JPH05198912A - Electronic component with flexible board - Google Patents

Abstract

PURPOSE:To simultaneously conduct connections by a plurality of electronic components to a flexible board at a unit by providing a plurality of sets of conductive pattern groups on an upper surface of a resin film, adhering a reinforcing resin film substantially to the entire lower surface of the film, half- cutting only the film. CONSTITUTION:A plurality of sets of conductive pattern groups 13 each having four patterns are formed on a resin film 11. Then, solder resist 15 made of insulating paint is screen printed on an upper surface of the film 11 except both ends of the groups 13 to cover most parts of the pattern groups. Both exposed ends of the groups 13 are soldered in this state. Then, the film 11 is pressed to form a protrusion 14 and to form a substantially L-shaped hole 17 at the periphery of the other end. Thereafter, a reinforcing resin film made of polyethylene terephthalate film is adhered to the rear surface of the film 11 through an adhesive layer, and half-cut a line 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component with a flexible substrate in which a flexible substrate is connected to a terminal pattern of an electronic component such as a magnetoresistive sensor (hereinafter referred to as "MR sensor").

[0002]

2. Description of the Related Art An electronic component such as an MR sensor mounted on a glass substrate has a weak terminal pattern, and if this terminal pattern is directly connected to a desired circuit pattern, the connection portion is easily damaged. Further, since the electronic parts such as the MR sensor are small in size, the pitch intervals of the terminal patterns are quite small, and it may not be possible to connect them to a desired circuit pattern as they are.

Therefore, there is a terminal pattern of the electronic component in which a flexible substrate is connected and the other end of the flexible substrate is connected to a desired circuit pattern.

[0004]

However, in the above-mentioned conventional electronic component with a flexible substrate, the flexible substrates are connected to the electronic component one by one, so that the connecting work becomes complicated and the manufacturing cost increases. Not only that, since the electronic components with the flexible substrate were separately manufactured one by one, the handling when the electronic components with the flexible substrate were mass-produced was complicated (for example, the electronic component with the flexible substrate, which is a small component, was When stored in a box and delivered to the manufacturer, 1
There is a problem that it is complicated to pick up each piece.

The present invention has been made in view of the above-mentioned points, and a plurality of electronic components and flexible substrates can be collectively connected at one time, and the manufactured electronic components with a flexible substrate can be individually separated. An electronic component with a flexible substrate is provided.

[0006]

In order to solve the above problems, the present invention provides a plurality of conductive pattern groups 13 on the upper surface of a resin film 11, and one end of each of the plurality of conductive pattern groups 13 is made of resin. The resin film 11 is cut so as to project from one side of the film 11, and a reinforcing resin film 25 is attached to substantially the entire lower surface of the resin film 11, and the plurality of conductive pattern groups 13 are electrically connected to each set. Only the resin film 11 provided with the conductive pattern groups 13 so as to be divided for each pattern group 13 is half-cut, and one end of each conductive pattern group 13 cut so as to project from one side of the resin film 11. By connecting the terminal pattern 31 of the electronic component 30 to the above, a plurality of sets of electronic components with a flexible substrate were simultaneously manufactured. The resin film 11 to which the electronic component 30 is connected is peeled off from the reinforcing resin film 25 to obtain each electronic component with a flexible substrate.

[0007]

With the above-described structure, the electronic components and the flexible board can be connected in a unit of a plurality of units at a time, and the connecting work can be facilitated.

Further, since a plurality of electronic components with a flexible substrate can be stored and transported while being stuck on the reinforcing resin film, they are not separated one by one,
The handling becomes easy.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. 7A and 7B are diagrams showing an MR sensor 1 with a flexible substrate manufactured by using the present invention. FIG. 7A is a left side view and FIG. 7B is a plan view (however, the bonding shown in FIG. The agent 35 is omitted in the drawing).

As shown in FIG. 1, the MR sensor 1 with a flexible substrate is constructed by connecting an MR sensor 30 to one end of a flexible substrate 10 having a conductive pattern group 13 provided on the upper surface of a resin film 11. A solder resist 15 is applied on the conductive pattern group 13.

Next, a method of manufacturing the MR sensor 1 with the flexible substrate will be described. 1 to 6 are views showing a method of manufacturing the MR sensor 1 with a flexible substrate.

First, as shown in FIG. 2, a plurality of four conductive pattern groups 13 (four groups are shown in the figure) are formed on a resin film 11 made of a strip-shaped polyimide film or the like.
Form. This conductive pattern group 13 is made up of the resin film 1
1 is formed by etching the metal foil pasted on 1.
It is formed by screen printing.

Next, as shown in FIG. 3, a solder resist 15 made of an insulating paint is screen-printed on the upper surface of the resin film 11 excluding both end portions of each conductive pattern group 13 so that most of the conductive pattern group 13 is formed. Cover the part.

Then, in this state, solder plating is performed on the portions on both ends of each conductive pattern group 13 where the solder resist 15 is not printed, that is, on both exposed end portions of the conductive pattern group 13.

