JP2924822B2 - Mounting structure and mounting method for surface mount components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure and a mounting method.
The present invention relates to a mounting structure and a mounting method capable of improving impedance in a signal line.

[0002]

2. Description of the Related Art Conventionally, as a method for mounting an electronic component having a function of transmitting a signal at a high speed, which is composed of a semiconductor package such as an IC or an LSI, on a predetermined printed circuit board, many methods and mounting structures have been proposed. Are coming.
An example of the conventional mounting structure will be described with reference to FIG.

[0003] That is, FIG.
No. 7 discloses an example of a conventional mounting structure, in which a high-speed signal line 18 derived from a semiconductor package 19 such as an IC or LSI is formed in, for example, an L-shape as shown. Then, it is connected to the signal wiring 16 exposed on one main surface of the appropriate printed circuit board 14 to complete the mounting.

However, in the connection structure of the signal line 18 as described above, the length of the signal line 18 becomes longer,
The so-called L characteristic has a large value in a high frequency band, and as a result, the impedance deteriorates. Therefore, the mounting board having such a configuration has a problem that it cannot be applied to a board having a high frequency having a high RF signal transmission characteristic, for example, a frequency band of 4 GHz or more.

FIG. 3B shows another example of a conventional mounting structure. When mounting a surface mounting component mounting board 2 on which a surface mounting component 18 is mounted on a printed circuit board 14, FIG. The signal line 6 formed on one main surface of the surface mount component mounting board 2 is connected to the signal line 6 formed on one main surface of the printed circuit board 14 through the through hole 5 of the surface mount component mounting board 2. 1 and a ground layer or ground line 3 formed on the other main surface of the surface mount component mounting board 2 via a through hole 5 ′ provided in the printed board 14. It is configured to be connected to a ground layer or ground line 9 formed on another main surface.

However, even in such a mounting structure, the lengths of the signal lines and the ground lines are increased, and the impedance at the through-holes is deteriorated. There was also a problem that the man-hour for forming the hole was extra.

[0007]

SUMMARY OF THE INVENTION It is an object of the present invention to improve the above-mentioned drawbacks of the prior art and to reduce the L characteristic while having a simple structure, thereby achieving an RF having a high frequency band of, for example, 4 GHz or more. An object of the present invention is to provide a mounting structure or a mounting method with improved high-frequency characteristics that can be used for signals.

[0008]

In order to achieve the above-mentioned object, the present invention employs a basic technical configuration as described below. That is, as a first aspect according to the present invention, when mounting a surface-mounted component mounting board on an appropriate printed board, the surface mounted on the surface-mounted component mounting board is placed in an opening provided in the printed board. The mounted components are fitted, and the signal lines disposed on the mounting surface of the surface-mounted component mounting board and the signal lines disposed on the surface of the printed board are directly joined to each other. The signal line disposed on the mounting surface of the mounting component mounting board and the signal line disposed on the surface of the printed circuit board are substantially arranged on one plane, and the mounting surface of the surface mounting component mounting board is And the signal lines disposed on the surface of the printed circuit board are directly joined so as to be formed substantially linearly. Mounting structure of a ground layer disposed on the mounting surface opposite to the surface of the surface mount component mounting board are connected via a ground layer and tab means disposed on a predetermined surface of the printed circuit board
And the mounting surface of the surface mounting component mounting board.
At least the ground layer located on the surface facing
Some of them are located on the mounting surface of the surface mounting component mounting board.
Signal lines that are placed on the surface of the printed circuit board.
Notch at the part corresponding to the part where the signal line
In the second embodiment, the surface mounting component mounting board is mounted on an appropriate printed circuit board.
At the time of mounting, the open
The table mounted on the surface mounting component mounting board in the mouth
The surface mount component is inserted and the surface mount
Signal lines located on the mounting surface of the
The signal lines on the surface of the printed circuit board
Bonding, thereby forming the surface mounting component mounting substrate.
The signal lines on the mounting surface and the printed circuit board
The signal lines arranged on the surface are substantially on one plane
And the mounting surface of the surface mounting component mounting board.
Signal lines and the surface of the printed circuit board.
So that the signal lines that are placed are formed substantially linearly
Directly connected to the surface mount components.
The ground placed on the surface facing the mounting surface of the mounting board
At least a part of the printed layer is a predetermined surface of the printed circuit board.
Overlap with at least part of the ground layer
And both ground layers are
A mounting structure connected to each other through means,
And a surface facing the mounting surface of the surface mounting component mounting board.
At least a portion of the ground layer
Signals placed on the mounting surface of the surface mount component mounting board
Lines and signal lines arranged on the surface of the printed circuit board.
Notch is provided at the part corresponding to the part where
Mounting structure .

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The mounting structure and the mounting method according to the present invention employ the above-described technical configuration, and therefore, a signal line on a chip component mounting surface in a surface mount component and a signal line on a printed board are used. Are connected so as to face each other directly, and at the same time, the connection form is arranged and formed in substantially the same plane, and at the same time, the connection form of the signal line is substantially linear. Therefore, the above-mentioned L characteristic can be kept small, so that a good high frequency characteristic can be exhibited, and as a result, there is provided a mounting structure or a mounting method which can be used even for an RF signal having a high frequency band of 4 GHz or more. It is easily obtained.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A specific example of a mounting structure and a mounting method according to the present invention will be described below in detail with reference to the drawings. That is, FIGS. 1A and 1B show the configuration of one specific example of the mounting structure of the surface mount component according to the present invention.
1A is a cross-sectional view taken along line XX ′ in FIG. 1B. In FIG. 1A, when mounting the surface-mounted component mounting board 2 on an appropriate printed board 14, The mounting structure 20 is shown in which the surface mounting component 8 mounted on the surface mounting component mounting board 2 is fitted into the opening 4 provided in the substrate 14 and the both are joined and fixed.

That is, the surface mounting component mounting board 2 on which the appropriate surface mounting components according to the present invention, for example, the electronic component 8 composed of a transistor, a capacitor, a resistor, a coil and the like are mounted, the surface mounting component 8 is An appropriate signal line 6 is arranged and formed on one main surface on which the device is mounted, and a ground line or a ground layer 3 is provided on the other main surface of the surface mounting component mounting board 2 opposite to the one main surface. Is formed.

On one main surface of the surface mounting component mounting board 2 on which the surface mounting component 8 is mounted, a cover 7 for covering the surface mounting component 8 may be provided. In the present invention, the surface mounting component mounting substrate 2
When joining the printed circuit board 14 and the printed circuit board 14, an appropriate opening 4 is provided at an appropriate portion of the printed circuit board 14, and the surface mounting component 8 is fitted into the opening 4 if necessary. The surface mounting component mounting board 2 is stacked and fixed in an inverted state so that the surface mounting component 8 fits into the opening 4 including the cover portion 7.

By adopting such a configuration, it is possible to reduce the height of the laminate of the surface-mounted component mounting board 2 and the printed board 14 and, at the same time, to mount the surface-mounted component on the printed board 14. Since the positioning of the substrate 2 is facilitated, the working process is simplified, and
Production costs can be reduced. Next, the second embodiment according to the present invention will be described. As shown in FIGS. 1A and 1B, the mounting structure 20 according to the present invention can When mounted on the printed circuit board 14, the signal line 6 disposed on the mounting surface of the surface-mounted component mounting substrate 2 and the signal line 1 disposed on the surface of the printed circuit board 14 face directly. The bonded mounting structure is shown.

That is, as shown in FIG. 1A, the mounting structure 20 according to the present invention comprises the signal line 6 disposed on the mounting surface of the surface mounting component mounting board 2 and the printed circuit board 1.
It is desirable that the signal line 1 and the signal line 1 disposed on the surface 4 are directly joined so as to be disposed substantially on one plane. Further, as shown in FIG. The signal line 6 arranged on the mounting surface of the surface mount component mounting board 2 and the signal line 1 arranged on the surface of the printed board 14
Are preferably directly joined so that they are formed substantially linearly.

In the mounting structure 20 according to the present invention,
The ground line or ground layer 3 of the surface mounting component mounting board 2 is usually arranged on the other main surface of the surface mounting component mounting board 2 opposite to the main surface on which the signal line 6 is formed. Because it is common to form
As shown in (A) and (B), one main surface of the printed circuit board 14 on which the signal lines 1 are formed via appropriate through holes 5 provided in the surface mounting component mounting board 2. It is configured to be connected to a ground line or a ground layer 9 formed on the same main surface as.

In the present invention, as shown in the figure, the signal lines 6 on the mounting surface of the surface mount components and chip components are connected so as to face the signal lines 1 on the printed circuit board 14. At the same time, the surface mounting component is provided with an appropriate opening 4 provided on the printed circuit board 14 together with an appropriate cover.
It has a configuration that fits inside. Accordingly, an appropriate signal passing through the signal line 1 formed on one main surface of the printed circuit board 14 passes through the signal line 6 formed on one main surface of the surface mount component mounting board 2 and passes through the chip component. After passing through the surface mounting component 8 such as a printed circuit board 14 via the signal line 6 formed on one main surface of the surface mounting component mounting substrate 2
Pass through the signal line 1 formed on one main surface of the optical disk.

In this state, the signal lines 1 and 6
Means that the signals are arranged in a substantially straight line and are formed in substantially the same plane, so that the passing distance of the signal is set to the shortest. Band signals can be applied. Therefore, in the present invention, as shown in FIG. 1 (B), the signal lines 1 are arranged substantially linearly on one main surface of the printed circuit board 14 in advance, and the same main line is formed. It is desirable that a ground line or a ground layer 9 be arranged and formed in a portion different from the signal line 1 on the surface.

Similarly, on one main surface of the surface mount component mounting board 2 used in the present invention, the signal line 6 connected to the surface mount component is placed at a predetermined position, that is, as described above. In addition, when the surface mounting component mounting board 2 and the printed board 14 are joined, the signal lines 1 provided on the printed board 14 are formed in a substantially linear shape at a position where they can come into contact with each other. It is.

On the other hand, on the other main surface of the surface mounting component mounting board 2 opposite to the one main surface on which the signal lines 6 are arranged and formed, a ground having an appropriate size, length or area is provided. The line or the ground layer 3 is arranged and formed. A notch 10 of an appropriate size may be provided in the ground line or in a portion 11 of the ground layer 3 corresponding to the joint between the signal lines 1 and 6.

This structure is effective in preventing the occurrence of mismatch at the junction between the signal lines 1 and 6 by balancing the dielectric constants of the dielectrics of the two substrates located above and below it. Become. A second specific example of the mounting structure according to the present invention will be described with reference to FIGS. 2 (A) and 2 (B).

That is, the second structure of the mounting structure 20 according to the present invention
In the specific example, the propagation path of the ground signal is formed as linear as possible, and the length of the propagation path is shortened as much as possible. Therefore, the joining form of the signal lines 1 and 6 in this embodiment is the same as that in the first embodiment, but the structure of the ground line or the ground layer is different. is there.

That is, in this embodiment, another printed circuit board 21 is added to the structure of the above-described embodiment.
When mounting the surface-mounted component mounting board 2 on the printed circuit board 14, the ground line or the ground layer 3 disposed on the surface facing the mounting surface of the surface-mounted component mounting board 2 is printed on the printed circuit board 14. The mounting structure is connected to a ground layer 9 ′ disposed on the surface of a predetermined main surface of the substrate 21 via an appropriate conductive member such as a tab unit 23.

It is desirable that the printed circuit board 21 be provided with an opening 22 into which the surface-mounted component mounting board 2 is fitted at an appropriate portion, similarly to the above-described printed circuit board 14. Component mounting board 2
Is completely embedded in the printed circuit boards 14 and 21. Of course, in this specific example, the ground line or the ground layer 3 formed on the other main surface of the surface mounting component mounting board 2 and the ground line formed on the other main surface of the printed board 21 Alternatively, since the ground layer 9 'is formed on substantially the same plane, the ground line or ground layer 3 of the surface mounting component mounting board 2 and the ground line or ground layer 9' of the printed board 21 are appropriately Since the connection is made substantially linearly through the tab means 23 made of the conductive material described above, the high-frequency characteristics with respect to the ground signal are also improved.

For this reason, it is desirable that the thickness of the printed circuit board 21 in this specific example is substantially equal to the thickness of the surface mount component mounting board 2. In the case where the mounting structure 20 according to the present invention is configured, as described above, when the surface mounting component mounting board 2 is mounted on an appropriate printed board 14, the mounting surface of the surface mounting component mounting board 2 is mounted. The mounting method is preferably such that the arranged signal lines 6 and the signal lines 1 arranged on the surface of the printed circuit board 14 are directly joined so as to form a substantially shortest connection length.

As a specific example of the mounting method according to the present invention, the signal line 6 disposed on the mounting surface of the surface mounting component mounting board 2 and the signal line 6 disposed on the surface of the printed circuit board 14 are described. It is desirable to use a mounting method in which the first and second substrates 1 and 2 are joined so as to be formed on substantially the same plane and substantially linearly. Further, in the present invention, when mounting the surface mounting component mounting board 2 on an appropriate printed board 14, one of the mounting mounting boards 2 on which the signal lines 6 in the surface mounting component mounting board 2 are arranged is arranged. Main surface and the printed circuit board 14
Printed circuit board 1 on which signal line 1 is disposed
A bonding method is proposed in which the two signal lines are connected to each other by bonding such that one main surface of each of the four signal lines faces one another.

[0026]

The mounting structure and the mounting method according to the present invention are as follows.
Since the above configuration is employed, the signal lines on the chip component mounting surface in the surface mount components and the signal lines on the printed circuit board are directly connected to each other so as to face each other. Are arranged substantially in the same plane, and at the same time, exhibit a substantially linear state, so that the distance between the connection portions of the signal lines is shortened. As a result, a mounting structure or a mounting method that can use even an RF signal having a high frequency band of 4 GHz or more can be easily obtained.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a configuration of a specific example of a mounting structure according to the present invention. FIG.
FIG. 1B is a sectional view taken along line XX ′ in FIG.
(B) is a plan view thereof.

FIG. 2 is a view for explaining the configuration of another specific example of the mounting structure according to the present invention. FIG.
FIG. 2B is a sectional view taken along line XX ′ in FIG.
(B) is a plan view thereof.

FIGS. 3A and 3B are side views showing a configuration of a specific example of a conventional mounting structure. FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Signal line 2 ... Surface mounting component mounting board 3 ... Ground line, ground layer 4, 22 ... Opening 5, 5 '... Through hole 6 ... Signal line 7 ... Cover part 8 ... Surface mounting component 9 ... Ground line, ground Layer 10: Notch 11: Site facing signal line and junction 14, 21, Printed board 16: Signal wiring 18: High-speed signal line 19: Semiconductor package 20: Mounting structure 23: Tab means

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 1/18 H05K 9/00

Claims (2)

(57) [Claims] When mounting a surface mounting component mounting board on an appropriate printed circuit board, the surface mounting component mounted on the surface mounting component mounting board is fitted into an opening provided in the printed board, The signal line disposed on the mounting surface of the surface-mounted component mounting board and the signal line disposed on the surface of the printed circuit board are directly joined, thereby forming the signal line on the mounting surface of the surface-mounted component mounting substrate. The arranged signal line and the signal line arranged on the surface of the printed board are arranged substantially on one plane, and the signal line arranged on the mounting surface of the surface mount component mounting board. The signal lines arranged on the surface of the printed circuit board are directly joined so as to be formed substantially linearly. Fruit ground layer disposed on the surface opposite to the surface are connected via a ground layer and tab means disposed on a predetermined surface of the printed circuit board
Mounting of the surface mounting component mounting substrate having the mounting structure
Fewer ground layers on the surface facing the surface
Partly on the mounting surface of the surface mount component mounting board.
Signal lines that are placed on the surface of the printed circuit board.
To the part corresponding to the part where the
Mounting structure characterized by having a notch. 2. When mounting the surface mounting component mounting board on an appropriate printed board, the surface mounting component mounted on the surface mounting component mounting board is fitted into an opening provided in the printed board. The signal line disposed on the mounting surface of the surface-mounted component mounting board and the signal line disposed on the surface of the printed circuit board are directly joined, thereby forming the signal line on the mounting surface of the surface-mounted component mounting substrate. The arranged signal line and the signal line arranged on the surface of the printed board are arranged substantially on one plane, and the signal line arranged on the mounting surface of the surface mount component mounting board. The signal lines arranged on the surface of the printed circuit board are directly joined so as to be formed substantially linearly. At least a part of the ground layer arranged on the surface facing the surface is arranged so as to overlap with at least a part of the ground layer arranged on the predetermined surface of the printed circuit board, and the two ground layers are appropriately Mounting structures connected to each other via
And facing the mounting surface of the surface mounting component mounting board.
At least part of the ground layer located on the surface
Is placed on the mounting surface of the surface mount component mounting board.
Signal lines and are placed on the surface of the printed circuit board
Notch at the part corresponding to the part where the signal line is joined
The mounting structure characterized by that is provided.