JPH0516180B2 - - Google Patents
Info
- Publication number
- JPH0516180B2 JPH0516180B2 JP2275945A JP27594590A JPH0516180B2 JP H0516180 B2 JPH0516180 B2 JP H0516180B2 JP 2275945 A JP2275945 A JP 2275945A JP 27594590 A JP27594590 A JP 27594590A JP H0516180 B2 JPH0516180 B2 JP H0516180B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- tester
- performance board
- wafer prober
- probe card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 claims description 48
- 238000012360 testing method Methods 0.000 claims description 37
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2275945A JPH03148849A (ja) | 1990-10-15 | 1990-10-15 | ウェハ試験装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2275945A JPH03148849A (ja) | 1990-10-15 | 1990-10-15 | ウェハ試験装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03148849A JPH03148849A (ja) | 1991-06-25 |
| JPH0516180B2 true JPH0516180B2 (enExample) | 1993-03-03 |
Family
ID=17562619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2275945A Granted JPH03148849A (ja) | 1990-10-15 | 1990-10-15 | ウェハ試験装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03148849A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111624372A (zh) * | 2020-06-30 | 2020-09-04 | 成都铭钛科技有限公司 | 一种器件检测触发器、器件检测装置及器件检测方法 |
-
1990
- 1990-10-15 JP JP2275945A patent/JPH03148849A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03148849A (ja) | 1991-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH022547B2 (enExample) | ||
| US20100225345A1 (en) | Apparatus and method for testing a semiconductor device | |
| TWI351524B (en) | Apparatus for planarizing a probe card and method | |
| JPH08201427A (ja) | 複数の探針を位置決めして配置した探針組立体および位置決め基板 | |
| US20050124144A1 (en) | Electrical connecting apparatus | |
| JP3194669B2 (ja) | 検査装置および検査装置における接続方法 | |
| KR20100069300A (ko) | 프로브 카드와, 이를 이용한 반도체 디바이스 테스트 장치 및 방법 | |
| JP2000150092A (ja) | Icソケット | |
| JP2000031222A (ja) | バーンイン検査治具 | |
| JPH06258374A (ja) | 被検査電極板の検査方法 | |
| JPH0516180B2 (enExample) | ||
| JP2002365310A (ja) | 垂直型プローブカード | |
| JP3610919B2 (ja) | 回路基板の検査用治具、検査方法、および製造方法 | |
| JP2004138576A (ja) | 電気的接続装置 | |
| JP3224519B2 (ja) | ウェーハ測定治具、テストヘッド装置およびウェーハ測定装置 | |
| JP2965174B2 (ja) | 半導体素子検査装置 | |
| JP3061008B2 (ja) | プローブ装置 | |
| KR20150139093A (ko) | 테스트 장치의 커넥터 시스템 | |
| JPH1152000A (ja) | プリント配線基板の検査装置及び検査方法 | |
| JPH08136601A (ja) | バックボード用布線試験治具 | |
| CN218099326U (zh) | 探针卡 | |
| JP2007003433A (ja) | 試験装置用テストヘッド | |
| JPH0992754A (ja) | 半導体パッケージ基板、半導体パッケージ基板の検査装置及び検査方法 | |
| JPH0758168A (ja) | プローブ装置 | |
| JPH04215450A (ja) | 半導体集積回路装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |