JPH0516973B2 - - Google Patents
Info
- Publication number
- JPH0516973B2 JPH0516973B2 JP60107527A JP10752785A JPH0516973B2 JP H0516973 B2 JPH0516973 B2 JP H0516973B2 JP 60107527 A JP60107527 A JP 60107527A JP 10752785 A JP10752785 A JP 10752785A JP H0516973 B2 JPH0516973 B2 JP H0516973B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- wafer
- substrate
- head
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 54
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 230000032258 transport Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 35
- 239000004593 Epoxy Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
- Specific Conveyance Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60107527A JPS61265231A (ja) | 1985-05-20 | 1985-05-20 | チップ実装装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60107527A JPS61265231A (ja) | 1985-05-20 | 1985-05-20 | チップ実装装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61265231A JPS61265231A (ja) | 1986-11-25 |
| JPH0516973B2 true JPH0516973B2 (de) | 1993-03-05 |
Family
ID=14461450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60107527A Granted JPS61265231A (ja) | 1985-05-20 | 1985-05-20 | チップ実装装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61265231A (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2617077B1 (fr) * | 1987-06-25 | 1994-09-02 | Merlin Gerin | Manipulateur rapide a transfert multiple |
| CN109014835B (zh) * | 2018-09-13 | 2023-11-17 | 长沙纽泰自动化科技有限公司 | 导轨片安装组件及安装方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5871044A (ja) * | 1981-10-23 | 1983-04-27 | Fujitsu Ltd | 給材装置 |
| JPS60107530A (ja) * | 1983-11-16 | 1985-06-13 | Nec Corp | 音響光学スペクトラム・アナライザ |
-
1985
- 1985-05-20 JP JP60107527A patent/JPS61265231A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5871044A (ja) * | 1981-10-23 | 1983-04-27 | Fujitsu Ltd | 給材装置 |
| JPS60107530A (ja) * | 1983-11-16 | 1985-06-13 | Nec Corp | 音響光学スペクトラム・アナライザ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61265231A (ja) | 1986-11-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |