CN211165092U - Injection mold - Google Patents
Injection mold Download PDFInfo
- Publication number
- CN211165092U CN211165092U CN201922055454.XU CN201922055454U CN211165092U CN 211165092 U CN211165092 U CN 211165092U CN 201922055454 U CN201922055454 U CN 201922055454U CN 211165092 U CN211165092 U CN 211165092U
- Authority
- CN
- China
- Prior art keywords
- floating plate
- injection mold
- mold
- upper die
- lower die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000002347 injection Methods 0.000 title claims abstract description 18
- 239000007924 injection Substances 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000001746 injection moulding Methods 0.000 claims abstract description 12
- 239000012528 membrane Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 description 18
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Images
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The application relates to the technical field of injection molding, in particular to an injection mold. The method comprises the following steps: a lower die; the lower die comprises a plurality of side walls, and a floating plate for supporting the substrate is arranged in a space surrounded by the side walls; the upper die is positioned above the lower die, and an injection molding space is formed among the upper die, the side wall and the floating plate; and the elastic component is used for providing elastic force to the upper die direction for the floating plate. The plastic mould in this application, under the effect of elastic component elasticity, when making the floating plate can closely laminate with the base plate that sets up in this floating plate top, do not influence the heat dissipation of base plate promptly, can not produce the damage to the base plate.
Description
Technical Field
The application relates to the technical field of injection molding, in particular to an injection mold.
Background
The double-sided copper-clad ceramic substrate has good heat conduction performance, meanwhile, a copper layer on the front side of the ceramic substrate can be etched and used for manufacturing a circuit, so that the double-sided copper-clad ceramic substrate is widely applied to the field of power semiconductor packaging at present, in a semiconductor injection molding process, the copper layer on the back side of the ceramic substrate needs to be exposed out of the surface of epoxy resin for heat dissipation, the double-sided copper-clad ceramic substrate can be completely attached to a lower die after a die is assembled in the injection molding process, if the attachment is not tight, resin overflows to the surface of the double-sided copper-clad ceramic substrate, the heat dissipation performance of a module is influenced, and.
SUMMERY OF THE UTILITY MODEL
The utility model provides an injection mold, under the effect of elastic component elasticity, make the floating plate can with set up in the time of closely laminating of the base plate of this floating plate top, do not influence the heat dissipation of base plate promptly, can not produce the damage to the base plate.
In order to achieve the above object, the present invention provides the following technical solutions:
an injection mold comprising: a lower die;
the lower die comprises a plurality of side walls, and a floating plate for supporting the substrate is arranged in a space surrounded by the side walls;
the upper die is positioned above the lower die, and an injection molding space is formed among the upper die, the side wall and the floating plate;
and the elastic component is used for providing elastic force to the upper die direction for the floating plate.
Injection mold in this application, the in-process of laminating between with base plate and the unsteady board, owing to be equipped with elastic component in one side that the unsteady board kept away from the base plate, after laminating closely between base plate atress and unsteady board, when continuing to apply the effort, elastic component atress shrink to the too big risk that produces the fracture of base plate atress has been reduced, and this kind of mode is after unsteady board and the inseparable laminating of base plate, and the unsteady board can be in predetermined height range.
Preferably, the resilient assembly comprises a plurality of springs;
the springs are uniformly distributed on one side, away from the upper die, of the floating plate.
Preferably, the elastic assembly comprises a plurality of air bags, and the air bags are uniformly distributed on one side, away from the upper die, of the floating plate.
Preferably, the elastic component comprises a plurality of rubber columns, and the rubber columns are uniformly distributed on one side, away from the upper die, of the floating plate.
Preferably, a film is provided on a side of the floating plate facing the upper mold.
Preferably, the film is an adhesive film.
Preferably, a lead frame is arranged between the upper die and the lower die, and the lead frame is used for being connected with the substrate.
Preferably, a plurality of lead terminals are arranged on the lead frame, and the lead terminals correspond to the chips on the substrate one to one.
Drawings
Fig. 1 is a sectional view of an injection mold according to an embodiment of the present application.
Icon: 10-upper mould; 20-lower die; 30-a film; 40-a floating plate; 50-an elastic component; 60-a substrate; and 70-a lead frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides an injection mold, including:
a lower die 20;
the lower die 20 comprises a plurality of side walls, and a floating plate 40 for supporting a substrate 60 is arranged in a space enclosed by the side walls;
an upper mold 10, the upper mold 10 being positioned above the lower mold 20, and forming an injection molding space with the side wall and the floating plate 40;
and an elastic member 50, wherein the elastic member 50 is used for providing elastic force to the floating plate 40 towards the upper die 10.
The substrate 60 is a double-sided copper-clad ceramic substrate 60.
Injection mold in this application, in-process of laminating between base plate 60 and floating plate 40, owing to be equipped with elastic component 50 in one side that floating plate 40 deviates from base plate 60, laminate closely after base plate 60 atress and floating plate 40, when continuing to apply the effort, elastic component 50 atress shrink, thereby the too big risk that produces the fracture of base plate 60 atress has been reduced, and this kind of mode is closely laminated the back at floating plate 40 and base plate 60, floating plate 40 can be in predetermined height range.
