JPH0515415U - Surface mount mold package - Google Patents

Abstract

(57) [Abstract] [Purpose] Terminals 2a, 3 after being mounted on a printed wiring board
The quality of the soldering state of a can be easily determined. In the terminals 2a and 3a protruding from the resin outer shell 1 and inward along the side surface and bent back on the mounting surface side, the width Wa of the tip portion 7 is wider than the width W of the root portion 6.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a surface mount mold package in which a functional element is sealed with a resin to form a resin shell, and a plurality of terminals are exposed from the resin shell.

[0002]

[Prior Art]

 3A, 3B and 3C show an example of a conventional surface mount mold package, FIGS. 3A and 3B are side views and FIG. 3C is a bottom view. Conventionally, this type of surface mounting mold package is, for example, as shown in FIG. 3, a resin outer shell 1 formed by sealing a functional element with resin, and exposed from the resin outer shell 1. It has two terminals 2 and 3. Further, these terminals 2 and 3 project from the side surface of the resin outer shell 1 and are bent along the bottom surface from the side surface, and the arrow ends thereof are soldered to the pads of the printed wiring board. Further, the width W of these terminals 2 and 3 is constant from the protruding portion to the arrow end, and is narrower than the width W of the resin outer shell 1.

FIG. 4 is a bottom view showing a soldered state of the surface mount mold package of FIG. When mounting such a surface mount mold package on a printed wiring board, the terminals 2 and 3 have been soldered to the pads of the printed wiring board.

The surface mounting mold package soldered to the printed wiring board as described above is visually soldered in a mounting inspection.

[0005]

[Problems to be solved by the device]

 However, in the above-mentioned conventional surface mount mold package, the width W of the terminals 2 and 3 is constant, and is smaller than the width W of the mold portion. For example, when W is 2.5 mm, W is about 1.5 mm. Therefore, it is possible to confirm the state of the solder 5 on the root 6 by visual inspection after soldering, but since the solder 5 on the printed wiring board side is hidden, is the solder 5 on the tip 7 surely covered? It is difficult to determine whether or not it is by visual inspection.

An object of the present invention is to provide a surface mount mold package that can easily determine the quality of the soldered state in order to solve such a problem.

[0007]

[Means for Solving the Problems]

 The surface mount mold package of the present invention is such that the terminal protruding from the side surface of the resin outer casing formed by sealing the functional element with resin is mounted on the mounting surface side more than the width of the portion bent along the side surface from the protruding portion. The feature is that the width of the part folded back is wide.

[0008]

【Example】

 Next, the present invention will be described with reference to the drawings.

1 (a), 1 (b) and 1 (c) show an embodiment of the surface mount mold package of the present invention, wherein (a) and (b) are side views and (c) is a bottom view. is there. As shown in FIG. 1, this surface mounting mold package is attached to the tip portion, that is, the printed wiring board side with respect to the width W of the root portion of the terminals 2a and 3a protruding from the side surface of the resin outer casing 1. That is, the width Wa of the portion is increased. In the case of this drawing, the width is the same as the width W of the resin outer casing 1.

FIG. 2 is a bottom view showing a soldered state of the surface mount mold package of FIG. By making the width Wa of the tip portion 7 wider than the width W of the root portion 6 in this manner, the surface mount mold package soldered to the printed wiring board can have a solder 5a of the root portion 6 and a solder of the tip portion 7 Since 5a protrudes to the outside, the soldering state can be easily inspected visually.

[0011]

[Effect of the device]

 INDUSTRIAL APPLICABILITY As described above, according to the present invention, in a terminal which is protruded from the resin outer shell 1 and is bent inward along the side surface, and is bent back to the mounting surface side of the resin outer shell 1, the portion bent along the side surface is formed. By making the width of the part that is folded back to the mounting surface side wider than the width, it is possible to obtain a surface mounting mold package that can easily determine the quality of soldering condition even after soldering to a printed wiring board. effective.

[Brief description of drawings]

FIG. 1 shows an embodiment of a surface mount mold package of the present invention, wherein (a) and (b) are side views and (c) is a bottom view.

FIG. 2 is a bottom view showing a state in which the surface mount marl package of FIG. 1 is soldered.

FIG. 3 shows an example of a conventional surface mount mold package, in which (a) and (b) are side views and (c) is a bottom view.

FIG. 4 is a bottom view showing a state in which the surface mount mold package of FIG. 3 is soldered.

[Explanation of symbols]

 1 Resin Outer Body 2, 2a, 3, 3a Terminal 5, 5a Solder 6 Root 7 Tip

Claims (1)

[Scope of utility model registration request] 1. A terminal portion projecting from a side surface of a resin outer casing formed by sealing a functional element with a resin is folded back to a mounting surface side from a width of a portion bent along the side surface from a projecting portion. Mold package for surface mounting, which has a wide width.