JP2814031B2 - LED display device and manufacturing method thereof - Google Patents

LED display device and manufacturing method thereof

Info

Publication number
JP2814031B2
JP2814031B2 JP4024756A JP2475692A JP2814031B2 JP 2814031 B2 JP2814031 B2 JP 2814031B2 JP 4024756 A JP4024756 A JP 4024756A JP 2475692 A JP2475692 A JP 2475692A JP 2814031 B2 JP2814031 B2 JP 2814031B2
Authority
JP
Japan
Prior art keywords
silicone resin
led display
display device
frame
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4024756A
Other languages
Japanese (ja)
Other versions
JPH05190905A (en
Inventor
雅俊 尾本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP4024756A priority Critical patent/JP2814031B2/en
Publication of JPH05190905A publication Critical patent/JPH05190905A/en
Application granted granted Critical
Publication of JP2814031B2 publication Critical patent/JP2814031B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明はLED表示装置及びその
製造方法に係り、特に2種類のシリコン樹脂を充填する
ことにより防水処理されたものに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED display device and a method of manufacturing the same, and more particularly, to an LED display device which is waterproofed by being filled with two kinds of silicone resins.

【0002】[0002]

【従来の技術】従来、屋外用のユニットに使用されるL
ED表示装置では、防水対策が必要であり、そのため数
個のLED表示素子( 以下素子という) の前面に、アク
リル板等で覆いを設けたり、個々のユニットにシリコン
ゴムで成型されたパッケージを取付けて防水処理を図っ
ている。
2. Description of the Related Art Conventionally, L used for outdoor units
ED display devices require waterproofing measures.Therefore, several LED display elements (hereafter referred to as elements) should be covered with an acrylic plate, etc., or a package made of silicon rubber should be attached to each unit. To achieve waterproofing.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、前記処
理のうち、数個の素子の前面にアクリル板等で覆いをし
たものは、アクリル板の定型寸法の制約により、LED
表示装置のサイズに限界があり、市場が要望する表示画
面の大きいディスプレイが出来ないという問題がある。
However, among the above-mentioned treatments, those in which the front surfaces of several elements are covered with an acrylic plate or the like are limited by the limitations on the standard size of the acrylic plate.
There is a problem that the size of the display device is limited and a display having a large display screen required by the market cannot be provided.

【0004】また個々の素子にシリコンゴムで成型され
たパッケージを取付けることにより、表示画面のサイズ
は自由になるが、シリコンゴムを成型することによりコ
ストアップの問題があり、また素子への組み込み工程が
非常に難しく、量産に適しないという問題もある。本発
明は上記事情に鑑みて創案されたもので、大型の表示装
置の実現が可能で、コストアップや前記製造工程の問題
等を解決できる新規なLED表示装置及びその製造方法
を提供することを目的としている。
Although the size of the display screen can be freely set by attaching a package formed of silicon rubber to each element, there is a problem that the cost is increased by molding the silicon rubber, and a process of assembling into the element is also required. Is very difficult, and is not suitable for mass production. The present invention has been made in view of the above circumstances, and provides a novel LED display device which can realize a large-sized display device, can solve the cost increase, the problem of the manufacturing process, and the like, and a method of manufacturing the same. The purpose is.

【0005】[0005]

【課題を解決するための手段】本発明に係るLED表示
装置は、枠体と、枠体に組み込まれるLED表示素子を
搭載した駆動基板と、枠体と前記駆動基板の隙間を目張
りする非流動性のシリコン樹脂と、駆動基板の上に充填
した流動性シリコン樹脂を具備したことを特徴としてい
る。
According to the present invention, there is provided an LED display device comprising: a frame; a driving board on which an LED display element incorporated in the frame is mounted; And a fluid silicone resin filled on the drive substrate.

【0006】その製造方法は枠体にLED表示素子を搭
載した駆動基板を組み込んだあと、枠体と駆動基板の隙
間に非流動性のシリコン樹脂でもって目張りし、そのあ
と前記駆動基板上に流動性シリコン樹脂を充填したこと
を特徴としている。そして前記非流動性のシリコン樹脂
は一液性シリコン樹脂であり、流動性シリコン樹脂は二
液性シリコン樹脂であるものを含んでいる。
In the manufacturing method, after a driving substrate having an LED display element mounted on a frame is assembled, a gap between the frame and the driving substrate is laid with a non-flowable silicone resin, and then the liquid flows over the driving substrate. It is characterized by being filled with conductive silicone resin. The non-fluid silicone resin is a one-liquid silicone resin, and the fluid silicone resin includes a two-liquid silicone resin.

