CN210225869U - Plastic structure frame body convenient for local glue sealing on PCB (printed circuit board) - Google Patents

Plastic structure frame body convenient for local glue sealing on PCB (printed circuit board) Download PDF

Info

Publication number
CN210225869U
CN210225869U CN201920361073.1U CN201920361073U CN210225869U CN 210225869 U CN210225869 U CN 210225869U CN 201920361073 U CN201920361073 U CN 201920361073U CN 210225869 U CN210225869 U CN 210225869U
Authority
CN
China
Prior art keywords
frame body
pcb
plastic
structural frame
plastic structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201920361073.1U
Other languages
Chinese (zh)
Inventor
Chaoping Liu
刘超平
Yingxia Cao
曹英霞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jade Bird Fire Co Ltd
Original Assignee
Jade Bird Fire Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jade Bird Fire Co Ltd filed Critical Jade Bird Fire Co Ltd
Priority to CN201920361073.1U priority Critical patent/CN210225869U/en
Application granted granted Critical
Publication of CN210225869U publication Critical patent/CN210225869U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model discloses a convenient plastic structure framework of local gluey seal on PCB assembly board, it includes the plastic structure framework, the plastic structure framework have two at least fasteners with PCB board block, the shape of plastic structure framework with the shape of PCB board suits, the plastic structure framework have with PCB board interference fit's soft glue layer, the inner chamber of plastic structure framework is the encapsulating region, the utility model discloses avoid the waste of encapsulating material, it is sealed effectual, improve the encapsulation yield, the installation of being convenient for.

