JPH05175627A - Hybrid integrated circuit board - Google Patents

Abstract

PURPOSE:To surface-mount a hybrid integrated circuit board on a mother board in a simple and definite manner. CONSTITUTION:Square-shaped recessed parts 4a and 4b are concentrically formed on the outer edge of an insulation board 2 which is substantially flush with a land 3a of a conductor pattern 3 of a hybrid integrated circuit board 1 where the recessed parts 4a and 4b are identical to each other in shape and size. A main body 5a of a terminal 5 made of a conductor metal is fitted closely into the square-shaped recessed parts 4a and 4b so that the bottom of a flange 5b of the terminal 5 may come into contact with the land 3a of the conductor pattern 3. At the same time, a bottom 5c of the main body 5a is placed in contact with the land of the circuit pattern of a mother board and these contact portions are soldered with reflow solder or the like and electrically connected to each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit board mounted on a mother board, and more particularly to a hybrid integrated circuit board having an improved connection method for electrically connecting a conductor pattern to a circuit pattern on the mother board.

[0002]

2. Description of the Related Art Generally, a hybrid integrated circuit board of this type is
The hybrid integrated circuit board is surface-mounted on the motherboard by providing terminals on the lands of the conductor pattern formed on the insulating substrate and electrically connecting to the lands of the motherboard via the terminals.

Conventionally, as this type of terminal, there are a lead terminal, a through hole terminal and the like. The lead terminal is mounted by soldering a lead frame of F type or Y type, which is the terminal metal, to the solder land of the conductor pattern, and inserting the tip end of the lead terminal into the pin hole of the motherboard and soldering. ing.

Further, the through-hole terminal is formed with a through hole penetrating in the thickness direction of the insulating substrate in the land of the conductor pattern of the hybrid integrated circuit board, and a through hole is formed by pouring a conductive metal into the through hole. Then, the conductor patterns on both the front and back surfaces of the insulating substrate and the circuit pattern on the motherboard are connected in the front and back direction through the through holes.

[0005]

However, in such a conventional hybrid integrated circuit board having lead terminals,
To surface mount this on the motherboard, the tip of each lead terminal must be bent and made parallel so that it can be placed on the mounting surface of the motherboard, and in addition to the bending process, There is a problem that the installation space is enlarged and it is difficult to achieve high-density mounting.

Further, in order to expose one side surface of the through hole terminal in the radial direction to the outside, for example, after forming a circular through hole, the insulating substrate must be cut so as to be cut into a substantially semicircular shape. At the time of cutting, the conductive metal inside may be peeled off, resulting in poor electrical connection.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a hybrid integrated circuit board which can be surface-mounted on a mother board easily and reliably.

[0008]

The present invention is constructed as follows.

That is, the present invention provides a hybrid integrated circuit board which is provided on a mother board on which a circuit pattern is formed and which forms a conductor pattern connected to the circuit pattern on an insulating substrate. On the outer end surface of the insulating substrate that is substantially flush with, concave portions are formed concentrically through the conductor pattern and the insulating substrate in the thickness direction, and the conductive pattern is formed by the conductive metal fitted in the concave portions. It is characterized by being electrically connected to the circuit pattern.

[0010]

When the hybrid integrated circuit board is placed at a desired surface mounting position on the motherboard, the conductor pattern of the hybrid integrated circuit board is electrically connected to the circuit pattern of the motherboard through the conductor metal in the recess.

In other words, the conductor pattern of the hybrid integrated circuit board is mounted on the motherboard by fitting the conductor metal into the conductor pattern of the hybrid integrated circuit board and the recess formed in the outer end surface of the insulating substrate. It can be electrically connected to the circuit pattern.

Therefore, by mounting the thick film hybrid integrated circuit board on the mother board, the surface mounting can be performed easily and surely, and as a result, the mounting density can be increased.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of an essential part of an embodiment of the present invention, and FIG. 2 is a plan view of FIG. 1, in which a hybrid integrated circuit board 1 is provided on an upper surface of an insulating substrate 2 made of ceramics or the like. The required conductor pattern 3 is formed of a thick film or a thin film, and a rectangular land 3a is formed at one end of the conductor pattern 3, for example.

The tip (outer) end surface of the land 3a and the outer end surface of the insulating substrate 2 which is substantially flush with the land 3a are recessed inward and penetrate in the thickness (film thickness or plate thickness) direction. For example, rectangular rectangular recesses 4a and 4b having the same planar shape and the same size are formed concentrically.

The prismatic main body 5a of the terminal 5 made of a conductive metal is closely fitted into the rectangular concave portions 4a and 4b. The terminal 5 is a rectangular recess 4a, 4
The axial length of the solid or hollow bottomed prismatic main body 5a which is densely fitted in the b concentrically is set to be substantially equal to the length from the upper surface of the conductor pattern 3 to the lower surface of the insulating substrate 2 in the drawing. is doing.

Further, as shown in FIG. 2, a rectangular flange 5b, which is slightly smaller than the land 3a of the conductor pattern 3, is slightly eccentrically inwardly fixed to the upper surface of the main body 5a in the figure to fix the rectangular flange 5b and the main body 5a. Both outer end faces of the are substantially flush with each other.

Next, a method for mounting the hybrid integrated circuit board 1 thus constructed at a predetermined mounting position on the mother board 6 will be described with reference to FIGS.

First, as shown in FIG. 3, the hybrid integrated circuit board 1 is placed on the land 7a of the circuit pattern 7 of the mother board 6, and the mother board 6 and the lands 7a and 3a of the hybrid integrated circuit board 1 are concentric with each other. Position so that it matches the shape.

Next, the main body 5a of the terminal 5 is closely fitted into the rectangular recesses 4a and 4b of the hybrid integrated circuit board 1 from above, and the lower surface of the rectangular flange 5b of the terminal 5 is brought into contact with the upper surface of the land 3a. The bottom surface 5c of the main body 5b is brought into contact with the top surface of the land 7a of the mother board 6 while being brought into contact with each other for electrical insulation. These contact portions are fixed by soldering such as reflow soldering.

Therefore, according to this embodiment, the hybrid integrated circuit board 1 can be mounted on the lands 7aa of the circuit pattern 7 of the mother board 6 and easily surface-mounted by, for example, reflow soldering.

The land 3 of the thick film hybrid integrated circuit board 1 is also used.
a and the flange 5b of the terminal 5 are in flat contact with each other,
Since the bottom surface 5c of the terminal 5 and the land 7a of the mother board 6 are in flat contact with each other and the contact area of these contact portions is large, these contacts can be ensured.

For this reason, the hybrid integrated circuit board 1 can be surface-mounted on the mother board 6 with high density, and
The reliability can be increased.

Further, in the multi-chambered board before being cut into each hybrid integrated circuit board 1, that is, in the state of one plate in which a plurality of hybrid integrated circuit boards 1 are vertically and horizontally connected, the corners of each hybrid integrated circuit board 1 are formed. Since the terminals 5 can be fitted into the recesses 4a and 4b, soldered, and then cut into the hybrid integrated circuit boards 1, the integrated circuits can be cut into the integrated circuit boards as in the conventional example and then the integrated circuits can be cut. Compared with the method of electrically connecting the conductor pattern of the substrate to the land of the circuit pattern on the motherboard, the work efficiency of surface mounting can be improved.

[0025]

As described above, according to the present invention, the outer end of the conductor pattern and the outer end face of the insulating substrate which is substantially flush with the outer end face of the conductor pattern are formed with recesses penetrating in the thickness direction thereof. Since the conductor metal is inserted into the circuit board to electrically connect the conductor pattern to the circuit pattern of the mother board, this connection can be performed easily and reliably. Therefore, the hybrid integrated circuit board can be surface-mounted on the mother board with high density.

[Brief description of drawings]

FIG. 1 is a perspective view of essential parts of a hybrid integrated circuit board according to the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a diagram showing one step of a method of surface-mounting the hybrid integrated circuit board of the embodiment shown in FIG. 1 on a circuit pattern of a mother board.

FIG. 4 is a diagram showing a state in which the hybrid integrated circuit substrate of the embodiment shown in FIG. 1 and the like is surface-mounted on a motherboard.

[Explanation of symbols]

 1 Hybrid Integrated Circuit Board 2 Insulating Board 3 Conductor Pattern 3a Land 4a, 4b Square Recess 5 Terminal 5b Flange 5c Bottom 6 Motherboard 7 Circuit Pattern 7a Land

Claims (1)

[Claims] 1. A hybrid integrated circuit board having a conductor pattern installed on a mother board on which a circuit pattern is formed and connected to the circuit pattern on an insulating substrate. On the outer end face of the insulating substrate that forms one, concavities are formed concentrically to penetrate the conductor pattern and the insulating substrate in the thickness direction, and the conductor pattern is formed on the circuit pattern by the conductor metal fitted in these recesses. A hybrid integrated circuit board characterized by being electrically connected.