Next, the resin film 11 is pressed to form a plurality of conductive pattern groups 1 as shown in FIG.
A protrusion 14 is provided so that one end of each of the three 3 protrudes from one side of the resin film 11, and a substantially L-shaped hole 17 is provided around the other end.

Next, a reinforcing resin film 25 made of a strip-shaped polyethylene terephthalate film shown in FIG. 5 is attached to the back surface of the resin film 11 shown in FIG. 4 via an adhesive layer (not shown). As the adhesive layer, for example, an acrylic resin is used.

Next, the line 21 shown by the chain double-dashed line in FIG. 6 is half-cut. Here, the half cut means that only the upper resin film 11 is cut without cutting the lower reinforcing resin film 25. As a result, the portions of the resin film 11 provided with the conductive pattern groups 13 are separated from the other resin films 11, respectively, to form flexible substrates 10 as shown in FIG. Since it is attached to the reinforcing resin film 25 which has not been cut, it remains integrated.

Next, MR is formed on the protrusion 14 of the resin film 11.
The sensor 30 is attached, and the state at that time is shown in FIG. 1A is a plan view (however, the adhesive 35 shown in FIG. 1B is omitted), and FIG.
(B) is an AA line upper side sectional view of the same figure (a). That is, as shown in the figure, the four terminal patterns 31 provided on the lower end of the back surface of the MR sensor 30 are respectively formed by the resin film 11
Is connected and fixed by solder 33 to the end of each conductive pattern of the conductive pattern group 13 of the protruding portion 14, and the MR sensor 30 and the resin film 11 are bonded and fixed by an insulating adhesive 35 for reinforcement. . The connection and fixing work of the MR sensor 30 can be performed collectively on the plurality of projecting portions 14 arranged in a line so as to project to one side of the resin film 11, so that the connecting work between the two can be performed. Be efficient. The connection of the two with the solder 33 is performed by heating the solder previously attached to the end of the conductive pattern group 13.

When the MR sensor 30 is pulled up to the front side of the paper surface of FIG. 1, the portion of the resin film 11 provided with the conductive pattern 13 is easily separated from the other resin film 11 by the half-cut line 21. It can be peeled off from the reinforcing resin film 25. As a result, the MR sensor 1 with a flexible substrate as shown in FIG. 7 is completed.

The storage, storage, and transportation when a large number of MR sensors 1 with a flexible substrate are manufactured are as follows.
The state shown in FIG. 1 (that is, M with a plurality of flexible substrates)
The R sensor 1 is attached in a line on the reinforcing resin film 25). In this state, each MR sensor 30 with a flexible substrate is maintained in an aligned state, does not come apart, and can be easily stored and transported.
It is easy to attach the R sensor 30 to another circuit board or the like.

Although the above embodiment shows an example in which the present invention is applied to an MR sensor, the present invention is not limited to this and may be applied to other electronic parts.

[0022]

As described in detail above, the electronic component with a flexible substrate according to the present invention has the following excellent effects.

A plurality of electronic components and flexible substrates can be collectively connected at once, the connection work can be facilitated, and the manufacturing cost can be reduced.

Further, since the electronic component is connected to the portion projecting from one side of the resin film, the connecting work is easy.

Further, since a plurality of electronic components with a flexible substrate can be stored and transported while being stuck on the reinforcing resin film, the individual electronic components are not separated one by one and the handling thereof is easy.

[Brief description of drawings]

FIG. 1 is a diagram showing a method of manufacturing an MR sensor 1 with a flexible substrate.

FIG. 2 is a diagram showing a method of manufacturing the MR sensor with a flexible substrate 1.

FIG. 3 is a diagram showing a method for manufacturing the MR sensor with a flexible substrate 1.

FIG. 4 is a diagram showing a method of manufacturing the MR sensor with a flexible substrate 1.

FIG. 5 is a diagram showing a method of manufacturing the MR sensor with a flexible substrate 1.

FIG. 6 is a diagram showing a method for manufacturing the MR sensor with a flexible substrate 1.

7A and 7B are diagrams showing an MR sensor with a flexible substrate 1 manufactured by using the present invention, wherein FIG. 7A is a left side view and FIG. 7B is a plan view.

[Explanation of symbols]

1 MR sensor with flexible substrate (electronic component with flexible substrate) 11 Resin film 13 Conductive pattern group 25 Reinforcing resin film 30 MR sensor (electronic component) 31 Terminal pattern

Claims (1)

[Claims] 1. An electronic component with a flexible substrate for connecting each end of a conductive pattern group provided on a resin film to each terminal pattern of the electronic component, wherein a plurality of conductive pattern groups are provided on the upper surface of the resin film. The resin film is cut so that one end of each of the plurality of conductive pattern groups projects from one side of the resin film, and the reinforcing resin film is attached to substantially the entire lower surface of the resin film, Only one half of the resin film is cut so as to divide a plurality of conductive pattern groups into each conductive pattern group, and one end of each conductive pattern group is cut so as to project from one side of the resin film. An electronic component with a flexible substrate, characterized in that the terminal pattern of the electronic component is connected to.