Description

Plastic structure frame body convenient for local glue sealing on PCB (printed circuit board)
Technical Field
The utility model relates to an electronic component technical field particularly, relates to a convenient plastic structure framework who seals is glued to local on total board of PCB.
Background
The explosion-proof fire-fighting product is a product used in dangerous environments such as chemical engineering, the safety design of the product is particularly important, the hardware part of the product is provided with an intrinsic safety circuit, and the intrinsic safety circuit part needs to adopt an epoxy resin glue sealing process to ensure the safety of the circuit. In order to simplify the hardware design of the product, the conventional method is that the intrinsic safety circuit and the common circuit are arranged on the same total PCB, so that the local part of the circuit board needs to be subjected to glue pouring and sealing treatment.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving above-mentioned technical problem to a certain extent.
In view of this, the utility model provides a local plastic structure framework of gluing and sealing on PCB is always managed to convenience, and this local plastic structure framework of gluing and sealing is avoided the encapsulating material extravagant in PCB is always managed to convenience, and is sealed effectual, improves the encapsulation yield, the installation of being convenient for.
In order to solve the technical problem, the utility model provides a make things convenient for plastic structure framework who seals is glued to local on PCB total board, it includes plastic structure framework, plastic structure framework has two at least fasteners with PCB board block, plastic structure framework's shape with the shape of PCB board suits, plastic structure framework have with PCB board interference fit's flexible glue layer, just plastic structure framework's inner chamber is glue filling region.
Furthermore, the glue injection area comprises an isolation area and a glue injection area.
Furthermore, a clamping hook is arranged on the clamping piece, and a clamping space is formed between the clamping hook and the soft adhesive layer.
Further, still include at least one keep apart interior plastic structure framework, every keep apart interior plastic structure framework and set up the inner chamber of plastic structure framework, every keep apart interior plastic structure framework with form between the plastic structure framework the injecting glue is regional, and every keeps apart interior plastic structure framework inner chamber and be the isolation region.
Further, the plastic structure frame body is also provided with at least one guide piece used for determining the position of the PCB.
Further, the guiding part have the locating surface and with the locating surface becomes the spigot surface of angle connection, the locating surface with the PCB board outer fringe face closely laminates, one side of spigot surface with the locating surface is connected, the extension is extended to another side of spigot surface, and with the outer fringe of PCB board is personally submitted the acute angle setting.
Furthermore, the plurality of guide pieces are distributed close to the corners of the plastic structure frame body.
Further, the inclination angle of the guide surface is the same as that of the hook.
Furthermore, the clamping pieces are uniformly distributed along the frame of the plastic structure frame body.
The technical effects of the utility model reside in that: (1) this ampere of circuit part needs to take the technology that epoxy glued and seals, because this ampere of circuit arranges at same total PCB board with ordinary circuit, consequently, through plastic structure framework block on the PCB board that needs the encapsulation part to constitute the encapsulating region, pour into the sealing colloid into in the encapsulating region, realized the local of this ampere of circuit and sealed the glue, avoid the material extravagant.
(2) The plastic structure frame body is provided with the soft rubber layer tightly attached to the PCB, the sealing effect is good, and the packaging yield is improved.
(3) The plastic structure frame body is provided with at least two clamping pieces clamped with the PCB, the clamping pieces are provided with clamping hooks, and the plastic structure frame body is clamped on the PCB through the clamping hooks and is convenient to mount.
Drawings
Fig. 1 is a perspective view of a plastic structural frame body for facilitating local glue sealing on a PCB assembly board according to the present invention;
fig. 2 is a schematic diagram of a positional relationship between a plastic structural frame body for facilitating local glue sealing on a PCB assembly and the PCB according to the present invention;
fig. 3 is a schematic view of the installation of the plastic structural frame body convenient for local glue sealing on the PCB assembly board according to the present invention.
Wherein, 1-plastic structure frame body; 2-a PCB board; 3-glue pouring area; 11-a snap-fit; 12-soft glue layer; 13-a guide; 14-isolating the inner plastic structural frame; 15-a connecting frame; 31-an isolation region; 32-glue injection area; 111-hook; 131-a positioning surface; 132-guide surface.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
As shown in fig. 1, 2 and 3, a plastic structure frame body convenient for local glue sealing on a PCB board includes a plastic structure frame body 1, the plastic structure frame body 1 has at least two fasteners 11 engaged with the PCB board 2, the shape of the plastic structure frame body 1 is adapted to the shape of the PCB board 2, the inner cavity of the plastic structure frame body 1 is a glue filling region 3, and the plastic structure frame body 1 has a soft glue layer 12 tightly attached to the PCB board 2.
