필름이 부착된 웨이퍼(204) 위에 안착시킨 후 회전용 커터(cutter)(210)를 이용하여 웨이퍼의 플랫존(flat zone)과 가장자리에 맞도록 웨이퍼의 모양대로 보호 필름(202)을 커팅한다.As shown in FIG. 2B, the attachment of the protective film 204 to the wafer 202 is completed and then fixed to the lower end of the liftable cylinder 208 so that the protective film is attached to the wafer protection plate 206. After mounting on the wafer 204, the protective film 202 is cut in the shape of the wafer to fit the flat zone and the edge of the wafer using the rotating cutter 210.

여기서, 웨이퍼 보호 플레트는 세라믹으로 형성할 수 있다.Here, the wafer protection plate may be formed of ceramic.

이와 같이, 보호 필름을 부착한 웨이퍼 위에 웨이퍼 보호 플레트를 안착한 후 보호 필름을 커팅하여 웨이퍼가 깨지(broken)는 것을 방지할 수 있다.As such, after the wafer protection plate is placed on the wafer to which the protective film is attached, the protective film may be cut to prevent the wafer from being broken.

이상과 같이 본 발명은 비록 한정된 실시 예와 도면에 의해 설명되었으나, 본 발명은 상기의 실시 예에 한정되는 것이 아니며, 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면, 이러한 기재로부터 다양한 수정 및 변형이 가능하다.As described above, although the present invention has been described with reference to the limited embodiments and the drawings, the present invention is not limited to the above embodiments, and those skilled in the art to which the present invention pertains can make various modifications and Modifications are possible.

그러므로, 본 발명의 범위는 설명된 실시 예에 국한되어 정해져서는 아니되며, 후술하는 특허청구범위뿐만 아니라 이 특허 청구범위와 균등한 것들에 의해 정해져야 한다.Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below but also by the equivalents of the claims.

이상에서 설명한 바와 같이, 본 발명에 따른 테이프 라미네이팅 장치에 따라 보호 필름을 부착한 웨이퍼 위에 웨이퍼 보호 플레트를 안착한 후 웨이퍼의 보호 필름을 커팅함으로써, 웨이퍼에 흠집 또는 웨이퍼가 깨지(broken)는 것을 방지할 수 있다.As described above, by cutting the protective film of the wafer after seating the wafer protective plate on the wafer with the protective film according to the tape laminating apparatus according to the present invention, to prevent scratches or cracks on the wafer can do.

Claims (2)

보호필름을 부착할 웨이퍼를 안착하는 테이핑 테이블(taping table)과,A taping table for mounting a wafer on which a protective film is to be attached; 상기 테이핑 테이블에 안착하여 상기 보호 필름을 부착한 상기 웨이퍼 위에 안착하여 상기 웨이퍼를 보호하는 웨이퍼 보호 플레트(plate)를 하단부에 구비하고 승강이 가능한 실린더(cylinder)와,A cylinder having a lower portion having a wafer protection plate at a lower end thereof seated on the taping table and mounted on the wafer to which the protective film is attached to protect the wafer; 상기 웨이퍼 위에 상기 실린더의 웨이퍼 보호 플레이트를 안착한 후 상기 웨이퍼의 상기 보호필름을 상기 웨이퍼의 모양대로 커팅(cutting)하는 회전용 커터(cutter)를 포함하는 테이프 라미네이팅 장치.And a rotating cutter for cutting the protective film of the wafer into the shape of the wafer after mounting the wafer protection plate of the cylinder on the wafer. 제1항에 있어서,The method of claim 1, 상기 보호 플레이트는The protective plate is 세라믹으로 형성하는 것을 특징으로 하는 테이프 라미네이팅 장치.Tape laminating apparatus, characterized in that formed of ceramic.
KR1020060137292A 2006-12-29 2006-12-29 Tape laminating apparatus KR100778864B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101431206B1 (en) 2014-05-19 2014-08-19 제너셈(주) A film cutting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010045869A (en) * 1999-11-09 2001-06-05 윤종용 Wafer finger of tape laminating apparatus for semiconductor manufacturing process

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010045869A (en) * 1999-11-09 2001-06-05 윤종용 Wafer finger of tape laminating apparatus for semiconductor manufacturing process

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
한국특허공개공보 1020010045869호

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101431206B1 (en) 2014-05-19 2014-08-19 제너셈(주) A film cutting device

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