JPH0587839U - Modular jack - Google Patents

Abstract

(57) [Summary] [Construction] A base 12 into which a modular plug is inserted and a contact lead portion 20 mounted inside the base and brought into contact with the contact portion of the plug are provided. When the base body 12 is placed on the wiring board, the tail portions 22 of the contact lead portions 20 are in contact with each other along the surface of the wiring board, and the side wall of the base body 12 is provided with the metal fitting mounting portion 15. A fitting 30 having an L-shaped cross section is inserted into the portion 15 to fix the base 12 to the substrate. [Effect] Since the contact lead portion does not pass through the board and its tail end is in contact with the surface of the wiring board, and the mounting bracket having an L-shaped cross section is inserted and attached to the side wall of the base body, other SMT compatible components. In the same manner as described above, it is possible to mount it on a substrate together with them, and there is an advantage that a troublesome post process is unnecessary.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a modular jack mounted on a wiring board.

[0002]

[Prior Art]

 As a conventional modular jack mounted on a wiring board, a DIP type as shown in FIG. 4 is known. That is, the modular jack 50 of this type has a base 12 made of a resin mold provided with a fitting insertion portion 14 into which a modular plug to be connected is inserted, and a plurality of (for example, 6) bases 12 are provided in the base 12. The contact lead portion 20 is attached.

The central portion of the contact lead portion 20 is inserted into and fixed to the insertion portion 16 of the base body 12, and the tip end side portion 26 thereof is exposed in the fitting insertion portion 14 so as to come into contact with the contact portion of the modular plug. Further, the tail portion is extended downward so that the tail end 22 penetrates the substrate 5 and projects to the lower surface side thereof, and is fixed by soldering on the rear surface side of the substrate 5.

[0004]

[Problems to be solved by the device]

 As mentioned above, when using a DIP type modular jack for SMT type products by a set maker, after mounting other SMT compatible parts on the board, solder the modular jack in a later process. Since it was necessary to perform the mounting process, the modular jack could not be mounted on the board together with other components, which was troublesome.

In view of the above points, the present invention has an object to provide a modular jack that can be mounted on a board together with other SMT compatible components and that can reduce a troublesome post process.

[0006]

[Means for Solving the Problems]

 In order to achieve the above-mentioned object, the modular jack according to the present invention comprises a base body into which the modular plug is inserted and a contact lead part which is mounted inside the base body and is brought into contact with the contact part of the plug. In the state where the base body is placed on the wiring board, the tail portions of the contact lead portions are in contact with each other along the surface of the wiring board, and the side wall of the base body is provided with a metal fitting mounting portion. It is characterized in that a mounting member having an L-shaped cross section is inserted and attached to the attaching portion so as to fix the base body to the substrate.

[0007]

[Action]

 In the modular jack according to the present invention constructed as described above, the contact lead portion does not pass through the board, its tail end is in contact with the surface of the wiring board, and the side wall of the base body is L-shaped in cross section. Since the metal fittings are attached, they can be mounted on the board together with other SMT compatible parts, eliminating the need for time-consuming post-processing.

[0008]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of a modular jack according to the present invention, and FIGS. 2 and 3 show a state in which it is mounted on a board. 1 to 3, parts corresponding to respective parts of the conventional modular jack shown in FIG. 4 described above are denoted by the same reference numerals, and duplicated description thereof will be omitted.

2 and 3, the modular jack 10 includes a base 12 having a fitting insertion portion 14 into which a modular plug to be connected is inserted, and an insertion portion 16 provided inside the base 12. And a contact lead portion 20 attached to the contact portion of the plug. The central portion of the contact lead portion 20 is inserted into and fixed to the insertion portion 16 of the base body 12, and the tip side portion 21 thereof is bent in a U shape from the insertion portion 16 so as to come into contact with the contact portion of the modular plug. It is exposed in the fitting portion 14.

Further, the tail portion of the contact lead portion 20 is provided with a curved portion 25 which is curved in a wave shape so as to project upward from the insertion portion 16, and the tail end 22 of the contact lead portion is provided on the substrate. 5 is contacted along the surface of the substrate 5, and is connected and fixed on the wiring pattern of the substrate 5 by soldering.

Further, as shown in detail in FIG. 1, metal fitting mounting portions 15 are provided on both side walls of the base material 12, and the metal fitting mounting portion 15 has a cross section L for fixing the base material 12 to the substrate 5. A character-shaped mounting bracket 30 is attached. The mounting bracket 30 includes a vertical side portion 31 provided with a pair of locking projections 34 and a retaining projection 35 on both sides, and a lower side portion 32 that is bent from the lower end of the vertical side portion 31 and horizontally projects. The locking projection 34 is inserted into the insertion opening 15a of the metal fitting mounting portion 15 and locked by the locking portion 15b, and the retaining projection 35 is provided on the metal fitting mounting portion 15 at the opposite side surface portion 15c. Is pressed against.

In this case, the modular jack 10 is placed on the substrate 5 with the mounting bracket 30 inserted in the mounting bracket 15, and the lower side 32 of the mounting bracket 30 is fixed to the substrate 5 by soldering or the like. At the same time, the modular jack 10 is mounted on the substrate 5 by soldering the tail end 22 of the contact lead portion 20.

In the modular jack 10 of this embodiment, the lower side portion 32 of the mounting member 30 is prevented from protruding outward from the end face of the side wall when the mounting member 30 is attached to the side wall of the base 12. By doing so, there is an advantage that the mounting bracket 30 does not get in the way when the modular jacks 10 are packed side by side, and the mounting bracket 30 is less likely to be damaged.

Further, in this embodiment, the upper wall and the side wall of the base 12 are extended rearward to cover the tail end 22 of the contact lead portion 20, whereby the entire contact lead portion 20 is covered. The contact lead portion 20 is housed in the base 12 and is less susceptible to damage and deformation.

Further, the modular jack 10 of the present embodiment is provided with a positioning pin 29 protruding downward from the bottom for the convenience of mounting on the substrate 5.

In the modular jack 10 of the present embodiment configured as described above, the contact lead portion 20 does not penetrate the board 5 and its tail end 22 is in contact with the surface of the wiring board, and Since the mounting bracket 30 having an L-shaped cross section is inserted and attached to the side wall of 12, it can be mounted on the board 5 together with other SMT-compatible components, and a troublesome post-process is unnecessary.

Further, since the tail portion of the contact lead portion 20 is provided with the curved portion 25 which is bent in a corrugated manner so as to project upward, such a portion has a spring property, and therefore, the base body 12 is formed. Even if external force is applied to, it is absorbed in the tail part. Therefore, a situation in which an undesired force is applied to the tail end 22 of the contact lead portion 20 is avoided, and problems such as pattern peeling are less likely to occur.

Further, since the tail portion has elasticity and the tail end 22 projects downward from the bottom surface of the base body, high manufacturing accuracy is not required, and the tail end 22 is properly prepared. It has the advantage that it can be brought into contact with the substrate surface and can be easily manufactured.

[0019]

[Effect of the device]

 As is apparent from the above description, in the modular jack according to the present invention, the contact lead portion does not pass through the board and its tail end is in contact with the surface of the wiring board, and the side wall of the base body has an L-shaped mounting bracket. Since it is inserted, it can be mounted on the board together with other SMT compatible parts, and there is an advantage that a troublesome post process is unnecessary.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a modular jack according to the present invention.

FIG. 2 is a front view showing a mounted state of the board of the embodiment of FIG.

FIG. 2 is a sectional view taken along the line AA of FIG.

FIG. 3 is a sectional view showing an example of a conventional modular jack.

[Explanation of symbols]

 10 Modular Jack 12 Base 14 Fitting Insert 15 Metal Fitting Attachment 20 Contact Lead 22 Tail End 30 Attachment

[Procedure amendment]

[Submission date] May 31, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Brief explanation of the drawing

[Correction method] Change

[Correction content]

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a modular jack according to the present invention.

FIG. 2 is a front view showing a mounted state of the board of the embodiment of FIG.

3 is a sectional view taken along the line AA of FIG.

FIG. 4 is a sectional view showing an example of a conventional modular jack.

[Explanation of symbols] 10 modular jack 12 base 14 fitting insertion part 15 metal fitting mounting part 20 contact lead part 22 tail end 30 mounting metal fitting

Claims (1)

[Scope of utility model registration request] 1. A base body into which a modular plug is inserted,
A contact lead portion attached to the inside of the base and brought into contact with the contact portion of the plug,
When the base body is placed on the wiring board, the tail portions of the contact lead portions are in contact with each other along the surface of the wiring board, and the side wall of the base body is provided with a metal fitting mounting portion. A modular jack in which a mounting member having an L-shaped cross section is inserted to fix the base body to the substrate.