JPH05160613A - High frequency substrate - Google Patents

Abstract

PURPOSE:To make a device small-sized and thin by providing a a coupler substrate of only a coupler part and a main substrate on which circuit elements are mounted and soldering the coupler substrate to the main substrate to give a margin to the height of mounting of the device using a coupler. CONSTITUTION:A main signal output land 12, a couple signal input land 13, a ground land 14, a through signal input land 15, and an isolate signal input land 16 are formed on the surface of a main substrate 11. A coupler substrate 5 consists of a four-layered substrate. That is, a main signal input land 6, a couple signal output land 7, a ground land 8, a through signal output land 9, and an isolate signal output land 10 are formed on substrates of first and fourth layers of the coupler substrate 6. Lands 12 and 6, lands 13 and 7, lands 14 and 8, lands 15 and 9, and lands 16 and 10 are soldered with each other respectively to connect these high frequency substrates. As the result, the thickness of the main substrate 11 is reduced, and a margin is given to the height of mounting of the device using the coupler, and the device can be effectively made small-sized and thin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency board including a coupler.

[0002]

2. Description of the Related Art Conventionally, a four-layer substrate containing a coupler has been used for coupling a high frequency signal. FIG. 6 is an explanatory view of an embodiment of a substrate including a conventional coupler. 1
Is a four-layer substrate containing a coupler, and 2, 3 and 4 are circuit elements.

[0003]

However, in the conventional structure in which the coupler is included, the coupler becomes thick to some extent, so that there is a problem in that it becomes thick as a whole. That is, in order to form a coupler having a high degree of coupling, the distance between the second layer pattern and the third layer pattern or the distance between the second layer pattern and the first layer ground pattern or the third layer pattern and the fourth layer ground is required to form a highly coupled coupler. Since the pattern distance becomes large and the distance between the second layer pattern and the third layer pattern is limited to 0.1 mm, the substrate becomes thicker accordingly.

[0004]

In order to solve the above problems, the present invention is provided with a coupler substrate having only a coupler section and a mother board on which a circuit element is mounted, and the coupler board is soldered to the mother board. ..

[0005]

According to the present invention, since the thickness of the parent board is reduced by the above-described structure, the mounting height of the device using the coupler having a high degree of coupling can be afforded, and it is effective for downsizing and thinning of the device. ..

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a block diagram of a high frequency substrate including a coupler according to an embodiment of the present invention. 5 is a coupler substrate,
It is composed of a four-layer substrate. 6 is a main signal input land for inputting a main signal, 7 is a couple signal output land for outputting a signal combined with the main signal, 8 is a ground land, 9
Is a through signal output land that outputs a passing signal of the main signal,
Reference numeral 10 is an isolated signal output land for outputting an isolated signal from the main signal. These main signal input land 6
The coupled signal output land 7, the ground land 8, the through signal output land 9, and the isolated signal output land 10 are formed on the first and fourth layers of the coupler substrate 5, as shown in FIG.

Reference numeral 11 is a main board, and 12 is a main signal input land 6.
, 13 is a main signal output land whose position corresponds, 13 is a couple signal input land whose position corresponds to the couple signal output land 7, 14 is a ground land whose position corresponds to the ground land 8, and 15 is a through signal output land 9 and the position The corresponding through signal input land, 16 is an isolated signal input land whose position corresponds to that of the isolated signal output land 10. The main signal output land 12, the couple signal input land 13, the ground land 14, the through signal input land 15, and the isolated signal input land 16
Are formed on the surface of the parent substrate 11, respectively.

FIG. 2 is an assembly view of the coupler substrate of FIG.
Reference numeral 17 is a first layer substrate. Further, the fourth layer substrate has the same configuration as the first layer substrate 17, and therefore, the same numbers are attached. Reference numeral 18 is a second layer substrate, and 19 is a third layer substrate. The above four layers are overlapped with each other with an insulating layer interposed therebetween. The shaded area indicates the conductive foil.

A connection method for the high-frequency board constructed as described above will be described. That is, the main signal output land 12
And main signal input land 6, couple signal input land 13 and couple signal output land 7, ground land 14 and ground land 8, through signal input land 15 and through signal output land 9, isolated signal input land 16 and isolated signal output Solder the lands 10 respectively.

