JPH0517318B2 - - Google Patents
Info
- Publication number
- JPH0517318B2 JPH0517318B2 JP1739485A JP1739485A JPH0517318B2 JP H0517318 B2 JPH0517318 B2 JP H0517318B2 JP 1739485 A JP1739485 A JP 1739485A JP 1739485 A JP1739485 A JP 1739485A JP H0517318 B2 JPH0517318 B2 JP H0517318B2
- Authority
- JP
- Japan
- Prior art keywords
- plating liquid
- hole
- plating
- mask
- supply hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 47
- 239000007788 liquid Substances 0.000 claims description 27
- 238000002347 injection Methods 0.000 claims description 17
- 239000007924 injection Substances 0.000 claims description 17
- 238000007599 discharging Methods 0.000 claims 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1739485A JPS61177390A (ja) | 1985-01-31 | 1985-01-31 | 部分メツキ装置 |
| GB08601963A GB2170513B (en) | 1985-01-31 | 1986-01-28 | Selectively plating apparatus for forming an annular coated area |
| US06/823,630 US4675093A (en) | 1985-01-31 | 1986-01-29 | Selectively plating apparatus for forming an annular coated area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1739485A JPS61177390A (ja) | 1985-01-31 | 1985-01-31 | 部分メツキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61177390A JPS61177390A (ja) | 1986-08-09 |
| JPH0517318B2 true JPH0517318B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-03-08 |
Family
ID=11942782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1739485A Granted JPS61177390A (ja) | 1985-01-31 | 1985-01-31 | 部分メツキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61177390A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1985
- 1985-01-31 JP JP1739485A patent/JPS61177390A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61177390A (ja) | 1986-08-09 |