JPH0519952Y2 - - Google Patents

Description

[Detailed explanation of the invention] (1) Purpose of the invention [Field of industrial application] The present invention relates to a jig for heat treatment of wafers, and in particular, the present invention relates to a jig for heat treatment of wafers. The present invention relates to a heat treatment jig.

[Prior Art] Conventionally, as shown in FIG. 4, a jig for heat treatment of wafers has been proposed in which the entire lower surface 22D of the lower plate-like body 22 of the wafer support portion 20 is made on the same plane. It had been.

[Problems to be Solved] However, in the conventional wafer heat treatment jig, the lower surface 22D of the lower plate-shaped body 22 is on the same plane. However, it has the disadvantage that its entire surface must be flattened by polishing, and furthermore, the polishing process requires a great deal of labor and time.

Therefore, in order to solve these drawbacks, this invention
It is an object of the present invention to provide a jig for heat treatment of a wafer, in which the lower surface of a lower plate-like body of a wafer support part has a concave portion at its center.

(2) Structure of the invention [Means for solving problems] The means for solving problems provided by this invention are as follows:
Consists of a wafer support part 20 and a table part 30,
The wafer support section 20 includes a wafer support column 21 having a slit groove 21a into which a wafer is inserted and supported, an upper plate-like body 23 and a lower plate disposed at both ends of the wafer support column 21. shape body 2
2 and a positioning hole 22B formed in the center of the lower surface of the lower plate-like body 22, and the table part 30 has a table substrate 35 disposed on the upper part of the elevating member 34; A positioning column 32 disposed at the center of the upper surface of the table board 35 and fitted into the positioning hole 22B at the center of the lower plate of the lower plate-like body 22; It has a plurality of support columns 33 arranged along the column, and further includes:
A recess 22A is formed on the lower surface of the lower plate-like body 22 between the plurality of support columns 33 and the positioning hole 22B.
1. A jig for heat treatment of semiconductor wafers, characterized in that: is formed.

It is.

[Function] The wafer heat treatment jig according to the present invention has a recess formed in the center of the lower surface of the lower plate of the wafer support, and therefore requires polishing of the lower surface of the lower plate. This has the effect of limiting the area to only the area around the recess, which in turn has the effect of greatly reducing the labor and time required for the polishing process.

[Example] Next, the present invention will be specifically described with reference to the accompanying drawings.

FIG. 1 is a front view showing an embodiment of the wafer heat treatment jig according to the present invention, with the center portion of the lower surface of the lower plate-shaped body removed.

2 and 3 are both partial perspective views of the embodiment shown in FIG. 1, showing a wafer support section and a table section, respectively.

First, the structure of an embodiment of the wafer heat treatment jig according to the present invention will be described in detail.

Reference numeral 10 denotes a wafer heat treatment jig of the present invention, which includes a wafer support part 20 made of quartz or silicon carbide for supporting a semiconductor wafer (not shown), and a vertical support part 20 that supports the wafer support part 20 from below. The table 30 is made of quartz, silicon carbide, or the like and is inserted into or removed from a vertical heat treatment furnace (not shown).

The wafer support section 20 includes a plurality of (for example, four) wafer support columns 21 each having a slit groove 21a for inserting and supporting a semiconductor wafer.
and a lower plate-like body 2 disposed at both ends of the wafer support column 21, that is, the lower end and the upper end.
2 and an upper plate-like body 23. A recess 22A is formed in the center of the lower surface of the lower plate-shaped body 22, and a positioning hole 22B is formed in the center of the recess 22A.

The table part 30 has a positioning column 32 whose head, that is, an upper end thereof, is inserted into the positioning hole 22B of the lower plate-like body 22, and a support area 22C, which is the peripheral part of the recess 22A of the lower plate-like body 22. a plurality of support columns 33 whose heads or upper ends are abutted;
A positioning column 32 and a support column 33 are implanted on the upper surface, and the table substrate 35 is supported on the lower surface by an elevating member 34. Here, a heat shielding plate or the like may be arranged between the elevating member and the table substrate 35 if desired.

Furthermore, the operation of an embodiment of the wafer heat treatment jig according to the present invention will be explained in detail.

The wafer heat treatment jig 10 of the present invention forms the slit groove 21a in the wafer support column 21, and then polishes the peripheral part of the recess 22A of the lower plate-shaped body 22, that is, the support region 22C, to make it a flat surface. Perform processing.

As a result, on the lower surface of the lower plate-like body 22, the support area 22C required for support by the support columns 33 of the table part 30 can be flattened with minimum effort and time, and as a result, the table part 30 can be flattened with minimal effort and time. Support by the head of the support column 33 is efficiently ensured and stabilized.

(3) Effects of the invention As is clear from the above, the wafer heat treatment jig according to the invention has a positioning column and a support column arranged on the table substrate, so that the lower plate-shaped body of the wafer support part can be fixed. This is a jig for heat treatment of wafers that supports the lower surface of the lower plate, and in particular, since the central part of the lower surface of the lower plate is a recessed part, (i) the area of the lower surface of the lower plate that requires polishing; This has the effect of restricting the polishing process to only the surrounding area of the recess, and has the effect of (ii) greatly reducing the labor and time required for the polishing process.

[Brief explanation of the drawing]

FIG. 1 is a front view showing an embodiment of the wafer heat treatment jig according to the present invention, FIGS. 2 and 3 are both perspective views of the same part, and FIG. 4 is a perspective view showing the conventional example. . 10 ... wafer heat treatment jig, 20... wafer support section, 21... support column, 21a... slit groove, 22... lower plate-shaped body, 22A... recess, 22B... positioning hole, 23... Upper plate-shaped body,
30...Table part, 32...Positioning column body, 33
. . . Support column body, 34 . . . Lifting member, 35 . . . Table substrate.

Claims (1)

[Scope of utility model registration request] It consists of a wafer support section 20 and a table section 30, and the wafer support section 20 includes a wafer support column 21 having a slit groove 21a into which a wafer is inserted and supported, and a wafer support column 21 disposed at both ends of the wafer support column 21. The table part 30 has an upper plate-like body 23 and a lower plate-like body 22 provided therein, and a positioning hole 22B formed in the center of the lower surface of the lower plate-like body 22. a table substrate 35 disposed on the upper part; and a positioning column disposed at the center of the upper surface of the table substrate 35 and fitted into the positioning hole 22B at the center of the lower surface of the lower plate-like body 22. It has a body 32 and a plurality of support columns 33 arranged along the outer periphery of the positioning column 32, and further includes a plurality of support columns 33 and a plurality of support columns 33 arranged on the lower surface of the lower plate-like body 22. The recess 2 is located between the positioning hole 22B and the positioning hole 22B.
A jig for heat treatment of semiconductor wafers, characterized in that 2A is formed.