JPH05190905A - Led display device and manufacture thereof - Google Patents
Led display device and manufacture thereofInfo
- Publication number
- JPH05190905A JPH05190905A JP4024756A JP2475692A JPH05190905A JP H05190905 A JPH05190905 A JP H05190905A JP 4024756 A JP4024756 A JP 4024756A JP 2475692 A JP2475692 A JP 2475692A JP H05190905 A JPH05190905 A JP H05190905A
- Authority
- JP
- Japan
- Prior art keywords
- led display
- silicone resin
- display device
- drive substrate
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はＬＥＤ表示装置及びその
製造方法に係り、特に２種類のシリコン樹脂を充填する
ことにより防水処理されたものに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED display device and a method for manufacturing the same, and more particularly, to an LED display device which is waterproofed by being filled with two kinds of silicone resins.
【０００２】[0002]
【従来の技術】従来、屋外用のユニットに使用されるＬ
ＥＤ表示装置では、防水対策が必要であり、そのため数
個のＬＥＤ表示素子( 以下素子という) の前面に、アク
リル板等で覆いを設けたり、個々のユニットにシリコン
ゴムで成型されたパッケージを取付けて防水処理を図っ
ている。2. Description of the Related Art Conventionally, L has been used for outdoor units.
The ED display device requires waterproofing measures. Therefore, several LED display elements (hereinafter referred to as "elements") are covered with an acrylic plate or the like, or each unit is attached with a molded silicone rubber package. To ensure waterproofing.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前記処
理のうち、数個の素子の前面にアクリル板等で覆いをし
たものは、アクリル板の定型寸法の制約により、ＬＥＤ
表示装置のサイズに限界があり、市場が要望する表示画
面の大きいディスプレイが出来ないという問題がある。However, among the above-mentioned treatments, the one in which several elements are covered with an acrylic plate or the like on the front surface of the LED is limited by the standard size of the acrylic plate.
There is a problem in that the size of the display device is limited and a display with a large display screen demanded by the market cannot be produced.
【０００４】また個々の素子にシリコンゴムで成型され
たパッケージを取付けることにより、表示画面のサイズ
は自由になるが、シリコンゴムを成型することによりコ
ストアップの問題があり、また素子への組み込み工程が
非常に難しく、量産に適しないという問題もある。本発
明は上記事情に鑑みて創案されたもので、大型の表示装
置の実現が可能で、コストアップや前記製造工程の問題
等を解決できる新規なＬＥＤ表示装置及びその製造方法
を提供することを目的としている。Although a display screen size can be freely set by attaching a package formed of silicon rubber to each element, there is a problem of cost increase due to the molding of silicon rubber, and a process of incorporating the element into the element. Is very difficult and not suitable for mass production. The present invention was devised in view of the above circumstances, and provides a novel LED display device and a manufacturing method thereof, which can realize a large-sized display device and can solve the problems of cost increase and the manufacturing process. Has an aim.
【０００５】[0005]
【課題を解決するための手段】本発明に係るＬＥＤ表示
装置は、枠体と、枠体に組み込まれるＬＥＤ表示素子を
搭載した駆動基板と、枠体と前記駆動基板の隙間を目張
りする非流動性のシリコン樹脂と、駆動基板の上に充填
した流動性シリコン樹脂を具備したことを特徴としてい
る。SUMMARY OF THE INVENTION An LED display device according to the present invention is a frame, a drive substrate on which an LED display element incorporated in the frame is mounted, and a non-flowing member that seals a gap between the frame and the drive substrate. And a fluid silicon resin filled on the driving substrate.
【０００６】その製造方法は枠体にＬＥＤ表示素子を搭
載した駆動基板を組み込んだあと、枠体と駆動基板の隙
間に非流動性のシリコン樹脂でもって目張りし、そのあ
と前記駆動基板上に流動性シリコン樹脂を充填したこと
を特徴としている。そして前記非流動性のシリコン樹脂
は一液性シリコン樹脂であり、流動性シリコン樹脂は二
液性シリコン樹脂であるものを含んでいる。According to the manufacturing method, a drive substrate having an LED display element mounted on a frame body is assembled, and then a seal is applied with a non-fluidic silicone resin in a gap between the frame body and the drive substrate, and then a fluid is flown on the drive substrate. It is characterized by being filled with a conductive silicone resin. The non-fluidic silicone resin is a one-liquid silicone resin, and the fluid silicone resin is a two-liquid silicone resin.
【０００７】[0007]
【実施例】以下、図面を参照して本発明の実施例を説明
する。図１はＬＥＤ表示装置の断面図、図２は同平面図
である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of the LED display device, and FIG. 2 is a plan view thereof.