FIG. 3 is a pattern diagram seen from the first layer of the coupler substrate in one embodiment of the present invention. 3A is a first layer substrate 17, FIG. 3B is a second layer substrate 18, and FIG.
(C) shows the third layer substrate 19, respectively. Reference numeral 20 is a through hole that connects the patterns of the first layer substrate and the fourth layer substrate and the second layer substrate, 21 is a through hole that connects the patterns of the first layer substrate and the fourth layer substrate and the pattern of the third layer substrate, 22
Is a through hole that connects the pattern of the first layer substrate and the pattern of the fourth layer substrate.

The main signal input to the input land of the main signal input land 6 passes through the through hole 20 and reaches the pattern of the second layer substrate. The main signal reaching the second layer substrate is coupled with the pattern of the third layer substrate, and part of the energy of the main signal is transferred to the third layer pattern. When the energy of the main signal component is transferred to the third layer pattern, a couple signal is generated in the third layer pattern. The couple signal reaches the couple signal output land 7 through the through hole 21.

On the other hand, the main signal is attenuated by the second layer pattern and becomes a through signal. The through signal reaches the through signal output land 9 through the through hole 20.

FIG. 4 shows a mixer circuit of an application example of the coupler substrate of the present invention, which inputs a main signal of frequency fRF and a local signal of frequency fLO and outputs a signal of frequencies fRF-2fLO. 24 is a mixer substrate having a coupling degree of 3 dB at a frequency (fRF + fLO) / 2, 25 is a capacitor, 26 is a coil, 27 is a diode, 28 is a resistor, 29 is a capacitor, 30 is a resistor, and 31 is an output pin.

When the local signal is input to the isolated signal input land, the through signal of the local signal is output to the couple signal output land and the couple signal of the local signal is output to the through signal output land. The through signal of the local oscillator signal and the couple signal of the local oscillator signal pass through the capacitor 25 and reach the diode 27. Since the diode 27 is repeatedly turned on and off at a frequency 2fLO that is twice the frequency of the local oscillation signal, the frequency 2fL
An O signal is generated.

When the main signal is input to the main signal input land, the signal of frequency 2fLO outputs the couple signal to the couple signal output land and outputs the through signal to the through signal output land. The through signal is combined with the signal of frequency 2fLO to form a combined signal a. The frequency of the couple signal is 2
It is combined with the signal of fLO to form a combined signal b.

The composite signal a reaches the output terminal via the capacitor 29, and the composite signal b reaches the output terminal via the resistor 28. Further, the combined signal a and the combined signal b are combined at the output terminal to become a signal of fRF-2fLO.

FIG. 5 is an explanatory diagram of a high frequency substrate including a coupler according to an embodiment of the present invention. Reference numeral 32 denotes a high frequency board including a coupler in which the coupler board 5 is soldered to the parent board 11.
Reference numerals 3, 34 and 35 are circuit elements that form a circuit. These circuit elements 33, 34, 35 are mounted on the parent board 11. The thickness of the circuit other than the coupler is the thickness t of the parent board 11.
1 and the thickness t2 of the circuit element 35.

[0018]

As described above, according to the present invention, by soldering the coupler substrate to the parent substrate, the thickness of the high-frequency substrate including the coupler is reduced except for the coupler portion, so that the space on the high-frequency substrate has a margin. As a result, the device can be made thinner.

[Brief description of drawings]

FIG. 1 is an external perspective view of a high-frequency board and a coupler board according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of a coupler substrate of the same embodiment.

3A is a pattern diagram of a first layer substrate 17; FIG. 3B is a pattern diagram of a second layer substrate 18; FIG. 3B is a pattern diagram of a third layer substrate 19;

FIG. 4 is a circuit diagram of a mixer circuit to which the coupler substrate is applied.

FIG. 5 is an explanatory view of a high frequency board including the coupler board.

FIG. 6 is an explanatory view of a substrate including a conventional coupler.

[Explanation of symbols]

 5 Coupler board 6 Main signal input land 7 Couple signal output land 8 Ground land 9 Through signal output land 10 Isolated signal output land 11 Parent board 12 Main signal output land 13 Couple signal input land 14 Ground land 15 Through signal input land 16 Iso Rate signal input land 17 First layer substrate 18 Second layer substrate 19 Third layer substrate

Claims (1)

[Claims] 1. A coupler substrate in which a plurality of substrates are laminated and at least a signal input land and a signal output land are formed on the outermost substrate, and a signal output land corresponding to the position of the signal input land of the coupler substrate and the coupler. A parent board having a signal input land corresponding to the position of the signal output land on the board is formed on the surface, and the signal input land and the signal output land of the coupler board are soldered to the signal output land and the signal input land of the parent board. A high-frequency board that is characterized.