As an alternative, with continued reference to fig. 1, the resilient member 50 includes a plurality of springs; the springs are uniformly distributed on the side of the floating plate 40 away from the upper die 10. When the acting force on one side of the floating plate 40, which is far away from the springs, is larger, the springs are all contracted, so that the floating plate 40 moves to one side far away from the upper die 10, and the situation that the base plate 60 is damaged due to overlarge pressure of the attaching process when the base plate 60 is attached to the floating plate 40 is avoided; and a plurality of springs are uniformly distributed to stably move the floating plate 40 toward the upper mold 10 or away from the upper mold 10.
As an alternative, the elastic assembly 50 includes a plurality of air pockets, which are uniformly distributed on a side of the floating plate 40 facing away from the upper die 10. When the acting force on one side of the floating plate 40, which is far away from the air bags, is large, the air bags are stressed to deform, so that the floating plate 40 moves to one side far away from the upper die 10, and the situation that the base plate 60 is damaged due to overlarge pressure of the attaching process when the base plate 60 is attached to the floating plate 40 is avoided; when the external force is removed, the air bag returns to the original state, so that the floating plate 40 returns to the original position, thereby ensuring that the whole volume of the injection molding space is basically kept unchanged, and reducing the using amount of the epoxy resin.
As an alternative, the elastic assembly 50 includes a plurality of rubber columns uniformly distributed on a side of the floating plate 40 facing away from the upper die 10. When the acting force on one side of the floating plate 40, which is far away from the rubber columns, is larger, the rubber columns are stressed to deform, so that the floating plate 40 moves to one side far away from the upper die 10, and the situation that the base plate 60 is damaged due to overlarge pressure of the attaching process when the base plate 60 is attached to the floating plate 40 is avoided; when the external force is removed, the rubber column returns to the original state, so that the floating plate 40 returns to the original position, thereby ensuring that the whole volume of the injection space is basically kept unchanged, and reducing the using amount of the epoxy resin.
As an alternative, the floating plate 40 is provided with a membrane 30 on the side facing the upper mold 10. In the injection molding process, the temperature of the double-sided copper-clad ceramic substrate 60 is high, so that the double-sided copper-clad ceramic substrate 60 is warped, and the film 30 is located between the floating plate 40 and the substrate 60 and can be attached to the surface of the double-sided copper-clad ceramic substrate 60 with high temperature, so that epoxy resin in the injection molding process is prevented from overflowing to the surface of the double-sided copper-clad ceramic substrate 60, and the heat dissipation performance of the double-sided copper-clad ceramic substrate 60 is guaranteed.
Specifically, the film 30 is a glue film, and the glue film 30 can be located at the outer edge of the double-sided copper-clad ceramic substrate 60 to ensure that the glue film is adhered between the possibly warped part and the non-warped part, so as to prevent the high temperature of the double-sided copper-clad ceramic substrate 60, so that the heat dissipation surface of the double-sided copper-clad ceramic substrate 60 is flush with the epoxy resin layer, the heat dissipation surface of the double-sided copper-clad ceramic substrate 60 does not overflow glue, and the heat dissipation performance of the whole module is improved.
As an alternative, a lead frame 70 is disposed between the upper die 10 and the lower die 20, and the lead frame 70 is used for connecting with the substrate 60.
As an alternative, a plurality of lead terminals are disposed on the lead frame 70, and the plurality of lead terminals correspond to the chips on the substrate 60 one to one. Specifically, during the injection molding process, the lead terminals are connected to the chip on the substrate 60 to connect the chip to other modules.
In the using process of the mold, firstly, a layer of glue film is attached to the surface of the floating plate 40; placing the double-sided copper-clad ceramic substrate 60 on the adhesive film; placing the lead frame 70 between the upper die 10 and the lower die 20, and closing the upper die 10 and the lower die 20; after the position of the floating plate 40 is stabilized, epoxy resin is injected to the double-sided copper-clad ceramic substrate 60.
It will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (7)
1. An injection mold, comprising: a lower die;
the lower die comprises a plurality of side walls, and a floating plate for supporting the substrate is arranged in a space surrounded by the side walls;
the upper die is positioned above the lower die, and an injection molding space is formed among the upper die, the side wall and the floating plate;
and the elastic component is used for providing elastic force to the upper die direction for the floating plate.
2. The injection mold of claim 1, wherein the resilient component comprises a plurality of springs;
the springs are uniformly distributed on one side, away from the upper die, of the floating plate.
3. The injection mold of claim 1, wherein the resilient member comprises a plurality of air pockets evenly distributed on a side of the floating plate facing away from the upper mold.
4. The injection mold of claim 1, wherein the resilient member comprises a plurality of rubber posts evenly distributed on a side of the floating plate facing away from the upper mold.
5. The injection mold of claim 1, wherein a side of the float plate facing the upper mold is provided with a membrane.
6. An injection mold according to claim 5, wherein the film is a film.
7. The injection mold of claim 1, wherein a lead frame is disposed between the upper mold and the lower mold, the lead frame being configured to be connected to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922055454.XU CN211165092U (en) | 2019-11-22 | 2019-11-22 | Injection mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922055454.XU CN211165092U (en) | 2019-11-22 | 2019-11-22 | Injection mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211165092U true CN211165092U (en) | 2020-08-04 |
Family
ID=71826800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922055454.XU Active CN211165092U (en) | 2019-11-22 | 2019-11-22 | Injection mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211165092U (en) |
-
2019
- 2019-11-22 CN CN201922055454.XU patent/CN211165092U/en active Active
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