【０００８】図において、1 はＬＥＤ表示装置の枠体で
あり、この枠体1 内に例えば16個×16個もしくは24個×
24個の素子2 をマトリクス状に搭載した駆動基板3 を組
み込んである。そして駆動基板3 と前記枠体1 の隙間に
図１及び図２の斜線で示したように、非流動性のシリコ
ン樹脂4 を目張りしてある。特にこのシリコン樹脂4は
一液性の速硬化型樹脂を用いることにより、目張り作業
工程が簡略化されるという利点がある。In the figure, 1 is a frame of an LED display device, and for example, 16 × 16 or 24 ×
It incorporates a drive substrate 3 on which 24 elements 2 are mounted in a matrix. Then, in the gap between the drive substrate 3 and the frame body 1, a non-fluidic silicone resin 4 is sealed as shown by the diagonal lines in FIGS. In particular, the silicone resin 4 has an advantage that the stitching process can be simplified by using a one-component quick-curing resin.
【０００９】前記目張り作業のあと、前記駆動基板3 の
上に流動性のシリコン樹脂5 を充填する。この場合にお
いて、流動性シリコン樹脂5 は二液性の熱硬化型樹脂を
用いるとよい。After the sealing work, a fluid silicone resin 5 is filled on the drive substrate 3. In this case, the liquid silicone resin 5 is preferably a two-component thermosetting resin.
【００１０】[0010]
【発明の効果】以上説明したように、本発明に係るＬＥ
Ｄ表示装置及びその製造方法は枠体と駆動基板の隙間に
非流動性のシリコン樹脂で目張りし、駆動基板上を流動
性シリコン樹脂でもって充填したものであるから、非流
動性のシリコン樹脂は隙間からこぼれ落ちることがな
く、また早く硬化が行え、作業上大変都合がよい。また
駆動基板の防水に流動性シリコン樹脂を使用したので、
駆動基板及び素子に樹脂が隈無く浸透し、この樹脂が非
流動性のシリコン樹脂から流出することがない。また同
じシリコン系樹脂であるから、全体としての信頼性も高
いものである。As described above, the LE according to the present invention
In the D display device and the manufacturing method thereof, since the gap between the frame and the drive substrate is sealed with the non-fluidic silicon resin and the drive substrate is filled with the fluidized silicon resin, the non-fluidic silicone resin is It does not spill out from the gap and can be cured quickly, which is very convenient for work. In addition, since fluid silicon resin is used to waterproof the drive board,
The resin thoroughly penetrates into the drive substrate and the element, and the resin does not flow out from the non-fluidic silicone resin. Further, since the same silicone resin is used, the reliability as a whole is high.
【００１１】さらに従来のような成型品でなく、樹脂を
用いたので、駆動基板や枠体の形状や構造の自由度も大
きくなり、装置の大型化が可能である。さらに、樹脂の
注型だけの作業であるので、工程も簡単で、成型費用も
不要であり、装置全体としてのコストダウンを図ること
ができる。Furthermore, since a resin is used instead of the conventional molded product, the degree of freedom in the shape and structure of the drive substrate and the frame is increased, and the size of the device can be increased. Further, since only the resin is cast, the process is simple, the molding cost is unnecessary, and the cost of the entire apparatus can be reduced.
【図１】本発明に係る図面であって、ＬＥＤ表示装置の
断面図である。FIG. 1 is a cross-sectional view of an LED display device according to the present invention.
【図２】本発明に係る図面であって、ＬＥＤ表示装置の
平面図である。FIG. 2 is a plan view of an LED display device according to the present invention.
1 枠体 2 ＬＥＤ表示素子 3 駆動基板 4 非流動性のシリコン樹脂 5 流動性シリコン樹脂 1 Frame 2 LED display element 3 Drive substrate 4 Non-fluidic silicone resin 5 Fluidic silicone resin
Claims (6)
素子を搭載した駆動基板と、枠体と前記駆動基板の隙間
を目張りする非流動性のシリコン樹脂と、駆動基板の上
に充填した流動性シリコン樹脂を具備したことを特徴と
するＬＥＤ表示装置。1. A frame, a drive substrate on which an LED display element incorporated in the frame is mounted, a non-fluidic silicone resin that seals a gap between the frame and the drive substrate, and the drive substrate is filled with the resin. An LED display device comprising a fluid silicone resin.
シリコン樹脂である請求項１記載のＬＥＤ表示装置。2. The LED display device according to claim 1, wherein the non-fluidic silicone resin is a one-component silicone resin.
コン樹脂である請求項１記載のＬＥＤ表示装置。3. The LED display device according to claim 1, wherein the fluid silicone resin is a two-component silicone resin.
板を組み込んだあと、枠体と駆動基板の隙間に非流動性
のシリコン樹脂でもって目張りし、そのあと前記駆動基
板上に流動性シリコン樹脂を充填したことを特徴とする
ＬＥＤ表示装置の製造方法。4. A drive substrate having an LED display element mounted on a frame body is assembled, and a gap between the frame body and the drive substrate is sealed with a non-fluidic silicon resin, and then a fluid silicon is placed on the drive substrate. A method for manufacturing an LED display device, which is characterized by being filled with a resin.
シリコン樹脂である請求項４記載のＬＥＤ表示装置の製
造方法。5. The method of manufacturing an LED display device according to claim 4, wherein the non-fluidic silicone resin is a one-component silicone resin.
コン樹脂である請求項４記載のＬＥＤ表示装置の製造方
法。6. The method of manufacturing an LED display device according to claim 4, wherein the fluid silicone resin is a two-component silicone resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4024756A JP2814031B2 (en) | 1992-01-14 | 1992-01-14 | LED display device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4024756A JP2814031B2 (en) | 1992-01-14 | 1992-01-14 | LED display device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05190905A true JPH05190905A (en) | 1993-07-30 |
| JP2814031B2 JP2814031B2 (en) | 1998-10-22 |
Family
ID=12146994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4024756A Expired - Lifetime JP2814031B2 (en) | 1992-01-14 | 1992-01-14 | LED display device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2814031B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1031434A (en) * | 1996-02-29 | 1998-02-03 | Toshiba Lighting & Technol Corp | Light emitting diode, display unit, and display device |
| US6268432B1 (en) | 1998-10-01 | 2001-07-31 | Dow Corning Toray Silicone Co. Ltd. | Filler/adhesive agent for display units containing a curable silicone composition |
| JP2008277828A (en) * | 2007-05-07 | 2008-11-13 | Neovison Pnv Co Ltd | Light emitting diode mounted on electric sign |
-
1992
- 1992-01-14 JP JP4024756A patent/JP2814031B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1031434A (en) * | 1996-02-29 | 1998-02-03 | Toshiba Lighting & Technol Corp | Light emitting diode, display unit, and display device |
| US6268432B1 (en) | 1998-10-01 | 2001-07-31 | Dow Corning Toray Silicone Co. Ltd. | Filler/adhesive agent for display units containing a curable silicone composition |
| JP2008277828A (en) * | 2007-05-07 | 2008-11-13 | Neovison Pnv Co Ltd | Light emitting diode mounted on electric sign |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2814031B2 (en) | 1998-10-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH03252692A (en) | Liquid crystal display unit, its device and washing machine using same liquid crystal display | |
| JP2981370B2 (en) | MID chip type light emitting device | |
| KR950004467A (en) | Semiconductor device and manufacturing method | |
| JPH0417343A (en) | Manufacture of thin-type semiconductor device | |
| JPH0715046A (en) | Injection molded printed board | |
| JPH05190905A (en) | Led display device and manufacture thereof | |
| US5855924A (en) | Closed-mold for LED alphanumeric displays | |
| JPS63240053A (en) | Semiconductor device | |
| JPS5848442A (en) | Sealing of electronic parts | |
| JPH0237761A (en) | Hybrid integrated circuit device | |
| JPS6476741A (en) | Semiconductor device | |
| JPH04352131A (en) | Plane type display device | |
| CN210225869U (en) | Plastic structure frame body convenient for local glue sealing on PCB (printed circuit board) | |
| JPH0546270Y2 (en) | ||
| JPH02307250A (en) | Hybrid integrated circuit package | |
| JPS5795651A (en) | Semiconductor device | |
| JPH0621145A (en) | Semiconductor device | |
| JPH04201393A (en) | Ic module and ic card using said module | |
| JPS641262A (en) | Electronic device and manufacture thereof | |
| JPS6341033A (en) | Sealing method for chip ic | |
| JPS5813514U (en) | liquid crystal display device | |
| JPH02251153A (en) | Resin sealing for tape carrier mounted with semiconductor element | |
| JPH02205390A (en) | Resin sealing method for electric component for surface mounting of electric circuit board | |
| CN110729284A (en) | Preparation method of outdoor full-color display screen device | |
| JP2594244B2 (en) | Semiconductor sealing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070814 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080814 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080814 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090814 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090814 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100814 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110814 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110814 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120814 Year of fee payment: 14 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120814 Year of fee payment: 14 |