JPH05159992A - Dipping apparatus - Google Patents

Abstract

PURPOSE:To provide a clipping apparatus wherein the parallelism of a holding plate with a paste is kept and an electrode coating operation can be performed with high accuracy. CONSTITUTION:A chuck part 10 is held in a horizontal state so as to be capable of being ascended and descended via four shafts at the lower part of a dipping head part 2. Two shafts 11a, 11b in diagonal positions are ball screws, and the other two shafts 11c, 11d are guide shafts. A motor 12 which drives the two ball screws synchronously is built in the dipping head part 2. A holding plate A which has held many chip components B in a downward protruding state is held horizontally at the chuck part 10. A dipping tank 7 whose bottom face has been coated with a paste in a thin-film shape is installed horizontally at the lower part of the dipping head part 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dipping device capable of highly accurately applying a paste to the ends of small parts such as chip parts.

[0002]

2. Description of the Related Art Conventionally, a holding plate having a large number of holding holes has been used in order to efficiently attach electrodes to the ends of a large number of chip parts (Japanese Patent Publication No. 62-20685). This holding plate forms a large number of through holes in a thin flat plate portion formed in the center of the hard substrate,
A rubber-like elastic body is embedded in a recess formed by the flat plate portion, and a holding hole having a smaller diameter than the through hole is formed in the elastic body. Then, the chip component is elastically held so as to partially project into the holding hole, and an electrode paste of silver or the like is evenly attached to the projecting surface, and then the chip component is heated to dry the electrode paste. An example using a roller is described in the above publication as a method of applying an electrode paste to a chip component. That is, a part of the chip component is projected and held on the upper surface side of the holding plate, and the roller coated with the electrode paste on the peripheral surface is brought into contact with the protruding part of the chip component while the holding plate is conveyed by a conveyor, Electrode paste is applied to chip parts. In order to apply the electrode paste with a uniform thickness on the peripheral surface of the roller, the excess paste is scraped off with a leveling plate called a scraper while rotating the roller.

[0003]

For example, the length is 1.6.
In the case of a chip component of about 5.7 mm, the thickness of the electrode is very thin, about 0.15 to 0.3 mm, and high precision is required for controlling the film thickness. However, in the above-mentioned coating method, since the paste coated on the peripheral surface of the roller flows as the roller rotates, there is a problem that the film thickness of the paste slightly changes depending on the portion of the roller and the electrode thickness of the chip component varies. .. In addition, the electrode thickness varies depending on the vibration of the conveyor and the levelness.

As another method of attaching the electrode paste to the chip component, as described in Japanese Patent Publication No. 3-44404, the electrode paste is applied in a thin film on the upper surface of a flat coating plate so that part of the chip component is There is a method in which a holding plate held so as to project downward is brought close to the coating plate, and the projecting portion of the chip component is pressed against the coating plate to attach the electrode paste. This adhesion method does not cause the inconvenience unlike the coating method using a roller. In this method, the protrusion of the chip component is pressed against the bottom surface of the coating plate on which the paste is applied, thereby eliminating the variation in the protrusion length of the chip component and making the electrode width uniform. However, since a single holding plate holds thousands of chip components, when these chip components are pressed against the paste-coated coating plate, a very large reaction force acts on the holding plate. Therefore, the holding plate is inclined and the parallelism with the paste is disturbed, or the holding plate itself is bent and flatness cannot be obtained, so that it is not possible to apply electrodes with high precision.

Therefore, an object of the present invention is to provide a dipping device capable of maintaining the parallelism between the holding plate and the paste and applying electrodes with high precision. Another object is to provide a dipping device capable of preventing the holding plate from bending and ensuring flatness.

[0006]

In order to achieve the above object, a first aspect of the present invention is a dip head part, and a dip which is horizontally installed below the dip head part and whose surface is coated with a paste in a thin film form. A chuck, and a chuck unit is supported on the lower part of the dip head unit so as to be able to move up and down via two or more shafts, and at least one of the shafts is composed of a ball screw driven by a motor. Is characterized in that a holding plate holding a large number of chip parts in a protruding state downward is horizontally held. A second aspect of the present invention is configured such that the chuck portion according to the first aspect is supported by four shafts arranged in a rectangular shape, and two diagonal shafts are synchronously driven by a ball screw. The other two shafts in 1 are constituted by guide shafts that guide the chuck portion up and down. In a third aspect based on the first aspect, chuck grooves are provided on both end surfaces of the holding plate, and a horizontal backing plate is provided in the chuck portion.
A chuck claw that engages with the chuck groove and presses the upper surface of the holding plate against the backing plate is provided.