According to the utility model discloses a specific embodiment, in explosion-proof fire control product, this ampere of circuit is arranged at same total PCB board with ordinary circuit, this ampere of circuit part needs to glue and seals, plastic structure framework 1 has at least two fasteners 11 with the 2 blocks of PCB board that need the encapsulation part, the shape of plastic structure framework 1 suits with the shape of PCB board 2, every fastener 11 block of plastic structure framework 1 is on PCB board 2, plastic structure framework 1's inner chamber is glue filling region 3, glue filling region 3 carries out the encapsulating, the local of having realized this ampere of circuit is sealed glues, avoid the material extravagant, simple process simultaneously, easy to operate.
The plastic structural frame body 1 is provided with a soft rubber layer 12 tightly attached to the PCB 2, the contact surface of the soft rubber layer 12 and the PCB 2 is in interference fit, and the soft rubber layer 12 is in a compressed state when the plastic structural frame body 1 is clamped on the PCB 2 to play a role in sealing, so that the plastic structural frame body 1 is ensured not to overflow when a rubber body is filled in the plastic structural frame body 1;
specifically, the plastic injection structure of flexible glue layer 12 and plastic structure framework 1 formula as an organic whole has guaranteed the seal of flexible glue layer 12 and plastic structure framework 1 junction promptly, has avoided the human cost that artifical installation flexible glue layer 12 brought again.
The plastic structure frame body 1 is provided with the soft rubber layer 12 tightly attached to the PCB 2, so that the sealing effect of the plastic structure frame body 1 and the PCB 2 is improved, and the packaging yield is improved.
The potting adhesive is sealed by epoxy resin, and the epoxy resin has the characteristics of strong adhesive force, high mechanical strength, medium resistance, aging resistance, good electrical insulation piece and small volume shrinkage.
As shown in fig. 3, the glue filling area 3 includes an isolation area 31 and a glue filling area 32.
According to the specific embodiment of the utility model, still include at least one isolation inner plastic structure framework 14, each isolation inner plastic structure framework 14 sets up in the inner chamber of plastic structure framework 1, form injecting glue region 32 between each isolation inner plastic structure framework 14 and the plastic structure framework 1, each isolation inner plastic structure framework 14 inner chamber is isolation region 31, carry out the encapsulating to injecting glue region 32, the inner chamber of each isolation inner plastic structure framework 14 does not carry out the encapsulating, realize not carrying out the requirement of encapsulating to mounting hole or other positions that do not need the encapsulating;
specifically, each isolated inner plastic structural frame 14 is connected with the plastic structural frame 1 through a connecting frame 15.
As shown in fig. 1 and 3, the engaging piece 11 has a hook 111, and an engaging space is formed between the hook 111 and the soft adhesive layer 12.
According to the utility model discloses a specific embodiment, the pothook 111 that fastener 11 has constitutes the block space between pothook 111 and the flexible glue layer 12, and plastic structure framework 1 is on the PCB board through its pothook 111 block, simple to operate.
As shown in fig. 1 and 3, the plastic structural frame 1 further has at least one guide 13 for determining the position of the PCB 2.
According to the utility model discloses a concrete embodiment, plastic structure framework 1 still has at least one guide 13, and PCB board 2 closes the in-process with the PCB integrated circuit board, and guide 13 plays guide effect, simple to operate to the position of PCB board 2's installation.
As shown in fig. 1 and 2, the guiding member 13 has a positioning surface 131 and a guiding surface 132 connected to the positioning surface 131 at an angle, the positioning surface 131 is closely attached to the outer edge surface of the PCB 2, one side of the guiding surface 132 is connected to the positioning surface 131, and the other side of the guiding surface 132 extends outwards and forms an acute angle with the outer edge surface of the PCB 2.
According to the utility model discloses a specific embodiment, guide 13 has locating surface 131 and the locating surface 132 of being connected with locating surface 131 angulation, and the opposite side of locating surface 132 outwards extends, and personally submits the acute angle setting with PCB board 2's outer fringe to confirm PCB board 2's approximate position, one side and the locating surface 131 of locating surface 132 are connected, and locating surface 131 closely laminates with PCB board 2 outer fringe face, with confirm PCB board 2's concrete position, easy to assemble.
As shown in fig. 1 and 3, a plurality of guides 13 are distributed near the corners of the plastic structural frame 1.
According to the utility model discloses a concrete embodiment, a plurality of guides 13 are close to the turning distribution of plastic structure framework 1, guarantee its accurate definite PCB board 2's position.
As shown in fig. 1 and 3, the engaging members 11 are uniformly distributed along the frame of the plastic frame 1.
According to the utility model discloses a concrete embodiment, fastener 11 makes PCB board 2 atress even when making 1 block of plastic structure framework on PCB board 2 along the frame evenly distributed of plastic structure framework 1, improves stable effect.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.

Claims (8)

1. The utility model provides a local plastic structure framework of gluing and sealing on PCB board is always convenient which characterized in that, it includes the plastic structure framework, the plastic structure framework have at least two with the fastener of PCB board block, the shape of plastic structure framework with the shape of PCB board suits, the plastic structure framework have with PCB board interference fit's soft glue layer, the inner chamber of plastic structure framework is the encapsulating region.
2. The plastic structural frame body facilitating local glue sealing on the PCB assembly board as recited in claim 1, wherein the glue filling area comprises an isolation area and a glue filling area.
3. The plastic structural frame body facilitating local glue sealing on a PCB panel as recited in claim 2, further comprising at least one isolated inner plastic structural frame body, each isolated inner plastic structural frame body being disposed in an inner cavity of the plastic structural frame body, the glue injection region being formed between each isolated inner plastic structural frame body and the plastic structural frame body, and the inner cavity of each isolated inner plastic structural frame body being the isolated region.
4. The plastic frame of claim 1, wherein the engaging member has a hook, and a space is defined between the hook and the soft adhesive layer.
5. The plastic structural frame facilitating partial glue sealing on a PCB panel as recited in claim 1, wherein the plastic structural frame further has at least one guide for determining the position of the PCB panel.
6. The plastic structural frame body convenient for partial glue sealing on the PCB assembly board as recited in claim 5, wherein the guiding member has a positioning surface and a guiding surface connected with the positioning surface at an angle, the positioning surface is tightly attached to the outer edge surface of the PCB assembly board, one side of the guiding surface is connected with the positioning surface, the other side of the guiding surface extends outwards and is arranged at an acute angle with the outer edge surface of the PCB assembly board.
7. The plastic structural frame body facilitating partial glue sealing on a PCB panel as recited in claim 5, wherein a plurality of the guiding members are distributed near corners of the plastic structural frame body.
8. The plastic structural frame body facilitating local glue sealing on a PCB panel as recited in claim 1, wherein the engaging members are evenly distributed along a rim of the plastic structural frame body.
CN201920361073.1U 2019-03-20 2019-03-20 Plastic structure frame body convenient for local glue sealing on PCB (printed circuit board) Active CN210225869U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920361073.1U CN210225869U (en) 2019-03-20 2019-03-20 Plastic structure frame body convenient for local glue sealing on PCB (printed circuit board)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920361073.1U CN210225869U (en) 2019-03-20 2019-03-20 Plastic structure frame body convenient for local glue sealing on PCB (printed circuit board)

Publications (1)

Publication Number Publication Date
CN210225869U true CN210225869U (en) 2020-03-31

Family

ID=69922195

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920361073.1U Active CN210225869U (en) 2019-03-20 2019-03-20 Plastic structure frame body convenient for local glue sealing on PCB (printed circuit board)

Country Status (1)

Country Link
CN (1) CN210225869U (en)

Similar Documents

Publication Publication Date Title
US7616448B2 (en) Wrap-around overmold for electronic assembly
KR20160086385A (en) Speaker Module and Manufacturing Method Therefor
ES2047107T3 (en) PROCEDURE FOR PACKAGING A MEASURED AMOUNT OF THERMOSTABLE RESIN, INTENDED FOR THE CAPSULE OF A COMPONENT, PACKAGING OBTAINED USING THIS PROCEDURE, PROCEDURE FOR WORKING WITH A MOLD AND MOLD TO PERFORM SUCH PROCEDURE.
CN207235291U (en) A kind of electronic product and its waterproof and breathable structure
EP2088841B1 (en) Overmolded electronic assembly with metal seal ring
WO2016206328A1 (en) Mini loudspeaker
CN210225869U (en) Plastic structure frame body convenient for local glue sealing on PCB (printed circuit board)
CN108055794A (en) A kind of waterproof fastens shell
CN207766453U (en) Microphone assembly and electronic equipment
JP2012200061A (en) Method for fabricating watertight case, watertight case and on-vehicle electronic apparatus
US4618467A (en) Method for sealing cavities
US20090197478A1 (en) Interlocking overmold for electronic assembly
CN108321125A (en) Electronic component encapsulates
CN207535195U (en) The low-pressure injection molding component of intelligent gas meter controller wiring board
US11289393B2 (en) Methods, devices, and systems for electronic device molding and encapsulation
CN207995523U (en) A kind of waterproof fastening shell
CN209002216U (en) A kind of waterproof Microspeaker
CN207518847U (en) A kind of micro injection bonded structure of loud speaker
CN107948892B (en) Micro injection molding bonding structure of loudspeaker and processing method thereof
CN207060260U (en) A kind of waterproof construction for electric bicycle instrument
CN211165092U (en) Injection mold
CN215491787U (en) Sensor module assembly and sensor fixing component
CN207883675U (en) Electronic component encapsulates
CN211930863U (en) Loudspeaker
CN212062263U (en) Ultra-thin mechanical patch encoder packaging structure

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant