JPH05167234A - Circuit constituent electronic part - Google Patents

Abstract

PURPOSE:To manufacture the title circuit constituent electronic part in easy composition taking the least assembling manhours capable of enhancing the endurance and the reliability. CONSTITUTION:A circuit pattern 28, electrode parts 22, connecting terminals 30, etc., are integrally provided by stamping a metallic board 24. Next, electronic elements 34, etc., are fixed on the circuit pattern 28 so as to mold the circuit pattern 28 and the electronic elements 34 in an insulating resin. Besides, solder checking parts are provided in the electrode parts 22.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit provided in an electronic device, and to a circuit constituent electronic component in which an electronic element is provided in a circuit pattern.

[0002]

2. Description of the Related Art In a conventional general circuit pattern, as shown in FIG. 7, a circuit pattern 12 is formed on an insulating substrate 10 with a conductive paint or a metal foil, and the electrode portion 1 of the circuit pattern 12 is formed.
The electronic element 16 was soldered to the No. 4. Particularly in recent years, due to the trend toward smaller and lighter electronic devices, the number of surface-mounted electronic elements has increased, and the number of electronic elements 16 directly placed on the surface of the insulating substrate 10 and soldered has also increased.

In addition, Japanese Utility Model Laid-Open No. 48-48568 and
As disclosed in Japanese Patent Application Laid-Open No. 61-199606, a semiconductor device, a resistor or the like in which terminals are formed from a lead frame is generally widely used. In these devices, terminals extending inward from the outer frame of the frame at equal pitches are connected to electrode portions of a semiconductor element or a resistor. As a result, when the terminals are connected to the semiconductor element or the resistor, the connection can be accurately and easily performed with the terminals aligned.

[0004]

In the former case of the above-mentioned conventional technique, the reliability of the built-in electronic circuit becomes low and the long-term use becomes difficult when the temperature conditions, vibrations and other operating environments are severe. Was unbearable. This is because, for example, when the temperature fluctuates significantly, there are obstacles such as peeling of the electronic element 16 and variation of the characteristics due to the difference in the coefficient of thermal expansion between the substrate 10 and the solder or the electronic element 16.
Moreover, the work such as the step of soldering the terminal 18 to the circuit board 10 is troublesome, and the assembling efficiency is not good.

Further, the conventional techniques disclosed in the above-mentioned respective publications use a lead frame for attaching terminals to a semiconductor element, a resistor, etc., and do not require a circuit-like structure. A semiconductor element or a resistor is simply attached to the base end of the lead frame terminal.

The present invention has been made in view of the above conventional technique, and an object thereof is to provide a circuit-structured electronic component having a simple structure, a small number of assembling steps, and durability against heat cycles and the like. And

[0007]

SUMMARY OF THE INVENTION According to the present invention, a circuit pattern and a connecting terminal which are integrally formed by punching out a metal plate are provided, and an electronic element is mounted on the circuit pattern. It is a circuit component electronic component formed by molding in insulating resin.

Further, according to the present invention, a metal plate is punched out to integrally form a circuit pattern and a connecting terminal, an electrode portion for soldering an electronic element is provided on the circuit pattern, and a portion of the electrode portion to be soldered is provided. It is a circuit-structured electronic component provided with a solder blocking portion for preventing solder from flowing out of the circuit.

[0009]

In the circuit-structured electronic component of the present invention, since the circuit pattern is formed by punching out the metal plate, it is not necessary to separately provide the circuit board and the circuit pattern, and the electronic element is surely protected by the molding resin. It is a thing.

Further, in the circuit-structured electronic component of the present invention, the electronic element is directly attached to the circuit pattern of the metal plate so that the solder does not unnecessarily spread from the electrode portion of the circuit pattern.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A circuit-structured electronic component of a first embodiment of the present invention will be described below with reference to the drawings. In this example,
A circuit pattern 28 is formed by punching out a metal plate 24 having a thickness of about 0.8 mm, and connecting terminals 30 and lead terminals 32 are attached to both sides of the circuit pattern 28 by soldering or the like.

An electrode portion 22 to which an electronic element 34 such as a chip resistor or a diode is soldered is provided on the circuit pattern 28, and the electronic element 34 is directly soldered to the electrode portion 22. Further, accessories such as a jumper wire 36 are attached. Also, the circuit pattern 2
A through hole 40 is formed at an edge portion of the connection terminal 8 on the side of the connection terminal 30.

The circuit pattern 28, the electronic element 34 soldered to the circuit pattern 28, and the like form a circuit component electronic component 44 having a predetermined function. This circuit-structured electronic component 44 is insert-molded in an insulating resin 46 having high insulation and high durability, and the through hole 40 has an insulating resin 46.
The resin is embedded inside and the resin penetrates into the inside of the through hole 40. As shown in FIG. 2, the insulating resin 46 covers the circuit pattern 28, and the connecting terminals 30 and the lead terminals 32 are
It is molded so as to project from the insulating resin 46.

In the method of manufacturing the circuit component electronic component 44 of this embodiment, first, the metal plate 24 is punched, and the electrode portion 22, the circuit pattern 28, and the through hole 40 are punched simultaneously. Then, the electronic element 34 is directly soldered to the predetermined electrode portion 22 of the circuit pattern 28. In this embodiment, the electronic element 34 is a surface mounting type component, and is soldered by a reflow soldering method or the like as in the case of surface mounting on a ceramic substrate.

Next, insert molding is performed so as to cover the circuit pattern 28 and the electronic element 34, the electronic element 34 is covered with the insulating resin 46, and the resin also digs into the through holes 40 to ensure the circuit pattern 28 and the insulating resin. 46 joins.

The circuit component electronic component 44 of this embodiment has a simple structure because the metal plate 24 is punched out to form the circuit pattern 28 and the electronic element 34 is directly soldered to the circuit pattern 28. The electronic element 34 can also be easily embedded and protected in the resin 46 by insert molding. Moreover, even against high heat and heat cycles,
Since the electronic element 34 is soldered directly to the circuit pattern 28 of the metal plate, the soldered portions are metal-to-metal bonded, and the thermal expansion coefficients of the two are very close to each other, the bonding force is high, and the heat dissipation is high. It also has an effect and is extremely durable.
Further, the assembling work is made only by punching, mounting of electronic elements, and insert molding, and it is easy to automate and can be manufactured extremely efficiently.

Next, a second embodiment of the present invention will be described with reference to FIG. Here, description of the same members as those in the above-described embodiment will be omitted. In this embodiment, the metal plate 24
Electrode portion 22 of circuit pattern 28 formed by punching
Further, a solder resist 50 having a solder blocking portion formed thereon is formed by printing so as to cover portions other than the soldering portion. this is,
This is because if the electronic element 34 is directly soldered to the electrode portion 22, the flux flows over the periphery of the electrode portion 22 wider than necessary, the solder spreads in that portion, and the durability is deteriorated.

According to this embodiment, the solder applied to the electrode portion 22 spreads only in the area where the solder resist 50 is not printed, and is limited to a predetermined spread, and the stability of the quality of the soldered portion is improved. The durability is improved.

Next, a third embodiment of the present invention will be described with reference to FIG. Here, description of the same members as those in the above-described embodiment will be omitted. In this embodiment, the metal plate 24
Electrode portion 22 of circuit pattern 28 formed by punching
The recessed portion 52 on which the solder is placed is press-molded. The peripheral portion of the recess 52 serves as a solder blocking portion. Further, the recess 52 is formed at the same time when the circuit pattern 28 is punched out.

According to this embodiment, the solder applied to the electrode portion 22 spreads only inside the concave portion 52, so that the quality and stability of the soldered portion are improved and the number of manufacturing steps is reduced. Can be done.

Next, a fourth embodiment of the present invention will be described with reference to FIG. Here, description of the same members as those in the above-described embodiment will be omitted. In this embodiment, the metal plate 24
The groove portion 54 for preventing the spread of the solder is press-molded on the peripheral portion of the electrode portion 22 of the circuit pattern 28 formed by punching. The grooves 54 are formed at the same time when the circuit pattern 28 is punched out.

According to this embodiment, the solder applied to the electrode portion 22 is prevented from spreading in the groove portion 54,
Solder spreads only on the inside, similar to the above example,
The stability and durability of the quality of the soldered portion are improved, and the number of manufacturing steps can be reduced.

Next, a fifth embodiment of the present invention will be described with reference to FIG. Here, description of the same members as those in the above-described embodiment will be omitted. In this embodiment, the metal plate 24
Electrode portion 22 of circuit pattern 28 formed by punching
In addition, the mesh groove 5 that prevents the spread of the solder within a certain range
6 is press-molded. The formation of the mesh groove 56 is
It is formed at the same time when the circuit pattern 28 is punched out.

According to this embodiment, the solder applied to the electrode portion 22 is hard to enter the mesh groove 56, and the solder spreads only inside the mesh groove 56, so that the quality of the soldered portion is stable as in the above embodiments. In addition to improving durability and durability, the number of manufacturing steps can be reduced.

The circuit-constituent electronic component of the present invention may be any one in which a large flat metal plate is punched out to form a circuit pattern, and the type of electronic element to be mounted does not matter, and surface mounting is performed. In addition to die-type chip parts, discrete parts may be attached to this circuit pattern by soldering or spot welding. Also, the thickness and shape of the circuit pattern do not matter at all,
Besides punching a metal plate in a plane, after punching,
It may be formed three-dimensionally, and the electronic elements having different heights may be aligned and soldered at a constant height, or the electronic elements may be hierarchically soldered to the circuit pattern. Further, the shape of the electrode portion may be such that the solder blocking portion is formed so that the solder does not spread more than necessary,
Any means for preventing solder may be used.

[0026]

EFFECTS OF THE INVENTION The circuit component electronic component of the present invention has a simple structure because the metal plate is punched out to form a circuit pattern, and the electronic element is directly attached to this circuit pattern and insert-molded. Can be surely embedded and protected in the insulating resin by insert molding.
Moreover, the joining of parts and materials with different thermal expansion coefficients is reduced, and the joining force is high even with high heat and heat cycles,
Moreover, the circuit pattern made of a metal plate also has a heat dissipation effect and is extremely durable. Further, the number of parts is small, and the assembling work is performed only by punching, mounting of electronic elements, and insert molding, which facilitates automation and enables extremely efficient manufacturing.

Further, the circuit-constituent electronic component of the present invention has a simple structure because a circuit pattern is formed by punching out a metal plate and an electronic element is directly attached to this circuit pattern to constitute an electronic circuit. Soldering of electronic elements is easy and has extremely high durability against high temperatures and heat cycles. Further, the number of assembling steps is small, automation is easy, and a high-performance circuit component electronic component can be provided with an extremely small number of steps.

Further, in this circuit-constituent electronic component, a metal plate is punched out to form a circuit pattern, and an electronic element is directly attached to this circuit pattern. As described above, since the cleaned water cannot remain between the back surface of the surface-mounted electronic device and the substrate, the flux can be easily removed by cleaning with water, and it is not necessary to use CFCs.

[Brief description of drawings]

FIG. 1 is a front view of a first embodiment of a circuit component electronic component of the present invention.

FIG. 2 is a perspective view of a circuit configuration electronic component of this embodiment.

FIG. 3 is a perspective view of an electrode portion of a second embodiment of the electronic circuit component according to the present invention.

FIG. 4 is a perspective view of an electrode portion of a third embodiment of the electronic circuit component according to the present invention.

FIG. 5 is a perspective view of an electrode portion of a fourth embodiment of the electronic circuit component according to the present invention.

FIG. 6 is a perspective view of an electrode portion of a fifth embodiment of the electronic circuit component according to the present invention.

FIG. 7 is a perspective view showing a conventional technique.

[Explanation of symbols]

 22 Electrode Part 24 Metal Plate 28 Circuit Pattern 30 Connection Terminal 34 Electronic Element 44 Circuit Component Electronic Component 46 Insulating Resin

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Kiyohito Nakagawa 3158 Shimookubo, Osawano-cho, Kamishinagawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd.

Claims (3)

[Claims] 1. A circuit component having a circuit pattern for connecting electronic elements to each other, wherein a metal plate is punched to integrally form a circuit pattern, an electrode portion and a connecting terminal, and the circuit pattern and the electrode portion are formed. An electronic component having a circuit structure, characterized in that an electronic element is attached to, and an insulating resin is molded to surround the circuit pattern and the electronic element. 2. In a circuit component having a circuit pattern for connecting electronic elements to each other, a metal plate is punched to integrally form a circuit pattern and a connection terminal, and the electronic element is soldered to the circuit pattern. A circuit-structured electronic component, comprising: an electrode section for preventing a solder from flowing out from a soldered portion of the electrode section. 3. A circuit component having a circuit pattern for connecting electronic elements to each other, wherein a metal plate is punched to integrally form a circuit pattern, an electrode portion and a connecting terminal, and an electrode portion of this circuit pattern. A solder blocking portion for preventing the solder from flowing out of a predetermined range, an electronic element is soldered inside the solder blocking portion, and an insulating resin is molded so as to surround the circuit pattern and the electronic element. Circuit-structured electronic parts characterized by the following.