[0007]

The operation will be described with respect to an example in which the chuck portion is suspended and supported below the dip head portion via a ball screw. When the nut screwed to the ball screw is rotated by the motor, the ball screw moves in the axial direction. As a result, the chuck portion connected to the lower end of the ball screw moves up and down, and the protruding portion of the chip component held by the holding plate is pressed against the bottom surface of the dip tank coated with the paste. Although a reaction force acts on the holding plate at the time of pressing, since the chuck part is lifted and supported by two or more shafts including a ball screw, the chuck part can be prevented from tilting. Therefore, the holding plate is always held horizontally, and the electrodes can be uniformly applied to the end portions of the chip components held by the holding plate. In the present invention, since the motor and the ball screw are used as the elevating means, the elevating speed can be freely adjusted by the motor, so that the shock applied to the holding plate can be reduced. As the arrangement configuration of the shaft for vertically supporting the chuck portion, if two ball screws and two guide shafts are arranged in diagonal positions as in the second invention, and the ball screws in the diagonal positions are synchronously driven by a motor, The reaction force at the time of dipping can be received in a well-balanced manner, and the tilt of the chuck part can be prevented more effectively. Since a large number of chip components are held on the holding plate, the holding plate itself is easily bent by the reaction force at the time of dipping. In the third invention, the back surface of the holding plate is supported by the backing plate to prevent the holding plate from bending due to a reaction force,
The flatness is secured. Further, since the chuck portion engages with the chuck grooves provided on the end faces of both side portions of the holding plate, the chuck portion does not project downward from the holding plate and does not interfere with the dipping process.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an example of a dipping device according to the present invention, which is used for applying electrodes to the end portions of a chip part B. The chip component B is elastically held in the holding hole a ₁ of the holding plate A shown in FIGS. 2 and 3 so as to partially project. The specific structure of the holding plate A is similar to that shown in Japanese Patent Publication No. 3-44404. A dip device according to the present invention includes a dip device main body 1 in which a control device (not shown) is built in, a dip head portion 2 fixed on the main body 1 via a fixed column 3, a carry-in conveyor 5, Carry-out conveyor 6 and dip tank 7
And the blade portion 8.

At the lower portion of the dip head portion 2, as shown in FIGS. 4 and 5, the chuck portion 10 has four shafts 11a and 11a.
It is suspended and supported so as to be able to move up and down via b, 11c, and 11d. These shafts are arranged in a rectangular shape centered on the center of gravity of the chuck portion 10, and the two shafts 1 in diagonal positions
1a and 11b are ball screws, and the other two shafts 11
c and 11d are guide shafts. Guide shafts 11c, 11d
Is guided by the top plate 4 of the dip head portion 2 via a guide bush 108 so as to be slidable in the vertical direction. A lifting motor 12 is installed on the top plate 4, and the motor 12 rotates a nut 103 screwed to one ball screw 11a via a pulley 100, a belt 101 and a pulley 102.
This nut 103 is attached to the pulley 10 that rotates together with the pulley 102.
4, through the belt 105 and the pulley 106, the nut 107 screwed to the other ball screw 11b is rotated. Therefore, the two ball screws 11a and 11b are driven synchronously. As described above, the chuck portion 10 includes the four shafts 11a to 11
Since it is supported by d, it is possible to move up and down while always maintaining the levelness.

FIG. 6 and FIG. 7 show the details of the chuck portion 10, in which the substrate 1 attached to the lower ends of the shafts 11a to 11d.
4 and a backing plate 15 fixed horizontally on the lower side of the substrate 14. Two open / close cylinders 16 and one elevating cylinder 17 are installed on both left and right sides of the substrate 14. A chuck holder 19 is vertically movably guided by a pair of slide shafts 18 fixed to the substrate 14 in an upright state, and the chuck holder 19 is connected to a piston rod of a lifting cylinder 17 via a stay 20. .. Therefore, the chuck holder 19 can be moved up and down by the lifting cylinder 17. A pair of vertically arranged slide shafts 21 are slidably passed through both front and rear sides of the chuck holder 19, and a pair of front and rear chuck claws 22 are provided at outer end portions of these slide shafts 21.
The slider 23 is vertically bridged and fixed to the side end of the slide shaft 21. The tip end surface of the piston rod of the opening / closing cylinder 16 slidably contacts the side surface of the slider 23. The contact pressure between the piston rod of the opening / closing cylinder 16 and the slider 23 is
It is provided by a spring 24 inserted through the slide shaft 21.