【0007】[0007]

【実施例】以下、図面を参照して本発明の実施例を説明
する。図1はLED表示装置の断面図、図2は同平面図
である。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of the LED display device, and FIG. 2 is a plan view of the same.

【0008】図において、1 はLED表示装置の枠体で
あり、この枠体1 内に例えば16個×16個もしくは24個×
24個の素子2 をマトリクス状に搭載した駆動基板3 を組
み込んである。そして駆動基板3 と前記枠体1 の隙間に
図1及び図2の斜線で示したように、非流動性のシリコ
ン樹脂4 を目張りしてある。特にこのシリコン樹脂4は
一液性の速硬化型樹脂を用いることにより、目張り作業
工程が簡略化されるという利点がある。
In FIG. 1, reference numeral 1 denotes a frame of an LED display device, for example, 16 × 16 or 24 ×
A drive board 3 on which 24 elements 2 are mounted in a matrix is incorporated. A non-fluid silicone resin 4 is lined up in the gap between the drive substrate 3 and the frame 1 as shown by hatching in FIGS. In particular, the use of a one-component quick-curing resin as the silicone resin 4 has an advantage that the seaming work process is simplified.

【0009】前記目張り作業のあと、前記駆動基板3 の
上に流動性のシリコン樹脂5 を充填する。この場合にお
いて、流動性シリコン樹脂5 は二液性の熱硬化型樹脂を
用いるとよい。
[0009] After the seaming operation, a fluid silicon resin 5 is filled on the drive substrate 3. In this case, a two-component thermosetting resin is preferably used as the fluid silicone resin 5.

【0010】[0010]

【発明の効果】以上説明したように、本発明に係るLE
D表示装置及びその製造方法は枠体と駆動基板の隙間に
非流動性のシリコン樹脂で目張りし、駆動基板上を流動
性シリコン樹脂でもって充填したものであるから、非流
動性のシリコン樹脂は隙間からこぼれ落ちることがな
く、また早く硬化が行え、作業上大変都合がよい。また
駆動基板の防水に流動性シリコン樹脂を使用したので、
駆動基板及び素子に樹脂が隈無く浸透し、この樹脂が非
流動性のシリコン樹脂から流出することがない。また同
じシリコン系樹脂であるから、全体としての信頼性も高
いものである。
As described above, the LE according to the present invention is used.
In the D display device and the method of manufacturing the same, the gap between the frame and the drive substrate is laid with non-fluid silicone resin, and the drive substrate is filled with fluid silicone resin. There is no spillage from the gap, and curing can be performed quickly, which is very convenient for work. In addition, since fluid silicone resin was used for waterproofing the drive board,
Resin penetrates all over the drive substrate and elements, and this resin does not flow out of the non-fluid silicone resin. In addition, since the same silicone resin is used, the reliability as a whole is high.

【0011】さらに従来のような成型品でなく、樹脂を
用いたので、駆動基板や枠体の形状や構造の自由度も大
きくなり、装置の大型化が可能である。さらに、樹脂の
注型だけの作業であるので、工程も簡単で、成型費用も
不要であり、装置全体としてのコストダウンを図ること
ができる。
Further, since a resin is used instead of a conventional molded product, the degree of freedom in the shape and structure of the drive substrate and the frame is increased, and the apparatus can be made larger. Further, since the operation is only for casting the resin, the process is simple, the molding cost is unnecessary, and the cost of the entire apparatus can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る図面であって、LED表示装置の
断面図である。
FIG. 1 is a cross-sectional view of an LED display device according to the present invention.

【図2】本発明に係る図面であって、LED表示装置の
平面図である。
FIG. 2 is a plan view of the LED display device according to the present invention.

【符号の説明】[Explanation of symbols]

1 枠体 2 LED表示素子 3 駆動基板 4 非流動性のシリコン樹脂 5 流動性シリコン樹脂 1 Frame 2 LED display element 3 Drive board 4 Non-fluid silicone resin 5 Fluid silicone resin

Claims (6)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 枠体と、枠体に組み込まれるLED表示
素子を搭載した駆動基板と、枠体と前記駆動基板の隙間
を目張りする非流動性のシリコン樹脂と、駆動基板の上
に充填した流動性シリコン樹脂を具備したことを特徴と
するLED表示装置。
1. A frame, a driving substrate on which an LED display element to be incorporated in the frame is mounted, a non-fluid silicone resin for filling a gap between the frame and the driving substrate, and filling on the driving substrate. An LED display device comprising a fluid silicone resin.
【請求項2】 前記非流動性のシリコン樹脂は一液性の
シリコン樹脂である請求項1記載のLED表示装置。
2. The LED display device according to claim 1, wherein the non-fluid silicone resin is a one-liquid silicone resin.
【請求項3】 前記流動性シリコン樹脂は二液性のシリ
コン樹脂である請求項1記載のLED表示装置。
3. The LED display device according to claim 1, wherein the fluid silicone resin is a two-liquid silicone resin.
【請求項4】 枠体にLED表示素子を搭載した駆動基
板を組み込んだあと、枠体と駆動基板の隙間に非流動性
のシリコン樹脂でもって目張りし、そのあと前記駆動基
板上に流動性シリコン樹脂を充填したことを特徴とする
LED表示装置の製造方法。
4. After incorporating a drive board on which an LED display element is mounted on a frame, a gap between the frame and the drive board is laid with non-fluid silicone resin, and then a flowable silicon is placed on the drive board. A method for manufacturing an LED display device, characterized by filling with a resin.
【請求項5】 前記非流動性のシリコン樹脂は一液性の
シリコン樹脂である請求項4記載のLED表示装置の製
造方法。
5. The method according to claim 4, wherein the non-fluid silicone resin is a one-liquid silicone resin.
【請求項6】 前記流動性シリコン樹脂は二液性のシリ
コン樹脂である請求項4記載のLED表示装置の製造方
法。
6. The method according to claim 4, wherein the fluid silicone resin is a two-liquid silicone resin.
JP4024756A 1992-01-14 1992-01-14 LED display device and manufacturing method thereof Expired - Lifetime JP2814031B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4024756A JP2814031B2 (en) 1992-01-14 1992-01-14 LED display device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4024756A JP2814031B2 (en) 1992-01-14 1992-01-14 LED display device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPH05190905A JPH05190905A (en) 1993-07-30
JP2814031B2 true JP2814031B2 (en) 1998-10-22

Family

ID=12146994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4024756A Expired - Lifetime JP2814031B2 (en) 1992-01-14 1992-01-14 LED display device and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP2814031B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3622404B2 (en) * 1996-02-29 2005-02-23 東芝ライテック株式会社 Display unit
US6268432B1 (en) 1998-10-01 2001-07-31 Dow Corning Toray Silicone Co. Ltd. Filler/adhesive agent for display units containing a curable silicone composition
JP2008277828A (en) * 2007-05-07 2008-11-13 Neovison Pnv Co Ltd Light emitting diode mounted on electric sign

Also Published As

Publication number Publication date
JPH05190905A (en) 1993-07-30

Similar Documents

Publication Publication Date Title
JPH03155995A (en) Ic module and ic card using the same
MY122191A (en) Liquid crystal display device having spacers with two sizes and metal films and protrusions
JPH0417343A (en) Manufacture of thin-type semiconductor device
JP2814031B2 (en) LED display device and manufacturing method thereof
US5855924A (en) Closed-mold for LED alphanumeric displays
JPH0237761A (en) Hybrid integrated circuit device
JPH055892A (en) Liquid crystal panel and production thereof
TW202141223A (en) Housing and electronic device using thereof
JPS5854679U (en) liquid crystal display device
JP4195587B2 (en) Manufacturing method of light emitting / receiving element
JPS57188852A (en) Method of sealing ic
JPH0920059A (en) Potting method
JPS5813514U (en) liquid crystal display device
JPH0964077A (en) Method of manufacturing electronic component
JPH0546270Y2 (en)
JPS6413522A (en) Liquid crystal display device
JPS62137471U (en)
JPH0621145A (en) Semiconductor device
JP2952728B2 (en) Exposed structure of heat dissipation slag on electronic component mounting board
JPS62117347A (en) Resin seal method for semiconductor device
JPH02205390A (en) Resin sealing method for electric component for surface mounting of electric circuit board
JPS57201053A (en) Sealing method for semiconductor device
JPH02132214U (en)
JPH0922965A (en) Ic mounting structure
JPS63144095A (en) Ic card

Legal Events

Date Code Title Description
FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20070814

Year of fee payment: 9

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080814

Year of fee payment: 10

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080814

Year of fee payment: 10

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090814

Year of fee payment: 11

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090814

Year of fee payment: 11

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100814

Year of fee payment: 12

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110814

Year of fee payment: 13

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110814

Year of fee payment: 13

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120814

Year of fee payment: 14

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120814

Year of fee payment: 14