JPS59149082A - Thick film hybrid integrated circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thick film hybrid integrated circuit board (hereinafter referred to as thick film hybrid ).

Conventional configuration and its rough points Conventionally, as a means of connecting a thick film hybrid IC to a related printed circuit board, a connecting terminal (2) is attached to a thick film hybrid IC (1) as shown in Fig. 1. ,
This connection terminal (2) can be inserted into the hole (4) of the printed circuit board (3) and connected, or as shown in Figure 2, the terminal part (5) of the thick film hybrid IC (1)' Insert the printed circuit board (3F slit (6)) and connect the terminal part (5).
) and the printed circuit board (sY) are said to be directly soldered. However, the former involves the material cost of the connecting terminal (2) and requires a large amount of assembly man-hours.
It is disadvantageous to use it in consumer equipment where price competition is fierce.

The latter eliminates the drawbacks of the former, but it also eliminates the disadvantages of the terminal section (5) of the thick film hybrid IC (1)' and the printed circuit board (3).
)' Opposing reference end surface (A) of slit (6) (A
Since the position is determined by γ and (BlΦY, the thick film hybrid 1C(1)' is positioned at the reference end surface (A
) (El) and either reference end face (A) or (
Dimensional accuracy from B) to the printed terminal (7) is strictly required. Moreover, the ceramic base material has a certain degree of tolerance [15JR field] in its external dimensions, and when the pitch between the terminals (7) becomes fine, alignment becomes difficult and there is a big problem that it cannot be put to practical use.

OBJECTS OF THE INVENTION The present invention solves the above-mentioned conventional drawbacks, and aims to provide a thick film hybrid E-C that can be connected to a printed circuit board with accurate positioning and circuit connection with a simple structure. It is something.

Structure of the Invention In order to achieve the above object, a thick film hybrid IC of the present invention is provided.
In this method, conductive paste is printed and fired on the board to provide circuit connection terminals, rounds, etc., and paste-like solder is printed on the rounds and heated to solidify to form protrusions for positioning with the printed circuit board to be connected. This protrusion is formed using the same printing method as the connection terminal, so
As with connection terminals, dimensional relationships can be set accurately. Therefore, by using these protrusions for positioning, it is possible to accurately connect the thick film hybrid XC to the printed circuit board without depending on the external dimensional accuracy of the thick film hybrid Costs and assembly man-hours can also be reduced.

EMBODIMENT OF THE INVENTION Hereinafter, an embodiment of the present invention will be described based on the drawings.

FIG. 3 shows a printed circuit board (2) to which the thick film hybrid ICgη and the thick film hybrid ICQυ are connected. The thick film hybrid IC (11) has a large number of circuit connection terminals q4 formed by printing and baking a conductive paste on the board on one end side, while the printed board Q has a thick film hybrid IC gυ A slit Q4) slightly larger than the external dimensions of the thick film hybrid IC gη is provided to allow insertion of the connection terminal (to) side of the thick film hybrid IC gη. Above the connection terminal (to) of the thick film hybrid ICQυ, there is a round α which is formed by printing and baking a conductive paste on the substrate, similar to this connection terminal (to).
Four key points are provided along the arrangement direction. Two types of protrusions (16a) and (16b) formed by printing paste-like solder and heating and hardening are provided on these rounds (G), respectively. These projections (16a) (16
b) has a semi-cylindrical shape whose axial direction is the same as the insertion direction of the thick film hybrid ICQυ into the slit α◆, and the two inner protrusions (1sa) (16a) are the connecting terminals (c). The side end surface is in contact with the zero surface of the printed circuit board and is for a stopper to regulate the amount of insertion into the slit (141) of the thick film hybrid E C9υ, and the two outer protrusions (+ on 16) (16b) are for the stopper. It is formed longer on the connection terminal U side than the protrusion (16a) for the printed circuit board (2).
A semicircular recess (
14a) This is for positioning by fitting into (14a) and positioning the connection terminal (to) of the thick film hybrid E C (11) in the pitch direction.

Next, the connection method will be explained using FIGS. 4 and 5. Insert the connecting terminal (to) side of the thick-film hybrid ICDI into the slit (b) of the printed circuit board (2), and insert the positioning protrusions (16b) (16b) into the semicircular recess (one set) of the slit (b). (14a), and roughly insert the stopper protrusion (16a) until the end surface of the connection terminal (towards) comes into contact with the top surface of the printed circuit board (2). In this state, the thick film hybrid IC (b)
The connection terminal a3 and the copper foil Oη of the printed circuit board (B) are soldered with solder (G) to complete the mutual connection. Since the positioning projections ('1eb) are formed by printing paste-like solder and solidifying it by heating, the dimensions between the two positioning projections (16b) and these positioning projections are It is possible to set the dimensional relationship between (16b) and the connecting terminal with high accuracy. Therefore, the alignment between the connection terminal (to) of the thick film hybrid E CQη and the copper foil 0η of the printed circuit board 4 can be achieved by using the connection terminal (2) as shown in the conventional example shown in Fig. 1, or by using the connection terminal (2) shown in Fig. 2 of the conventional example. The positioning protrusion ('16b) and the stopper protrusion (1,
6a) can be determined more accurately.

In this embodiment, the protrusions (16a) and (16b) are semi-cylindrical in shape; however, other shapes may be used, and the number of positioning protrusions (16'b) is limited to two. It goes without saying that even just one is a good thing.

Effects of the Invention As described above, according to the present invention, it is easy to connect a thick film hybrid E-C to a printed circuit board without using connection terminals or positioning parts, and the material costs for terminals can be reduced. Assembly man-hours can be reduced. In addition, thick film hybrid
:) Since positioning can be performed with printing accuracy regardless of variations in board dimensions, connection reliability and yield can be improved.

[Brief explanation of drawings]

1 and 2 are perspective views showing a conventional example, FIG. 3 is a perspective view showing an embodiment of the present invention, FIG. 4 is an enlarged perspective sectional view showing the connection state of FIG. 3, and FIG. 5 is C-C in Figure 4
It is an arrow sectional view. Oυ・・・Thick film hybrid integrated circuit board, 0 success...
Printed circuit board, (to)...Circuit connection terminal, a→...
Slit, (14a)...Four semicircular parts, 00...Round, (16a)...Protrusion for stopper, (16b
) −...Positioning protrusion agent Morimoto
Yoshihiro (7) Figure 4 Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] 1 Conductive paste was printed and fired on the board to provide circuit connection terminals, rounds, etc. Paste solder was printed on the rounds and heated and solidified to form protrusions for positioning with the printed circuit board to be connected. Thick film hybrid integrated circuit board.