The chuck claw 22 is for opening and closing the cylinder 16.
The following chuck operation is performed by the lifting cylinder 17 and the lifting cylinder 17. First, the chuck claw 22 is opened to the outside by the opening / closing cylinder 16 in the first stage, and is lowered by the lifting cylinder 17 in the opened state in the second stage. In the third stage, the chuck claw 22 is closed inward by the opening / closing cylinder 16, and the tip of the chuck claw 22 is engaged with the chuck grooves a ₂ on both sides of the holding plate A. Chuck claw 2 in the 4th stage
When the lifting cylinder 17 is lifted while keeping 2 closed, the upper surface of the holding plate A is held in close contact with the backing plate 15. The lower surface of the backing plate 15 is the shaft 1
Since it is always kept horizontal by 1a to 11d, the holding plate A is also held horizontally, and the protruding surface of the chip component B held in the holding hole a ₁ of the holding plate A is also horizontal. The chuck claw 22 on the left side of FIG. 6 is in a closed state,
The chuck claw 22 on the right side is in an open state. To release the chuck, the reverse operation of the chuck operation is performed. That is, in the first step, the chuck claw 22 is lowered while being closed,
Transfer the holding plate A onto the conveyors 5 and 6 described later,
In the second stage, the chuck claw 22 is opened and the holding plate A is opened. In the third step, the chuck claws 22 are raised while being opened, and in the fourth step, the chuck claws 22 are closed inward, and a series of operations is completed.

8 to 10 show details of the carry-in conveyor 5. Guide rails 32a and 32b are installed in the front-rear direction on a pair of left and right support bases 31a and 31b that are horizontally fixed on the apparatus main body 1 via a plurality of support legs 30, and the guide rails 32a and 32b are mounted on the guide rails 32a and 32b. Conveyor body 33
Are slidable by slide bearings 34a and 34b. A sliding motor 36 is fixed on the apparatus body 1 via a bracket 35, and a drive pulley 37 is attached to the rotation shaft of the motor 36. The drive pulley 37 and the intermediate pulley 39 rotatably supported at the start end of the one support base 31 a are the belt 38.
The intermediate pulley 3 is connected by power transmission by
9 is a transmission pulley 4 located at the opposite position with the support base 31a interposed therebetween.
It rotates together with 0. The transmission pulley 40 and the support base 31a
A belt 42 for sliding is wound around a transmission pulley 41 rotatably supported at the end of the belt, and a clamp member 43 for clamping a part of the belt 42 for sliding is provided on one side of the conveyor main body 33. It is provided on the lower surface of the part. As a result, the conveyor main body 33 can be slid in the front-back direction by driving the sliding motor 36.

The starting position (standby position) and the ending position (working position) in the sliding operation of the conveyor body 33 are
Detection piece 4 attached to one side of conveyor body 33
4 is a position detector 45, 4 composed of photointerrupters attached to the side portion of one support base 31b at regular intervals.
It can be detected by reaching 6. Position detector 4
The slide motor 36 is stopped by the detection signals of 5, 46. In order to reduce the shock when the conveyor main body 33 stops at the start end position and the end position, a pair of shock absorbers 47, 48 is attached to one support base 31a, and the conveyor main body 33 side is correspondingly attached thereto. A stopper piece 49 is fixed to the portion.

Shafts 50 and 51 extending in the width direction are rotatably supported at the front and rear portions of the conveyor main body 33, and conveyor belts 52 and 53 are wound around the both ends of the shafts 50 and 51 in the front and rear direction. Transporting pulleys 54 and 55 are attached. The holding plate A has the above-mentioned conveyor belts 52, 5
Both sides are supported on the sheet 3 and conveyed. Conveyor body 3
The lower surface of 3 is provided with a transfer motor 57 via a bracket 56.
Is fixed, and a drive pulley 58 is attached to the rotating shaft of the motor 57. The drive pulley 58 is interlocked with a pulley 60 attached to an intermediate portion of the shaft 50 on the starting end side via a belt 59. Therefore, the transport motor 57
The left and right conveying belts 52 and 53 can be driven at the same speed, and the holding plate A supported on these belts 52 and 53 can be conveyed in parallel from the start side to the end side. In addition, 61 is a tension roller that gives a certain tension to the sliding belt 42, 62 and 63 are a pair of left and right guide plates that slidably support the lower surfaces of the conveying belts 52 and 53, and 64 and 65 are the conveying belt 52, A tension roller for applying a constant tension to 53 and a back cover 66 for preventing dust and the like adhering to the conveying system from dropping into the dip tank 7.

The carry-out conveyor 6 has a symmetrical structure to the carry-in conveyor 5, and a detailed description thereof will be omitted. The sliding operation and the conveying operation of the carry-out conveyor 6 are synchronized with the carry-in conveyor 5, and when the carry-in conveyor 5 is slid to the work position, the carry-out conveyor 6 is also slid to the work position in synchronization with the carry-in conveyor 5 for carrying-in. Conveyor belt 5 for conveyor 5
When 2, 53 are driven, the conveyor belt of the carry-out conveyor 6 is also driven in the same direction at the same speed. The structural difference between the carry-out conveyor 6 and the carry-in conveyor 5 is that
An upper surface of a back cover 66 arranged on the bottom surface of the conveyor main body 33,
Further, a photoelectric switch 67 and a proximity switch 68 for detecting the position of the holding plate A are attached to the side surface of the conveyor body 33 on the starting end side, respectively, as shown in FIG. The photoelectric switch 67 is for temporarily stopping the plate A when the holding plate A is conveyed to a process subsequent to the dipping process, and the proximity switch 68 straddles the holding plate A on the conveyors 5 and 6 before dipping. This is for determining the stop position of the holding plate A when it is supported.

11 to 13 show the dip tank 7 and the blade portion 8. The dip tank 7 is formed in a concave rectangular shape slightly larger than the holding plate A, and guide rails 70 are installed on both sides of its long side. Guide rail 70
A blade support frame 71 is slidably supported above the dip tank 7 in the front-rear direction. The blade supporting frame 71 includes a collecting blade 72 for scraping the electrode paste to one end of the dip tank 7 and a leveling blade 73 for adjusting the electrode paste to a predetermined thickness.
And are independently mounted so as to be vertically movable. The blades 72 and 73 have the same width dimension and are slightly smaller than the inner width dimension of the dip tank 7 in the short side direction.
The recovery blade 72 is fixed to the lower surface of a bridging rod 74 which is supported on the upper portion of the blade supporting frame 71 so as to be vertically movable. The bridging rod 74 is provided at a pair of end portions of the blade supporting frame 71. It is vertically moved up and down by the cylinder 75. A rubber blade piece 76 is attached to the lower end of the recovery blade 72, and the blade piece 76 can be brought into close contact with the bottom surface of the dip tank 7.

On the other hand, a pair of blocks 77 are fixed to one side surface of the leveling blade 73, a screw shaft 78 is screwed into the block 77, and a slide shaft 80 having an upper end fixed to a support plate 79 is provided. It is slidably inserted. The screw shaft 78 rotatably passes through the support plate 79, and the upper end portion thereof is driven by the position adjusting motor 81 via the belt 96. Further, lifting cylinders 82 are fixed to both front and rear ends of the support plate 79, and a piston rod of the cylinder 82 is connected to the blade support frame 71. Further, slide shafts 83 are provided at both end portions of the support plate 79 so as to project downward, and are vertically movably inserted into the blade support frame 71. Therefore, the support plate 79 is moved to the blade support frame 71 by driving the lifting cylinder 82.
On the other hand, the leveling blade 73 can be moved up and down largely while maintaining the levelness, and by driving the position adjusting motor 81, the position of the leveling blade 73 can be finely adjusted vertically with respect to the support plate 79. Since the lower limit position of the support plate 79 is set by the boss portion 83a of the slide shaft 83, the height of the leveling blade 73 from the bottom surface of the dip tank 7 can be precisely set. This means that the coating thickness of the electrode paste on the bottom surface of the dip tank 7 can be precisely adjusted.

The lower surface of the dip tank 7 is provided with four mounting holes 84 each having a circular shape on one end side and a T-shaped vertical section on the other end side, and four headed pins corresponding to the mounting holes 84 on the apparatus body 1. 8
5 is projected. The dip tank 7 is placed on the apparatus main body 1 so that the circular portion of the hole 84 engages with the head of the pin 85, and the dip tank 7 is slid rightward in FIG. The portion engages with the T-shaped portion of the mounting hole 84, and the dip tank 7 is held in close contact with the apparatus main body 1.

On the rear side of the dip tank 7, a ball screw 86 is arranged in parallel with the long side of the dip tank 7,
A guide rail 87 on the apparatus body 1 is attached to the ball screw 86.
A nut member 88 that is slidable along is screwed. The nut member 88 is provided with a handle 90.
9 is swingable about an axis parallel to the ball screw 86. When the handle 90 swings the engagement piece 89 toward the blade support frame 71 side, the engagement piece 89 engages with the receiving groove 91 formed at the rear end of the blade support frame 71, and the nut member 88 and The blade supporting frame 71 can be connected.
A pulley 92 is attached to the right end of the ball screw 86, and the pulley 92 is attached to the belt 93 and the pulley 94.
When driven by the motor 95 via the nut member 8
8 and the blade support frame 71 integrally reciprocate left and right.

The operation of the blade section 8 will now be described with reference to FIG.
Follow the instructions below. First, as shown in FIG. 14A, when the blade support frame 71 is stroked to the left with the blade piece 76 of the recovery blade 72 pressed against the bottom surface of the dip tank 7, the dip tank 7 enters the dip tank 7. The electrode paste is scraped to the left. Next, as shown in FIG. 14B, the recovery blade 72 is raised and the leveling blade 73 is brought close to the bottom surface of the dip tank 7.
At this time, immediately before the leveling blade 73, a collecting portion of the electrode paste scraped by the collecting blade 72 is formed. Next, when the leveling blade 73 is stroked to the right as shown in FIG. 14 (c),
On the bottom surface of the dip tank 7, a thin electrode paste film corresponding to the gap between the leveling blade 73 and the dip tank 7 is formed. After that, the paste film is brought into contact with the protruding portion of the chip component B held by the holding plate A, whereby the electrode can be attached to the end portion of the chip component B.

Next, the holding plate A is prepared by using the dip bath 7 coated with the thin film electrode paste as described above.
A method of attaching an electrode to the protruding portion of the chip component B held by will be described. First, as described above, the chip component B
By engaging the tip of the chuck claw 22 with the chuck groove a ₂ of the holding plate A holding the plate so as to project downward and pulling up the chuck claw 22 to crimp the upper surface of the holding plate A to the backing plate 15. Let The parallelism between the backing plate 15 and the bottom surface of the dip tank 7 is strictly set in advance. Here, when the motor 12 is driven to lower the ball screws 11a and 11b, the chuck portion 10 descends while maintaining the levelness. Then, after the protrusion of the chip component B is lowered to a position where it comes into contact with the bottom surface of the dip tank 7, the chuck part 10 is slightly lowered so that the chip component B is slightly pushed into the holding hole a ₁ . As a result, the protruding length of the chip component B is corrected to be constant, and electrodes having a uniform width can be formed. At this time, since the tip end of the chuck claw 22 is engaged with the chuck groove a ₂ of the holding plate A, it does not contact the bottom surface of the dip tank 7 and does not interfere with the dipping process. Since one holding plate A holds thousands of chip parts B, when the chip parts B are pressed against the bottom surface of the dip tank 7 coated with paste,
A large reaction force acts on the holding plate A and the chuck portion 10. Moreover, the magnitude and application of this reaction force differ for each holding plate A. However, since the chuck portion 10 is supported in a well-balanced manner by the two ball screws 11a and 11b diagonally arranged and the two guide shafts 11c and 11d, tilting is prevented. Also, the holding plate A
Also, since the upper surface thereof is surface-supported by the backing plate 15, bending is also prevented. Therefore, the electrode can be attached to the protruding portion of the chip component B with high accuracy. Further, the chuck unit 10 can be arbitrarily changed in its ascending / descending speed, stroke, etc. by the motor 12. Therefore, the chip component B can be immersed in the electrode paste a plurality of times.

By removing the engaging piece 89 from the receiving groove 91 and removing the mounting hole 84 on the bottom surface of the dip tank 7 from the pin 85 of the apparatus body 1, the dip tank 7 can be easily replaced with another tank. .. In other words, the type of paste can be changed without removing the paste attached to the dip tank 7 and the blades 72 and 73, so that the replacement time can be greatly shortened. In addition, when changing the type of paste, dip tank 7
Since the blades 72 and 73 are handled integrally, the positional relationship between the bottom surface of the dip tank 7 and the leveling blade 73, which requires high accuracy, does not shift.

In this embodiment, a timing belt is used as the belt and a toothed pulley is used as the pulley. Further, although all air cylinders are used as cylinders, solenoids can be used instead. Further, a servo motor is used for the chuck lifting / lowering motor 12 and the blade reciprocating motor 95, a reversible motor is used for the sliding motor 36 and the conveyance motor 57, and a pulse motor is used for the blade adjusting motor 81. There is.

It is needless to say that the present invention is not limited to the above embodiment and various modifications can be made. For example, the nuts 103 and 107 screwed onto the ball screws 11a and 11b are rotated by the lifting motor 12 to rotate the ball screws 11a and 11b.
The invention is not limited to raising and lowering a and 11b, but a ball screw may be rotated by a motor and a nut screwed with the ball screw may be fixed to the chuck portion. Similarly, the guide shaft 1
In addition to the case where the lower end portions of 1c and 11d are fixed to the chuck portion 10 and the guide shafts 11c and 11d are slid with respect to the dip head portion 2, the guide shaft is fixed to the dip head portion 2 and The chuck unit 10 may be slid. In addition, the motor 12 is not limited to the one built in the dip head unit 2, but the motor body unit 1
May be built into. Further, the chuck unit is not limited to one in which the two ball screws and the two guide shafts are used to support the chuck portion, and only two ball screws may be used to support the chuck unit, and the combination with the guide shafts is arbitrary. Further, even when two ball screws and two guide shafts are used, they are not limited to those arranged in diagonal positions, and any support structure capable of maintaining the parallelism of the chuck portion may be used. .. Further, the chuck part is not limited to the one that holds the holding plate in close contact with the backing plate, and any holding method may be used.

[0025]

As is apparent from the above description, according to the present invention, the chuck portion is lifted and lowered by the two or more shafts including at least one ball screw, so that the chip component held by the holding plate is When the protruding portion is pressed against the bottom surface of the dip tank coated with the paste, it is possible to prevent the chuck portion from tilting due to its reaction force. Therefore, the holding plate is always held horizontally, and the electrodes can be uniformly applied to the ends of the chip components held by the holding plate.

[Brief description of drawings]

FIG. 1 is a schematic front view of a dipping device according to the present invention.

FIG. 2 is a perspective view of a holding plate used in the present invention.

FIG. 3 is a sectional view of a holding plate holding a chip component.

FIG. 4 is a plan view of a dip head unit.

5 is a sectional view taken along line VV of FIG.

FIG. 6 is a sectional view of a chuck portion.

FIG. 7 is a partial plan view of the chuck unit shown in FIG.

FIG. 8 is a front view of the carry-in conveyor in the working position.

9 is a plan view of the carry-in conveyor shown in FIG. 8. FIG.

10 is a left side view of the carry-in conveyor shown in FIG.

FIG. 11 is a plan view of a dip tank and a blade portion.

12 is a sectional view taken along line XII-XII in FIG.

13 is a sectional view taken along line XIII-XIII in FIG.

FIG. 14 is an operation explanatory view showing the paste applying method.

[Explanation of symbols]

1 Device Main Body 2 Dip Head 7 Dip Tank 10 Chuck 11a, 11b Ball Screw 11c, 11d Guide Shaft 12 Motor 15 Backing Plate 22 Chuck Claw A Holding Plate a ₂ Chuck Groove B Chip Parts

Claims (3)

[Claims] 1. A dip head part and a dip tank horizontally installed below the dip head part and having a bottom surface coated with a paste in a thin film form. The lower part of the dip head part has two or more shafts. The chuck part is supported so as to be able to move up and down via a shaft, and at least one of the shafts is composed of a ball screw driven by a motor. The chuck part has a holding plate holding a large number of chip parts in a protruding state downward. A dipping device that is held horizontally. 2. The dipping device according to claim 1, wherein the chuck portion is supported by four shafts arranged in a rectangular shape, and the two diagonal shafts are synchronously driven by a ball screw. And the other two diagonally positioned shafts are guide shafts that vertically guide the chuck portion. 3. The dipping device according to claim 1 or 2, wherein chuck grooves are provided on both end faces of the holding plate,
A dipping device, wherein the chuck portion is provided with a horizontal backing plate and a chuck claw that engages with the chuck groove and presses the upper surface of the holding plate against the backing plate.